Device for measuring doses of ionizing particles

Abstract

Absorbed ionizing particles differentially effect first and second acquiring circuit stages configured to respectively generate first and second acquisition signals. Each acquisition signal has a characteristic that is variable as a function of an amount of absorbed ionizing particles. A measuring circuit generates, on the basis of the first and second acquisition signals, a relative parameter indicative of a relationship between the variable characteristics. A computation of a total ionizing dose is made using a 1st- or 2nd-degree polynomial relationship in the relative parameter.

Claims

1. A device for measuring ionizing particles, comprising: an acquiring circuit including first and second acquiring circuit stages respectively having different sensitivities to absorbed ionizing particles and configured to respectively generate first and second acquisition signals that each have a characteristic that is variable as a function of an amount of absorbed ionizing particles; and a processing circuit including a measuring circuit that is configured to generate, on the basis of the first and second acquisition signals, a relative parameter indicative of a relationship between said characteristics that are variable, and a computing circuit configured to compute a total ionizing dose using a 1st- or 2nd-degree polynomial relationship in said relative parameter.

2. The device according to claim 1, wherein the 1st- or 2nd-degree polynomial relationship includes an initial parameter corresponding to an absence of absorbed ionizing particles.

3. The device according to claim 1, wherein the characteristic that is variable as a function of the amount of absorbed ionizing particles is a frequency of the corresponding acquisition signal.

4. The device according to claim 3, wherein the relative parameter is a ratio of frequencies of two signals obtained from the first and second acquisition signals.

5. The device according to claim 1, wherein the first acquiring circuit stage comprises an nMOS first ring oscillator and the second acquiring circuit stage comprises a pMOS second ring oscillator.

6. The device according to claim 5, wherein the 1st- or 2nd-degree polynomial relationship is given by the formula: A*(N0Nr)+B*(N0Nr).sup.2, where A and B are coefficients and where only one of A and B is possibly zero.

7. The device according to claim 1, wherein the first acquiring circuit stage comprises a pMOS first ring oscillator and the second acquiring circuit stage comprises an nMOS second ring oscillator.

8. The device according to claim 7, wherein the 1st- or 2nd-degree polynomial relationship is given by the formula: A*(NrN0)+B*(NrN0).sup.2, where A and B are coefficients and where only one of A and B is possibly zero.

9. The device according to claim 4, wherein the measuring circuit comprises: a frequency-divider stage configured to receive the first acquisition signal and configured to deliver a third acquisition signal having a frequency that is equal to a frequency of the first acquisition signal divided by an integer value; and a state-machine circuit stage that is coupled to the frequency-divider stage and configured to receive the second and third acquisition signals, the state-machine circuit stage configured to generate the relative parameter as a function of a ratio between the frequencies of the second and third acquisition signals.

10. The device according to claim 1, wherein the acquiring circuit comprises low-threshold-voltage MOS transistors and the processing circuit comprises regular-threshold-voltage MOS transistors.

11. The device according to claim 1, produced in digital technology.

12. An electronic system, comprising a device according to claim 1.

13. An electronic apparatus, comprising an electronic system as claimed in claim 12.

14. The apparatus according to claim 13, being a satellite communication apparatus.

15. A method, comprising: generating a first acquisition signal having a variable characteristic that is function of an amount of ionizing particles absorbed by a circuit; generating a second acquisition signal having a variable characteristic that is an opposite function of the amount of ionizing particles absorbed by the circuit; generating, on the basis of the first and second acquisition signals, a relative parameter indicative of a relationship between said variable characteristics; and computing a total ionizing dose using a 1st- or 2nd-degree polynomial relationship in said relative parameter.

16. The method according to claim 15, wherein the 1st- or 2nd-degree polynomial relationship includes an initial parameter corresponding to an absence of absorbed ionizing particles.

17. The device according to claim 15, wherein the variable characteristic is a frequency of the corresponding acquisition signal.

18. The device according to claim 17, wherein the relative parameter is a ratio of frequencies of two signals obtained from the first and second acquisition signals.

19. The method according to claim 18, wherein generating comprises: frequency dividing the first acquisition signal and to generate a third acquisition signal having a frequency that is equal to a frequency of the first acquisition signal divided by an integer value; and generating the relative parameter as a function of a ratio between the frequencies of the second and third acquisition signals.

20. A device for measuring ionizing particles, comprising: an nMOS first ring oscillator configured to generate a first acquisition signal having a characteristic that is variable as a function of an amount of absorbed ionizing particles; a pMOS second ring oscillator configured to generate a second acquisition signal having a characteristic that is variable as a function of an amount of absorbed ionizing particles; a first circuit configured to generate, on the basis of the first and second acquisition signals, a relative parameter indicative of a relationship between said characteristics that are variable; and a second circuit configured to compute a total ionizing dose from the relative parameter.

21. The circuit of claim 20, wherein the second circuit computes the total ionizing dose using a 1st-degree polynomial relationship in said relative parameter.

22. The circuit of claim 20, wherein the second circuit computes the total ionizing dose using a 2nd-degree polynomial relationship in said relative parameter.

23. The circuit of claim 20 wherein the characteristic that is variable as a function of the amount of absorbed ionizing particles is a frequency of each of the first and second acquisition signals.

24. The circuit of claim 23, wherein the relative parameter is a ratio of frequencies of two signals obtained from the first and second acquisition signals.

25. The circuit of claim 20, wherein the first circuit comprises: a frequency-divider configured to generate a third acquisition signal having a frequency that is equal to a frequency of the first acquisition signal divided by an integer value; and a state-machine circuit configured to generate the relative parameter as a function of a ratio between the frequencies of the second and third acquisition signals.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Other advantages and features of the invention will become apparent on examining the detailed description of completely non-limiting embodiments and the appended drawings, in which:

(2) FIG. 1 is a block diagram of an electronic apparatus;

(3) FIGS. 2 and 3 schematically illustrate examples of a measuring device;

(4) FIG. 4 illustrates an example of an operation of a state-machine circuit stage; and

(5) FIGS. 5 and 6 illustrate examples of electronic circuits comprising the measuring device.

DETAILED DESCRIPTION OF THE DRAWINGS

(6) In FIG. 1, the reference 1 designates an electronic apparatus, such as a satellite communication apparatus, that is liable to be located in a space irradiated by ionizing particles such as alpha/beta particles, X/gamma radiation, protons or neutrons.

(7) The electronic apparatus 1, for example, comprises an electronic system 2 configured to process data received and emitted by the electronic apparatus 1. The electronic system 2 may, for example, include one or more integrated circuits and/or one or more microprocessors.

(8) Ionizing particles received by the apparatus 1 influence, to a greater or lesser extent, the performance of the electronic system 2 because nMOS/pMOS transistors of the electronic system 2 operate faster or slower as a result. Therefore, the frequency of the electronic system 2 is also influenced by the received ionizing particles.

(9) In order to detect this type of variation in performance, the electronic system 2 comprises a measuring circuit device 3 that is configured to quantitatively measure a total ionizing dose TID received by the electronic apparatus 1.

(10) The reader is now referred to FIG. 2, which schematically illustrates an example of the measuring circuit device 3 according to one embodiment.

(11) The device 3 comprises an acquiring circuit 4 that is configured to generate first and second acquisition signals 5 and 6, and a processing circuit 7 that is configured to determine, on the basis of the first and second acquisition signals 5 and 6, said total ionizing dose TID of the apparatus 1.

(12) The acquiring circuit 4 comprises a first acquiring circuit stage 8 and a second acquiring circuit stage 9, which are, for example, configured to respectively perform the same function, here for example the generation of a periodic signal having a given frequency.

(13) To do this, the first acquiring circuit stage 8 here comprises a first ring oscillator OSC1 that is configured to generate the first acquisition signal 5, and the second acquiring circuit stage 9 here comprises a second ring oscillator OSC2 that is configured to generate the second acquisition signal 6.

(14) In order to differentiate the first and second acquisition signals 5 and 6, the first and second acquiring circuit stages 8 and 9 are configured to respectively have different sensitivities to the ionizing particles, for example opposite sensitivities.

(15) In this respect and by way of example, the first ring oscillator OSC1 is produced only with nMOS transistors whereas the second ring oscillator OSC2 is produced only with pMOS transistors.

(16) It should be noted that the speed of nMOS transistors is generally increased after irradiation whereas the speed of pMOS transistors is generally decreased. In other words, the frequency of the first acquisition signal 5 is increased whereas the frequency of the second acquisition signal 6 is decreased once the acquiring circuit 4 has been irradiated.

(17) Although it is possible to use various existing process monitoring circuits to implement the first and second acquiring circuit stages 8 and 9, it is preferable to produce the acquiring circuit 4 with low-threshold-voltage transistors, here for example low-threshold-voltage (LVT) transistors in a 28 nm FDSOI CMOS technology, so as to decrease the sensitivity of the nMOS and pMOS transistors to variations in temperature and applied voltage.

(18) Thus, for transistors having different channel lengths in 28 nm FDSOI CMOS technology, said sensitivity to variations in temperature and applied voltage decreases with the increase in channel length. It should be noted that leakage current is also considerably decreased with this increase in channel length. The option referred to as PB16 (poly bias 16), i.e. a length equal to the minimum length of the 28 nm FDSOI CMOS technology increased by 16 nm (i.e. 42 nm), ensures a minimum sensitivity to variations in temperature and applied voltage.

(19) As a variant, the first ring oscillator OSC1 may be produced only with pMOS transistors whereas the second ring oscillator OSC2 may be produced only with nMOS transistors. This variant in particular leads to a change of variable in a 1st- or 2nd-degree polynomial relationship used in the processing circuit 7, which relationship will be described in detail below.

(20) The processing circuit 7 comprises a measuring circuit 10 that is coupled to the acquiring circuit 4 and configured to receive the first and second acquisition signals 5 and 6. The measuring circuit 10 is also configured to generate, on the basis of the first and second acquisition signals 5 and 6, a relative parameter Nr between the frequencies of the two signals, which is more precisely here a ratio of the frequencies of two signals obtained from the acquisition signals (5 and 6).

(21) The processing circuit also includes a computing circuit 11 that is configured to receive said relative parameter Nr and that is configured to compute the total ionizing dose TID using said relative parameter Nr and the aforementioned polynomial relationship.

(22) FIG. 3 schematically illustrates an example of the measuring circuit 10 according to one embodiment.

(23) The measuring circuit 10 comprises a frequency-divider stage DIVF configured to receive the first acquisition signal 5 and configured to generate an intermediate acquisition signal 12 having a divided frequency that is equal to that of the first acquisition signal 5 divided by a preset integer Ehere for example E=4096.

(24) The intermediate acquisition signal 12 is then delayed by way of a plurality of flip-flops, here for example three D flip-flops, 13 to 15, clocked by the second acquisition signal 6 in order to respectively generate at the outputs of the flip-flops 14 and 15 a third acquisition signal 16 and a delayed third acquisition signal 17 both having said divided frequency.

(25) It should be noted that the three flip-flops 13 to 15 are configured to slightly delay the intermediate acquisition signal 12 so as to allow the rising edges of the third acquisition signal 16 to be clearly distinguished, as will be seen below.

(26) The measuring circuit 10 furthermore comprises a state-machine circuit stage 18 configured to receive the third acquisition signal 16, the delayed third acquisition signal 17, and a reset signal 19 that is synchronized with the second acquisition signal 6 via two additional D flip-flops 20 and 21 that are clocked by the second acquisition signal 6.

(27) The state-machine circuit stage 18 is configured to generate as output said relative parameter Nr and an indication signal 22.

(28) The reader is now referred to FIG. 4, which illustrates in greater detail an example of the operation of the state-machine circuit stage 18.

(29) The state-machine circuit stage 18 has four states: reset, wait, done and count.

(30) When the reset signal 19 is in its high state (1), the state-machine circuit stage 18 is placed in the reset state independently of the second and third signals 6 and 16.

(31) When the reset signal 19 is in its low state (0), the stage 18 is switched to the wait state until the next rising edge of the third acquisition signal 16. As there is a delay, due to the flip-flop 15, between the third acquisition signal 16 and the delayed third acquisition signal 17, the rising edge of the third acquisition signal 16 is detected if the third acquisition signal 16 is in its low state (0) and the delayed third acquisition signal 17 is in its high state (1).

(32) Next, the state-machine circuit stage 18 is switched to its count state until the next rising edge of the third signal 16, i.e. when the third acquisition signal 16 is once again in its low state and the delayed third acquisition signal 17 is once again in its high state.

(33) The indication signal 22 is then switched to the high state at the end of the count state in order to indicate that the relative parameter Nr is ready to be used by the computing circuit 11.

(34) In the count state, the relative parameter Nr is incremented when the second acquisition signal 6 is in its high state. As the frequency of the second signal 6 is higher than that of the third signal 16, the relative parameter Nr is the ratio between the frequencies of the second and third acquisition signals 6 and 16.

(35) As the speed of nMOS transistors will generally increase after irradiation and that of pMOS transistors will decrease, the frequencies of the second and third acquisition signals 6 and 16 will change in opposite directions so as to make the relative parameter Nr vary.

(36) Therefore, the relative parameter Nr is representative of the amount of ionizing particles absorbed by the device 3.

(37) The inventors have moreover observed that, depending on the composition of the ring oscillators, it is possible to determine the dose TID using a polynomial relationship of the type TID=A*(N0Nr)+B*(N0Nr).sup.2 or TID=A*(NrN0)+B*(NrN0).sup.2.

(38) In these relationships, A and B are coefficients, one of which may possibly be zero, and N0 is the value of the parameter Nr in the absence of ionizing particles.

(39) This polynomial relationship is implemented in the computing circuit 11, for example in software form or using specific hardware or firmware circuits.

(40) The 1st- or 2nd-degree polynomial relationship includes a quadratic portion and a linear portion.

(41) When the first acquiring circuit stage 8 is produced with nMOS transistors, the polynomial relationship is written as follows:
TID=A*(N0Nr)+B*(N0Nr).sup.2.

(42) When the first acquiring circuit stage 8 is produced with pMOS transistors, the polynomial relationship is written as follows:
TID=A*(NrN0)+B*(NrN0).sup.2.

(43) In order to accurately calculate the total ionizing dose TID for circuits fabricated in various technologies and/or for various families of circuits, it is necessary to determine the initial parameter N0 and the coefficients A and B.

(44) This may be done in the factory or with a prototype circuit in a calibrating phase. The obtained values of N0, A and B will then be valid for any circuit analogous to the prototype circuit.

(45) As regards N0, a measurement of N0 is taken when the device 3 is not being irradiated.

(46) In order to determine the coefficients A and B, it is possible, for a series of known reference TID doses, to measure the corresponding values of Nr.

(47) On the basis of all these measurement points, it is then possible, for example, to use a polynomial regression method to optimally approximate the cloud of measurement points with a 1st or 2nd-degree polynomial relationship and thus obtain the coefficients A and B.

(48) Depending on the obtained measurements, the polynomial relationship may optionally be a pure quadratic relationship (A=0) or a pure linear relationship (B=0).

(49) However, generally, the coefficients A and B are both nonzero.

(50) The processing circuit 7 or even the device 3 is implemented entirely in digital (and not analog) technology in order to advantageously allow greater design flexibility and greater accuracy in the measurement of the ionizing particles TID.

(51) Once the coefficients N0, A and B of the polynomial relationship have been determined, the computing circuit 11 is configured to simply and accurately compute the total ionizing dose TID using the relative parameter Nr and the polynomial relationship.

(52) It should be noted that the device 3 also advantageously uses a conventional, triple modular redundancy (TMR) flip-flop so as to make the measuring device 3 more resistant to radiation. The on-silicon implementation of the processing circuit 7 is not very bulky and requires only a silicon area of about 400 m.sup.2 in 28 nm FDSOI CMOS technology.

(53) FIG. 5 illustrates another example of an electronic circuit 2 comprising the measuring device 3 such as described above.

(54) The electronic circuit 2 comprises a processing circuit 24 including a lookup table 25 that is coupled between the measuring device 3 and a substrate-bias- or supply-voltage (Vdd) generator 26 and other functional circuits 27.

(55) The processing circuit 24 is configured to receive the total ionizing dose TID computed by the device 3 and configured to generate, on the basis of the lookup table 25 and the total ionizing dose TID, a parameter 28 for adjusting the substrate-bias or supply voltage and to deliver this parameter 28 to the substrate-bias- or supply-voltage (Vdd) generator 26.

(56) The generator 26 is also configured to generate, on the basis of the parameter 28, an adjusted substrate-bias- or supply-voltage (Vdd) value 29 and to deliver this adjusted value 29 to the functional circuits 27 in order to compensate for the effects of the impacts of ionizing particles on these circuits 27.

(57) As a variant, the reader is now referred to FIG. 6, which illustrates yet another example of an electronic circuit 2 including the measuring device 3 such as described above.

(58) This electronic circuit 2 comprises, instead of the processing circuit 24 illustrated in FIG. 5, a comparing circuit 30 coupled between the measuring device 3 and the generator 26.

(59) This comparing circuit 30 is configured to compare the relative parameter Nr with the initial parameter N0 so as to generate, on the basis of the result of this comparison, the adjusting parameter 28 and to deliver this parameter 28 to the generator 26.

(60) The generator 26 is configured to receive the parameter 28 delivered by the comparing means 30 and configured to deliver the adjusted value 29 not only to the other functional circuits 27 but also to the measuring device 3.

(61) This fed-back adjusted value 27 advantageously allows the substrate-bias or supply voltage of the measuring device 3 to be adjusted so as to compensate for the effects of the impacts of absorbed ionizing particles.

(62) When the relative parameter Nr is once again substantially equal to the initial parameter N0, this means that the adjustment of the substrate-bias or supply voltage has correctly compensated for the impacts of absorbed ionizing particles.