Electronic unit
10957490 ยท 2021-03-23
Assignee
Inventors
Cpc classification
H01G9/0003
ELECTRICITY
H01G2/06
ELECTRICITY
H05K5/0056
ELECTRICITY
H01G9/14
ELECTRICITY
H01G9/28
ELECTRICITY
International classification
H05K7/00
ELECTRICITY
H01G9/14
ELECTRICITY
H01G9/00
ELECTRICITY
Abstract
An electronic unit includes an electrolytic capacitor, a covering resin layer, and electronic components. The electrolytic capacitor is on an upper surface of an insulating substrate. The covering resin layer covers the upper surface of the insulating substrate and the electronic components. Part of the covering resin layer serves as an electrolytic capacitor covering portion. The electrolytic capacitor covering portion includes an outer peripheral covering portion that covers an outer peripheral surface of the electrolytic capacitor and a top covering portion that covers a top portion of the electrolytic capacitor. A thin wall groove is formed in the top covering portion. The outer peripheral covering portion extends upward beyond the top covering portion by a height h. The top covering portion easily breaks at the thin wall groove so that an explosion-proof valve easily operates. A region corresponding to the height h creates an operating space of the explosion-proof valve.
Claims
1. An electronic unit comprising: a substrate; electronic components mounted on the substrate; and a covering resin layer configured to continuously cover the substrate and the electronic components, wherein the electronic components include an electrolytic capacitor with a top portion having an explosion-proof valve mounted thereon, and part of the covering resin layer forms an outer peripheral covering portion that covers a cylindrical outer peripheral surface of the electrolytic capacitor; wherein the outer peripheral covering portion has an upper extension portion formed thereon, and the upper extension portion extends upward beyond the top portion of the electrolytic capacitor so that an operating region in which the explosion-proof valve operates is formed above the top portion by the upper extension portion that surrounds the operating region; wherein part of the covering resin layer forms a top covering portion that covers the explosion-proof valve of the electrolytic capacitor, and wherein when the explosion-proof valve operates, the top covering portion is breakable.
2. The electronic unit according to claim 1, wherein a thin wall groove is formed in the top covering portion, and wherein a thickness of the thin wall groove is set to a value such that the thin wall groove is breakable when the explosion-proof valve operates.
3. An electronic unit comprising: a substrate; electronic components mounted on the substrate; and a covering resin layer configured to continuously cover the substrate and the electronic components, wherein the electronic components include an electrolytic capacitor with a top portion having an explosion-proof valve mounted thereon, and part of the covering resin layer forms an outer peripheral covering portion that covers a cylindrical outer peripheral surface of the electrolytic capacitor and a top covering portion that covers the top portion, and wherein the top covering portion has a thin wall groove formed therein, and a thickness of the thin wall groove is set to a value such that the thin wall groove is breakable when the explosion-proof valve operates.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
DETAILED DESCRIPTION OF THE DRAWINGS
(5)
(6) As illustrated in the exploded perspective view of
(7) A variety of electronic components are mounted on the upper surface 2a of the insulating substrate 2. The electronic components include two digital amplifier integrated circuits (ICs) 3, two electrolytic capacitors 4, and an electronic component group 5 of the other electronic components. The electronic component group 5 includes an IC and a variety of chip components. The upper surface 2a of the insulating substrate 2 has two connectors 6 mounted thereon. Furthermore, as illustrated in
(8) The insulating substrate 2 and the electronic components mounted on the insulating substrate 2 are covered with a covering resin layer 10. The covering resin layer 10 is made of an adhesive thermoplastic resin, which is a polyester based hot melt resin. The covering resin layer 10 is formed by hot-melt molding. In the hot-melt molding, the digital amplifier IC 3, the two electrolytic capacitors 4, the two connectors 6, and the electronic component group 5 of the other electronic components are soldered on the insulating substrate 2. In addition, the heat sink 7 is placed on the digital amplifier IC 3, and the insulating substrate 2 and the electronic components mounted on the insulating substrate 2 are placed in a mold. Thereafter, heated and melted hot melt resin is injected into the mold at a low pressure.
(9) As illustrated in
(10) The electrolytic capacitor covering portion 14 is illustrated in
(11) The metal case 41 of the electrolytic capacitor 4 has the bottom portion 41c, a cylindrical outer peripheral surface 41a, and a top portion 41b directed upward of the insulating substrate 2. When the ambient temperature rises and, thus, the internal pressure of the electrolytic capacitor 4 rises beyond a prescribed value, the explosion-proof valve 44, which is part of the top portion 41b of the metal case 41, starts operating. Accordingly, the top portion 41b bursts so that the internal pressure of the electrolytic capacitor 4 escapes to the outside of the metal case 41. In this manner, the explosion phenomenon of the electrolytic capacitor 4 can be prevented by the operation of the explosion-proof valve 44.
(12) As illustrated in
(13) As illustrated in
(14) As illustrated in
(15) The electronic unit 1 illustrated in
(16) If the ambient temperature where the electronic unit 1 is used becomes abnormally high and, thus, the internal pressure of the metal case 41 of the electrolytic capacitor 4 exceeds the prescribed value, which represents an abnormal value, the explosion-proof valve 44 provided in the top portion 41b of the metal case 41 breaks out and attempts to release the internal pressure of the metal case 41. At this time, when the internal pressure of the metal case 41 acts on the top covering portion 14c of the electrolytic capacitor covering portion 14 through the explosion-proof valve 44, the center thin wall portion 21 and the thin wall grooves 22 each having a small thickness break in the portion 14c. Accordingly, the separating portions 23 separates from one another due to the breakage. In this manner, the internal pressure of the electrolytic capacitor 4 can be released to the outside of the covering resin layer 10.
(17) As illustrated in
(18) Since, in the electrolytic capacitor covering portion 14, the electrolytic capacitors 4 are completely covered with the covering resin layer 10, excellent waterproofness can be provided. In addition, when the internal pressure of the electrolytic capacitor 4 rises, the explosion-proof valve 44 becomes easy to operate. Furthermore, a working space of the explosion-proof valve 44 can be ensured.
(19) The present disclosure is characterized in that the outer peripheral covering portion 14b of the covering resin layer 10 extends to a position higher than the top portion 41b of the electrolytic capacitor 4. In terms of the characteristic, the top portion 41b of the electrolytic capacitor 4 does not have to be covered with the top covering portion 14c of the covering resin layer 10. That is, the top portion 41b of the electrolytic capacitor 4 may be exposed to the outside.
(20) In addition, the upper extension portion 14d of the outer peripheral covering portion 14b may have a square tubular shape or the like. Alternatively, the upper extension portion 14d may be formed by a plurality of protrusions extending upward at intervals in the circumferential direction so as to surround the explosion-proof valve 44, rather than being cylindrical.