Magnetoresistance effect element
10937951 ยท 2021-03-02
Assignee
Inventors
Cpc classification
H01F10/3268
ELECTRICITY
International classification
H01F10/32
ELECTRICITY
Abstract
A magnetoresistance effect element according to an aspect of the present disclosure includes a first ferromagnetic layer as a magnetization fixed layer including a ferromagnetic Heusler alloy, a second ferromagnetic layer as a magnetization free layer including a ferromagnetic Heusler alloy, and a nonmagnetic spacer layer provided between the first ferromagnetic layer and the second ferromagnetic layer, and the nonmagnetic spacer layer includes a nonmagnetic Fe group, Co group, or Ni group Heusler alloy.
Claims
1. A magnetoresistance effect element comprising: a first ferromagnetic layer as a magnetization fixed layer including a ferromagnetic Heusler alloy; a second ferromagnetic layer as a magnetization free layer including a ferromagnetic Heusler alloy; and a nonmagnetic spacer layer provided between the first ferromagnetic layer and the second ferromagnetic layer, wherein the nonmagnetic spacer layer includes a nonmagnetic (i) Fe group Heusler alloy selected from the group consisting of Fe.sub.2TiSi, Fe.sub.2ZrGe, Fe.sub.2HfSn, Fe.sub.2TaAl, Fe.sub.2NbGa, Fe.sub.2CrZn, Fe.sub.2MoCd, Fe.sub.2WSr, and Fe.sub.2ScBi, or (ii) Co group Heusler alloy selected from the group consisting of Co.sub.2ZnGe, Co.sub.2ScAl, and Co.sub.2ScGa.
2. The magnetoresistance effect element according to claim 1, wherein the nonmagnetic Heusler alloy has a B2 structure or a L2.sub.1 structure.
3. The magnetoresistance effect element according to claim 2, wherein at least one of the ferromagnetic Heusler alloy included in the first ferromagnetic layer and the second ferromagnetic layer includes a Heusler alloy expressed by a composition formula of Co.sub.2QR, Q is one or more elements selected from the group consisting of Cr, Mn, and Fe, and R is one or more elements selected from the group consisting of Al, Si, Ga, Ge, In, and Sn.
4. The magnetoresistance effect element according to claim 1, wherein at least one of the ferromagnetic Heusler alloy included in the first ferromagnetic layer and the second ferromagnetic layer includes a Heusler alloy expressed by a composition formula of Co.sub.2QR, Q is one or more elements selected from the group consisting of Cr, Mn, and Fe, and R is one or more elements selected from the group consisting of Al, Si, Ga, Ge, In, and Sn.
5. The magnetoresistance effect element according to claim 1, wherein at least one of the ferromagnetic Heusler alloy included in the first ferromagnetic layer and the second ferromagnetic layer includes a Heusler alloy expressed by general formula (1):
Co.sub.2Q.sub.R.sub. (1) where Q is one or more elements selected from a group consisting of Cr, Mn, and Fe, R is one or more elements selected from a group consisting of Al, Si, Ga, Ge, In, and Sn, and 2<+<2.6.
6. The magnetoresistance effect element according to claim 1, wherein the nonmagnetic spacer layer includes the nonmagnetic Fe group Heusler alloy.
7. The magnetoresistance effect element according to claim 6, wherein the nonmagnetic Heusler alloy has a B2 structure or a L2.sub.1 structure.
8. The magnetoresistance effect element according to claim 7, wherein at least one of the ferromagnetic Heusler alloy included in the first ferromagnetic layer and the second ferromagnetic layer includes a Heusler alloy expressed by a composition formula of Co.sub.2QR, Q is one or more elements selected from the group consisting of Cr, Mn, and Fe, and R is one or more elements selected from the group consisting of Al, Si, Ga, Ge, In, and Sn.
9. The magnetoresistance effect element according to claim 6, wherein at least one of the ferromagnetic Heusler alloy included in the first ferromagnetic layer and the second ferromagnetic layer includes a Heusler alloy expressed by a composition formula of Co.sub.2QR, Q is one or more elements selected from the group consisting of Cr, Mn, and Fe, and R is one or more elements selected from the group consisting of Al, Si, Ga, Ge, In, and Sn.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
DETAILED DESCRIPTION
(4) Hereinafter, embodiments of the present disclosure will be described. Note that the following disclosure exemplifies some of the embodiments of the present disclosure, but the present disclosure is not limited to these embodiments, and any embodiments are included in the scope of the present disclosure as long as the embodiments include the technical ideas of the present disclosure. Respective configurations, combinations thereof in the respective embodiments, or the like are merely examples, and additions, omissions, substitutions, and other changes to the configurations can be performed without departing from the spirit of the present disclosure.
(5)
(6) A material constituting the substrate 10 is not particularly limited as long as the material is a material having appropriate mechanical strength and suitable for heat treatment and microprocessing. Examples of the substrate 10 include a metal oxide single crystal substrate, a silicon single crystal substrate, a silicon single crystal substrate with a thermal oxide film, a sapphire single crystal substrate, a ceramic substrate, a quartz substrate, and a glass substrate. A MgO single crystal substrate is particularly suitable. By using a MgO single crystal substrate which is a general-purpose substrate as the substrate 10, it is possible to easily obtain epitaxial growth films by using a known technology. Accordingly, the magnetoresistance effect element 1 having high MR characteristics can be obtained.
(7) The underlayer 12 is an electrode for allowing a detection current to flow and contains at least one metal element such as Ag, Au, Cu, Cr, V, Al, W, Pt or the like. The underlayer 20 may include an alloy of these metal elements or a laminate of materials including two or more of these metal elements. An example of such an alloy of metal elements includes a cubic-type material such as an AgZn alloy, an AgMg alloy, or a NiAl alloy.
(8) Note that a crystal orientation layer (not illustrated) for controlling a crystal orientation of an upper layer may be provided between the substrate 10 and the underlayer 12. The crystal orientation layer may include a layer containing at least one kind of MgO, TiN, and NiTa alloys. Further, a lower electrode (not illustrated) for allowing a current to flow through the magnetoresistance effect element 1 in a stacking direction may be provided between the substrate 10 and the underlayer 12.
(9) The first ferromagnetic layer 13 functioning as a magnetization free layer is formed of a soft magnetic material, and a magnetization direction thereof is not substantially fixed. Therefore, when an external magnetic field that is a measurement target is applied, the magnetization direction easily changes in a direction thereof. A magnetization direction of the second ferromagnetic layer 15 functioning as a magnetization fixed layer is more difficult to change as compared with the magnetization direction of the first ferromagnetic layer 13 with respect to an external magnetic field. Preferably, the magnetization direction of the second ferromagnetic layer 15 is substantially fixed with respect to an external magnetic field that is a measurement target, and does not substantially change with respect to an external magnetic field that is a measurement target. When an external magnetic field is applied to the magnetoresistive layer 18 and a relative magnetization direction between the first ferromagnetic layer 13 and the second ferromagnetic layer 15 changes, a resistance value of the magnetoresistive layer 18 changes, and a magnetoresistive effect is exhibited.
(10) The first ferromagnetic layer 13 and the second ferromagnetic layer 15 include a ferromagnetic Heusler alloy, and preferably, are formed of substantially a ferromagnetic Heusler alloy. In particular, the ferromagnetic Heusler alloy of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 is preferably formed of a Heusler alloy expressed by a composition formula Co.sub.2QR. In the composition formula, Q is one or more elements selected from a group consisting of Cr, Mn and Fe, and R is one or more elements selected from a group consisting of Al, Si, Ga, Ge, In, and Sn. By using such a ferromagnetic Heusler alloy, a spin polarization ratio of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 can be increased. As a result, the magnetoresistive effect of the magnetoresistance effect element 1 can be increased.
(11) Further, it is further preferable for the ferromagnetic Heusler alloy of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 to be the ferromagnetic Heusler alloy expressed by the following general formula (1).
CO.sub.2Q.sub.R.sub. (1)
(12) In the general formula (1), Q is one or more elements selected from a group consisting of Cr, Mn, and Fe, R is one or more elements selected from a group consisting of Al, Si, Ga, Ge, In, and Sn, and 2<+<2.6.
(13) Since the Heusler alloy of the general formula (1) satisfies the condition of 2<+<2.6, half metal characteristics are easily maintained for the following reasons. That is, it has been theoretically shown that in the Heusler alloy expressed by the general formula (1), when Co is substituted with Q and R sites, a spin polarizability decreases, but when the elements of the Q and R sites are substituted with a Co site, an influence on the spin polarizability is small. Therefore, when 2<+, the substitution of Co with the Q and R sites is reduced, and accordingly, a decrease in spin polarizability due to element substitution is reduced. On the other hand, when 2.6+, the amount of magnetization of the Heusler alloy decreases. Therefore, when the condition of 2<+<2.6 is satisfied in the Heusler alloy, half metal characteristics are easily maintained, and, as a result, the magnetoresistance effect element 1 can exhibit a large magnetoresistance effect.
(14) Co.sub.2Mn.sub.-XFe.sub.xSi.sub.(2<+<2.6, >X) is particularly preferable as the Heusler alloy of the general formula (1), but Co.sub.2Mn.sub.Al.sub.-XSi.sub.X(2<+<2.6, >X), Co.sub.2Fe.sub.Ga.sub.-XGe.sub.x(2<+<2.6, >X), Co.sub.2Fe.sub.Al.sub.-XSi.sub.X (2<+<2.6, >X), or the like in which a large RA (amount of magnetoresistance change x element area) can be obtained in a GMR element having a CPP structure is also preferable. Further, the first ferromagnetic layer 13 and the second ferromagnetic layer 15 may be formed of one type of ferromagnetic Heusler alloy, two or more types of ferromagnetic Heusler alloy, or a combination of a ferromagnetic Heusler alloy and a metal other than a Heusler alloy. Further, ferromagnetic Heusler alloys of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 may be the same as each other or may be different from each other.
(15) The nonmagnetic spacer layer 14 includes a nonmagnetic Fe group, Co group, or Ni group Heusler alloy, and is preferably formed of such a nonmagnetic Heusler alloy. When the nonmagnetic spacer layer 14 is formed of a nonmagnetic Heusler alloy, the nonmagnetic spacer layer 14, the first ferromagnetic layer 13, and the second ferromagnetic layer 15 are all formed of a Heusler alloy, and therefore, it is possible to crystallize the first ferromagnetic layer 13 and the second ferromagnetic layer 15 relatively easily. As a result, it is possible to increase a crystal orientation of the first ferromagnetic layer 13 and the second ferromagnetic layer 15. A thickness of the nonmagnetic spacer layer 14 is preferably equal to or greater than 1 nm and smaller than or equal to 10 nm.
(16) Examples of the nonmagnetic Fe group Heusler alloy include Fe.sub.2TiSi, Fe.sub.2ZrGe, Fe.sub.2HfSn, Fe.sub.2VAl, Fe.sub.2TaAl, Fe.sub.2NbGa, Fe.sub.2CrZn, Fe.sub.2MoCd, Fe.sub.2WSr, and Fe.sub.2ScBi. Examples of the nonmagnetic Co group Heusler alloy include Co.sub.2ZnGe, Co.sub.2ScAl, and Co.sub.2ScGa.
(17) The antiferromagnetic layer 16 is provided on a surface of the second ferromagnetic layer 15 opposite to the nonmagnetic spacer layer 14. The antiferromagnetic layer 16 is exchange-coupled with the second ferromagnetic layer 15 and is used to impart unidirectional anisotropy to the second ferromagnetic layer 15 and substantially fix the direction of magnetization of the second ferromagnetic layer 15. Examples of a material of the antiferromagnetic layer 16 include an FeMn alloy, a PtMn alloy, a PtCrMn alloy, a NiMn alloy, an IrMn alloy, NiO, and Fe.sub.2O.sub.3. A thickness of the first ferromagnetic layer 13 can be, for example, equal to or greater than 1 nm and smaller than or equal to 20 nm, and a thickness of the second ferromagnetic layer 15 can be, for example, equal to or greater than 1 nm and smaller than or equal to 20 mn. A thickness of the antiferromagnetic layer 16 can be, for example, equal to or greater than 5 nm and smaller than or equal to 15 nm. For the first ferromagnetic layer 13 and the second ferromagnetic layer 15, when a coercive force of the second ferromagnetic layer 15 is greater than a coercive force of the first ferromagnetic layer 13 and has a magnitude such that a magnetization direction of the second ferromagnetic layer 15 is substantially fixed with respect to an external magnetic field that is a measurement target, for example, due to a scheme for changing the thicknesses of the layers, the antiferromagnetic layer 16 need not necessarily be provided.
(18) The cap layer 17 is provided to protect the magnetoresistive layer 18. The cap layer 17 is formed of, for example, one or more of metal elements including Ru, Ag, Al, Cu, Au, Cr, Mo, Pt, W, Ta, Pd and Ir, an alloy of these metal elements, and a laminate of materials containing two or more of these metal elements. An upper electrode (not illustrated) for causing a current to flow through the magnetoresistance effect element 1 in a stacking direction may be provided on the cap layer 17.
(19) A method of manufacturing the magnetoresistance effect element 1 includes, for example, a step of forming each of the underlayer 12, the first ferromagnetic layer 13, the nonmagnetic spacer layer 14, the second ferromagnetic layer 15, the antiferromagnetic layer 16, and the cap layer 17 on a substrate 11 using a sputtering method. In each step, a heat treatment may be performed, as necessary, or a magnetic field application process for imparting uniaxial magnetic anisotropy may be performed. A heat treatment may be appropriately performed at the same time in the magnetic field application process. Further, the magnetoresistance effect element 1 is subjected to microprocessing into a form in which the magnetoresistance characteristics can be evaluated, by lithography using an electron beam or the like and dry etching using Ar ions or the like.
(20) According to the magnetoresistance effect element 1 of the embodiment as described above, since the nonmagnetic spacer layer 14 includes the nonmagnetic Fe group, Co group, or Ni group Heusler alloy, Fe, Co, or Ni that is a magnetic element contained in the nonmagnetic spacer layer 14 can be caused to be present near an interface between the first ferromagnetic layer 13 and the nonmagnetic spacer layer 14 and near an interface between the second ferromagnetic layer 15 and the nonmagnetic spacer layer 14. Accordingly, it is thought that stability of the magnetization directions of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 near the interfaces is improved. As a result, variation in a value of RA of the magnetoresistance effect element 1 can be reduced.
(21) Further, in the magnetoresistance effect element 1 of the embodiment, it is preferable that the nonmagnetic spacer layer 14 include a nonmagnetic Fe group Heusler alloy, and the nonmagnetic Heusler alloy contain the element Fe, an element L, and an element M, the element L being one or more elements selected from a group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Sc, and Y, and the element M being one or more elements selected from a group consisting of Si, Ge, Sn, Al, Ga, In, Zn, Cd, Hg, Mg, Ca, Sr, Ba, P, As, Sb, and Bi.
(22) By selecting such types of material for the nonmagnetic Fe group Heusler alloy, a small energy gap can be formed near a Fermi level of the nonmagnetic Heusler alloy, and electrical conduction characteristics of the nonmagnetic Heusler alloy can be semiconductive characteristics. Accordingly, it becomes easy to set the value of RA of the magnetoresistance effect element 1 to a desired value. A general formula of the nonmagnetic Heusler alloy of such a type of material is, for example, Fe.sub.2LM, but a composition of the nonmagnetic Heusler alloy may deviate somewhat from this general formula without deviating from the gist of the present disclosure.
(23) Further, in the magnetoresistance effect element 1 of the embodiment, it is preferable that the nonmagnetic spacer layer 14 include a nonmagnetic Fe group Heusler alloy, and the nonmagnetic Heusler alloy contain the element Fe, an element L, and an element M, the element L being one or more elements selected from a group consisting of Ti, Zr, Hf, V, Nb, Ta, Sc, and Y, and the element M being one or more elements selected from a group consisting of Si, Ge, Sn, Al, Ga, In, P, As, Sb, and Bi.
(24) By selecting such types of material for the nonmagnetic Fe group Heusler alloy, it becomes easy to set the value of RA of the magnetoresistance effect element 1 to a desired value for the same reason as described above. Further, in the periodic table of the elements, a group (Group 3, Group 4, or Group 5) to which the element L belongs and a group (Group 13, Group 14, or Group 15) to which the element M belongs, and a group (Group 8) to which Fe belongs can be greatly separated from each other. Accordingly, it is possible to reduce element substitution between Fe and element L or element M in the nonmagnetic Heusler alloy of the nonmagnetic spacer layer 14. As a result, variation in the value of RA of the magnetoresistance effect element 1 can be further reduced.
(25) Further, in the magnetoresistance effect element 1 of the embodiment, it is preferable that the nonmagnetic spacer layer 14 include a nonmagnetic Fe group Heusler alloy, and the nonmagnetic Heusler alloy contain the element Fe, an element L, and an element M, the element L being one or more elements selected from a group consisting of Ti, Zr, Hf, Sc, and Y, and the element M being one or more elements selected from a group consisting of Si, Ge, Sn, P, As, Sb, and Bi.
(26) By selecting such types of material for the nonmagnetic Fe group Heusler alloy, it becomes easy to set the value of RA of the magnetoresistance effect element 1 to a desired value for the same reason as described above. Further, in the periodic table of the elements, a group (Group 3 or Group 4) to which the element L belongs and a group (Group 14 or Group 15) to which the element M belongs, and a group (Group 8) to which Fe belongs can be further greatly separated from each other. Accordingly, it is possible to further reduce element substitution between Fe and element L or element M in the nonmagnetic Heusler alloy of the nonmagnetic spacer layer 14. As a result, variation in the value of RA of the magnetoresistance effect element 1 can be further reduced.
(27) Further, in the magnetoresistance effect element 1 of the embodiment, it is preferable for the nonmagnetic Heusler alloy of the nonmagnetic spacer layer 14 to have a B2 structure or a L2.sub.1 structure. This will be described with reference to
(28) As illustrated in
(29) Here, when a (001) plane P1 of the L2.sub.1 structure, the B2 structure, and the A2 structure is referred to, it is seen that the (001) plane P1 of the L2.sub.1 structure and the B2 structure is formed of only Fe. In a fcc structure, the (001) plane is a preferred orientation plane. Therefore, by forming the nonmagnetic spacer layer 14 using a nonmagnetic Heusler alloy having a B2 structure or a L2.sub.1 structure, it is possible to increase the amount of Fe, Co, or Ni which is a magnetic element contained in the nonmagnetic spacer layer 14 present near the interface between the first ferromagnetic layer 13 and the nonmagnetic spacer layer 14 and near the interface between the second ferromagnetic layer 15 and the nonmagnetic spacer layer 14, as compared with a case in which the nonmagnetic spacer layer 14 is formed of a non-magnetic Heusler alloy having an A2 structure. As a result, since the stability of the magnetization directions of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 near the interfaces is further improved, variation in a value of RA of the magnetoresistance effect element 1 can be further reduced.
(30) On the other hand, when the nonmagnetic spacer layer 14 is formed of a nonmagnetic Heusler alloy having an A2 structure, there are elements other than magnetic elements such as Fe on the (001) plane P1. Therefore, an effect of stabilizing the magnetization directions of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 near the interface is relatively low.
EXAMPLES
(31) Hereinafter examples of the present disclosure and comparative examples will be described in order to further clarify the effects of the magnetoresistance effect element of the present disclosure.
(32)
(33) The MR ratio is generally expressed by the following equation.
MR ratio (%) (R.sub.APR.sub.P)/R.sub.P100
(34) R.sub.P is the resistance of the magnetoresistance effect element when the magnetization directions of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 are parallel, and R.sub.AP, is the resistance of the magnetoresistance effect element when the magnetization directions of the first ferromagnetic layer 13 and the second ferromagnetic layer 15 are antiparallel. Further, when an area of a shape of the magnetoresistance effect element 1 when viewed in a plan view is A, R.sub.pA obtained by multiplying R.sub.p by A is defined as RA (area resistance). RA is a value normalized to a resistance value per unit area by dividing a resistance value obtained by dividing an applied bias voltage by a current flowing in the stacking direction of the magnetoresistance effect element, by a reciprocal of an area of a surface to which each layer is bonded. Here, R.sub.pA obtained by multiplying R.sub.p by the area is defined as RA. Further, the variation in the value of RA was defined as 3 for RA ( is a standard deviation of RA) measured for ten magnetoresistance effect elements respectively having substantially the same area of a shape when viewed in a plan view, which were prepared on the same substrate for Examples 1 to 11 and Comparative Example 1 respectively. The structure of the magnetoresistance effect element 1 according to each example and comparative example was confirmed in an X-ray diffraction image, a cross-sectional transmission electron microscope image, and an electron beam diffraction image of each layer.
Example 1
(35) The magnetoresistance effect element of Example 1 corresponding to the above embodiment will be described with reference to the magnetoresistance effect element 1 illustrated in
(36) A MgO substrate was used as the substrate 10, the underlayer 12 was formed by stacking Cr (10 nm) and Ag (100 nm) from the substrate 10 side, the first ferromagnetic layer 13 and the second ferromagnetic layer 15 were a ferromagnetic Heusler alloy of Co.sub.2MnSi (10 nm), the nonmagnetic spacer layer 14 was a nonmagnetic Heusler alloy of Fe.sub.2CrZn (2 nm), the antiferromagnetic layer 16 was IrMn (10 nm), and the cap layer 17 was Ru (5 nm). A value inside the parentheses is a film thickness, and a film formation of each layer was performed using a sputtering method.
(37) After the second ferromagnetic layer 15 was formed, a heat treatment was performed at 450 C. to promote crystallization regularity of the first ferromagnetic layer 13, the nonmagnetic spacer layer 14, and the second ferromagnetic layer 15. After the cap layer 17 was formed, a heat treatment in a magnetic field for imparting uniaxial magnetic anisotropy to the second ferromagnetic layer 15 was performed. At this time, a heat treatment temperature was 300 C., and a magnetic field application strength was 5 kOe.
(38) When a cross-sectional transmission electron microscope image and an electron beam diffraction image of each layer were confirmed after the heat treatment in the magnetic field, it was confirmed that the first ferromagnetic layer 13, the nonmagnetic spacer layer 14, and the second ferromagnetic layer 15 all had a B2 structure.
(39) For the magnetoresistance effect element according to Example 1 prepared as described above, RA, an RA variation, RA, and a MR ratio were measured using the magnetoresistive device 100 described above.
Example 2
(40) A magnetoresistance effect element according to Example 2 had the same configuration as the magnetoresistance effect element of Example 1 except that Fe.sub.2TaAl (2 nm) was used in place of Fe.sub.2CrZn (2 nm) for the nonmagnetic spacer layer 14, and preparation and measurement were performed using the same method as in Example 1.
Example 3
(41) A magnetoresistance effect element according to Example 3 had the same configuration as the magnetoresistance effect element of Example 1 except that Fe.sub.2TiSi (2 nm) was used in place of Fe.sub.2CrZn (2 nm) for the nonmagnetic spacer layer 14, and preparation and measurement were performed using the same method as in Example 1.
Example 4
(42) In a magnetoresistance effect element according to Example 4, preparation and measurement were performed using the same method as in Example 3 except that the second ferromagnetic layer 15 was formed and then heat treatment at 300 C. was performed in place of the heat treatment at 450 C.
(43) When the cross-sectional transmission electron microscope image and the electron beam diffraction image of each layer of the magnetoresistance effect element of Example 4 were confirmed after the heat treatment in the magnetic field, it was confirmed that the first ferromagnetic layer 13, the nonmagnetic spacer layer 14, and the second ferromagnetic layer 15 all had a A2 structure.
Example 5
(44) In a magnetoresistance effect element according to Example 5, preparation and measurement were performed using the same method as in Example 3 except that the second ferromagnetic layer 15 was formed and then a heat treatment at 550 C. was performed in place of the heat treatment at 450 C.
(45) When the cross-sectional transmission electron microscope image and the electron beam diffraction image of each layer of the magnetoresistance effect element of Example 5 were confirmed after the heat treatment in the magnetic field, it was continued that the first ferromagnetic layer 13, the nonmagnetic spacer layer 14, and the second ferromagnetic layer 15 all had an L2.sub.1 structure.
Examples 6 to 11
(46) In magnetoresistance effect elements according to Examples 6 to 11, preparation and measurement were performed using the same method as in Example 3 except that a Heusler alloy of Co.sub.2Q.sub.R.sub. in which a composition of Mn and Si with respect to Co varied was used in place of the Heusler alloy of Co.sub.2MnSi (10 nm) for the first ferromagnetic layer 13 and the second ferromagnetic layer 15.
Comparative Example 1
(47) In a magnetoresistance effect element according to Comparative Example 1, preparation and measurement were performed using the same method as in Example 1 except that Rh.sub.2CuSn was used in place of Fe.sub.2CrZn (2 nm) for the nonmagnetic spacer layer 14.
(48) Table 1 shows measurement results of Examples 1 to 11 and Comparative Example 1.
(49) TABLE-US-00001 TABLE 1 First Second Heat ferromagnetic ferromagnetic treatment RA variation electrode Nonmagnetic electrode temperature RA 3 RA MR Ratio layer A + B spacer layer layer [ C.] [m.sup.2] [m.sup.2] [m.sup.2] [%] Example 1 Co.sub.2MnSi 2 Fe.sub.2CrZn Co.sub.2MnSi 450 0.19 0.075 0.020 10.5 Example 2 Co.sub.2MnSi 2 Fe.sub.2TaAl Co.sub.2MnSi 450 0.28 0.062 0.030 10.7 Example 3 Co.sub.2MnSi 2 Fe.sub.2TiSi Co.sub.2MnSi 450 0.32 0.043 0.035 10.9 Example 4 Co.sub.2MnSi 2 Fe.sub.2TiSi Co.sub.2MnSi 450 0.31 0.082 0.010 3.2 Example 5 Co.sub.2MnSi 2 Fe.sub.2TiSi Co.sub.2MnSi 450 0.32 0.042 0.038 11.9 Example 6 Co.sub.2Mn.sub.1.1Si.sub.0.95 2.05 Fe.sub.2TiSi Co.sub.2Mn.sub.1.1Si.sub.0.95 450 0.29 0.039 0.053 18.3 Example 7 Co.sub.2Mn.sub.1.1Si.sub.0.95 2.15 Fe.sub.2TiSi Co.sub.2Mn.sub.1.1Si.sub.0.95 450 0.3 0.041 0.064 21.3 Example 8 Co.sub.2Mn.sub.1.1Si.sub.0.95 2.25 Fe.sub.2TiSi Co.sub.2Mn.sub.1.1Si.sub.0.95 450 0.31 0.042 0.072 23.2 Example 9 Co.sub.2Mn.sub.1.1Si.sub.0.95 2.45 Fe.sub.2TiSi Co.sub.2Mn.sub.1.1Si.sub.0.95 450 0.3 0.042 0.050 16.7 Example 10 Co.sub.2Mn.sub.1.1Si.sub.0.95 2.55 Fe.sub.2TiSi Co.sub.2Mn.sub.1.1Si.sub.0.95 450 0.31 0.039 0.045 14.5 Example 11 Co.sub.2Mn.sub.1.1Si.sub.0.95 2.6 Fe.sub.2TiSi Co.sub.2Mn.sub.1.1Si.sub.0.95 450 0.32 0.041 0.038 11.9 Comparative Co.sub.2MnSi 2 Rh.sub.2CuSn Co.sub.2MnSi 450 0.08 0.183 0.003 3.8 Example 1
(50) As shown in Table 1, the variation (3) of the value of RA was 0.075 um.sup.2 in Example 1, 0.062 um.sup.2 in Example 2, 0.043 um.sup.2 in Example 3, 0.082 um.sup.2 in Example 4, 0.042 um.sup.2 in Example 5, 0.039 um.sup.2 in Example 6, 0.041 um.sup.2 in Example 7, 0.042 um.sup.2 in Example 8, 0.042 um.sup.2 in Example 9, 0.039 um.sup.2 in Example 10, and 0.041 um.sup.2 in Example 11, which were all smaller than 0.183 um.sup.2 in Comparative Example 1.
(51) Further, the variation in the value of RA is smaller in the order of Example 1, Example 2, and Example 3. This shows that, for Fe.sub.2LM used for the nonmagnetic spacer layer 14, variation in RA becomes smaller when a group to which the X element belongs and a group to which the Y element belongs are separated from Fe of Group 8 in the periodic table of the elements. Further, it was shown from a comparison between Example 3, Example 4, and Example 5 that a crystal structure of the nonmagnetic spacer layer 14 is preferably a B2 structure or an L2.sub.1 structure rather than an A2 structure in terms of the variation in RA value. Further, it was shown from the results of Example 3 and Examples 6 to 11 that the MR ratio is particularly increased by setting a sum of and in Co.sub.2Q.sub.R.sub. to be greater than 2 and smaller than 2.6.