Component Carrier, Method of Manufacturing the Same and Method of Shielding a Structural Feature in a Component Carrier

Abstract

A component carrier, a method of manufacturing the same and a method of shielding a structural feature in a component carrier are disclosed. The component carrier includes a laminated stack with a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; an electrically insulating cap structure selectively covering a structural feature at an exterior surface of the laminated stack; and a shielding structure on the cap structure for shielding the structural feature.

Claims

1. A component carrier, comprising: a laminated stack comprising a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; an electrically insulating cap structure selectively covering a structural feature at an exterior surface of the laminated stack, the structural feature is at least one of an optical waveguide and a connection structure connected to an antenna structure; and a shielding structure on the cap structure for shielding the structural feature.

2. The component carrier according to claim 1, wherein the electrically insulating cap structure is a solder resist.

3. The component carrier according to claim 1, wherein the structural feature, the cap structure and the shielding structure are formed on both opposing main surfaces of the laminated stack.

4. The component carrier according to claim 1, wherein in a cross-sectional view, the cap structure is substantially U-shaped.

5. The component carrier according to claim 1, wherein in a cross-sectional view, the shielding structure is substantially U-shaped.

6. (canceled)

7. The component carrier according to claim 1, wherein the structural feature is a component.

8. The component carrier according to claim 1, wherein the shielding structure shields at least against one of electromagnetic radiation, in particular high-frequency radiation, heat radiation, infrared radiation, light, and humidity; and/or the shielding structure is configured to protect a signal integrity of a signal being transported within the structural feature.

9. The component carrier according to claim 1, wherein on top of the shielding structure, at least one of a surface finish and a further solder resist is formed.

10. The component carrier according to claim 1, further comprising at least one of the following features: the component carrier comprises at least one component being surface mounted on and/or embedded in the component carrier, wherein the at least one component is in particular selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier, and a logic chip; wherein at least one of the electrically conductive layer structures of the component carrier comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene; wherein the shielding structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene; wherein the electrically insulating layer structure comprises at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide; wherein the electrically insulating cap structure comprises at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide, a resin, and a mold compound; wherein the component carrier is shaped as a plate; wherein the component carrier is configured as one of the group consisting of a printed circuit board, a substrate, and an interposer; wherein the component carrier is configured as a laminate-type component carrier.

11. A method of manufacturing a component carrier, the method comprising: providing a laminated stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; forming an electrically insulating cap structure selectively covering a structural feature at an exterior surface of the laminated stack, the structural feature is at least one of an optical waveguide and a connection structure connected to an antenna structure; and forming a shielding structure on the cap structure for shielding the structural feature.

12. The method according to claim 11, wherein the electrically insulating cap structure is a solder resist.

13. The method according to claim 11, wherein the structural feature, the cap structure and the shielding structure are formed on both opposing main surfaces of the laminated stack.

14. The method according to claim 11, wherein the shielding structure is manufactured at least by one of plating, sputtering and three-dimensional printing.

15. A method of shielding a structural feature in a component carrier, wherein the method comprises a step of using a component carrier with the structural feature, the component carrier configured with a laminated stack comprising a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures; an electrically insulating cap structure selectively covering a structural feature at an exterior surface of the laminated stack, wherein the structural feature is at least one of an optical waveguide and a connection structure connected to an antenna structure; and a shielding structure on the cap structure for shielding the structural feature.

16. The method according to claim 15, wherein the component carrier performs a high frequency application, in particular 5G.

17. The method according to claim 15, wherein the structural feature is shielded at least against one of electromagnetic radiation, in particular high-frequency radiation, heat radiation, infrared radiation, light, and humidity; and/or the shielding structure is configured to protect a signal integrity of a signal being transported within the structural feature.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG. 1 illustrates a cross-sectional view of a component carrier according to an exemplary embodiment of the invention.

[0036] FIG. 2 illustrates a method of manufacturing a component carrier according to an exemplary embodiment of the invention.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

[0037] The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.

[0038] FIG. 1 illustrates a cross-sectional view of a component carrier 1 according to an exemplary embodiment of the invention. The component carrier 1 is shaped as a plate. The component carrier 1 can be configured as one of the group consisting of a printed circuit board, a substrate, and an interposer. The component carrier 1 can be configured as a laminate-type component carrier.

[0039] The component carrier 1 comprises a laminated stack 2 having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures.

[0040] At least one of the electrically conductive layer structures of the component carrier can comprise at least one material of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene.

[0041] At least one of the electrically insulating layer structures can comprise at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide.

[0042] The component carrier 1 comprises an electrically insulating cap structure 3 selectively covering a structural feature 4 at an exterior surface of the laminated stack 2.

[0043] In the present embodiment, the electrically insulating cap structure 3 is a solder resist. In another embodiment, the electrically insulating cap structure 3 can comprise at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide, a resin, and a mold compound.

[0044] The component carrier 1 comprises a shielding structure 5 on the cap structure 3 for shielding the structural feature 4. The shielding structure 5 is arranged above the cap structure 3. The shielding structure 5 can comprise at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene. The shielding structure 5 can also exclusively comprise graphene.

[0045] The shielding structure 5 shields at least against one of electromagnetic radiation, in particular high-frequency radiation, heat radiation, infrared radiation, light, and humidity. The shielding structure 5 is configured to protect a signal integrity of a signal being transported within the structural feature 4.

[0046] In an embodiment, the shielding structure 5 does not carry a signal which is used for a signal processing or a current which is used for a power supply. The shielding structure 5 is not necessarily connected to a port or pad for signal processing or power supply. In an embodiment, the shielding structure 5 does exclusively have a shielding functionality.

[0047] In the present embodiment, the structural feature 4, the cap structure 3 and the shielding structure 5 are formed only on one of both opposing main surfaces of the laminated stack 2. However, in an alternative embodiment, the structural feature 4, the cap structure 3 and the shielding structure 5 can be formed on both opposing main surfaces of the laminated stack 2. The shielding structure 5 on both opposing main surfaces of the laminated stack 2 can shield one and the same structural feature 4.

[0048] In the present embodiment, the cap structure 3 and the shielding structure 5 are substantially U-shaped in the cross-sectional view of FIG. 1.

[0049] In an embodiment, the structural feature 4 can completely be surrounded by the stack 2 and the cap structure 3 in the cross section of FIG. 1. The structural feature 4 can also completely be surrounded by the stack 2, the cap structure 3 and the shielding structure 5 in the cross section of FIG. 1. The shielding structure 5 can selectively or globally be applied on the cap structure 3, and optionally on the exterior surface of the laminated stack 2.

[0050] In the present embodiment, the structural feature 4 is an electrically conductive trace.

[0051] In another embodiment, the structural feature 4 can be an electrically conductive pad of the electrically conductive layer structures, an optical wave guide such as a glass fiber structure, and/or a connection structure connected to an antenna structure, or a component.

[0052] Such a component can be surface mounted on and/or embedded in the component carrier 1, wherein the component is in particular selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier 1, and a logic chip. The component can be surface-mounted on the exterior surface of the laminated stack 2, or the component can be embedded in a cavity in the laminated stack 2, where the cavity forms a part of the exterior surface of the laminated stack 2.

[0053] In a modified embodiment, at least one of a surface finish and a further solder resist can be formed on top of the shielding structure 5 and/or the stack 2. For example, after processing interior layer structures of the component carrier 1, the stack 2 and/or the shielding structure 5, it is possible to cover (in particular by lamination) one or both opposing main surfaces of the processed layer structures symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, a build-up may be continued until a desired number of layers is obtained.

[0054] After having completed formation of the stack 2 of electrically insulating layer structures and electrically conductive layer structures, it is possible to proceed with a surface treatment of the obtained layers structures or component carrier 1.

[0055] In particular, as the further solder resist, an electrically insulating solder resist may be applied to one or both opposing main surfaces of the layer stack 2 or component carrier 1 in terms of surface treatment. For instance, it is possible to form such as the further solder resist on an entire main surface and to subsequently pattern the layer of the further solder resist so as to expose one or more electrically conductive surface portions which shall be used for electrically coupling the component carrier 1 to an electronic periphery. The surface portions of the component carrier 1 remaining covered with the further solder resist may be efficiently protected against oxidation or corrosion, in particular surface portions containing copper.

[0056] It is also possible to apply a surface finish selectively to exposed electrically conductive surface portions of the stack 2 or the component carrier 1 in terms of surface treatment. Such a surface finish may be an electrically conductive cover material on exposed electrically conductive layer structures (such as pads, conductive tracks, etc., in particular comprising or consisting of copper) on a surface of the component carrier 1 or the stack 2. If such exposed electrically conductive layer structures are left unprotected, then the exposed electrically conductive component carrier material (in particular copper) might oxidize, making the component carrier less reliable. A surface finish may then be formed for instance as an interface between a surface mounted component and the component carrier 1. The surface finish has the function to protect the exposed electrically conductive layer structures (in particular copper circuitry) and enable a joining process with one or more components, for instance by soldering. Examples for appropriate materials for a surface finish are OSP (Organic Solderability Preservative), Electroless Nickel Immersion Gold (ENIG), gold (in particular Hard Gold), chemical tin, nickel-gold, nickel-palladium, etc.

[0057] FIG. 2 illustrates a method of manufacturing a component carrier 1 according to an exemplary embodiment of the invention.

[0058] In a step S1, a laminated stack 2 having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures (not shown) is provided. In detail, the plurality of electrically conductive layer structures comprises a structural feature 4 which is formed at an exterior surface of the laminated stack 2. In the present embodiment, the structural feature 4 is an electrically conductive trace. In another embodiment, the structural feature 4 can be an electrically conductive pad of the electrically conductive layer structures, an optical wave guide such as a glass fiber structure, and/or a connection structure connected to an antenna structure, or a component.

[0059] Such a component can be surface mounted on and/or embedded in the component carrier 1, wherein the component is in particular selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier 1, and a logic chip. The component can be surface-mounted on the exterior surface of the laminated stack 2, or the component can be embedded in a cavity in the laminated stack 2, where the cavity forms a part of the exterior surface of the laminated stack 2.

[0060] At least one of the electrically conductive layer structures of the stack 2 can comprise at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material such as graphene.

[0061] At least one of the electrically insulating layer structures of the stack 2 can comprise at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide.

[0062] In a step S2, an electrically insulating cap structure 3 is formed to selectively cover the structural feature 4. In the present embodiment, the electrically insulating cap structure 3 is a solder resist.

[0063] In another embodiment, the electrically insulating cap structure 3 can comprise at least one of the group consisting of resin, in particular reinforced or non-reinforced resin, for instance epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide, a resin, and a mold compound.

[0064] A material of the electrically insulating cap structure 3, for example the solder resist, is applied as a paste, a dry film, a lamination film or a liquid onto the structural feature 4. The material of the electrically insulating cap structure 3 can be photoimageable and globally applied onto the structural feature 4 and optionally on the stack 2. Thereafter, the material of the electrically insulating cap structure 3 is selectively cured and exposed, for example by means of heat or UV light, and the remaining unexposed material of the electrically insulating cap structure 3 can be removed, for example by stripping.

[0065] Alternatively, the material of the electrically insulating cap structure 3 can be applied by screen printing, spraying or curtain coating, or it can selectively be applied by ink jet printing.

[0066] In a step S3, a shielding structure 5 is formed on the cap structure 3 for shielding the structural feature 4. The shielding structure 5 can be manufactured at least by one of plating, sputtering and three-dimensional printing. In case of plating, a thin seed layer can chemically be applied on the cap structure 3, which is followed by a galvanic plating step on the thus formed seed layer.

[0067] The shielding structure 5 can also be formed by subtractive or additive processes. As additive processes, SAP (Semi-additive processes) or mSAP (modified Semi-additive processes) can be utilized.

[0068] The shielding structure 5 can selectively or globally be applied on the cap structure 3, and optionally on the exterior surface of the laminated stack 2.

[0069] In an embodiment, the shielding structure 5 does not carry a signal which is used for a signal processing or a current which is used for a power supply. The shielding structure 5 is not necessarily connected to a port or pad for signal processing or power supply. In an embodiment, the shielding structure 5 does exclusively have a shielding functionality.

[0070] In the present embodiment, the structural feature 4, the cap structure 3 and the shielding structure 5 are formed on only one of the opposing main surfaces of the laminated stack 2. In an alternative embodiment, the cap structure 3 and the shielding structure 5 can be formed on both opposing main surfaces of the laminated stack 2. The shielding structure 5 on both opposing main surfaces of the laminated stack 2 can shield one and the same structural feature 4. The component carrier 1 can symmetrically be formed, that is, the structural features 4, the cap structures 3 and the shielding structures 5 are arranged on both opposing main surfaces of the laminated stack 2.

[0071] In an embodiment, the component carrier 1 can perform a high frequency application, in particular 5G. The structural feature 4 can be shielded at least against one of electromagnetic radiation, in particular high-frequency radiation, heat radiation, infrared radiation, light, and humidity. In general, the shielding structure 5 is configured to protect a signal integrity of a signal being transported within the structural feature 4.

[0072] In the present embodiment, the cap structure 3 and the shielding structure 5 are formed to be substantially U-shaped in the cross-sectional view of FIG. 2 so that the structural feature 4 is shielded even at the lateral sides.

[0073] In an embodiment, the structural feature 4 can completely be surrounded by the stack 2 and the shielding structure 5 in the cross section of FIG. 2. The structural feature 4 can also completely be surrounded by the stack 2, the cap structure 3 and the shielding structure 5 in the cross section of FIG. 2.

[0074] In a modified embodiment, at least one of a surface finish and a further solder resist can be formed on top of the shielding structure 5 and/or the stack 2. For example, after processing interior layer structures of the component carrier 1, the stack 2 and/or the shielding structure 5, it is possible to cover (in particular by lamination) one or both opposing main surfaces of the processed layer structures symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, a build-up may be continued until a desired number of layers is obtained.

[0075] After having completed formation of the stack 2 of electrically insulating layer structures and electrically conductive layer structures, it is possible to proceed with a surface treatment of the obtained layers structures or component carrier 1.

[0076] In particular, as the further solder resist, an electrically insulating solder resist may be applied to one or both opposing main surfaces of the layer stack 2 or component carrier 1 in terms of surface treatment. For instance, it is possible to form such as the further solder resist on an entire main surface and to subsequently pattern the layer of the further solder resist so as to expose one or more electrically conductive surface portions which shall be used for electrically coupling the component carrier 1 to an electronic periphery. The surface portions of the component carrier 1 remaining covered with the further solder resist may be efficiently protected against oxidation or corrosion, in particular surface portions containing copper.

[0077] It is also possible to apply a surface finish selectively to exposed electrically conductive surface portions of the stack 2 or the component carrier 1 in terms of surface treatment. Such a surface finish may be an electrically conductive cover material on exposed electrically conductive layer structures (such as pads, conductive tracks, etc., in particular comprising or consisting of copper) on a surface of the component carrier 1 or the stack 2. If such exposed electrically conductive layer structures are left unprotected, then the exposed electrically conductive component carrier material (in particular copper) might oxidize, making the component carrier less reliable. A surface finish may then be formed for instance as an interface between a surface mounted component and the component carrier 1. The surface finish has the function to protect the exposed electrically conductive layer structures (in particular copper circuitry) and enable a joining process with one or more components, for instance by soldering. Examples for appropriate materials for a surface finish are OSP (Organic Solderability Preservative), Electroless Nickel Immersion Gold (ENIG), gold (in particular Hard Gold), chemical tin, nickel-gold, nickel-palladium, etc.

[0078] It should be noted that the term comprising does not exclude other elements or steps and the article a or an does not exclude a plurality. Also, elements described in association with different embodiments may be combined.

[0079] Implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which use the solutions shown and the principle according to the invention even in the case of fundamentally different embodiments.