Surface mounted fuse device having positive temperature coefficient body
10950372 ยท 2021-03-16
Assignee
Inventors
Cpc classification
H01C1/1406
ELECTRICITY
H01C7/027
ELECTRICITY
International classification
Abstract
A PPTC device including a PPTC body, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the PPTC body, wherein the PPTC body comprises a polymer matrix and a conductive filler.
Claims
1. A fuse device, comprising: a PPTC body; a first electrode, disposed on a first side of the PPTC body; a second electrode, disposed on a second side of the PPTC body; wherein the PPTC body comprises a polymer matrix and a conductive filler, wherein a current density for a hold current of the PPTC body is less than 0.16 A/mm2; and wherein a particle size of the conductive filler is small compared to a thickness of the PPTC body between the first electrode and the second electrode, wherein multiple interfaces are formed between particles of the conductive filler between the first electrode and the second electrode, leading to increased resistance as current travels between the first electrode and the second electrode.
2. The PPTC device of claim 1, further comprising an insulating layer, the insulating layer extending circumferentially around the PPTC body along a first elongated side and a second elongated side, and along a third elongated side and a fourth elongated side.
3. The fuse device of claim 1, wherein a volume fraction of conductive filler in the PPTC body ranges from 25% to 40%.
4. The fuse device of claim 1, wherein an aspect ratio of conductive filler particles is between 1:1 and 1:1.5.
5. A fuse device, comprising: a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body; wherein the PPTC body comprises a polymer matrix and a conductive filler, wherein a current density for a hold current of the PPTC body is greater than 0.4 A/mm2; and wherein a particle size of the conductive filler is large compared to a thickness of the PPTC body between the first electrode and the second electrode, wherein one or two interfaces are formed between particles of the conductive filler between the first electrode and the second electrode, leading to reduced resistance as current travels between the first electrode and the second electrode.
6. The fuse device of claim 5, wherein a volume fraction of conductive filler in the PPTC body ranges from 40% To 65%.
7. The fuse device of claim 5, wherein an aspect ratio of conductive filler particles is greater than 2.
8. The fuse device of claim 5, wherein the conductive filler comprises metal coated particles.
9. The fuse device of claim 8, wherein the metal coated particles comprise using a nickel core and a silver shell.
10. The fuse device of claim 8, wherein the metal coated particles comprise a WC core and a silver shell.
11. The fuse device of claim 5, further comprising an insulating layer, the insulating layer extending circumferentially around the PPTC body along a first elongated side and a second elongated side, and along a third elongated side and a fourth elongated side.
12. A fuse device, comprising: a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body; wherein the PPTC body comprises a polymer matrix and a conductive filler, wherein the PPTC body is elongated in a first direction, wherein the PPTC body comprises a first elongated side and a second elongated side, extending along the first direction, and wherein the first side and the second side extend perpendicularly to the first direction; and wherein a particle size of the conductive filler is large compared to a thickness of the PPTC body between the first electrode and the second electrode, wherein one or two interfaces are formed between particles of the conductive filler between the first electrode and the second electrode, leading to reduced resistance as current travels between the first electrode and the second electrode.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
DESCRIPTION OF EMBODIMENTS
(9) The present embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. The embodiments are not to be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey their scope to those skilled in the art. In the drawings, like numbers refer to like elements throughout.
(10) In the following description and/or claims, the terms on, overlying, disposed on and over may be used in the following description and claims. On, overlying, disposed on and over may be used to indicate that two or more elements are in direct physical contact with one another. Also, the term on,, overlying, disposed on, and over, may mean that two or more elements are not in direct contact with one another. For example, over may mean that one element is above another element while not contacting one another and may have another element or elements in between the two elements. Furthermore, the term and/or may mean and, it may mean or, it may mean exclusive-or, it may mean one, it may mean some, but not all, it may mean neither, and/or it may mean both, although the scope of claimed subject matter is not limited in this respect.
(11) In various embodiments, novel device structures and materials are provided for forming a PPTC device, where the PPTC device is configured as a surface mounted device (SMD).
(12) In various embodiments, an SMD is provided with a relatively high autotherm height (ATH) where and insulation layer is stacked on the PPTC surface. The autotherm height describes the resistance change between a low resistance ground state and a tripped state, where the number is measured in orders of magnitude.
(13) In some example, a polymer or polymers forming the PPTC body 102 may include polyvinylidene fluoride (PVDF), polytetrafluorethylene (PTFE), PFA(perflluorooxyalkane), polychlorotrifluoroethylene (PCTFE), low density polyethylene (LDPE), high density polyethylene (HDPE), LLDPE (linear low density polyethylene), HMPE (high molecular weight polyethylene), EVA (ethylene vinyl acetate copolymer), EBA (ethylene butyl acrylate copolymer).
(14) In various embodiments, the volume fraction of polymer may range from 35 to 75 volume % of the PPTC body 102.
(15) In various non-limiting embodiments, the melting point of the PPTC body 102 may be less than 320 C.
(16) In particular embodiments, the polymer matrix of the PPTC body 102 may be composed of two or more polymers where the melting point differs between at least two of the two or more polymers.
(17) According to various non-limiting embodiments, the volume fraction of conductive filler in the PPTC body 102 may range from 25% to 65%. In some embodiments, the conductive filler may be composed of metal particles, while in other embodiments the conductive filler may be composed of conductive ceramic particles. In still other embodiments, the conductive filer may be composed of a combination of metal particles and conductive ceramic particles. In various embodiments, the particle size of the conductive filler may range from 100 nm to 50 m, and in particular embodiments, equal to 1 m. The particle shape may be elongated in a given direction, or may be more equiaxed such as generally spherical shape. The embodiments are not limited in this context.
(18) By appropriate choice of volume fraction of conductive filler, particle size, and conductivity of conductive filler, the resistivity of the PPTC body 102 may be arranged for appropriate resistivity. In various embodiments, the resistivity of the conductive filler may be below 500 -cm in various non-limiting embodiments.
(19) In various embodiments, metal terminals and an insulation layer of a PPTC device may be stacked. In particular embodiments, a current density for hold current of the PPTC device 102 may be less than 0.16 A/mm.sup.2, while the resistivity is higher than 0.2 -cm. According to various embodiments, the ATH of the PPTC device 100 may exceed three decades (1000).
(20) In order to achieve a low hold current of less than <0.16 A/mm.sup.2 the volume fraction of conductive filler may be reduced to the lower range of the aforementioned range for conductive filler. Alternatively, or in addition, the particle size of conductive filler particles may be decreased to increase the contact resistance. For example, the overall resistance of a PPTC material may be dominated by contact resistance between conductive filler particles. For a given thickness of a PPTC body, decreases in particle size leads to larger surface number of interfaces between conductive particle surfaces when current travels from a first side of the PPTC body to an opposite side of the PPTC body. The larger number of interfaces leads to a higher value of contact resistance, and accordingly a higher contact resistance, leading to a higher overall resistance of the PPTC material.
(21) Alternatively, or in addition, the aspect ratio of conductive filler particles may be decreased to increase the resistivity of the PPTC body 102. For example, low aspect ratio particles may have an aspect ratio between 1:1 and 1:1.5. As the aspect ratio decreases, the particle's percolation threshold increases, meaning that it requires more filler loading to achieve the same conductivity as for a high aspect ratio conductive particle. Said differently, a material made of a matrix having high aspect ratio conductive filler particles, such as aspect ratio greater than 2, reaches a given conductivity at a lower volume fraction of conductive filler particles than a material where the matrix has low aspect ratio particles.
(22) In various additional embodiments, the composition and structure of a PPTC material may be arranged to generate a high hold current density, such as greater than 0.4 A/mm.sup.2, and a relatively low resistivity. In various embodiments, the high hold current density may be achieved by using a metal-coated particle as the constituent of a conductive filler.
(23) Turning now to
(24) Turning now to
(25)
(26) In additional embodiments, conductive particles used as filler may be provided without coatings for use in a PPTC layer. Conductive Fillers in these embodiments may have a volume fraction from 25 to 65 volume % of a PPTC layer, where metal or conductive ceramic particles are used, where the resistivity of the conductive filler is less than 500 -cm. Such PPTC layers may be used with metal terminals in both ends of the PTC block. In these embodiments, for a surface mount device, the current density may be between 0.01-0.0.7 A/mm.sup.2 and the PPTC resistivity may be between 0.1 and 20 -cm.
(27)
(28) While the present embodiments have been disclosed with reference to certain embodiments, numerous modifications, alterations and changes to the described embodiments are possible while not departing from the sphere and scope of the present disclosure, as defined in the appended claims. Accordingly, the present embodiments are not to be limited to the described embodiments, and may have the full scope defined by the language of the following claims, and equivalents thereof.