Recyclable Conductive Adhesive Composition for Led Packaging and Preparation Method Thereof, Recycling Method and Recycled Conductive Silver Powder

Abstract

The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused.

Claims

1. A recyclable conductive adhesive composition for LED packaging, characterized in comprising the following components by weight: epoxy resin, 8% to 12%; epoxy resin diluent, 2% to 4%; curing agent containing imine bond, 3% to 6%; amine curing agent, 1% to 3%; curing accelerator, 0.1% to 0.3%; wetting dispersant, 0.1% to 0.3%; coupling agent, 0.1% to 0.3%; defoamer, 0.1% to 0.3%; conductive silver powder, 78% to 82%; wherein, the epoxy resin comprises at least two selected from electronic grade bisphenol A epoxy resin, electronic grade bisphenol F epoxy resin and naphthol bifunctional epoxy resin; the structural formula of the curing agent containing imine bond is ##STR00005## wherein R.sub.1 is hydrogen or methoxy, R.sub.2 is hydrogen or methoxy; the amine curing agent is low viscous polyether amine curing agent and/or alicyclic amine curing agent; the average sheet diameter of the conductive silver powder is 5 m to 20 m.

2. The recyclable conductive adhesive composition for LED packaging of claim 1, characterized in that, the epoxy resin diluent is one selected from ethylene glycol diglycidyl ether, butanediol diglycidyl ether and neopentyl glycol diglycidyl ether.

3. The recyclable conductive adhesive composition for LED packaging of claim 1, characterized in that, the polyether amine curing agent is at least one selected from D-205, D-230 and D-400, and the alicyclic amine curing agent is at least one selected from isophorone diamine, 1,3-bis(aminomethyl)cyclohexane, 1-methyl-2,4-cyclohexanediamine and 4,4-diaminodicyclohexylmethane.

4. The recyclable conductive adhesive composition for LED packaging of claim 1, characterized in that, the curing accelerator is one selected from 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole and DMP-30.

5. The recyclable conductive adhesive composition for LED packaging of claim 1, characterized in that, the wetting dispersant is BYK-W980, BYK996, VATIX 2017 or VATIX 2018.

6. The recyclable conductive adhesive composition for LED packaging of claim 1, characterized in that, the coupling agent is A-187, SCA-E87M, SCA-E87E, Silok 6634E or Silok 6634M.

7. The recyclable conductive adhesive composition for LED packaging of claim 1, characterized in that, the defoamer is BYK-A530, BYK-320, VATIX 1030 or ACP-0001.

8. The recyclable conductive adhesive composition for LED packaging of claim 1, characterized in that, the average sheet diameter of the conductive silver powder is 10 m to 15 m.

9. A preparation method of the recyclable conductive adhesive composition for LED packaging of claim 1, characterized in comprising the following steps: (1) weighing each component by its weight percentage; (2) putting epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent and defoamer into a blender to disperse to obtain a liquid mixture; (3) adding conductive silver powder into the liquid mixture, dispersing in a blender, and then defoaming to obtain the recyclable conductive adhesive composition for LED packaging.

10. The preparation method of claim 9, characterized in that, in step (2), the dispersing lasts for 2 min to 4 min.

11. The preparation method of claim 9, characterized in that, in step (2) and/or step (3), the blender is in a mode of revolution and rotation synchronous agitation.

12. The preparation method of claim 9, characterized in that, in step (3), the dispersing lasts for 2 min to 4 min.

13. The preparation method of claim 9, characterized in that, in step (3), the defoaming is in vacuum and lasts for 30 min to 60 min.

14. A method for recycling the recyclable conductive adhesive composition for LED packaging of claim 1, characterized in comprising the following steps: (1) putting a cured recyclable conductive adhesive composition for LED packaging into an amine solvent, heating it to make the epoxy resin component degraded to obtain a mixture; (2) filtering and separating the mixture obtained in step (1) to obtain a filter cake; and (3) washing and drying the filter cake to obtain the recyclable conductive silver powder.

15. The method of claim 14, characterized in that, in step (1), the amine solvent is 5 to 10 times the weight of the cured recyclable conductive adhesive composition for LED packaging.

16. The method of claim 14, characterized in that, in step (1), the amine solvent includes at least one selected from butylamine, hexylamine, ethylenediamine, isophorone diamine, 1,3-bis(aminomethyl) cyclohexane, 1-methyl-2,4-cyclohexanediamine and 4,4-diamino dicyclohexylmethane.

17. The method of claim 14, characterized in that, in step (1), the heating is at the temperature of 50 C. to 80 C. and lasts for 2 h to 4 h.

18. The method of claim 14, characterized in that, in step (3), washing the filter cake with absolute ethanol and drying it in vacuum.

19. A recycled conductive silver powder obtained by the method of claim 14.

Description

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0049] The technical solutions of the present invention will be further illustrated and described in the following specific embodiments.

Example 1

[0050] The following components were accurately weighed and put into a blender using the revolution and rotation synchronous agitation mode to mix for 2 min: 7 parts of electronic grade bisphenol A epoxy resin (Huayi, Shanghai), 1.8 parts of naphthol bifunctional epoxy resin (DIC Corporation, Japan), 3.4 parts of diluent butanediol diglycidyl ether, 3 parts of curing agent containing imine bond, 2 parts of isophorone diamine, 0.2 parts of 2-ethyl-4-methylimidazole, 0.2 parts of wetting dispersant BYK996 (BYK, Germany), 0.2 parts of coupling agent A-187 (Momentive, USA), and 0.2 parts of defoamer VATIX 1030 (Vatix, Beijing). Then 82 parts of sheet silver powders with an average diameter of 12 m (Northwest Institute for Non-ferrous Metal Research) were added to the above obtained liquid mixture and put into a blender using the revolution and rotation synchronous agitation mode to disperse for 2 min. The obtained mixture was defoamed for 40 min in vacuum to obtain the recyclable conductive adhesive for LED packaging. The structural formula of the curing agent containing imine bond is as follows:

##STR00002##

[0051] The curing condition of the recyclable conductive adhesive composition for LED packaging is at 175 C. for 15 min. The cured conductive adhesive was put into ethylenediamine solvent of 8 times by weight and heated at 60 C. for 2 h, so that the epoxy resin component was completely degraded. The obtained mixture was filtered and separated to obtain a filter cake. The filter cake was washed with absolute ethanol for 3 times and then dried in vacuum to obtain the recyclable conductive silver powder. The performance of the recyclable conductive adhesive composition for LED packaging prepared in this embodiment is shown in Table 1.

Example 2

[0052] The following components were accurately weighed and put into a blender using the revolution and rotation synchronous agitation mode to mix for 3 min: 9 parts of electronic grade bisphenol F epoxy resin (Huayi, Shanghai), 3 parts of naphthol bifunctional epoxy resin (DIC Corporation, Japan), 3.1 parts of diluent glycol diglycidyl ether, 5 parts of curing agent containing imine bond, 1 parts of 1-methyl-2,4-cyclohexanediamine, 0.3 parts of 1-cyanoethyl-2 ethyl-4-methylimidazole, 0.2 parts of wetting dispersant VATIX 2018 (Vatix, Beijing), 0.2 parts of coupling agent Silok 6634E (Silok, Guangzhou), 0.2 parts of defoamer BYK-320 (BYK, Germany). Then 78 parts of sheet silver powders with an average diameter of 8 m (Northwest Institute for Non-ferrous Metal Research) were added to the above obtained liquid mixture and put into a blender using the revolution and rotation synchronous agitation mode to disperse for 3 min. The obtained mixture was defoamed for 60 min in vacuum to obtain the recyclable conductive adhesive for LED packaging. The structural formula of the curing agent containing imine bond is as follows:

##STR00003##

[0053] The curing condition of the recyclable conductive adhesive composition for LED packaging is at 170 C. for 20 min. The cured conductive adhesive was put into butylamine solvent of 5 times by weight and heated at 50 C. for 4 h, so that the epoxy resin component was completely degraded. The obtained mixture was filtered and separated to obtain a filter cake. The filter cake was washed with absolute ethanol for 3 times and then dried in vacuum to obtain the recyclable conductive silver powder. The performance of the recyclable conductive adhesive composition for LED packaging prepared in this embodiment is shown in Table 1.

Example 3

[0054] The following components were accurately weighed and put into a blender using the revolution and rotation synchronous agitation mode to mix for 2 min: 4 parts of electronic grade bisphenol A epoxy resin (Huayi, Shanghai), 5 parts of electronic grade bisphenol F epoxy resin (Huayi, Shanghai), 2 parts of naphthol bifunctional epoxy resin (DIC Corporation, Japan), 2.2 parts of diluent neopentyl glycol diglycidyl ether, 4 parts of curing agent containing imine bond, 2 parts of 1,3-bis(aminomethyl) cyclohexane, 0.2 parts of DMP-30, 0.2 parts of wetting dispersant BYK-W980 (BYK, Germany), 0.2 parts of coupling agent SCA-E87M (NANJING CAPATUE CHEMICAL CO., LTD), and 0.2 parts of defoamer BYK-A530 (BYK, Germany). Then 80 parts of sheet silver powders with an average diameter of 10 m (Northwest Institute for Non-ferrous Metal Research) were added to the above obtained liquid mixture and put into a blender using the revolution and rotation synchronous agitation mode to disperse for 2 min. The obtained mixture was defoamed for 60 min in vacuum to obtain the recyclable conductive adhesive for LED packaging. The structural formula of the curing agent containing imine bond is as follows:

##STR00004##

[0055] The curing condition of the recyclable conductive adhesive composition for LED packaging is at 190 C. for 20 min. The cured conductive adhesive was put into isophorone diamine solvent of 10 times by weight and heated at 80 C. for 6 h, so that the epoxy resin component was completely degraded. The obtained mixture was filtered and separated to obtain a filter cake. The filter cake was washed with absolute ethanol for 3 times and then dried in vacuum to obtain the recyclable conductive silver powder. The performance of the recyclable conductive adhesive composition for LED packaging prepared in this embodiment is shown in Table 1.

Comparative Example 1

[0056] The following components were accurately weighed and put into a blender using the revolution and rotation synchronous agitation mode to mix for 2 min: 8 parts of electronic grade bisphenol A epoxy resin (Huayi, Shanghai), 2 parts of naphthol bifunctional epoxy resin (DIC Corporation, Japan), 3 parts of diluent neopentyl glycol diglycidyl ether, 2 parts of 1-methyl-2,4-cyclohexanediamine, 0.2 parts of wetting dispersant BYK-W980 (BYK, Germany), 0.2 parts of coupling agent A-187 (Momentive, USA), and 0.2 defoamer BYK-A530 (BYK, Germany). Then 82 parts of sheet silver powders with an average diameter of 12 m (Northwest Institute for Non-ferrous Metal Research) were added to the above obtained liquid mixture and put into a blender using the revolution and rotation synchronous agitation mode to disperse for 2 min. The obtained mixture was defoamed for 60 min in vacuum to obtain the recyclable conductive adhesive for LED packaging.

[0057] The curing condition of the recyclable conductive adhesive composition for LED packaging is at 170 C. for 15 min. The cured conductive adhesive was put into ethylenediamine solvent of 10 times by weight and heated at 80 C. for 6 h. The performance of the conductive adhesive composition for LED packaging prepared in this embodiment is shown in Table 1.

[0058] Test

Experimental Test 1: Viscosity Test

[0059] The viscosities of the samples obtained from the above embodiments was measured at room temperature by a cone plate rotary viscometer.

Experimental Test 2: Volume Resistivity Test

[0060] The volume resistivities of the samples obtained from the above embodiments were measured by the four probe method based on the test standard of ASTM D257-2007.

Experimental Test 4: Shear Strength Test

[0061] The shear strengths of the samples obtained from the above embodiments were measured by a universal mechanical testing machine based on the test standard of ASTM D1002.

[0062] The experimental test results of the above embodiment are shown in Table 1.

TABLE-US-00001 TABLE 1 Test results of Examples and Comparative Example Volume Shear Degradation Degradation Viscosity resistivity strength temperature time (mPa .Math. s) (10.sup.4 .Math. cm) (MPa) ( C.) (h) Example 1 12480 2.4 7.2 60 2 Example 2 9860 40.6 9.5 40 4 Example 3 11640 9.8 7.9 80 6 Comparative 12050 2.8 6.8 No No example 1 degradation degradation

[0063] The above description is only the preferred embodiments of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and the like within the spirit and principle of the present invention shall be included in the protection scope of the present invention.