Ion source enhanced AlCrSiN coating with gradient Si content and gradient grain size

10941479 ยท 2021-03-09

Assignee

Inventors

Cpc classification

International classification

Abstract

An ion source enhanced AlCrSiN coating for a cutting tool is provided. The ion source enhanced AlCrSiN coaling has gradient Si content and grain size, including sequentially an AlCrSiN working layer, an interlayer and an AlCrN bottom layer in order from a surface of the coating to a substrate, wherein from the AlCrN bottom layer to the AlCrSiN working layer, Si content in the interlayer is gradually increased, and the interlayer has a texture that changes from coarse columnar crystals to fine nanocrystals and amorphous body. A texture of the coating, in which the grain size is gradually decreased, sequentially includes coarse columnar crystals, fine columnar crystals and fine equiaxed crystals. A method for preparing the ion source enhanced AlCrSiN coating with the gradient Si content and grain size is provided as well as a cutting tool having the coating deposited thereon.

Claims

1. An ion source enhanced AlCrSiN coating with a gradient Si content and a gradient grain size, comprising sequentially an AlCrSiN working layer, an interlayer and an AlCrN bottom layer in order from a surface of the ion source enhanced AlCrSiN coating to a substrate, wherein from the AlCrN bottom layer to the AlCrSiN working layer, the Si content in the interlayer is gradually increased, and the interlayer comprises a texture changing from coarse columnar crystals to fine nanocrystals and amorphous body, the texture sequentially comprises coarse columnar crystals, fine columnar crystals and fine equiaxed crystals, the grain size of the interlayer is gradually decreased, in the interlayer, the Si content is gradually increased from 1 wt. % to 5 wt. %, and the grain size is gradually decreased from 60 nm to 20 nm.

2. The ion source enhanced AlCrSiN coating with the gradient Si content and the gradient grain size according to claim 1, wherein Cr in the ion source enhanced AlCrSiN coating is completely or partially replaced by Ti to obtain an AlTiSiN coating or an AlCrTiSiN coating.

3. The ion source enhanced AlCrSiN coating with the gradient Si content and the gradient grain size according to claim 1, wherein the substrate is subjected to an etching and cleaning in advance, comprising the steps of: evacuating a vacuum oven for a multi-arc ion plating to 2.010.sup.4 Pa, and then introducing Ar gas to the vacuum oven to adjust a pressure of the vacuum oven to 4.0 Pa and heating the vacuum oven to 450 C., turning on a cleaning Ti target, and then turning on an anode target, so as to form positive and negative electrodes with the cleaning Ti target to achieve a traction of electron motion, allowing electrons to collide with the Ar gas to generate Ar.sup.+, and then controlling a negative bias voltage to 200 V, thereby attracting the Ar.sup.+ to perform an ion bombardment on a surface of the substrate for a bombardment time of 45 min.

4. The ion source enhanced AlCrSiN coating with the gradient Si content and the gradient grain size according to claim 1, wherein the ion source enhanced AlCrSiN coating has a coefficient of friction of 0.36-0.40 at room temperature.

5. The ion source enhanced AlCrSiN coating with the gradient Si content and the grain size according to claim 1, wherein the ion source enhanced AlCrSiN coating has a microhardness greater than 3800 HK.

6. A method for preparing the ion source enhanced AlCrSiN coating with the gradient Si content and the gradient grain size according to claim 1, wherein the AlCrSiN coating is deposited by the steps of: (1) evacuating a vacuum oven to a background vacuum of 110.sup.4 to 210.sup.4 Pa, and raising a temperature of the vacuum oven to 480 C.; (2) introducing Ar gas to the vacuum oven, controlling a vacuum degree in the vacuum oven to 4.0 Pa and controlling a negative bias voltage for the substrate to 200 V, and then turning on a Ti target and controlling a target current of the Ti target to 80 A, followed by performing an etching and cleaning on a surface of the substrate by a high-energy ion bombardment at the negative bias voltage for the substrate of 200 V for a cleaning time of 45 min; (3) turning off the Ti target and introducing nitrogen gas to the vacuum oven, controlling the negative bias voltage for the substrate to 60 V and adjusting the vacuum degree in the vacuum oven to 3.5 Pa, the nitrogen gas being introduced in such way to maintain a constant pressure at the vacuum degree of 3.5 Pa, using two sets of AlCr targets, and adjusting currents of the two sets of the AlCr targets to 130 A for a period of 77 min; (4) continuously operating the two sets of the AlCr targets with the preset parameters, and adjusting a target current of an AlCrSi target to 130 A with the negative bias voltage for the substrate still being 60 V for a period of 58 min; (5) turning off one set of the AlCr targets, and continuously operating the remaining AlCr targets and the AlCrSi target with the preset parameters for a period of 88 min; and (6) turning off the two sets of the AlCr targets, and continuously operating the AlCrSi target with the preset parameters for a period of 120 min.

7. The method according to claim 6, wherein each AlCr target of the two sets of the AlCr targets has an atomic ratio of Al to Cr of 70:30.

8. The method according to claim 6, wherein the AlCrSi target has an atomic ratio of Al:Cr:Si of 60:30:10.

9. A cutting tool comprising the ion source enhanced AlCrSiN coating according to claim 1.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram of the ion cleaning of the present invention.

(2) FIG. 2A shows the surface morphology of the substrate after Ar.sup.+ etching at the current for cleaning of 40 A.

(3) FIG. 2B shows the surface morphology of the substrate after Ar.sup.+ etching at the current for cleaning of 70 A.

(4) FIG. 2C shows the surface morphology of the substrate after Ar.sup.+ etching at the current for cleaning of 100 A.

(5) FIG. 2D shows the three-dimensional surface morphology of the substrate of FIG. 2A.

(6) FIG. 2E shows the three-dimensional surface morphology of the substrate of FIG. 2B.

(7) FIG. 2F shows the three-dimensional surface morphology of the substrate of FIG. 2C.

(8) FIG. 3A shows the Rockwell indentation morphology of the AlCrSiN coatings deposited on the substrate after Ar.sup.+ etching at the current for cleaning of 40 A.

(9) FIG. 3B shows the Rockwell indentation morphology of the AlCrSiN coatings deposited on the substrate after Ar.sup.+ etching at the current for cleaning of 70 A.

(10) FIG. 3C shows the Rockwell indentation morphology of the AlCrSiN coatings deposited on the substrate after Ar.sup.+ etching at the current for cleaning of 100 A.

(11) FIG. 4 shows cutting life curves of the AlCrSiN coatings deposited on the substrates after Ar.sup.+ etching under different currents for cleaning.

(12) FIG. 5 shows a schematic structural diagram of the multilayer gradient AlCrSiN composite coating for cutting tools.

(13) FIG. 6 is a diagram showing the distribution of the content of the Si element in the interlayer as the coating thickness changes.

(14) FIG. 7 shows a transmission electron microscopy (TEM) image of the interlayer.

(15) FIG. 8A shows the overall cross-sectional image of the AlCrSiN composite coating for the cutting tool.

(16) FIG. 8B shows the morphology and diffraction pattern of the AlCrN interlayer.

(17) FIG. 8C shows the morphology of the interface between the interlayer and the transition layer 1.

(18) FIG. 8D shows the morphology and diffraction pattern of the transition layer 2.

(19) FIG. 8E shows the morphology of the interface between the transition layer 2 and the working layer.

(20) FIG. 8F shows the morphology and diffraction pattern of the working layer.

(21) FIG. 8G shows the high-resolution morphology of the working layer.

(22) FIG. 8H shows the high-resolution morphology of the working layer after inverse Fourier transform.

(23) FIG. 9A shows the Rockwell indentation morphology of the coating AlCrSiN-1.

(24) FIG. 9B shows the Rockwell indentation morphology of the coating AlCrSiN-2.

(25) FIG. 10 shows cutting life curves of the high-speed steel cutting tools coated with the AlCrSiN composite coatings without and with interlayer reinforcement.

DETAILED DESCRIPTION OF THE EMBODIMENTS

(26) Hereinafter, embodiments of the present invention will be described in detail. The embodiments are implemented based on the technical solutions of the present invention and the detailed implementations and specific operating procedures are provided. However, the protection scope of the present invention is not limited by the following embodiments.

Embodiment 1

(27) As shown in FIG. 1, the cylindrical Ti target 2 for high-energy ion cleaning and six targets 3 for coating deposition were distributed in the chamber 1 of a vacuum oven in this embodiment. When the vacuum oven reached a high vacuum, the cylindrical Ti target 2 was turned on for ionization to obtain a large amount of Ti ions, and at the same time, argon gas was introduced to excite Ar.sup.+ to etch and clean a substrate. In FIG. 1, 4 represents a workpiece.

(28) A pre-treated high-speed steel cutting tool was evenly fixed on a rotating stand in the chamber, and the rotation speed of the rotating stand was controlled to 3 rpm. After that, the chamber was evacuated to a background vacuum of 110.sup.4 to 210.sup.4 Pa, while turning on a heater to raise the temperature to 480 C.

(29) When the vacuum degree in the vacuum oven reached 2.010.sup.4 Pa, Ar gas with a purity of 99.999% was introduced, followed by heating to 450 C. The cylindrical Ti target was turned on as a traction arc target. The current during cleaning was controlled to 40 A, so that a large number of electrons were excited. A circular auxiliary anode target was turned on to form a positive electrode and a negative electrode with the Ti target, thereby achieving traction of electron motion. The electrons collided with the Ar gas in the vacuum oven to generate high density of Ar.sup.+. Negative bias voltage for the substrate was set to 200 V, attracting the Ar.sup.+ to perform ion bombardment on the surface of the substrate for the bombardment time of 45 min.

(30) After that, the cylindrical Ti arc target was turned off, and a N.sub.2 flow valve was opened, followed by controlling the negative bias voltage for the substrate to 60 V and adjusting the vacuum degree in the vacuum oven to about 3.5 Pa. N.sub.2 was introduced in such way to maintain a constant pressure. Two sets of AlCr targets were used and their currents were adjusted to 130 A for a period of 252 min.

(31) Then, the AlCr targets were turned off, and the current of a set of AlCrSi targets was adjusted to 130 A, with the negative bias voltage for the substrate still being 60 V, for a period of 122 min. Finally, the AlCrSi targets were turned off, the bias voltage power supply was turned off and the N.sub.2 flow valve was closed to complete the coating process. The cutting tool was cooled along with the vacuum oven to 25 C. and then removed.

(32) The substrate which was subjected to the ion etching and cleaning, and the prepared coating were tested.

Embodiment 2

(33) In the present embodiment, the current for cleaning of the Ti cylindrical arc was controlled to 70 A during the process of the high-energy Ar.sup.+ ion etching. The substrate which was subjected to the ion etching and cleaning, and the prepared coating were tested.

(34) For other aspects, this embodiment was performed in the same manner as in Embodiment 1.

Embodiment 3

(35) In the present embodiment, the current for cleaning of the Ti cylindrical arc was controlled to 100 A during the process of the high-energy Ar.sup.+ ion etching. The substrate which was subjected to the ion etching and cleaning, and the prepared coating were tested.

(36) For other aspects, this embodiment was performed in the same manner as in Embodiment 1. The AlCrSiN coating prepared in this embodiment was denoted as AlCrSiN-1, and the coating included sequentially an AlCrSiN working layer and an AlCrN bottom layer in order from the surface of the coating to the substrate.

(37) The detailed process parameters for the cleaning and deposition of the coating in each of the above embodiments are shown in Table 1.

(38) TABLE-US-00001 TABLE 1 Detailed process parameters for cleaning and deposition of AlCrSiN coatings. substrate bias gas flow substrate voltage (ml/min) target current (A) temperature deposition step (V) Ar N.sub.2 Ti AlCr AlCrSi ( C.) time (min) 1 200 650 0 40 0 0 450 70 100 2 60 0 680 0 130 0 450 252 3 60 0 680 0 0 130 450 122

(39) The sample of each embodiment, after being prepared, was subjected to relevant tests. The test results of the AlCrSiN coatings are shown in Table 2.

(40) TABLE-US-00002 TABLE 2 Test results of AlCrSiN coatings. L.sub.c2 surface roughness coating (N) HF R.sub.a S.sub.q I.sub.40 41 HF3 140 226 I.sub.70 46 HF2 88 140 I.sub.100 52 HF1 69 117

(41) In order to compare the three cleaned substrates and coatings in Embodiment 1, Embodiment 2 and Embodiment 3, the following tests were performed.

(42) FIGS. 2A-2F show SEM images and three-dimensional morphologies of the surfaces of the substrates after Ar.sup.+ etching treatment at different currents for cleaning. It can be found from FIG. 2A and FIG. 2D that when the current for cleaning was 40 A, there were still attached substances on the surface of the substrate after the Ar.sup.+ etching treatment. When the current for cleaning was increased to 70 A, the attached substances on the surface of the substrate were reduced. By further increasing the current for cleaning to 100 A, almost no attached substances existed on the surface of the substrate, and traces of etching appeared on the surface of the substrate. It can be found that the surface of the substrate can be effectively etched and cleaned by increasing the current for cleaning. In the present invention, the surface roughness of the substrates which were subjected to the etching and cleaning was detected using a stylus profiler and characterized by root mean square height (Sq) and arithmetical mean deviation (Ra). FIGS. 2D-2F show three-dimensional morphologies of the surfaces of the substrates after ion etching treatment at different currents for cleaning. When the currents for cleaning were 40 A, 70 A, and 100 A, the surface roughnesses Sq of the coatings were 1112 nm, 759 nm, and 536 nm, respectively, and the Ra values of the coatings were 705 nm, 525 nm, and 396 nm, respectively. It can be found that when the current for cleaning is increased, the intensity of the Ar.sup.+ etching is increased and the surface roughness of the substrate is significantly reduced.

(43) FIGS. 3A-3C show Rockwell indentation morphologies of the AlCrSiN coatings deposited on the substrates after Ar.sup.+ etching at different currents for cleaning. FIG. 3A shows when the current for cleaning was 40 A, the cracks of the coating around the indentation were distributed radially and the coating was measurably exfoliated. When the current for cleaning was increased to 70 A, both the number of cracks and the exfoliation of the coating were greatly reduced, as shown in FIG. 3B. However, when the current for cleaning was increased to 100 A, there was almost no exfoliation of the coating. According to the standards of adhesion strength, it can be seen that when the currents for cleaning were 40 A, 70 A, and 100 A, the adhesion strengths between the AlCrSiN coatings and the substrates were graded as HF3, HF2 and HF1, respectively.

(44) FIG. 4 shows cutting life curves of the coated cutting tools at a cutting speed of 50 m/min. When the wear at of the flank surface of cutting tool reached the limit of wear (0.2 mm), it can be found that the Ar.sup.+ cleaning process at different currents for cleaning has a significant impact on the service life of the cutting tool. In the case where the current for cleaning was 40 A, the cutting length was 11 m. When the current for cleaning was increased to 70 A, the cutting length of the cutting tool was increased to 18 m. However, when the current for cleaning was increased to 100 A, the cutting length of the cutting tool was further increased to 23 m, and its cutting life was increased to about 2 times or more of the cutting life when the current for cleaning was 40 A, which was mainly attributed to the good adhesion strength between the coating and the substrate. The results show that when the ion etching and cleaning process was performed at the current of 100 A under the low negative bias voltage, the coated cutting tool has the lowest surface roughness, the highest adhesion strength, and the longest cutting life. Therefore, before the coating is deposited, the high-energy Ar.sup.+ etching and cleaning performed on the substrate of the cutting tool can significantly prolong its cutting life.

Embodiment 4

(45) In the present embodiment, an AlCrSiN composite coating for cutting tools was specifically prepared by the following method.

(46) A pre-treated high-speed steel cutting tool was evenly fixed on a rotating stand in the chamber, and the rotation speed of the rotating stand was controlled to 3 rpm. After that, the chamber was evacuated to a background vacuum of 110.sup.4 to 2.sup.4 Pa, while turning on a heater to raise the temperature to 480 C.

(47) When the vacuum degree in the vacuum oven reached 2.010.sup.4 Pa, Ar gas with a purity of 99.999% was introduced, followed by heating to 450 C. The cylindrical Ti target was turned on as a traction arc target. The current during cleaning was controlled to 100 A, so that a large number of electrons were excited. A circular auxiliary anode target was turned on to form a positive electrode and a negative electrode with the Ti target, thereby achieving traction of electron motion. The electrons collided with the Ar gas in the vacuum oven to generate Ar.sup.+ having high density. Negative bias voltage for the substrate was set to 200 V, attracting the Ar.sup.+ to perform ion bombardment on the surface of the substrate for a bombardment time of 45 min.

(48) After that, the cylindrical Ti target was turned off, and a N.sub.2 flow valve was opened, followed by controlling the negative bias voltage for the substrate to 6 V and adjusting the vacuum degree in the vacuum oven to about 3.5 Pa. N.sub.2 was introduced in such way to maintain a constant pressure. Two sets of AlCr targets were used and their currents were adjusted to 130 A for a period of 77 min.

(49) Then, the two sets of AlCr targets were continued to operate with the preset parameters, and the current of a set of AlCrSi targets was adjusted to 130 A, with the negative bias voltage for the substrate still being 60 V, for a period of 58 min.

(50) Afterward, one set of the AlCr targets were turned off, and the remaining AlCr targets and the AlCrSi targets were continued to operate with the preset parameters for a period of 88 min.

(51) Then, the AlCr targets were turned off, and the set of the AlCrSi targets were continued to operate with the preset parameters for a period of 120 min. Finally, the AlCrSi targets were turned off, the bias voltage power supply was turned off and the N.sub.2 flow valve was closed to complete the coating process. The cutting tool was cooled along with the oven to 25 C. and removed.

(52) As shown in FIG. 5, the AlCrSiN coating prepared in this embodiment having an interlayer with a gradient Si content was denoted as AlCrSiN-2. The coating sequentially included an AlCrSiN working layer, an interlayer and an AlCrN bottom layer in order from the surface of the coating to the substrate. From the AlCrN bottom layer to the AlCrSiN working layer, Si content in the interlayer was gradually increased from 1 wt. % to 5 wt. %, as shown in FIG. 6. The texture of the multilayer coating sequentially included coarse columnar crystals, fine columnar crystals and fine equiaxed crystals, in which the grain size was gradually changed from 60 nm to 40 nm and then to 20 nm, as shown in FIG. 7.

(53) FIG. 7 shows a TEM image of the interlayer with the gradient Si content prepared with the process parameters, including the transition layer 1, the transition layer 2, and the transition layer 3, of which the respective textures are coarse columnar crystals, fine columnar crystals and fine equiaxed crystals.

(54) FIGS. 8A-8H show TEM images and diffraction patterns of the multiple layers of the AlCrSiN composite coating for the cutting tool. FIGS. 8A-8H show the overall cross-sectional image of the AlCrSiN composite coating for the cutting tool, the morphology and diffraction pattern of the AlCrN interlayer, the morphology of the interface between the interlayer and the transition layer 1, the morphology and diffraction pattern of the transition layer 2, the morphology of the interface between the transition layer 2 and the working layer, the morphology and diffraction pattern of the working layer, the high-resolution morphology of the working layer, and the high-resolution morphology of the working layer after inverse Fourier transform, respectively. The coating had a total thickness of about 5.0 m. The texture of the multilayer coating sequentially included coarse columnar crystals, fine columnar crystals and fine equiaxed crystals, in which the grain size was gradually changed from 60 nm to 40 nm and then to 20 nm.

(55) The coating had a surface microhardness of 3813.4 HK. The coating had a coefficient of friction of 0.36 to 0.4 in a ball-on-disc friction and wear test. The coatings were deposited on high-speed steel vertical milling cutters to perform cutting test for comparison under the following cutting conditions: wet cutting (water-based cutting fluid, the ratio of cutting fluid to water of 1:30); material to be cut: 20 CrMo (normalized, HB200); cutting speed: 94.2 m/min; feedrate: 600 mm/min; and axial and radial depth of cut: 2 mm. Even in such harsh environments, the service life of the coated cutting tool was increased by 2 times or more.

(56) To compare the two coatings of Embodiment 3 and Embodiment 4, the following tests were performed.

(57) FIGS. 9A-9B show Rockwell indentation morphologies of the coatings prepared by the two processes, wherein FIG. 9A shows the AlCrSiN-1, and FIG. 9B shows the AlCrSiN-2. From FIG. 9A, it can be found that the cracks of the coating around the indentation were distributed radially and the coating was measurably exfoliated. It can be seen from FIG. 9B that after reinforced by the interlayer with the gradient Si content, the coating had almost no exfoliation. According to the standards of adhesion strength, it can be seen that the adhesion strengths between the two coatings and the substrates were graded as HF3 and HF1, respectively.

(58) FIG. 10 shows cutting life curves under the same cutting conditions of the vertical milling cutters based on the high-speed steel substrates coated by the above two processes. In the case of specifying the flank wear, when the interlayer with the gradient Si content was used in the composite coating, the coating had an increased cutting life.

Embodiment 5

(59) In this embodiment, an AlTiSiN coating, in which Cr in the AlCrSiN composite coating for cutting tools was completely replaced by Ti, was specifically prepared by the following method.

(60) A pre-treated high-speed steel cutting tool was evenly fixed on a rotating stand in the chamber, and the rotation speed of the rotating stand was controlled to 3 rpm. After that, the chamber was evacuated to a background vacuum of 110.sup.4 to 210.sup.4 Pa, while turning on a heater to raise the temperature to 480 C.

(61) When the vacuum degree in the vacuum oven reached 2.010.sup.4 Pa, Ar gas with a purity of 99.999% was introduced, followed by heating to 450 C. The cylindrical Ti target was turned on as a traction arc target. The current during cleaning was controlled to 100 A, so that a large number of electrons were excited. A circular auxiliary anode target was turned on to form a positive electrode and a negative electrode with the Ti target, thereby achieving traction of electron motion. The electrons collided with the Ar gas in the vacuum oven to generate Ar.sup.+ having high density. Negative bias voltage for the substrate was set to 200 V, attracting the Ar.sup.+ to perform ion bombardment on the surface of the substrate for a bombardment time of 45 min.

(62) After that, the cylindrical Ti target was turned off, and a N.sub.2 flow valve was opened, followed by controlling the negative bias voltage for the substrate to 60 V and adjusting the vacuum degree in the vacuum oven to about 3.5 Pa. N.sub.2 was introduced in such way to maintain a constant pressure. Two sets of AlTi targets (Al:Ti=67:33) were used and their currents were adjusted to 120 A for a period of 75 min.

(63) Then, the two sets of AlTi targets were continued to operate with the preset parameters, and the current of a set of AlTiSi targets (Al:Ti:Si=60:30:10) was adjusted to 120 A, with the negative bias voltage for the substrate still being 60 V, for a period of 55 min.

(64) Afterward, one set of the AlTi targets were turned off, and the remaining AlTi targets and the AlTiSi targets were continued to operate with the preset parameters for a period of 85 min.

(65) Then, the AlTi targets were turned off, and the set of the AlTiSi targets were continued to operate with the preset parameters for a period of 120 min. Finally, the AlTiSi targets were turned off, the bias voltage power supply was turned off and the N.sub.2 flow valve was closed to complete the coating process. The cutting tool was cooled along with the oven to 25 C. and then removed.

Embodiment 6

(66) In this embodiment, an AlCrTiSiN coating, in which Cr in the AlCrSiN composite coating for cutting tools was partially replaced by Ti, was specifically prepared by the following method.

(67) A pre-treated high-speed steel cutting tool was evenly fixed on a rotating stand in the chamber, and the rotation speed of the rotating stand was controlled to 3 rpm. After that, the chamber was evacuated to a background vacuum of 110.sup.4 to 210.sup.4 Pa, while turning on a heater to raise the temperature to 480 C.

(68) When the vacuum degree in the vacuum oven reached 2.010.sup.4 Pa, Ar gas with a purity of 99.999% was introduced, followed by heating to 450 C. The cylindrical Ti target us turned on as a traction arc target. The current during cleaning was controlled to 100 A, so that a large number of electrons were excited. A circular auxiliary anode target was turned on to form a positive electrode and a negative electrode with the Ti target, thereby achieving traction of electron motion. The electrons collided with the Ar gas in the vacuum oven to generate Ar.sup.+ having high density. Negative bias voltage for the substrate was set to 200 V, attracting the Ar.sup.+ to perform ion bombardment on the surface of the substrate for a bombardment time of 45 min.

(69) After that, the cylindrical Ti target was turned off, and a N.sub.2 flow valve was opened, followed by controlling the negative bias voltage for the substrate to 60 V and adjusting the vacuum degree in the vacuum oven to about 3.5 Pa. N.sub.2 was introduced in such way to maintain a constant pressure. Two sets of AlCr targets (Al:Cr=70:30) were used and their currents were adjusted to 130 A for a period of 75 min.

(70) Then, the two sets of AlCr targets were continued to operate with the preset parameters, and the current of a set of AlTiSi targets (Al:Ti:Si=60:30:10) was adjusted to 120 A, with the negative bias voltage for the substrate still being 60 V, for a period of 55 min.

(71) Afterward, one set of the AlCr targets were turned off, and the remaining AlTi targets and the AlTiSi targets were continued to operate with the preset parameters for a period of 200 min.

(72) Finally, the AlTi targets and the set of the AlTiSi targets were turned off, the bias voltage power supply was turned off and the N.sub.2 flow valve was closed to complete the coating process. The cutting tool was cooled along with the oven to 25 C.; and removed.

(73) The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention shall fall within the protection scope of the claims of the invention.