Array-type electrode, digital printing mold and method for manufacturing array-type electrode

Abstract

An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.

Claims

1. An array-type electrode, comprising: a substrate; an isolating layer, disposed on one side of the substrate; an electrode, wherein a first part of the electrode is disposed on one side of the substrate and covered by the isolating layer; a second part of the electrode penetrates through the substrate; a third part of the electrode is disposed on the other side of the substrate; the first part is connected to the third part via the second part; a micro-structure layer, disposed on the isolating layer; and a hydrophobic layer, disposed on the micro-structure layer.

2. The array-type electrode of claim 1, wherein a surface of the micro-structure layer comprises a plurality of protrusions.

3. The array-type electrode of claim 1, wherein the substrate comprises a through hole.

4. The array-type electrode of claim 3, wherein the electrode comprises a driving electrode part, a connection part, and a conductive part; the driving electrode is disposed on one side of the substrate, the conductive part is disposed on the other side of the substrate, and the connection part is disposed inside the through hole, and coupled to the driving electrode and the conductive part.

5. The array-type electrode of claim 4, further comprising a trace, wherein the conductive part is coupled to a power source via the trace.

6. The array-type electrode of claim 1, wherein the substrate is a printing circuit board, the electrode is a copper electrode, the isolating layer is a SiO.sub.2 layer, SiN.sub.3 layer, or, and the hydrophobic layer is a Teflon layer.

7. A digital printing mold, comprising an electrode array, wherein the electrode array comprises a plurality of array-type electrodes, and each of the array-type electrodes comprises: a substrate; an isolating layer, disposed on one side of the substrate; an electrode, wherein a first part of the electrode is disposed on one side of the substrate and covered by the isolating layer; a second part of the electrode penetrates through the substrate; a third part of the electrode is disposed on the other side of the substrate; the first part is connected to the third part via the second part; a micro-structure layer, disposed on the isolating layer; and a hydrophobic layer, disposed on the micro-structure layer.

8. The digital printing mold of claim 1, wherein a surface of the micro-structure layer comprises a plurality of protrusions.

9. The digital printing mold of claim 7, wherein the substrate comprises a through hole.

10. The digital printing mold of claim 9, wherein the electrode comprises a driving electrode part, a connection part, and a conductive part; the driving electrode is disposed on one side of the substrate, the conductive part is disposed on the other side of the substrate, and the connection part is disposed inside the through hole, and coupled to the driving electrode and the conductive part.

11. The digital printing mold of claim 10, further comprising a trace, wherein the conductive part is coupled to a power source via the trace.

12. The digital printing mold of claim 7, wherein the substrate is a printing circuit board, the electrode is a copper electrode, the isolating layer is a SiO.sub.2 layer, SiN.sub.3 layer, or, and the hydrophobic layer is a Teflon layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The present disclosure will become more fully understood from the detailed description given herein below and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present disclosure and wherein:

(2) FIG. 1 is a schematic view of a currently available array-type electrode.

(3) FIG. 2 is a schematic view of a parallel-type electrode array composed of the array-type electrodes.

(4) FIG. 3 is a top view of a digital printing mold of a first embodiment in accordance with the present disclosure.

(5) FIG. 4 is a cross-sectional view of the digital printing mold of the first embodiment in accordance with the present disclosure.

(6) FIG. 5 is a bottom view of the digital printing mold of the first embodiment in accordance with the present disclosure.

(7) FIG. 6 is a first schematic view of the digital printing mold of the first embodiment in accordance with the present disclosure.

(8) FIG. 7 is a second schematic view of the digital printing mold of the first embodiment in accordance with the present disclosure.

(9) FIG. 8A8G are firstninth schematic views of a manufacturing process of the array-type electrodes of the digital printing mold of the first embodiment in accordance with the present disclosure respectively.

(10) FIG. 9 is a flowchart of a method for manufacturing the array-type electrodes of the digital printing mold of the first embodiment in accordance with the present disclosure.

(11) FIG. 10AFIG. 10D are firstfourth schematic views of a digital printing mold of a second embodiment in accordance with the present disclosure.

DETAILED DESCRIPTION

(12) In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

(13) Please refer to FIG. 3, FIG. 4, and FIG. 5; FIG. 3 is a top view of a digital printing mold of a first embodiment in accordance with the present disclosure. As shown in FIG. 3, the digital printing mold 2 includes an electrode array, and the electrode array includes a plurality of array-type electrodes 21. These array-type electrodes 21 generate electric field to move the ink on the array-type electrodes 21 to form a desired pattern.

(14) FIG. 4 is a cross-sectional view of the digital printing mold of the first embodiment in accordance with the present disclosure. As shown in FIG. 4, each of array-type electrodes 21 includes a substrate 211, an electrode 212, an isolating layer 213, a micro-structure layer 215, and a hydrophobic layer 214.

(15) The isolating layer 213 is disposed on one side of the substrate 211, and the substrate 211 includes a through hole O. In an embodiment, the substrate 211 may be a printing circuit board (PCB) or other similar materials; the isolating layer 213 may be a SiO.sub.2 layer, Si.sub.3N.sub.4 layer, photoresist layer or other similar materials; the hydrophobic layer 214 may be Teflon (PTFB) or other similar materials.

(16) The electrode 212 includes three parts: the first part is a driving electrode part 212a, which is disposed on one side of the substrate 211, and covered by the isolating layer 213. The second part is a connection part 212b, which is disposed inside the through hole O, and penetrates through the substrate 211. The third part is a conductive part 212c, which is disposed on the other side of the substrate 211. The driving electrode part 212a is connected to the conductive part 212c via the connection part 212b. In an embodiment, the electrode 212 may be a copper electrode.

(17) As shown in FIG. 4, the micro-structure layer 215 is disposed on the isolating layer 213, and the surface of the micro-structure layer 215 is rough, and includes a plurality of protrusions. In an embodiment, the micro-structure layer 215 may be formed on the isolating layer 213 by the imprinting process.

(18) The hydrophobic layer 214 is disposed on the micro-structure layer 215.

(19) FIG. 5 is a bottom view of the digital printing mold of the first embodiment in accordance with the present disclosure. As shown in FIG. 5, the conductive part 212c of each of array-type electrodes 21 is connected to a pin P via a trace W to connect to a power source, such that the power source can activate the driving electrode part 212a to generate the electric field, which can move the ink to form the desired pattern.

(20) Please refer to FIG. 6 and FIG. 7; FIG. 6 and FIG. 7 are a first schematic view and a second schematic view of the digital printing mold of the first embodiment in accordance with the present disclosure respectively.

(21) As shown in FIG. 6, the driving electrode parts 212a of the array-type electrodes 21 are disposed on one side of the substrate 211. The traces W of the array-type electrodes 21 are connected to the conductive parts 212c disposed on the other side of the substrate 211, such that the plane where the driving electrodes 212a of the array-type electrodes 21 are disposed is different from the plane where the traces W of the array-type electrodes 21 is disposed. In this way, the electric field generated by the trances W of the array-type electrodes 21 will not interfere with the ink, so the ink can move along the desired path to precisely form the desired pattern.

(22) In addition, as shown in FIG. 6, when the ink D is on the surfaces of the array-type electrodes 21, the interfacial tensions applied to the ink D includes (1) solid-liquid interfacial tension .sub.SL; (2) solid-gas interfacial tension .sub.SG; (3) liquid-gas interfacial tension .sub.LG; the relation between the contact angle 1 and the above interfacial tensions is as shown in Equation (1):
.sub.SG=.sub.SL+.sub.LG cos 1(1)

(23) In the embodiment, as the surface of the micro-structure layer 215 of each array-type electrode 21 is rough, and includes a plurality of protrusions. Thus, the initial contact angle 1 between the ink D and the surfaces of the array-type electrodes 21 can be increased before the array-type electrodes 21 applies the electric field to the ink D.

(24) Regarding the above tensions, the solid-liquid interfacial tension .sub.SL can be adjusted by the electric field, generated by the applied voltage, applied to the ink D, as shown in Equation (2):
.sub.SL(V)=.sub.SL|.sub.v=0C/2*V.sup.2(2)

(25) In Equation (2), V stands for the voltage applied to the ink D; C stands for the capacitance of the dielectric layer.

(26) As shown in FIG. 7, after the array-type electrodes 21 apply the electric field to the ink D, the ink D is asymmetrically deformed. Therefore, the contact angle between the ink D and the surfaces of the array-type electrodes 21 is decreased to be 2, as shown in Equation (3). Thus, the ink D can move on the surfaces of the array-type electrodes 21.
cos 2cos 1=.sub.r.sub.02t.sub.LG*V.sup.2(3)

(27) Equation (3) can be derived from Equation (1) and Equation (2); in Equation (3), .sub.0 stands for the vacuum permittivity; .sub.r stands for the permittivity of the isolating layer; t stands for the thickness of the isolating layer.

(28) As described above, as the array-type electrodes 21 of the embodiment includes the micro-structure layers 215, the initial contact angle 1 between the ink D and the surfaces of the array-type electrodes 21 can be significantly increased. For the reason, the digital printing mold 2 can result in enough change to the contact angle without high voltage, and can control the ink D to move along the desired path. Therefore, the digital printing mold 2 can save more energy and will not be damaged by high temperature.

(29) In the embodiment, the digital printing mold can change different patterns by moving the ink, so it no longer needs to manufacture a lot of different printing molds for different patterns, and the patterns form by the digital printing mold can have higher resolution. Thus, the digital printing mold can satisfy the current market trend, small-volume and large-variety, the cost of the printing process can be significantly reduced, and the efficiency of the printing process can be improved.

(30) Moreover, each of the array-type electrodes of the digital printing mold of the embodiment has a special structure design, wherein the plane where the traces of the array-type electrodes of the digital printing mold are disposed is different from the plane where the driving electrodes of the array-type electrodes are disposed, so the electric field generated by the traces will not interfere with the ink. Therefore, the ink can move along the desired path to precisely from the desired pattern. Furthermore, each of the array-type electrodes of the digital printing mold has the micro-structure layer, so the digital printing mold can save more energy and will not be damaged by high temperature. As described above, the digital printing mold of the embodiment can definitely achieve great technical effect.

(31) Please refer to FIG. 8AFIG. 8G; FIGS. 8A8G are firstninth schematic views of a manufacturing process of the array-type electrodes of the digital printing mold of the first embodiment in accordance with the present disclosure respectively.

(32) First, a first metal layer M1 is adhered to one side of a substrate 211, and then a second metal layer M2 is adhered to the other side of the substrate 211, as shown in FIG. 8A.

(33) Next, the first metal layer M1 and the second metal layer M2 are etched by the lithography etching process in order to form a driving electrode part 212a and a conductive part 212c, as shown in FIG. 8B.

(34) Then, the substrate 211, the driving electrode 212a, and the conductive part 212c are perforated to form a through hole O, as shown in FIG. 8C.

(35) After that, a connection part 212b is formed in the through hole O by the electroplating process in order to connect the driving electrode part 212a to the conductive part 212c, as shown in FIG. 8D.

(36) Afterward, an isolating layer 213 is formed on the substrate 211 to cover the driving electrode part 212a, as shown in FIG. 8E.

(37) Then, a micro-structure layer 215 is formed on the isolating layer 213 by the imprinting process, as shown in FIG. 8F.

(38) Finally, a hydrophobic layer 214 is formed on the micro-structure layer 215, as shown in FIG. 8G.

(39) Please refer to FIG. 9; FIG. 9 is a flowchart of a method for manufacturing the array-type electrodes of the digital printing mold of the first embodiment in accordance with the present disclosure. The method for manufacturing the array-type electrodes of the embodiment includes the following steps:

(40) Step S91: adhering a first metal layer to one side of a substrate, and adhering a second metal layer to the other side of the substrate

(41) Step S92: etching the first metal layer and the second metal layer to form a driving electrode part and a conductive part respectively.

(42) Step S93: perforating the substrate, the driving electrode part, and the conductive part to form a through hole.

(43) Step S94: executing an electroplating process to form a connection part in the through hole to connect the driving electrode part to the conductive part.

(44) Step S95: forming an isolating layer on the substrate to cover the driving electrode part.

(45) Step S96: forming a micro-structure layer on the isolating layer.

(46) Step S97: forming a hydrophobic layer on the micro-structure layer.

(47) The embodiment just exemplifies the present disclosure and is not intended to limit the scope of the present disclosure. Any equivalent modification and variation according to the spirit of the present disclosure is to be also included within the scope of the following claims and their equivalents.

(48) It is worthy to point out that if conventional printing techniques are used to print different patterns, it is necessary to manufacture a lot of molds corresponding to these patterns. However, high-precision printing molds are very expensive, so the cost of the printing process has never been effectively reduced. Besides, it needs to spend about 34 weeks on manufacturing a printing mold, so the printing process is always inefficient. On the contrary, according to one embodiment of the present disclosure, the digital printing mold can change different patterns by moving the ink, so it no longer needs to manufacture a lot of different printing molds for different patterns, and the patterns form by the digital printing mold can have higher resolution. Thus, the cost of the printing process can be significantly reduced, and the efficiency of the printing process can be improved.

(49) Besides, when using a printing mold during a printing process, the user should frequently refill the printing mold, and repeatedly scrape the ink from the printing mold, so the printing mold tends to be damaged, which further increases the cost of the printing process. On the contrary, according to one embodiment of the present disclosure, the user does not need to frequently refill the digital printing mold and scrape the ink from the digital printing mold by a scraper. Therefore, the digital printing mold does not tend to be damaged, so the cost of the printing process can be further reduced.

(50) Further, the current trend of printing products is small-volume but large-variety, so the conventional printing techniques can no longer satisfy the requirements of the market. On the contrary, according to one embodiment of the present disclosure, the plane where the traces of the array-type electrodes of the digital printing mold are disposed is different from the plane where the driving electrodes of the array-type electrodes are disposed, so the electric field generated by the traces will not interfere with the ink. Therefore, the ink can move along the desired path to precisely from the desired pattern.

(51) Moreover, according to one embodiment of the present disclosure, each of the array-type electrodes of the digital printing mold has the micro-structure layer, so the initial contact angle between the ink and the surfaces of the array-type electrodes can be significantly increased. Thus, the digital printing mold can result in enough change to the contact angle without high voltage, and can control the ink to move along the desired path. Therefore, the digital printing mold can save more energy and will not be damaged by high temperature.

(52) Furthermore, according to one embodiment of the present disclosure, the digital printing mold can be applied to not only biomedical purposes, but also can be applied to printing process, which is more comprehensive in use.

(53) Please refer to FIG. 10AFIG. 10D; FIG. 10A10D are firstfourth schematic views of a digital printing mold of a second embodiment in accordance with the present disclosure respectively. The embodiment illustrates a preferred usage situation of the digital printing mold.

(54) As shown in FIG. 10A, the digital printing mold 2 includes an electrode array, and a plurality of storage tanks 22a22f, and the electrode array includes a plurality of array-type electrodes 21. The ink D can be contained in any one of the storage tanks 22. In the embodiment, the ink D is contained in the storage tank 22b at the upper left corner.

(55) As shown in FIG. 10B, the user can orderly turn on the array-type electrodes 21 from the left side to the right side, so the ink D can move toward the center of the digital printing mold 2.

(56) As shown in FIG. 10C, when the ink D moves to the center of the digital printing mold 2, the user can turn on the array-type electrode 21 at the middle of the digital printing mold 2 to shape the ink D to be rectangular, and then turn off the array-type electrodes 21 at the upper left corner to disconnect the ink D from the storage tank 22b.

(57) As shown in FIG. 10D, the user can turn on array-type electrodes 21 above and below to reshape the rectangular ink D to be the pattern I.

(58) The embodiment just exemplifies the present disclosure and is not intended to limit the scope of the present disclosure. Any equivalent modification and variation according to the spirit of the present disclosure is to be also included within the scope of the following claims and their equivalents.

(59) In summation of the description above, according to one embodiment of the present disclosure, the digital printing mold can change different patterns by moving the ink, so it no longer needs to manufacture different printing molds, and the patterns form by the digital printing mold can have higher resolution. Thus, the cost of the printing process can be significantly reduced, and the efficiency of the printing process can be improved.

(60) According to one embodiment of the present disclosure, the user does not need to frequently refill the digital printing mold and scrape the ink from the digital printing mold by a scraper. Therefore, the digital printing mold does not tend to be damaged, so the cost of the printing process can be further reduced.

(61) Also, according to one embodiment of the present disclosure, the digital printing mold can change the pattern according to actual requirements, so can satisfy the current market trend, small-volume and large-variety.

(62) Further, according to one embodiment of the present disclosure, the plane where the traces of the array-type electrodes of the digital printing mold are disposed is different from the plane where the driving electrodes of the array-type electrodes are disposed, so the electric field generated by the traces will not interfere with the ink. Therefore, the ink can move along the desired path to precisely from the desired pattern.

(63) Moreover, according to one embodiment of the present disclosure, each of the array-type electrodes of the digital printing mold has the micro-structure layer, so the initial contact angle between the ink and the surfaces of the array-type electrodes can be significantly increased. Thus, the digital printing mold can result in enough change to the contact angle without high voltage, and can control the ink to move along the desired path. Therefore, the digital printing mold can save more energy and will not be damaged by high temperature.

(64) Furthermore, according to one embodiment of the present disclosure, the digital printing mold can be applied to not only biomedical purposes, but also can be applied to printing process, which is more comprehensive in use.

(65) It will be apparent to those skilled in the art that various modifications and variations can be made to the disclosed embodiments. It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims and their equivalents.