METHOD OF FABRICATING HEXAGONAL BORON NITRIDE

Abstract

Disclosed herein is a method of fabricating hexagonal boron nitride in which hexagonal boron nitride is epitaxially grown. A method of fabricating hexagonal boron nitride includes placing a catalytic metal in a chamber, the catalytic metal having a hexagonal crystal structure and having a lattice mismatch of 15% or less with hexagonal boron nitride (h-BN) in a chamber; and growing hexagonal boron nitride on the catalytic metal at a temperature of 800 C. or lower while supplying a nitrogen source and a boron source into the chamber.

Claims

1. A method of fabricating hexagonal boron nitride, the method comprising: placing a catalytic metal in a chamber, the catalytic metal having a hexagonal crystal structure and having a lattice mismatch of greater than or equal to 0% and less than or equal to 15% with hexagonal boron nitride (h-BN); and growing hexagonal boron nitride on the catalytic metal at a temperature of 800 C. or lower while supplying a nitrogen source and a boron source into the chamber.

2. The method of claim 1, wherein the catalytic metal includes crystals of at least one of cobalt (Co), an CoCr alloy, a CoN alloy, a CoIr alloy, zinc (Zn), ruthenium (Ru), technetium (Tc), osmium (Os), and rhenium (Re).

3. The method of claim 1, wherein the nitrogen source and the boron source include at least one of borazine, 1,3,5-trimethylborazine, 2,4,6-trimethylborazine, aminoborane, 2,4,6-trichloroborazine, B-tri(methylamino)borazine, and ammonia borane.

4. The method of claim 1, wherein the nitrogen source includes at least one of ammonia (NH.sub.3) gas and nitrogen (N.sub.2) gas.

5. The method of claim 1, wherein the boron source includes at least one of BH.sub.3, BF.sub.3, BCl.sub.3, B.sub.2H.sub.6, (CH.sub.3CH.sub.2).sub.3B, and (CH.sub.3).sub.3B.

6. The method of claim 1, wherein the nitrogen source and the boron source are provided by vaporizing solid boron nitride powder.

7. The method of claim 1, further comprising: removing pollutants from a surface of the catalytic metal before growing the hexagonal boron nitride.

8. The method of claim 7, wherein the removing the pollutants from the surface of the catalytic metal includes supplying hydrogen (H.sub.2) gas into the chamber and increasing a temperature in the chamber to 1,000 C.

9. The method of claim 8, wherein the removing the pollutants from the surface of the catalytic metal is performed for 20 minutes while supplying the hydrogen gas at a flow rate of 100 sccm.

10. The method of claim 1, wherein the growing the hexagonal boron nitride is performed by inductively coupled plasma chemical vapor deposition.

11. The method of claim 1, wherein the growing the hexagonal boron nitride is performed at a temperature ranging from 350 C. to 800 C.

12. The method of claim 11, wherein the growing the hexagonal boron nitride includes: supplying hydrogen (H.sub.2) gas into the chamber at a flow rate of 0 sccm to 100 sccm, supplying argon (Ar) gas into the chamber at a flow rate of 0 sccm to 100 sccm, supplying borazine gas into the chamber at a flow rate of 0.01 sccm to 1 sccm, and maintaining pressure in the chamber at 0.01 Torr to 1 Torr.

13. The method of claim 1, wherein a lattice mismatch between the catalytic metal and the hexagonal boron nitride is greater than or equal to 0% and less than or equal to 10.4%.

14. The method of claim 1, wherein the growing the hexagonal boron nitride provides a grown hexagonal boron nitride that has a mono-crystalline structure.

15. The method of claim 1, wherein growing the hexagonal boron nitride provides a grown hexagonal boron nitride and a root mean square surface roughness of the grown hexagonal boron nitride is 2 nm or less and greater than or equal to 0 nm.

16. The method of claim 15, wherein the root mean square surface roughness of the grown hexagonal boron nitride is 1.7 nm or less and greater than or equal to 0 nm.

17. A hexagonal boron nitride, fabricated by the method of claim 1, wherein the hexagonal boron nitride has a mono-crystalline structure and has a root mean square surface roughness of 2 nm or less and greater than or equal to 0 nm.

18. An electric device, comprising: the hexagonal boron nitride of claim 17; and a two-dimensional material on the hexagonal boron nitride.

19. The electric device of claim 18, wherein the two-dimensional material includes graphene, transition metal dichalcogenide, black phosphorus, or phosphorene.

20. A semiconductor device, comprising: a substrate including a source region and a drain region that each includes a doped semiconductor; a first hexagonal boron nitride and a second hexagonal boron nitride fabricated by the method of claim 1 on the substrate, the first hexagonal boron nitride being on the source region, and the second hexagonal boron nitride being disposed on the drain region; a source electrode on the first hexagonal boron nitride; and a drain electrode on the second hexagonal boron nitride.

21. A method of fabricating hexagonal boron nitride, the method comprising: placing a catalytic metal in a chamber, the catalytic metal having a hexagonal crystal structure and including crystals of at least one of cobalt (Co), an CoCr alloy, a CoN alloy, a CoIr alloy, zinc (Zn), ruthenium (Ru), technetium (Tc), osmium (Os), and rhenium (Re); and growing hexagonal boron nitride on the catalytic metal at a temperature in a range of about 350 C. to about 800 C. while supplying a nitrogen source and a boron source into the chamber.

22. The method of claim 21, wherein the growing hexagonal boron nitride includes: supplying hydrogen (H.sub.2) gas into the chamber at a flow rate of 0 sccm to 100 sccm, supplying argon (Ar) gas into the chamber at a flow rate of 0 sccm to 100 sccm, supplying borazine gas into the chamber at a flow rate of 0.01 sccm to 1 sccm, and maintaining pressure in the chamber at 0.01 Torr to 1 Torr.

23. The method of claim 21, wherein the growing hexagonal boron nitride is performed by inductively coupled plasma chemical vapor deposition.

24. The method of claim 21, further comprising: removing pollutants from a surface of the catalytic metal before growing the hexagonal boron nitride.

25. The method of claim 21, wherein the nitrogen source and the boron source include at least one of borazine, 1,3,5-trimethylborazine, 2,4,6-trimethylborazine, aminoborane, 2,4,6-trichloroborazine, B-tri(methylamino)borazine, and ammonia borane.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above/and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0033] FIG. 1 is a schematic view of a system for fabricating hexagonal boron nitride according to an embodiment;

[0034] FIG. 2 is an atomic force microscope photograph of the surface of the hexagonal boron nitride fabricated by the system of FIG. 1;

[0035] FIG. 3 shows the low-energy electron diffraction measurement results of the hexagonal boron nitride fabricated by the system of FIG. 1;

[0036] FIG. 4 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 400 C.;

[0037] FIG. 5 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 500 C.;

[0038] FIG. 6 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 600 C.;

[0039] FIG. 7 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 800 C.;

[0040] FIG. 8 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown by the method according to Comparative Example 1;

[0041] FIG. 9 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown by the method according to Comparative Example 2;

[0042] FIGS. 10A to 10E are schematic perspective views illustrating a process of manufacturing a field effect transistor using hexagonal boron nitride; and

[0043] FIG. 11 is a cross-sectional view of a schematic structure of a semiconductor device including hexagonal boron nitride.

DETAILED DESCRIPTION

[0044] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, embodiments of inventive concepts may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments are merely described below, by referring to the figures, to explain aspects. As used herein, the term and/or includes any and all combinations of one or more of the associated listed items.

[0045] Expressions such as at least one of, when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. Expressions such as at least one of, when preceding a list of elements (e.g., A, B, and C), modify the entire list of elements and do not modify the individual elements of the list. For example, at least one of A, B, and C, at least one of A, B, or C, one of A, B, C, or a combination thereof, and one of A, B, C, and a combination thereof, respectively, may be construed as covering any one of the following combinations: A; B; A and B; A and C; B and C; and A, B, and C.

[0046] Hereinafter, a method of fabricating hexagonal boron nitride will be described in detail with reference to the accompanying drawings. In the following drawings, like reference numerals refer to like elements, and the size of each element may be exaggerated for clarity and convenience of explanation. Further, the following embodiments are merely illustrative, and may be variously modified. Further, in the following layer structures, the expressions over or on may include not only being in contact directly on/under/left/right but also not being in contact above/below/left/right.

[0047] Hexagonal boron nitride (h-BN) includes boron atoms and nitrogen atoms that are alternately arranged in a planar hexagonal crystal structure. Hexagonal boron nitride has an interlayer structure in which adjacent boron atoms and nitrogen atoms overlap each other due to the polarity of the two atoms. Hexagonal boron nitride may be used for various applications because it is very inactive in an oxidizing atmosphere, has high thermal conductivity and high electrical insulating properties, and has stable chemical properties. The present disclosure provides a method of epitaxially growing hexagonal boron nitride at a relatively low temperature.

[0048] For example, FIG. 1 is a schematic view of a system for fabricating hexagonal boron nitride according to an embodiment. Referring to FIG. 1, hexagonal boron nitride may be grown using an inductively coupled plasma chemical vapor deposition (ICP-CVD) system 10. The inductively coupled plasma chemical vapor deposition system 10 may include a chamber 11 in which reaction occurs, source inlets 12 and 13 for providing source gas 15 into the chamber 11, and a coil 14 for ionizing the source gas 15 introduced into the chamber 11 and generating plasma 17. The coil 14 may be located in the chamber 11 or may be located outside the chamber 11. The inductively coupled plasma chemical vapor deposition system 10 may have other various structures. However, the detailed structure of the inductively coupled plasma chemical vapor deposition system 10 is beyond the scope of the present embodiment, and thus a detailed description thereof will be omitted.

[0049] First, according to an embodiment, a catalytic metal 16 is placed in the chamber 11. The catalytic metal 16 may have a flat thin film form. The catalytic metal 16 may include a metal material having the same hexagonal crystal structure as hexagonal boron nitride. In particular, the catalytic metal 16 may include a metal material having a lattice mismatch of 15% or less (e.g., greater than or equal to 0% and less than or equal to 15%) with hexagonal boron nitride. For example, the catalytic metal 16 may include crystals of at least one material selected from cobalt (Co), an CoCr alloy, a CoN alloy, a CoIr alloy, zinc (Zn), ruthenium (Ru), technetium (Tc), osmium (Os), and rhenium (Re). For example, the lattice constant of hexagonal boron nitride is about 250 pm (picometer), and the lattice constant of rhenium (Re) is about 276.1 pm, so that the lattice mismatch between rhenium (Re) and hexagonal boron nitride is about 10.4%. Further, the lattice constant of cobalt (Co) having the lowest lattice mismatch of about 0.3% with hexagonal boron nitride is about 250.71 pm. Accordingly, the scope of the metal material may be further restricted such that a metal material having a lattice mismatch of 10.4% or less with hexagonal boron nitride may be used as the catalytic metal 16.

[0050] In order for the catalytic metal 16 to have a hexagonal crystal structure, a catalytic metal 16 previously grown on a growth substrate (not shown) having a hexagonal crystal structure may be used. For example, a catalytic metal 16 obtained by growing the aforementioned metal layer on an aluminum oxide (Al.sub.2O.sub.3) substrate at an appropriate temperature. The growth temperature condition for allowing the catalytic metal 16 to have a hexagonal crystal structure may be changed depending on the metal material. Although the catalytic metal 16 is detached from the growth substrate and only the catalytic metal 16 is placed in the chamber 11, both the growth substrate and the catalytic metal 16 may be placed in the chamber 11.

[0051] Further, before the catalytic metal 16 is placed in the chamber 11, selectively, the surface of the catalytic metal 16 may be processed to improve smoothness. For example, as a polishing process, at least one of chemical polishing, physical polishing, chemical-mechanical polishing, and electropolishing may be used.

[0052] After the catalytic metal 16 is placed in the chamber 11, selectively, pollutants such as carbon may be removed from the surface of the catalytic metal 16. For example, in a hydrogen atmosphere, pollutants such as carbon existing on the surface of the catalytic metal 16 may be removed by bonding with hydrogen. For example, the temperature in the chamber 11 may be increased to 1,000 C. while supplying hydrogen gas (H.sub.2) into the chamber 11 at a flow rate of about 100 sccm. The process of removing the pollutants may be performed for about 20 minutes. No current is applied to the coil 14 while removing the pollutants. If there is little contaminant on the surface of the catalytic metal 16, the process of removing these pollutants may be omitted.

[0053] After the pollutants are removed from the surface of the catalytic metal 16, hexagonal boron nitride may be grown on the catalytic metal 16 by inductively coupled plasma chemical vapor deposition. According to the present embodiment, hexagonal boron nitride may be grown on the catalytic metal 16 at a temperature of 800 C. or lower while supplying a nitrogen source and a boron source into the chamber 11. For this purpose, the nitrogen source and the boron source are provided into the chamber 11 together with hydrogen gas (H.sub.2) or a mixture (Ar/H.sub.2) of argon gas and hydrogen gas while maintaining the temperature in the chamber 11 at 800 C. or lower. Simultaneously, a current is applied to the coil 14.

[0054] A compound of nitrogen and boron may be used as the nitrogen source and the boron source. For example, the compound of nitrogen and boron may include at least one material selected from borazine ((BH).sub.3(NH).sub.3), aminoborane (NH.sub.2BH.sub.2), ammonia borane (H.sub.3NBH.sub.3) 1,3,5-trimethylborazine (C.sub.3H.sub.12B.sub.3N.sub.3), 2,4,6-trimethylborazine, 2,4,6-trichloroborazine (B.sub.3Cl.sub.3H.sub.3N.sub.3), and B-tri(methylamino)borazine (B.sub.3.0N.sub.4.40.1C.sub.2.00.1H.sub.9.30.2). Alternatively, the compound of nitrogen and boron may be provided into the chamber 11 by vaporizing solid boron nitride powder.

[0055] Further, a nitrogen precursor, as the nitrogen source, may be provided into the chamber 11, and a boron precursor, as the boron source, may be provided into the chamber 11. The nitrogen precursor may include, for example, at least one material selected from ammonia (NH.sub.3) gas and nitrogen (N.sub.2) gas. Further, the boron precursor includes at least one material selected from borane (BH.sub.3), boron trifluoride (BF.sub.3), boron trichloride (BCl.sub.3), B.sub.2H.sub.6, (CH.sub.3CH.sub.2).sub.3B, and (CH.sub.3).sub.3B.

[0056] The nitrogen source and the boron source are ionized by an electric field inside the coil 14 while passing through the inside of the chamber 11. As a result, the nitrogen source and the boron source are present in the state of plasma 17 in the chamber 11. Thereafter, nitrogen atoms and boron atoms in the state of plasma 17 are coupled with each other to grow crystals of hexagonal boron nitride.

[0057] For example, when hexagonal boron nitride is fabricated using borazine, the temperature in the chamber 11 may be maintained at about 800 C. or lower. Further, borazine may be supplied into the chamber 11 at a flow rate of about 0.01 sccm to about 1 sccm while applying power of about 500 W or less to the coil 14. Simultaneously, hydrogen (H.sub.2) gas may be supplied into the chamber 11 at a flow rate of about 0 sccm to about 100 sccm, and argon (Ar) gas may be supplied into the chamber 11 at a flow rate of about 0 sccm to about 100 sccm. In this case, the pressure in the chamber 11 may maintain about 0.01 Torr to about 1 Torr.

[0058] FIG. 2 is an atomic force microscope photograph of the surface of the hexagonal boron nitride fabricated by the system of FIG. 1. For example, the hexagonal boron nitride of FIG. 2 is fabricated at a temperature of about 390 C. using cobalt grown to a thickness of 500 nm on an aluminum oxide substrate as the catalytic metal 16. Referring to FIG. 2, it may be found that hexagonal boron nitride having a relatively smooth and uniform surface was formed. The hexagonal boron nitride fabricated in this way was measured to have a root mean square (RMS) surface roughness of about 2 nm or less, more precisely about 1.7 nm or less.

[0059] FIG. 3 shows the measurement results of the hexagonal boron nitride fabricated by the aforementioned method using low-energy electron diffraction (LEED). Referring to FIG. 3, as a result of the LEED measurement, six diffraction spots arranged in one hexagonal pattern form were found. This means that the hexagonal boron nitride formed by the aforementioned method has a mono-crystalline structure. Therefore, the hexagonal boron nitride formed by the aforementioned method may have high quality.

[0060] FIGS. 4 to 7 are graphs showing the Raman spectrum measurement results of hexagonal boron nitrides grown at different temperatures. FIG. 4 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 400 C., FIG. 5 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 500 C., FIG. 6 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 600 C., and FIG. 7 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown at a temperature of 800 C.

[0061] Referring to FIG. 4, it may be found that a peak of the Raman spectrum appears at about 1370 cm.sup.1. Raman spectra have different peaks depending on the kind of materials. Since hexagonal boron nitride has an inherent peak at 1370 cmt, it may be confirmed that hexagonal boron nitride may be fabricated even at a temperature of about 400 C. However, in the graph of FIG. 4, peaks are also seen at positions other than 1370 cm.sup.1. This means that heterogeneous components of cubic boron nitride (c-BN), amorphous boron nitride (a-BN), boron nitride carbon (B.sub.xC.sub.yN.sub.z) or BN soot are partially formed in addition to heterogeneous components of hexagonal boron nitride. Sequentially referring to FIGS. 5 to 7, as the growth temperature of hexagonal boron nitride increases, a certain peak appears at 1370 cm.sup.1. In particular, in the case of hexagonal boron nitride grown at 600 C. and 800 C., the intensity of the peak at 1370 cm.sup.1 is much stronger than that of other peaks.

[0062] As may be found from the measurement results of FIGS. 2 to 7, according to the present embodiment, when a catalytic metal having a lattice mismatch of about 15% or less with hexagonal boron nitride is used, hexagonal boron nitride may be grown even at a low temperature of about 800 C. or lower. For example, hexagonal boron nitride may be grown within a temperature range of about 350 C. to about 800 C. Accordingly, since the growth temperature of hexagonal boron nitride is low, the process cost for fabricating hexagonal boron nitride may be reduced and the production cost of hexagonal boron nitride may be reduced.

[0063] Further, since the hexagonal boron nitride fabricated by the method of the present embodiment may have a mono-crystalline structure, the quality of hexagonal boron nitride may be improved. For example, when hexagonal boron nitride having a polycrystalline structure is used as an anti-diffusion film or surface antioxidant film of an electrical device or an electronic device, a dopant or hydrogen may penetrate into crystal defects of hexagonal boron nitride. In this case, the performance of the anti-diffusion film or the surface antioxidant film may be degraded. Hexagonal boron nitride having a mono-crystalline structure may improve the performance of the anti-diffusion film or the surface antioxidant film.

[0064] Meanwhile, FIG. 8 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown by the method according to Comparative Example 1. The hexagonal boron nitride according to Comparative Example 1 was fabricated by ICP-CVD at 700 C., 800 C., and 900 C. using platinum (Pt) crystals having a face-centered cubic structure as a catalytic metal. Further, in Comparative Example 1, pollutants were not removed from the surface of the platinum catalytic metal. Referring to the graph of FIG. 8, in the hexagonal boron nitride fabricated at 700 C., no peak appeared at 1370 cm.sup.1, and in the hexagonal boron nitride fabricated at 800 C. and 900 C., a weak peak appeared at about 1365 cm.sup.1.

[0065] Further, FIG. 9 is a graph showing the Raman spectrum measurement results of hexagonal boron nitride grown by the method according to Comparative Example 2 In Comparative Example 2, pollutants were removed from the surface of a catalytic metal at a temperature of 1000 C. in a hydrogen atmosphere. Besides, hexagonal boron nitride was fabricated under the same conditions as those in Comparative Example 1. Referring to the graph of FIG. 9, in the hexagonal boron nitride fabricated at 700 C., no peak appeared at 1370 cm.sup.1, in the hexagonal boron nitride fabricated at 800 C., a weak peak appeared at about 1370 cm.sup.1, and in the hexagonal boron nitride fabricated at 900 C., a relatively strong peak appeared at about 1370 cmt. Accordingly, it may be found that platinum (Pt), which is mainly used as a catalytic metal when fabricating hexagonal boron nitride by conventional thermochemical vapor deposition (T-CVD), is not suitable for growing hexagonal boron nitride at 800 C. or lower by the method according to the present embodiment.

[0066] The hexagonal boron nitride fabricated by the aforementioned method according to the present embodiment may be usefully used as a passivation film such as an anti-diffusion film or a surface antioxidant film. In this case, since the hexagonal boron nitride has a mono-crystalline structure, the performance of the passivation film may be improved. Further, hexagonal boron nitride may be used as a substrate for growth of other two-dimensional materials such as graphene.

[0067] For example, when hexagonal boron nitride may be used as a substrate for growth of other two-dimensional materials, the catalytic metal 16 under the hexagonal boron nitride may be removed. For example, the catalytic metal 16 may be removed by an acidic solution. When a hexagonal boron nitride thin film is coated with a support member, for example, polymethyl methacrylate (PMMA) prior to acid treatment, and then the catalytic metal 16 is removed, a subsequent transfer process of hexagonal boron nitride may be facilitated.

[0068] Hexagonal boron nitride has less lattice mismatch with graphene. Therefore, when the hexagonal boron nitride thin film is transferred onto a catalytic metal for graphene and then graphene is formed by CVD, high-quality graphene may be obtained. In addition to graphene, other two-dimensional materials such as black phosphorus (BP), phosphorene, which is a two-dimensional allotrope, and transition metal dichalcogenide (TMDC), which is a compound of transition metal and chalcogen element, may be grown on hexagonal boron nitride. For example, transition metal dichalcogenide such as MoS.sub.2, WS.sub.2, TaS.sub.2, HfS.sub.2, ReS.sub.2, TiS.sub.2, NbS.sub.2, SnS.sub.2, MoSe.sub.2, WSe.sub.2, TaSe.sub.2, HfSe.sub.2, ReSe.sub.2, TiSe.sub.2, NbSe.sub.2, SnSe.sub.2, MoTe.sub.2, WTe.sub.2, TaTe.sub.2, HfTe.sub.2, ReTe.sub.2, TiTe.sub.2, NbTe.sub.2, SnTe.sub.2, black phosphorus, or phosphorene may be grown on hexagonal boron nitride. Besides, other various two-dimensional materials, such as TiOx, NbOx, MnOx, VaOx, MnO.sub.3, TaO.sub.3, WO.sub.3, MoCl.sub.2, CrCl.sub.3, RuCl.sub.3, BiI.sub.3, PbCl.sub.4, GeS, GaS, GeSe, GaSe, PtSe.sub.2, In.sub.2Se.sub.3, GaTe, InS, InSe, and InTe, may be grown on hexagonal boron nitride.

[0069] Further, an electric device or an electronic device such as a field effect transistor (FET) may be manufactured using a two-dimensional material grown on hexagonal boron nitride. For example, FIGS. 10A to 10E are schematic perspective views illustrating a process of manufacturing a field effect transistor using hexagonal boron nitride.

[0070] First, referring to FIG. 10A, hexagonal boron nitride 22 and graphene 21 may be placed on a silicon on insulator (SOI) substrate including silicon 23 and disposed on an insulating film 24 including an insulating material such as SiO.sub.2. For example, the hexagonal boron nitride 22 coated with PMMA is transferred to the SOI substrate, and the PMMA is removed by acetone. Thereafter, the graphene 21 is transferred onto the hexagonal boron nitride 22. Alternatively, the hexagonal boron nitride 22 may be transferred onto a catalytic metal for graphene, PMMA may be removed, and then the graphene 21 may be grown on the hexagonal boron nitride 22. Thereafter, the catalytic metal for graphene is removed, and the hexagonal boron nitride 22 and the graphene 21 thereon are transferred onto the SOI substrate.

[0071] Next, referring to FIGS. 10B and 10C, a first electrode 26 and a second electrode 27 are deposited on the graphene 21 through a mask 25 by sputtering or the like. Next, referring to FIGS. 10D and 10E, except for a portion covered by a mask 28 between the first electrode 26 and the second electrode 27, remaining portions of the hexagonal boron nitride 22 and the graphene 21 are removed. For example, the hexagonal boron nitride 22 and the graphene 21 on the SOI substrate may be removed using 02 plasma. In this way, a field effect transistor 20 including a channel made of the graphene 21 may be manufactured. Here, the graphene 21 remaining between the first electrode 26 and the second electrode 27 may serve as a channel.

[0072] Although it is explained in the above description with reference to FIGS. 10A to 10E that the graphene 21 is grown on or transferred onto the hexagonal boron nitride 22, this is merely an example. In addition to the graphene 21, other various two-dimensional materials may be grown on or transferred onto the hexagonal boron nitride 22 to manufacture an electric device such as a transistor. For example, two-dimensional materials such as transition metal dichalcogenide, black phosphorus, phosphorene, TiOx, NbOx, MnOx, VaOx, MnO.sub.3, TaO.sub.3, WO.sub.3, MoCl.sub.2, CrCl.sub.3, RuCl.sub.3, BiI.sub.3, PbCl.sub.4, GeS, GaS, GeSe, GaSe, PtSe.sub.2, In.sub.2Se.sub.3, GaTe, InS, InSe, and InTe may be grown on or transferred onto the hexagonal boron nitride 22 instead of the graphene 21 to manufacture an electric device such as a field effect transistor.

[0073] Meanwhile, hexagonal boron nitride may be interposed at an interface between a metal and a semiconductor to lower the Schottky barrier occurring at the interface between the metal and the semiconductor. For example, FIG. 11 is a cross-sectional view of a schematic structure of a semiconductor device including hexagonal boron nitride. Referring to FIG. 11, a semiconductor device 100 may include semiconductor layers 101, 102, and 103, metal layers 106 and 107 electrically contacting the semiconductor layers 101, 102, and 103, and hexagonal boron nitrides 104 and 105 disposed between the semiconductor layers 101, 102, and 103 and the metal layers 106 and 107.

[0074] Here, the semiconductor layers 101, 102, and 103 may include a well region 101 formed of a semiconductor doped with a first type dopant, and a source region 102 and a drain region 103 formed of a semiconductor doped with a second type dopant electrically opposite to the first type dopant. Although it is shown in FIG. 11 that the well region 101 is doped with a p-type dopant and the source and drain regions 102, 103 are doped with an n-type dopant, this is only an example. The well region 101 may be doped with an n-type dopant, and the source and drain regions 102, 103 may be doped with a p-type dopant.

[0075] The hexagonal boron nitrides 104 and 105 may include a first hexagonal boron nitride 104 disposed on the source region 102, and a second hexagonal boron nitride 105 disposed on the drain region 103. Although not shown in FIG. 11, as shown in FIGS. 10A to 10E, two-dimensional materials such as graphene, transition metal dichalcogenide, black phosphorus, and phosphorene may be additionally grown on or transferred onto the hexagonal boron nitrides 104 and 105,

[0076] The metal layers 106 and 107 may include a source electrode 106 disposed on the first hexagonal boron nitride 104 and a drain electrode 107 disposed on the second hexagonal boron nitride 105. The metal layers 106 and 107 including the source electrode 106 and the drain electrode 107 may include a metal such as magnesium (Mg), aluminum (Al), scandium (Sc), titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), nickel (Ni), copper (Cu), zinc (Zn), gallium (Ga), zirconium (Zr), niobium (Nb), molybdenum (Mo), lead (Pd), silver (Ag), cadmium (Cd), indium (In), tin (Sn), lanthanum (La), hafnium (Hf), tantalum (Ta), tungsten (W), iridium (Ir), platinum (Pt), gold (Au), bismuth (Bi), or an alloy thereof.

[0077] The semiconductor device 100 may further include a gate insulating film 108 disposed on the well region 101 between the source region 102 and the drain region 103, a gate electrode 109 disposed on the gate insulating film 108, and a spacer 110 surrounding the sidewalls of the gate insulating film 108 and the gate electrode 109. The well region 101, source region 102, and drain region 103 may be formed in a semiconductor substrate. The spacer 110 may limit and/or prevent the gate insulating film 108 and the gate electrode 109 from directly contacting the source electrode 106 and the drain electrode 107. The gate insulating film 108 may be formed of SiO.sub.2, SiNx, HfO.sub.2, Al.sub.2O.sub.3, or the like, and the gate electrode 109 may be made of polysilicon, or may be made of the same metal material as the metal layers 106 and 107. The spacer 110 may be made of an insulating material such as SiO.sub.2 or SiNx.

[0078] In such a structure, the first hexagonal boron nitride 104 may lower the Schottky barrier between the source region 102 and the source electrode 106, and the second hexagonal boron nitride 105 may lower the Schottky barrier between the drain region 103 and the drain electrode 107. Therefore, the contact resistance between the source region 102 and the source electrode 106 and between the drain region 103 and the drain electrode 107 may be reduced.

[0079] It should be understood that embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as available for other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope as defined by the following claims.