DIELECTRIC MATERIALS

Abstract

The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Claims

1. Polymerizable compound, represented by Formula (1):
P.sup.1-Sp.sup.1-(MG-Sp.sup.1).sub.m-P.sup.1 Formula (1) wherein: m is an integer from 1 to 60; P.sup.1 denotes a polymerizable group (P); Sp.sup.1 denotes at each occurrence a spacer group (Sp) or a single bond; MG is a rod-shaped mesogenic group, which is preferably selected from Formula (2):
-(A.sup.21-Z.sup.21).sub.k-A.sup.22-(Z.sup.22-A.sup.23).sub.l- Formula (2) wherein: A.sup.21 to A.sup.23 are independently and at each occurrence independently of one another an aryl group, heteroaryl group, heterocyclic group, alicyclic group or cyclic imide group optionally being substituted by one or more identical or different groups L; Z.sup.21 and Z.sup.22 are independently and at each occurrence independently from each other, O, S, CO, COO, OCO, SCO, COS, OCOO, CONR.sup.01, NR.sup.01CO, NR.sup.01CONR.sup.02, NR.sup.01COO, OCONR.sup.01, OCH.sub.2, CH.sub.2O, SCH.sub.2, CH.sub.2S, CF.sub.2O, OCF.sub.2, CF.sub.2S, SCF.sub.2, CH.sub.2CH.sub.2, (CH.sub.2).sub.4, CF.sub.2CH.sub.2, CH.sub.2CF.sub.2, CF.sub.2CF.sub.2, CHN, NCH, NN, CHCR.sup.01, CY.sup.01CY.sup.02, CC, CHCHCOO, OCOCHCH, or a single bond; R.sup.01 and R.sup.02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms; L is F, Cl, Br, I, CN, NO.sub.2, NCO, NCS, OCN, SCN, C(O)NR.sup.xxR.sup.yy, C(O)OR.sup.xx, C(O)R.sup.xx, NR.sup.xxR.sup.yy, OH, SF.sub.5, or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 20 C atoms, wherein one or more H atoms are optionally replaced by F or Cl, CN or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 6 C atoms; R.sup.xx and R.sup.yy independently of each other denote H or alkyl with 1 to 12 C-atoms; Y.sup.01 and Y.sup.02 each, independently of one another, denote H, alkyl having 1 to 12 C atoms, aryl, F, Cl, or CN; and k and l are each and independently 0, 1, 2, 3 or 4.

2. Polymerizable compound according to claim 1, wherein the polymerizable groups P are selected from groups containing a CC double bond or CC triple bond, and groups which are suitable for polymerization by a ring-opening reaction.

3. Polymerizable compound according to claim 1, wherein the polymerizable groups P are selected from the group consisting of of CH.sub.2CW.sup.1COO, CH.sub.2CW.sup.1CO, ##STR00055## CH.sub.2CW.sup.2(O).sub.k3, CW.sup.1.sub.2CHCO(O).sub.k3, CW.sup.1.sub.2CHCONH, CH.sub.2CW.sup.1CONH, CH.sub.3CHCHO, (CH.sub.2CH).sub.2CHOCO, (CH.sub.2CHCH.sub.2).sub.2CHOCO, (CH.sub.2CH).sub.2CHO, (CH.sub.2CHCH.sub.2).sub.2N, (CH.sub.2CHCH.sub.2).sub.2NCO, CH.sub.2CW.sup.1CONH, CH.sub.2CH(COO).sub.k1-Phe-(O).sub.k2, CH.sub.2CH(CO).sub.k1-Phe-(O).sub.k2, and Phe-CHCH, wherein: W.sup.1 denotes H, F, Cl, CN, CF.sub.3, phenyl or alkyl having 1 to 5 C atoms; W.sup.2 denotes H or alkyl having 1 to 5 C atoms; W.sup.3 and W.sup.4 each, independently of one another, denote H, Cl or alkyl having 1 to 5 C atoms; Phe denotes 1,4-phenylene, which is optionally substituted by one or more radicals L as being defined above but being different from P-Sp; and k.sub.1, k.sub.2 and k.sub.3 each, independently of one another, denote 0 or 1; and k.sub.4 is an integer from 1 to 10.

4. Polymerizable compound according to claim 1, wherein the spacer groups Sp are selected from the formula Sp-X, so that the radical P-Sp- corresponds to the formula P-Sp-X, wherein: Sp denotes (a) straight chain or branched chain alkylene having 1 to 40, preferably 1 to 30 C atoms, which is optionally mono- or polysubstituted by F, Cl, Br, I or CN and in which, in addition, one or more non-adjacent CH.sub.2 groups may each be replaced, independently of one another, by O, S, NH, NR.sup.01, SiR.sup.01R.sup.02, CO, COO, OCO, OCOO, SCO, COS, NR.sup.01COO, OCONR.sup.01, NR.sup.01CONR.sup.01, CHCH or CC in such a way that O and/or S atoms are not linked directly to one another, or (b) -Sp.sup.x-G-Sp.sup.y-, wherein Sp.sup.x and Sp.sup.y denote independently of each other alkylene having 1 to 20 C atoms or a single bond; G denotes cycloalkylene having 3 to 20 C atoms which is optionally mono- or polysubstituted by alkyl having 1 to 20 C atoms; X denotes O, S, CO, COO, OCO, OCOO, CONR.sup.01, NR.sup.01CO, NR.sup.01CONR.sup.01, OCH.sub.2, CH.sub.2O, SCH.sub.2, CH.sub.2S, CF.sub.2O, OCF.sub.2, CF.sub.2S, SCF.sub.2, CF.sub.2CH.sub.2, CH.sub.2CF.sub.2, CF.sub.2CF.sub.2, CHN, NC, NN, CHCR.sup.01, CY.sup.01CY.sup.02, CC, CHCHCOO, OCOCHCH or a single bond; R.sup.01 and R.sup.02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms; and Y.sup.01 and Y.sup.02 each, independently of one another, denote H, F, Cl or CN.

5. Polymerizable compound according to claim 1, wherein the spacer groups Sp are selected from the list consisting of (CH.sub.2).sub.p1, (CH.sub.2CH.sub.2O).sub.q1CH.sub.2CH.sub.2, CH.sub.2CH.sub.2SCH.sub.2CH.sub.2, CH.sub.2CH.sub.2NHCH.sub.2CH.sub.2, (SiR.sup.01R.sup.02O).sub.p1, (CH.sub.2).sub.p1-(cyclo-C.sub.6H.sub.8R.sup.01R.sup.02)(CH.sub.2).sub.p1 and ##STR00056## wherein: p1 is an integer from 1 to 60; q1 is an integer from 1 to 12; and R.sup.01 and R.sup.02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms.

6. Polymerizable compound according to claim 1, wherein A.sup.21 to A.sup.23 denote independently and, in case of multiple occurrence, independently of one another, a moiety selected from the following groups a) to e): a) trans-1,4-cyclohexylene, 1,4-cyclohexenylene and 4,4-bicyclohexylene, in which one or more non-adjacent CH.sub.2 groups may be replaced by O and/or S and wherein one or more H atoms may be replaced by a group L; b) 1,4-phenylene, 1,3-phenylene, 4,4-biphenylene, 2,5-thiphene and 2,6-dithieno[3,2-b:2,3-d]thiophene in which one or two CH groups may be replaced by N and where one or more H atoms may be replaced by a group L; c) tetrahydropyran-2,5-diyl, 1,3-dioxane-2,5-diyl, tetrahydrofuran-2,5-diyl, cyclobut-1,3-diyl, piperidine-1,4-diyl, thiophene-2,5-diyl and selenophen-2,5-diyl, which may be substituted one or more groups L; d) saturated, partially unsaturated or completely unsaturated, and optionally substituted, polycyclic radicals having 5 to 20 cyclic C atoms, of which one or more can also be replaced by heteroatoms, preferably selected from the group consisting of bicyclo [1.1.1] pentane-1,3-diyl, bicyclo [2.2.2] octane-1,4-diyl, spiro [3.3] heptane-2,6-diyl, tricyclo [3.3.1.1] decane-1,3-diyl, ##STR00057## ##STR00058## where one or more H atoms may be replaced by a group L, and/or one or more double bonds may be replaced by single bonds, and/or one or more CH groups may be replaced by N, and where M denotes O, S, CH.sub.2, CHY.sup.03 or CY.sup.03Y.sup.04; Y.sup.03, Y.sup.04 denote independently of each other one of the meanings given above for R.sup.01, F, Cl, CN, OCF.sub.3 or CF.sub.3, and preferably H, F, Cl, CN, OCF.sub.3 or CF.sub.3; W.sup.5, W.sup.6 denote independently of each other CH.sub.2CH.sub.2, CHCH, CH.sub.2O, OCH.sub.2, C(R.sup.cR.sup.d) or O; R.sup.c, R.sup.d denote independently of each other H or alkyl having 1 to 6 C atoms, preferably H, methyl or ethyl; and R.sup.03, R.sup.04 denote independently of each other H, F, straight chain or branched chain alkyl having 1 to 12 C atoms where one or more H atoms may be replaced by F; e) cyclic imides selected from the group consisting of: ##STR00059## where one or more H atoms may be replaced by a group L, and/or one or more double bonds may be replaced by single bonds, and/or one or more CH groups may be replaced by N.

7. Method for forming a polymer comprising the following steps: (i) providing a polymerizable starting material comprising one or more polymerizable compounds according to claim 1; and (ii) polymerizing said polymerizable starting material.

8. Method for forming a polymer according to claim 7, wherein the polymerizable starting material further comprises one or more additional polymerizable compounds which are capable to react with the polymerizable compound to form a copolymer.

9. Method for forming a polymer according to claim 7, wherein the polymerizable starting material is polymerized in step (ii) by radical or ionic polymerization or by exposure to radiation.

10. Polymer, obtainable by the method for forming a polymer according to claim 7.

11. Polymer containing at least one repeating unit which is derived from the polymerizable compound of Formula (1) as defined in claim 1.

12. Polymer according to claim 11, wherein the repeating unit comprises a structural unit represented by Formula (4):
[-Sp.sup.1-(MG-Sp.sup.1).sub.m-]Formula (4)

13. Electronic device comprising a polymer according to claim 11.

14. Electronic device according to claim 13, wherein the polymer forms a dielectric layer.

15. Manufacturing method for preparing a packaged microelectronic structure, in which a substrate is provided with a coating comprising one or more polymerized liquid crystalline monomers, wherein the method comprises the following steps: (1) applying a polymerizable composition comprising one or more polymerizable compounds according to claim 1 to a surface of a substrate; and (2) curing said polymerizable composition to form a dielectric layer.

16. Manufacturing method for preparing a packaged microelectronic structure according to claim 15, wherein the polymerizable composition further comprises one or more additional polymerizable compounds which are capable to react with the polymerizable compound to form a copolymer.

17. Manufacturing method for preparing a packaged microelectronic structure according to claim 15, wherein the polymerizable composition further comprises one or more inorganic filler materials.

18. Microelectronic device comprising a packaged microelectronic structure obtainable by the manufacturing method according to claim 15.

Description

DETAILED DESCRIPTION

[0071] Definitions

[0072] The term liquid crystal, mesomorphic compound, or mesogenic compound (also shortly referred to as mesogen) means a compound that under suitable conditions of temperature, pressure and concentration can exist as a mesophase or in particular as a LC phase. Non-amphiphilic mesogenic compounds comprise for example one or more calamitic, banana-shaped or discotic mesogenic groups.

[0073] The term calamitic means a rod- or board/lath-shaped compound or group. The term banana-shaped means a bent group in which two, usually calamitic, mesogenic groups are linked through a semi-rigid group in such a way as not to be co-linear. The term discotic means a disc- or sheet-shaped compound or group.

[0074] The term mesogenic group or its abbreviation MG means a group with the ability to induce liquid crystal (LC) phase behavior. Mesogenic groups, especially those of the non-amphiphilic type, are usually either calamitic or discotic. The compounds comprising mesogenic groups do not necessarily have to exhibit an LC phase themselves. It is also possible that they show LC phase behavior only in mixtures with other compounds, or when the mesogenic compounds or the mixtures thereof are polymerized. For the sake of simplicity, the term liquid crystal is used hereinafter for both mesogenic and LC materials.

[0075] A calamitic mesogenic compound is usually comprising a calamitic, i.e. rod- or lath-shaped, mesogenic group consisting of one or more aromatic or alicyclic groups connected to each other directly or via linkage groups, optionally comprising terminal groups attached to the short ends of the rod, and optionally comprising one or more lateral groups attached to the long sides of the rod, wherein these terminal and lateral groups are usually selected e.g. from carbyl or hydrocarbyl groups, polar groups like halogen, nitro, hydroxy, etc., or polymerizable groups.

[0076] A discotic mesogenic compound is usually comprising a discotic, i.e. relatively flat disc- or sheet-shaped mesogenic group consisting for example of one or more condensed aromatic or alicyclic groups, like for example triphenylene, and optionally comprising one or more terminal groups that are attached to the mesogenic group and are selected from the terminal and lateral groups mentioned above.

[0077] The term reactive mesogen or its abbreviation RM means a polymerizable mesogenic or liquid crystalline compound, which is preferably a monomeric or oligomeric compound. Polymerizable compounds with one polymerizable group are also referred to as monoreactive compounds, compounds with two polymerizable groups as direactive compounds, and compounds with more than two polymerizable groups as multireactive compounds. Compounds without a polymerizable group are also referred to as non-reactive compounds.

[0078] The term spacer or spacer group, also referred to as Sp below, is known to the person skilled in the art and is described in the literature. Unless stated otherwise, the term spacer or spacer group above and below denotes a flexible organic group, which in a polymerizable mesogenic compound (RM) connects the mesogenic group and the polymerizable group(s).

[0079] The term polymer includes, but is not limited to, homopolymers, copolymers, for example, block, random, and alternating copolymers, terpolymers, quaterpolymers, etc., and blends and modifications thereof. Furthermore, unless otherwise specifically limited, the term polymer shall include all possible configurational isomers of the material. These configurations include, but are not limited to isotactic, syndiotactic, and atactic symmetries. A polymer is a molecule of high relative molecular mass, the structure of which essentially comprises the multiple repetition of units (i.e. repeating units) derived, actually or conceptually, from molecules of low relative mass (i.e. monomers). In the context of the present invention polymers are composed of more than 60 monomers.

[0080] The term oligomer is a molecular complex that consists of a few monomer units, in contrast to a polymer, where the number of monomers is, in principle, unlimited. Dimers, trimers and tetramers are, for instance, oligomers composed of two, three and four monomers, respectively. In the context of the present invention oligomers may be composed of up to 60 monomers.

[0081] The term monomer as used herein refers to a molecule which can undergo polymerization thereby contributing constitutional units (repeating units) to the essential structure of a polymer or an oligomer.

[0082] The term homopolymer as used herein stands for a polymer derived from one species of (real, implicit or hypothetical) monomer.

[0083] The term copolymer as used herein generally means any polymer derived from more than one species of monomer, wherein the polymer contains more than one species of corresponding repeating unit. In one embodiment the copolymer is the reaction product of two or more species of monomer and thus comprises two or more species of corresponding repeating unit. It is preferred that the copolymer comprises two, three, four, five or six species of repeating unit. Copolymers that are obtained by copolymerization of three monomer species can also be referred to as terpolymers. Copolymers that are obtained by copolymerization of four monomer species can also be referred to as quaterpolymers. Copolymers may be present as block, random, and/or alternating copolymers.

[0084] The term block copolymer as used herein stands for a copolymer, wherein adjacent blocks are constitutionally different, i.e. adjacent blocks comprise repeating units derived from different species of monomer or from the same species of monomer but with a different composition or sequence distribution of repeating units.

[0085] Further, the term random copolymer as used herein refers to a polymer formed of macromolecules in which the probability of finding a given repeating unit at any given site in the chain is independent of the nature of the adjacent repeating units. Usually, in a random copolymer, the sequence distribution of repeating units follows Bernoullian statistics.

[0086] The term alternating copolymer as used herein stands for a copolymer consisting of macromolecules comprising two species of repeating units in alternating sequence.

[0087] Electronic packaging is a major discipline within the field of electronic engineering, and includes a wide variety of technologies. It refers to inserting discrete components, integrated circuits, and MSI (medium-scale integration) and LSI (large-scale integration) chips (usually attached to a lead frame by beam leads) into plates through hole on multilayer circuit boards (also called cards), where they are soldered in place. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission, protection from electrostatic discharge maintenance, operator convenience, and cost.

[0088] The term microelectronic device as used herein refers to electronic devices of very small electronic designs and components. Usually, but not always, this means micrometer-scale or smaller. These devices typically contain one or more microelectronic components which are made from semiconductor materials and interconnected in a packaged structure to form the microelectronic device. Many electronic components of normal electronic design are available in a microelectronic equivalent. These include transistors, capacitors, inductors, resistors, diodes and naturally insulators and conductors can all be found in microelectronic devices. Unique wiring techniques such as wire bonding are also often used in microelectronics because of the unusually small size of the components, leads and pads.

[0089] Points of attachment (binding sites) of structural elements presented in this patent application may be indicated by

##STR00006##

wherein * represents the structural element and

##STR00007##

a binding site.

Preferred Embodiments

[0090] Polymerizable Compound

[0091] The present invention relates to a polymerizable compound represented by Formula (1):

P.sup.1-Sp.sup.1-(MG-Sp.sup.1).sub.m-P.sup.1 Formula (1)

[0092] wherein: [0093] m is an integer from 1 to 60; [0094] P.sup.1 denotes a polymerizable group (P); [0095] Sp.sup.1 denotes at each occurrence a spacer group (Sp) or a single bond; [0096] MG is a rod-shaped mesogenic group, which is preferably selected from Formula (2):

-(A.sup.21-Z.sup.21).sub.k-A.sup.22-(Z.sup.22-A.sup.23).sub.l- Formula (2)

[0097] wherein: [0098] A.sup.21 to A.sup.23 are independently and at each occurrence independently of one another an aryl group, heteroaryl group, heterocyclic group, alicyclic group or cyclic imide group optionally being substituted by one or more identical or different groups L; [0099] Z.sup.21 and Z.sup.22 are independently and at each occurrence independently from each other, O, S, CO, COO, OCO, SCO, COS, OCOO, CONR.sup.01, NR.sup.01CO, NR.sup.01CONR.sup.02, NR.sup.01COO, OCONR.sup.01, OCH.sub.2, CH.sub.2O, SCH.sub.2, CH.sub.2S, CF.sub.2O, OCF.sub.2, CF.sub.2S, SCF.sub.2, CH.sub.2CH.sub.2, (CH.sub.2).sub.4, CF.sub.2CH.sub.2, CH.sub.2CF.sub.2, CF.sub.2CF.sub.2, CHN, NCH, NN, CHCR.sup.01, CY.sup.01CY.sup.02, CC, CHCHCOO, OCOCHCH, or a single bond; [0100] R.sup.01 and R.sup.02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms; [0101] L is F, Cl, Br, I, CN, NO.sub.2, NCO, NCS, OCN, SCN, C(O)NR.sup.xxR.sup.yy, C(O)OR.sup.xx, C(O)R.sup.xx, NR.sup.xxR.sup.yy, OH, SF.sub.5, or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 20 C atoms, preferably 1 to 12 C atoms, wherein one or more H atoms are optionally replaced by F or Cl, preferably F, CN or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 6 C atoms; [0102] R.sup.xx and R.sup.yy independently of each other denote H or alkyl with 1 to 12 C atoms; [0103] Y.sup.01 and Y.sup.02 each, independently of one another, denote H, alkyl having 1 to 12 C atoms, aryl, F, Cl, or CN; and [0104] k and l are each and independently 0, 1, 2, 3 or 4.

[0105] The polymerizable compound according to the present invention is preferably a polymerizable direactive mesogenic compound.

[0106] The polymerizable group P is a group capable to undergo a polymerization reaction such as, for example, a radical or ionic chain polymerization, a polyaddition or a polycondensation, or capable to undergo a polymerization analogous reaction such as, for example, an addition or a condensation on a polymer backbone.

[0107] It is preferred that the index m is from 1 to 50. More preferably, the index m is from 2 to 30, and most preferably from 3 to 20.

[0108] It is preferred that Z.sup.21 and Z.sup.22 are independently and at each occurrence independently from each other COO, OCO, COO, OCO, OCH.sub.2, CH.sub.2O, CH.sub.2CH.sub.2, (CH.sub.2).sub.4, CF.sub.2CH.sub.2, CH.sub.2CF.sub.2, CF.sub.2CF.sub.2, CC, CHCHCOO, OCOCHCH, or a single bond.

[0109] Preferably, k and l are each and independently 0, 1 or 2, more preferably k and l are 1.

[0110] Preferred polymerizable groups P are selected from groups containing a CC double bond or a CC triple bond, and from groups which are suitable for polymerization by a ring-opening reaction, such as, for example, oxetane or epoxide groups.

[0111] More preferred polymerizable groups P are selected from the list consisting of CH.sub.2CW.sup.1COO, CH.sub.2CW.sup.1CO,

##STR00008##

CH.sub.2CW.sup.2(O).sub.k3, CW.sup.1.sub.2CHCO(O).sub.k3, CW.sup.1.sub.2CHCONH, CH.sub.2CW.sup.1CONH, CH.sub.3CHCHO, (CH.sub.2CH).sub.2CHOCO, (CH.sub.2CHCH.sub.2).sub.2CHOCO, (CH.sub.2CH).sub.2CHO, (CH.sub.2CHCH.sub.2).sub.2N, (CH.sub.2CHCH.sub.2).sub.2NCO, CH.sub.2CW.sup.1CONH, CH.sub.2CH(COO).sub.k1-Phe-(O).sub.k2, CH.sub.2CH(CO).sub.k1-Phe-(O).sub.k2, and Phe-CHCH,

[0112] wherein: [0113] W.sup.1 denotes H, F, Cl, CN, CF.sub.3, phenyl or alkyl having 1 to 5 C atoms, more preferably H, F, Cl or CH.sub.3; [0114] W.sup.2 denotes H or alkyl having 1 to 5 C atoms, more preferably H, methyl, ethyl or n-propyl; [0115] W.sup.3 and W.sup.4 each, independently of one another, denote H, Cl or alkyl having 1 to 5 C atoms; [0116] Phe denotes 1,4-phenylene, which is optionally substituted by one or more radicals L as being defined above but being different from P-Sp, preferably preferred substituents L are F, Cl, CN, NO.sub.2, CH.sub.3, C.sub.2H.sub.5, OCH.sub.3, OC.sub.2H.sub.5, COCH.sub.3, COC.sub.2H.sub.5, COOCH.sub.3, COOC.sub.2H.sub.5, CF.sub.3, OCF.sub.3, OCHF.sub.2, OC.sub.2F.sub.5 and phenyl; and [0117] k.sub.1, k.sub.2 and k.sub.3 each, independently of one another, denote 0 or 1, k.sub.3 preferably denotes 1; and [0118] k.sub.4 is an integer from 1 to 10.

[0119] Most preferred polymerizable groups P are vinyloxy, acrylate, methacrylate, fluoroacrylate, chloroacrylate, oxetane, epoxy, maleimide, 3-methyl maleimide, 3-ethyl maleimide, 3-propyl maleimide, 3,4-dimethyl maleimide, 3-methyl-4-ethyl maleimide, 3-methyl-4-propoyl maleimide, 3,4-diethyl maleimide, 3-ethyl-4-propoyl maleimide and 3,4-dipropyl maleimide groups, most preferably acrylate, methacrylate, maleimide and 3,4-dimethyl maleimide groups.

[0120] Preferred spacer groups Sp are selected from the formula Sp-X, so that the radical P-Sp- corresponds to the formula P-Sp-X, wherein: [0121] Sp denotes [0122] (a) straight chain or branched chain alkylene having 1 to 40, preferably 1 to 30 C atoms, which is optionally mono- or poly-substituted by F, Cl, Br, I or CN and in which, in addition, one or more non-adjacent CH.sub.2 groups may each be replaced, independently of one another, by O, S, NH, NR.sup.01, SiR.sup.01R.sup.02, CO, COO, OCO, OCOO, SCO, COS, NR.sup.01COO, OCONR.sup.01, NR.sup.01CONR.sup.01, CHCH or CC in such a way that O and/or S atoms are not linked directly to one another, or [0123] (b) -Sp.sup.x-G-Sp.sup.y-, wherein Sp.sup.x and Sp.sup.y denote independently of each other alkylene having 1 to 20 C atoms, preferably 1 to 12 C atoms, or a single bond; G denotes cycloalkylene having 3 to 20 C atoms, preferably 5 to 12 C atoms, which is optionally mono- or polysubstituted by alkyl having 1 to 20 C atoms, preferably 1 to 12 C atoms; [0124] X denotes O, S, CO, COO, OCO, OCOO, CONR.sup.01, NR.sup.01CO, NR.sup.01CONR.sup.01, OCH.sub.2, CH.sub.2O, SCH.sub.2, CH.sub.2S, CF.sub.2O, OCF.sub.2, CF.sub.2S, SCF.sub.2, CF.sub.2CH.sub.2, CH.sub.2CF.sub.2, CF.sub.2CF.sub.2, CHN, NC, NN, CHCR.sup.01, CY.sup.01CY.sup.02, CC, CHCHCOO, OCOCHCH or a single bond, preferably O, S, CO, COO, OCO, OCOO, CONR.sup.0, NR.sup.01CO, NR.sup.01CONR.sup.01 or a single bond; [0125] R.sup.01 and R.sup.02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms; and [0126] Y.sup.01 and Y.sup.02 each, independently of one another, denote H, F, Cl or CN.

[0127] Preferred groups Sp are in each case selected from straight chain methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, and octadecylene, cyclo-hexylene, ethyleneoxyethylene, methyleneoxybutylene, ethylenethioethylene, ethylene-N-methyliminoethylene, 1-methylalkylene, ethenylene, propenylene and butenylene.

[0128] More preferred spacer groups Sp are selected from the list consisting of (CH.sub.2).sub.p1, (CH.sub.2CH.sub.2O).sub.q1CH.sub.2CH.sub.2, CH.sub.2CH.sub.2SCH.sub.2CH.sub.2, CH.sub.2CH.sub.2NHCH.sub.2CH.sub.2, (SiR.sup.01R.sup.02O).sub.p1, (CH.sub.2).sub.p1-(cyclo-C.sub.6H.sub.8R.sup.01R.sup.02)(CH.sub.2).sub.p1, and

##STR00009##

[0129] wherein: [0130] p1 is an integer from 1 to 60, preferably from 1 to 36, more preferably from 1 to 12; [0131] q1 is an integer from 1 to 12, preferably from 1 to 3; and

[0132] R.sup.01 and R.sup.02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms.

[0133] Most preferred groups Sp are (CH.sub.2).sub.p1, O(CH.sub.2).sub.p1, O(CH.sub.2).sub.p1O, OCO(CH.sub.2).sub.p1, and OCOO(CH.sub.2).sub.p1, in which p1 is an integer from 1 to 36, preferably from 1 to 12.

[0134] In a preferred embodiment of the present invention, the groups A.sup.21 to A.sup.23 denote independently and, in case of multiple occurrence, independently of one another, a moiety selected from the following groups a) to e): [0135] a) trans-1,4-cyclohexylene, 1,4-cyclohexenylene and 4,4-bicyclohexylene, in which one or more non-adjacent CH.sub.2 groups may be replaced by O and/or S and wherein one or more H atoms may be replaced by a group L; [0136] b) 1,4-phenylene, 1,3-phenylene, 4,4-biphenylene, 2,5-thiphene and 2,6-dithieno[3,2-b:2,3-d]thiophene in which one or two CH groups may be replaced by N and where one or more H atoms may be replaced by a group L; [0137] c) tetrahydropyran-2,5-diyl, 1,3-dioxane-2,5-diyl, tetrahydrofuran-2,5-diyl, cyclobut-1,3-diyl, piperidine-1,4-diyl, thiophene-2,5-diyl and selenophen-2,5-diyl, which may be substituted one or more groups L; [0138] d) saturated, partially unsaturated or completely unsaturated, and optionally substituted, polycyclic radicals having 5 to 20 cyclic C atoms, of which one or more can also be replaced by heteroatoms, preferably selected from the group consisting of bicyclo [1.1.1] pentane-1,3-diyl, bicyclo [2.2.2] octane-1,4-diyl, spiro [3.3] heptane-2,6-diyl, tricyclo [3.3.1.1] decane-1,3-diyl,

##STR00010## ##STR00011## [0139] where one or more H atoms may be replaced by a group L, and/or one or more double bonds may be replaced by single bonds, and/or one or more CH groups may be replaced by N, and where [0140] M denotes O, S, CH.sub.2, CHY.sup.03 or CY.sup.03Y.sup.04; [0141] Y.sup.03, Y.sup.04 denote independently of each other one of the meanings given above for R.sup.01, F, Cl, CN, OCF.sub.3 or CF.sub.3, and preferably H, F, Cl, CN, OCF.sub.3 or CF.sub.3; [0142] W.sup.5, W.sup.6 denote independently of each other CH.sub.2CH.sub.2, CHCH, CH.sub.2O, OCH.sub.2, C(R.sup.cR.sup.d) or O; [0143] R.sup.c, R.sup.d denote independently of each other H or alkyl having 1 to 6 C atoms, preferably H, methyl or ethyl; and [0144] R.sup.03, R.sup.04 denote independently of each other H, F, straight chain or branched chain alkyl having 1 to 12 C atoms where one or more H atoms may be replaced by F; [0145] e) cyclic imides selected from the group consisting of:

##STR00012## [0146] where one or more H atoms may be replaced by a group L, and/or [0147] one or more double bonds may be replaced by single bonds, and/or [0148] one or more CH groups may be replaced by N.

[0149] Preferred polymerizable compounds according to Formula (1) are:

##STR00013## ##STR00014## ##STR00015## ##STR00016## ##STR00017## ##STR00018## ##STR00019##

[0150] where the radicals and indices have the following meanings: [0151] L is F, Cl, Br, I, CN, NO.sub.2, NCO, NCS, OCN, SCN, C(O)NR.sup.xxR.sup.yy, C(O)OR.sup.xx, C(O)R.sup.xx, NR.sup.xxR.sup.yy, OH, SF.sub.5, or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 20 C atoms, preferably 1 to 12 C atoms, wherein one or more H atoms are optionally replaced by F or Cl, preferably F, CN or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 6 C atoms; [0152] R.sup.xx and R.sup.yy independently of each other denote H or alkyl with 1 to 12 C atoms; [0153] r is 0, 1, 2, 3 or 4; [0154] s is 0, 1, 2 or 3; [0155] t is 0, 1 or 2; [0156] Z.sup.21 and Z.sup.22 are independently and at each occurrence independently from each other, O, S, CO, COO, OCO, SCO, COS, OCOO, CONR.sup.01, NR.sup.01CO, NR.sup.01CONR.sup.02, NR.sup.01CONR.sup.02, NR.sup.01COO, OCONR.sup.01, OCH.sub.2, CH.sub.2O, SCH.sub.2, CH.sub.2S, CF.sub.2O, OCF.sub.2, CF.sub.2S, SCF.sub.2, CH.sub.2CH.sub.2, (CH.sub.2).sub.4, CF.sub.2CH.sub.2, CH.sub.2CF.sub.2, CF.sub.2CF.sub.2, CHN, NCH, NN, CHCR.sup.01, CY.sup.01CY.sup.02, CC, CHCHCOO, OCOCHCH, or a single bond, preferably COO, OCO, COO, OCO, OCH.sub.2, CH.sub.2O, CH.sub.2CH.sub.2, (CH.sub.2).sub.4, CF.sub.2CH.sub.2, CH.sub.2CF.sub.2, CF.sub.2CF.sub.2, CC, CHCHCOO, OCOCHCH, or a single bond; [0157] R.sup.01 and R.sup.02 each, independently of one another, denote H or alkyl having 1 to 12 C atoms; [0158] Sp.sup.1 denotes at each occurrence a space group (Sp) as defined above or a single bond; [0159] P.sup.1 denotes a polymerizable group (P) as defined above; and [0160] m is an integer from 1 to 60, preferably 1 to 50, more preferably 2 to 30, and most preferably 3 to 20.

[0161] More preferred polymerizable compounds according to Formula (1) are:

##STR00020##

[0162] where the radicals and indices have one of the meanings as defined above.

[0163] Particularly preferred polymerizable compounds according to Formula (1) are:

##STR00021## ##STR00022##

[0164] where the radicals and indices have one of the meanings as defined above.

[0165] Most preferred polymerizable compounds according to Formula (1) are:

##STR00023## ##STR00024## ##STR00025## ##STR00026## ##STR00027## ##STR00028## ##STR00029## ##STR00030## ##STR00031##

[0166] wherein [0167] n is an integer from 1 to 60, preferably from 1 to 36, and more preferably from 6 to 12; and [0168] m is an integer from 1 to 60, preferably 1 to 50, more preferably 2 to 30, and most preferably 3 to 20.

[0169] In the compounds of formulae M1 to M33 and the corresponding sub-formulae, the ring group

##STR00032##

is preferably

##STR00033##

[0170] wherein [0171] L is at each occurrence independently from each other F, Cl, Br, I, CN, NO.sub.2, NCO, NCS, OCN, SCN, C(O)NR.sup.xxR.sup.yy, C(O)OR.sup.xx, C(O)R.sup.xx, NR.sup.xxR.sup.yy, OH, SF.sub.5, or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 20 C atoms, preferably 1 to 12 C atoms, wherein one or more H atoms are optionally replaced by F or Cl, preferably F, CN or straight chain or branched chain alkyl, alkoxy, alkylcarbonyl, alkoxycarbonyl, alkylcarbonyloxy or alkoxycarbonyloxy with 1 to 6 C atoms; and [0172] R.sup.xx and R.sup.yy are defined according to the definitions given above.

[0173] The polymerizable compound represented by Formula (1) can be prepared by any standard synthesis. Usually, the compound is retrosynthetically cut into smaller units and formed stepwise from suitable precursor compounds. For this purpose, known standard reactions can be used. It has proven to be particularly advantageous to attach the polymerizable groups P.sup.1 at a late stage of the synthesis, typically at the very last step of the synthesis. By doing so, undesirable side-reactions or premature polymerization of the compound can be avoided.

[0174] For example, if the polymerizable compound contains polymerizable groups P which are represented by

##STR00034##

[0175] wherein W.sup.3 and W.sup.4 each, independently of one another, denote H, Cl or alkyl having 1 to 5 C atoms,

[0176] a precursor represented by Formula (3):

X-Sp.sup.1-(MG-Sp.sup.1).sub.m-X Formula (3)

[0177] is reacted with

##STR00035##

[0178] to form a polymerizable compound represented by Formula (1):

P.sup.1-Sp.sup.1-(MG-Sp.sup.1).sub.m-P.sup.1 Formula (1)

[0179] wherein X is NH.sub.2;

[0180] P.sup.1 is

##STR00036##

and

[0181] Sp.sup.1, MG, and m have one of the definitions as given above.

[0182] The present invention further provides a method for forming a polymer comprising monomer units of one or more of the polymerizable compound. The polymer is a dielectric polymer which may be linear or crosslinked.

[0183] The method for forming a polymer comprises the following steps: [0184] (i) providing a polymerizable starting material comprising one or more polymerizable compounds according to the present invention; and [0185] (ii) polymerizing said polymerizable starting material.

[0186] The polymerizable compound comprised in the polymerizable starting material is a polymerizable compound which is represented by Formula (1) and the above-mentioned definitions.

[0187] It is preferred that the polymerizable starting material provided in step (i) comprises one polymerizable compound according to the present invention.

[0188] In a preferred embodiment, the polymerizable starting material provided in step (i) comprises one or more additional polymerizable compounds which are capable to react with the polymerizable compound according to the present invention to form a copolymer.

[0189] Preferred additional polymerizable compounds are monomers which are capable to react with the polymerizable group P of the polymerizable compound of the present invention to form a copolymer. Such preferred additional polymerizable compounds are selected from acrylates, epoxides, olefins, vinyl ethers, vinyl esters, polythiols, polyamines, and polymaleimides. Using basic chemical knowledge, the skilled person is able to find and select for a given polymerizable compound of the present invention suitable additional polymerizable compounds which are capable to react with the first mentioned to form a copolymer.

[0190] Preferred acrylates are acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, methyl cyanoacrylate, ethyl acrylate, ethyl methacrylate, ethyl cyanoacrylate, propyl acrylate, propyl methacrylate, propyl cyanoacrylate, butyl acrylate, butyl methacrylate, butyl cyanoacrylate, pentyl acrylate, pentyl methacrylate, pentyl cyanoacrylate, hexyl acrylate, hexyl methacrylate, hexyl cyanoacrylate, heptyl acrylate, heptyl methacrylate, heptyl cyanoacrylate, octyl acrylate, octyl methacrylate, octyl cyanoacrylate, ethylene glycol dimethacrylate, 2-ethylhexyl acrylate, glycidyl methacrylate, (hydroxyethyl)acrylate, (hydroxyethyl) methacrylate, methyl 2-chloroacrylate, and methyl 2-fluoroacrylate.

[0191] Preferred epoxides are ethylene oxide, propylene oxide, butylene oxide, pentylene oxide, hexylene oxide, heptylene oxide, octylene oxide, glycidamide, glycidol, styrene oxide , 3,4-epoxytetrahydrothiophene-1,1-dioxide, ethyl 2,3-epoxypropionate, methyl 2-methylglycidate, methyl glycidyl ether, ethyl glycidyl ether, diglycidyl ether, cyclopentene oxide, cyclohexene oxide, cycloheptene oxide, cyclooctene oxide, and stilbene oxide.

[0192] Preferred olefins are ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, isoprene styrene, and vinylethylene.

[0193] Preferred vinyl ethers are divinyl ether, methylvinylether, ethylvinylether, propylvinylether, butylvinylether, pentylvinylether, hexylvinylether, heptylvinylether, and octylvinylether.

[0194] Preferred vinyl esters are vinyl formate, vinyl acetate, vinyl propanoate, vinyl butanoate, vinyl pentanoate, vinyl hexanoate, vinyl heptanoate, vinyl octanoate, vinyl nonanoate, vinyl decanoate, vinyl acrylate, vinyl methacrylate, vinyl benzoate, vinyl 4-tert-butylbenzoate, vinyl cinnamate, and vinyl trifluoroacetate.

[0195] Preferred polythiols are organosulfur compounds with two or more thiol functional groups. Particularly preferred polythiols are selected from the list consisting of HS(C.sub.nH.sub.2n)SH, wherein n=2 to 20, preferably 2 to 12; C.sub.nH.sub.2n1(SH).sub.3, wherein n=3 to 20, preferably 3 to 12; HSArSH, wherein Ar=substituted or unsubstituted C.sub.6-C.sub.20 arylene; and HS(CH.sub.2).sub.mAr(CH.sub.2).sub.mSH, wherein Ar=substituted or unsubstituted C.sub.6-C.sub.20 arylene and m=1 to 12.

[0196] Preferred polyamines are organoamine compounds with two or more amino functional groups. Particularly preferred polyamines are selected from the list consisting of H.sub.2N(C.sub.nH.sub.2n)NH.sub.2, wherein n=2 to 20, preferably 2 to 12; H.sub.2N(C.sub.nH.sub.2nNH)NH.sub.2, wherein n=2 to 20, preferably 2 to 12; C.sub.nH.sub.2n1(NH.sub.2).sub.3, wherein n=3 to 20, preferably 3 to 12; H.sub.2NArNH.sub.2, wherein Ar=substituted or unsubstituted C.sub.6-C.sub.20 arylene; and H.sub.2N(CH.sub.2).sub.mAr(CH.sub.2).sub.mH.sub.2N, wherein Ar=substituted or unsubstituted C.sub.6-C.sub.20 arylene and m=1 to 12.

[0197] Preferred polymaleimides are maleimide end-capped polyimides as described in US 2008/0075961 A1 and US 2017/0152418 A1 the disclosure of which is herewith incorporated by reference. It is preferred that the polymaleimides are dimaleimides selected from compounds represented by the following Formula (A) or Formula (B):

##STR00037##

[0198] wherein R.sub.1 and Q.sub.1 are independently selected from the group consisting of structures derived from unsubstituted or substituted aliphatic, alicyclic, alkenyl, aryl, heteroaryl, siloxane, poly(butadiene-co-acrylonitrile) and poly(alkylene oxide); X.sub.1 to X.sub.4 are each independently H or an alkyl group with 1 to 6 C atoms; and n=0 to 30;

##STR00038##

[0199] wherein R.sub.2 and Q.sub.2 are independently selected from the group consisting of structures derived from unsubstituted or substituted aliphatic, alicyclic, alkenyl, aryl, heteroaryl, siloxane, poly(butadiene-co-acrylonitrile) and poly(alkylene oxide); X.sub.5 to X.sub.8 are each independently H or an alkyl group with 1 to 6 C atoms; R.sub.3 and R.sub.4 are each independently H or CH.sub.3, wherein at least one of R.sub.3 and R.sub.4 is CH.sub.3; and n=0 to 30.

[0200] In a preferred embodiment, the structure derived from unsubstituted or substituted aliphatic, alicyclic, alkenyl, aryl, heteroaryl, siloxane, poly(butadiene-co-acrylonitrile) and poly(alkylene oxide) are alkyl group, alkenyl group, alkynyl group, hydroxyl group, oxo group, alkoxy group, mercapto group, cycloalkyl group, substituted cycloalkyl group, heterocyclic group, substituted heterocyclic group, aryl group, substituted aryl group, heteroaryl group, substituted heteroaryl group, aryloxy group, substituted aryloxy group, halogen, haloalkyl group, cyano group, nitro group, nitrone group, amino group, amide group, C(O)H, acyl group, oxyacyl group, carboxyl group, carbamate group, sulfonyl group, sulfonamide group, sulfuryl group, or C(O), S, S(O).sub.2, OC(O)O, NA-C(O), NAC(O)NA-, OC(O)NA-, (in the formula, A is H or an alkyl group with 1 to 6 carbons), and it is preferable that one terminal further contains a substituent.

[0201] Preferred substituents are alkyl group, alkenyl group, alkynyl group, hydroxyl group, oxo group, alkoxy group, mercapto group, cycloalkyl group, substituted cycloalkyl group, heterocyclic group, substituted heterocyclic group, aryl group, substituted aryl group, heteroaryl group, substituted heteroaryl group, aryloxy group, substituted aryloxy group, halogen, haloalkyl group, cyano group, nitro group, nitrone group, amino group, amide group, C(O)H, acyl group, oxyacyl group, carboxyl group, carbamate group, sulfonyl group, sulfonamide group, sulfuryl group, or C(O), S, S(O).sub.2, OC(O)O, NA-C(O), NAC(O)NA-, OC(O)NA-, (in the formula, A is H or an alkyl group with 1 to 6 carbons), acyl group, oxyacyl group, carboxyl group, carbamate group, sulfonyl group, sulfonamide group, or sulfuryl group.

[0202] In a more preferred embodiment, R.sup.1 and R.sup.2, and Q.sup.1 and Q.sup.2 are independently selected from the group consisting of substituted or unsubstituted aliphatic, alicyclic, alkenyl, aromatic, heteroaromatic, siloxane, poly(butadiene-co-acrylonitrile), or poly(alkylene oxide) moieties.

[0203] Preferred aliphatic moieties are straight or branched chain C.sub.1-C.sub.50 alkylene, more preferably straight or branched chain C.sub.1-C.sub.36 alkylene.

[0204] Preferred alicyclic moieties are both aliphatic and cyclic and contain one or more all-carbon rings which may be either substituted or unsubstituted and which may be optionally condensed and/or bridged. Preferred alicyclic moieties have 3 to 72 C atoms, more preferably 3 to 36 C atoms. Particularly preferred alicyclic moieties are represented by -Sp.sup.1-Cy-Sp.sup.2-, wherein Sp.sup.1 and Sp.sup.2 denote independently of each other alkylene having 1 to 12 C atoms or a single bond; G denotes cycloalkylene having 3 to 12 C atoms which is optionally mono- or polysubstituted by alkyl having 1 to 12 C atoms.

[0205] Preferred alkenyl moieties are straight or branched chain hydrocarbyl moieties having at least one carbon-carbon double bond, and having in the range of about up to 100 C atoms. More preferred alkenyl moieties are C.sub.2-C.sub.50 alkenylene, most preferably C.sub.2-C.sub.36 alkenylene.

[0206] Preferred aromatic moieties are arylene groups having 6 to 20 C atoms, more preferably 6 to 14 C atoms, which may be either substituted or unsubstituted.

[0207] Heteroaromatic moieties are aromatic moieties containing one or more heteroatoms (e.g. N, O, S, or the like) as part of the ring structure. Preferred heteroaromatic moieties have 3 to 20 C atoms, preferably 3 to 14 C atoms, and one or more heteroatoms selected from N, O and/or S, and they may be either substituted or unsubstituted.

[0208] Preferred siloxane moieties are selected from [R.sup.aR.sup.bSiO].sub.nR.sup.aR.sup.bSi, wherein R.sup.a and R.sup.b are independently H or C.sub.1-C.sub.6 alkyl, and n=1 to 1000, more preferably 1 to 100.

[0209] Preferred poly(alkylene oxide) moieties are poly(C.sub.1-C.sub.12 alkylene oxide) moieties.

[0210] It is preferred that the molar ratio between the polymerizable compounds of the present invention and the additional polymerizable compounds in the polymerizable starting material is from 0.1:100 to 100:0.1.

[0211] It is preferred that the polymerizable starting material provided in step (i) is substantially free of solvent. Substantially free of solvent means that the content of total residual solvent in the polymerizable starting material is not more than 10 wt.-%, preferably not more than 5 wt.-%, and more preferably not more than 1 wt.-%, based on the total weight of the polymerizable compound(s).

[0212] It is preferred that the polymerizable starting material is polymerized in step (ii) by radical or ionic polymerization or by exposure to radiation. It is further preferred that the polymerizable starting material contains an initiator for free radical polymerization or an initiator for ionic polymerization. It is further preferred that the polymerization of the polymerizable compounds in step (ii) takes place at elevated temperature, preferably at a temperature in the range from 25 to 200 C., more preferably at a temperature in the range from 25 to 150 C.

[0213] Preferably, the initiators for radical polymerization are activated thermally by exposure to heat or photochemically by exposure to radiation such as UV and/or visible light.

[0214] Preferred initiators for radical polymerization are: tert-amyl peroxybenzoate, 4,4-azobis(4-cyanovaleric acid), 1,1-azobis(cyclohexanecarbonitrile), 2,2-azobisisobutyronitrile (AIBN), benzoyl peroxide, 2,2-bis(tert-butylperoxy)butane, 1,1-bis(tert-butylperoxy)cyclohexane, 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane, 2,5-bis(tert-butylperoxy)-2,5-dimethyl-3-hexyne, bis(1-(tert-butylperoxy)-1-methylethyl)benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, tert-butyl hydroperoxide, tert-butyl peracetate, tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butylperoxy isopropyl carbonate, cumene hydroperoxide, cyclohexanone peroxide, dicumyl peroxide, lauroyl peroxide, 2,4-pentanedione peroxide, peracetic acid, and potassium persulfate. Typically, such initiators are radical polymerization initiators which may be thermally activated.

[0215] Further preferred initiators for radical polymerization are: acetophenone, p-anisil, benzil, benzoin, benzophenone, 2-benzoylbenzoic acid, 4,4-bis(diethylamino)benzophenone, 4,4-bis(dimethylamino)benzophenone, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin ethyl ether, 4-benzoylbenzoic acid, 2,2-bis(2-chlorophenyl)-4,4,5,5-tetraphenyl-1,2-biimidazole, methyl 2-benzoylbenzoate, 2-(1,3-benzodioxol-5-yl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-benzyl-2-(dimethylamino)-4-morpholinobutyrophenone, ()-camphorquinone, 2-chlorothioxanthone, 4,4-dichlorobenzophenone, 2,2-Diethoxyacetophenone, 2,2-Dimethoxy-2-phenylacetophenone, 2,4-diethylthioxanthen-9-one, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, 1,4-dibenzoylbenzene, 2-ethylanthraquinone, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methylpropiophenone, 2-hydroxy-4-(2-hydroxyethoxy)-2-methylpropiophenone, 2-isopropylthioxanthone, lithium phenyl(2,4,6-trimethylbenzoyl)phosphinate, 2-methyl-4-(methylthio)-2-morpholino-propiophenone, 2-isonitrosopropiophenone, 2-phenyl-2-(p-toluenesulfonyl-oxy)acetophenone, and phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. Typically, such initiators are radical polymerization initiators which may be photochemically activated.

[0216] Preferred initiators for ionic polymerization are: alkyl lithium compounds, alkylamine lithium compounds and pentamethylcyclopentadienyl (Cp*) complexes of titanium, zirconium and hafnium.

[0217] Further preferred initiators for ionic polymerization are: bis(4-tert-butylphenyl)iodonium hexafluorophosphate, bis(4-fluorophenyl)iodonium trifluoromethanesulfonate, cyclopropyldiphenylsulfonium tetrafluoroborate, dimethylphenacylsulfonium tetrafluoroborate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroarsenate, diphenyliodonium trifluoromethanesulfonate, 2-(3,4-dimethoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-[2-(furan-2-yl)vinyl]-4,6-bis(trichloromethyl)-1,3,5-triazine, 4-isopropyl-4-methyldiphenyliodonium tetrakis(pentafluorophenyl)borate, 2-[2-(5-methylfuran-2-yl)vinyl]-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methoxystyryl)-4,6-bis(trichloro-methyl)-1,3,5-triazine, (2-methylphenyl)(2,4,6-trimethylphenyl)iodonium trifluoromethanesulfonate, (3-methylphenyl)(2,4,6-trimethylphenyl)iodonium trifluoromethanesulfonate, (4-methylphenyl)(2,4,6-trimethylphenyl)iodonium trifluoromethanesulfonate, 4-nitrobenzenediazonium tetrafluoroborate, (4-nitrophenyl)(phenyl)iodonium trifluoromethanesulfonate, triphenylsulfonium tetrafluoroborate, triphenylsulfonium bromide, tri-p-tolylsulfonium hexafluorophosphate, tri-p-tolylsulfonium trifluoromethanesulfonate, [3-(trifluoromethyl)phenyl](2,4,6-trimethylphenyl)iodonium trifluoro-methanesulfonate, and [4-(trifluoromethyl)phenyl](2,4,6-trimethyl-phenyl)iodonium trifluoromethanesulfonate. Typically, such initiators are cationic polymerization initiators which may be photochemically activated.

[0218] Further preferred initiators for ionic polymerization are: acetophenone O-benzoyloxime, 1,2-bis(4-methoxyphenyl)-2-oxoethyl cyclohexylcarbamate, nifedipine, 2-nitrobenzyl cyclohexylcarbamate, 2-(9-oxoxanthen-2-yl)propionic acid 1,5,7-triazabicyclo[4.4.0]dec-5-ene salt, 2-(9-oxoxanthen-2-yl)propionic acid 1,5-diazabicyclo[4.3.0]non-5-ene salt, and 2-(9-oxoxanthen-2-yl)propionic acid 1,8-diazabicyclo[5.4.0]undec-7-ene salt. Typically, such initiators are anionic polymerization initiators which may be photochemically activated.

[0219] Exposure to radiation includes exposure to visible light and/or UV light. It is preferred that the visible light is electromagnetic radiation with a wavelength from >380 to 780 nm, more preferably from >380 to 500 nm. It is preferred that the UV light is electromagnetic radiation with a wavelength of 380 nm, more preferably a wavelength from 100 to 380 nm. More preferably, the UV light is selected from UV-A light having a wavelength from 315 to 380 nm, UV-B light having a wavelength from 280 to 315 nm, and UV-C light having a wavelength from 100 to 280 nm.

[0220] As UV light sources Hg-vapor lamps or UV-lasers are possible, as IR light sources ceramic-emitters or IR-laser diodes are possible and for light in the visible area laser diodes are possible.

[0221] Preferred UV light sources are light sources having a) a single wavelength radiation with a maximum of <255 nm such as e.g. 254 nm and 185 nm Hg low-pressure discharge lamps, 193 nm ArF excimer laser and 172 nm Xe2 layer, or b) broad wavelength distribution radiation with a wavelength component of <255 m such as e.g. non-doped Hg low-pressure discharge lamps.

[0222] In a preferred embodiment of the present invention the light source is a xenon flash light. Preferably, the xenon flash light has a broad emission spectrum with a short wavelength component going down to about 200 nm.

[0223] It is preferred that the polymerization in step (ii) takes place in a time range from 0.1 to 1 h, preferably from 0.5 to 1 h.

[0224] There is further provided a polymer which is obtainable or obtained by the above-mentioned method for forming a polymer according to the present invention. The polymer is preferably a linear or crosslinked polymer, more preferably a linear polymer.

[0225] There is also provided a polymer which contains at least one repeating unit derived from the polymerizable compound of Formula (1) as defined above.

[0226] More preferably, said polymer contains repeating units comprising a structural unit represented by the following Formula (4):

[-Sp.sup.1-(MG-Sp.sup.1).sub.m-]Formula (4)

[0227] wherein Sp.sup.1, MG and m have one of the above-mentioned definitions.

[0228] In a preferred embodiment, the polymer further contains additional repeating units derived from the additional polymerizable compounds as defined above.

[0229] Preferably, the polymers according to the present invention have a molecular weight M.sub.w, as determined by GPC, of at least 2000 g/mol, more preferably of at least 4000 g/mol, even more preferably of at least 5000 g/mol. Preferably, the molecular weight M.sub.w of the polymers is less than 50000 g/mol. More preferably, the molecular weight M.sub.w of the polymers is in the range from 5000 to 20000 g/mol.

[0230] Moreover there is provided an electronic device comprising a polymer according to the present invention. For the electronic device it is preferred that the polymer forms a dielectric layer. The dielectric layer serves to electrically separate one or more electronic components being part of the electronic device from each other.

[0231] Finally, there is provided a manufacturing method for preparing a packaged microelectronic structure, in which a substrate is provided with a dielectric coating comprising one or more polymerized liquid crystalline monomers, wherein the method comprises the following steps: [0232] (1) applying a polymerizable composition comprising one or more polymerizable compounds according to the present invention to a surface of a substrate; and [0233] (2) curing said polymerizable composition to form a dielectric layer.

[0234] It is preferred that the polymerizable composition provided in step (1) comprises one polymerizable compound according to the present invention.

[0235] In a preferred embodiment, the polymerizable composition provided in step (1) comprises one or more additional polymerizable compounds which are capable to react with the polymerizable compound according to the present invention to form a copolymer.

[0236] Preferred additional polymerizable compounds are monomers which are capable to react with the polymerizable group P of the polymerizable compound of the present invention to form a copolymer. Such preferred additional polymerizable compounds are selected from acrylates, epoxides, olefins, vinyl ethers, vinyl esters, polythiols, polyamines, and polymaleimides. Using basic chemical knowledge, the skilled person is able to find and select for a given polymerizable compound of the present invention suitable additional polymerizable compounds which are capable to react with the first mentioned to form a copolymer.

[0237] Preferred acrylates, epoxides, olefins, vinyl ethers, vinyl esters, polythiols, polyamines, and polymaleimides are the same as described above.

[0238] It is preferred that the molar ratio between the polymerizable compounds of the present invention and the additional polymerizable compounds in the polymerizable composition is from 0.1:100 to 100:0.1.

[0239] It is preferred that the polymerizable composition further comprises one or more inorganic filler materials. Preferred inorganic filler materials are selected from nitrides, titanates, diamond, oxides, sulfides, sulfites, sulfates, silicates and carbides which may be optionally surface-modified with a capping agent. More preferably, the filler material is selected from the list consisting of AlN, Al.sub.2O.sub.3, BN, BaTiO.sub.3, B.sub.2O.sub.3, Fe.sub.2O.sub.3, SiO.sub.2, TiO.sub.2, ZrO.sub.2, PbS, SiC, diamond and glass particles.

[0240] Preferably, the total content of the inorganic filler material in the polymerizable composition is in the range from 0.001 to 90 wt.-%, more preferably 0.01 to 70 wt.-% and most preferably 0.01 to 50 wt.-%, based on the total weight of the polymerizable composition.

[0241] It is preferred that the polymerizable composition provided in step (1) is substantially free of solvent. Substantially free of solvent means that the content of total residual solvent in the polymerizable composition is not more than 10 wt.-%, preferably not more than 5 wt.-%, and more preferably not more than 1 wt.-%, based on the total weight of the polymerizable compound(s).

[0242] The method by which the polymerizable composition is applied in step (1) is not particularly limited. Preferred application methods for step (1) are dispensing, dipping, screen printing, stencile printing, roller coating, spray coating, slot coating, spin coating, gravure printing, flexo printing or inkjet printing.

[0243] The polymerizable compounds of the present invention may be provided in the form of a formulation suitable for gravure printing, flexo printing and/or ink-jet printing. For the preparation of such formulations, ink base formulations as known from the state of the art can be used.

[0244] Alternatively, the polymerizable compound of the present invention may be provided in the form of a formulation suitable for photolithography. The photolithography process allows the creation of a photopattern by using light to transfer a geometric pattern from a photomask to a light-curable composition. Typically, such light-curable composition contains a photo-chemically activatable polymerization initiator. For the preparation of such formulations, photoresist base formulations as known from the state of the art can be used.

[0245] The layer of the polymerizable composition which is applied in step (1) has preferably an average thickness of 1 to 50 m, more preferably 2 to 30 m, and most preferably 3 to 15 m.

[0246] It is preferred that the curing in step (2) is carried out by radical or ionic polymerization or by exposure to radiation. Preferred curing conditions correspond to the preferred polymerization conditions as given above for the method for forming a polymer material.

[0247] There is also provided a microelectronic device which comprises the packaged microelectronic structure prepared according to the above-mentioned manufacturing method.

[0248] The present invention is further illustrated by the examples following hereinafter which shall in no way be construed as limiting. The skilled person will acknowledge that various modifications, additions and alternations may be made to the invention without departing from the spirit and scope of the invention as defined in the appended claims.

EXAMPLES

[0249] A Synthesis of Dianhydrides

1. Synthesis of 2-methyl-1,4-phenylene bis(4-hydroxybenzoate) (1)

[0250] ##STR00039##

[0251] A mixture of 4-hydroxybenzoic acid (111 g, 0.8 mol), 2-methylhydroquinone (50 g, 0.4 mol), p-toluenesulfonic acid monohydrate (7.7 g, 0.04 mol) and p-xylene (400 mL) was heated to reflux using a Dean-Stark apparatus for 20 h. The reaction mixture was cooled to room temperature and the product was isolated by filtration, washed with methanol (400 mL) and vacuum-dried at 40 C. for 12 h to give the product as a white crystalline solid (136 g, 93%). LC-MS (ESI-MS): m/z=365 g/mol [M+1H].sup.1+.

2. Synthesis of (((2-methyl-1,4-phenylene)bis(oxy))bis(carbonyl)bis (4,1-phenylene) bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate (2)

[0252] ##STR00040##

[0253] Diphenol 1 (72 g, 0.2 mol) was dissolved in dry THF (1.2 L) in the presence of pyridine (50 mL, 0.62 mol) as an HCl acceptor. In a separated flask trimellitic anhydride chloride (TMAC, 85 g, 0.41 mol) was dissolved in dry THF (0.8 L). The diphenol solution was slowly added to the TMAC solution at 0 C. After stirring for 20 h at room temperature the formed precipitate was filtered, washed with THF, water and again THF and vacuum-dried at 80 C. for 12 h. An excess of Ac.sub.2O was added to the partially hydrolyzed product and heated at 120 C. for 3 h to ensure cyclodehydration. Ac.sub.2O was azeotropically removed with toluene. The product was finally purified by recrystallization from toluene and vacuum-dried at 160 C. for 12 h (104 g, 71%). .sup.1H-NMR (500 MHz, DMSO-d.sub.6): =8.74-8.62 (m, 3H), 8.41-8.22 (m, 6H), 7.71-7.66 (m, 3H), 7.65-7.61 (m, 1 H), 7.40-7.36 (m, 3H), 7.28 (dd, J=8.6, 2.7 Hz, 1H), 2.25 (s, 3H) ppm.

3. Synthesis of 2-methyl-1,4-phenylene bis(1,3-dioxo-1,3-dihydroiso-benzofuran-5-carboxylate) (3)

[0254] ##STR00041##

[0255] 2-Methyl hydroquinone (30 g, 0.24 mol) was dissolved in a mixed solvent of dry THF (0.4 L) and pyridine (59 mL, 0.73 mol). Trimellitic anhydride chloride (104 g, 0.48 mol) was dissolved in anhydrous THF (0.3 L) and added dropwise to the methyl hydroquinone solution at 0 C. with continuous stirring over 1 h, then subsequently reacted at room temperature for 12 h. The reaction mixture was filtered off to collect the white precipitate consisting of crude product and pyridine/hydrochloride salt as by-product. The precipitate was repeatedly washed with water and THF to remove the salt and subsequently dried at 160 C. for 24 h in vacuum. Since the product undergoes partial hydrolysis toward anhydride ring opening on the procedure, the solid was suspended in dry toluene (600 mL), added with DMF (6 drops) and oxalyl chloride (49.5 g, 0.39 mol) and stirred at reflux for 8 h to ensure ring closure dehydration. The batch is cooled to room temperature, filtered and washed with dry toluene and dry THF and finally dried at 120 C. in vacuum. The crude product obtained was finally recrystallized from a mixed solvent of 1,4-dioxane/THF (1/1, v/v) then vacuum-dried again at 160 C. for 24 h to yield the product as a white solid (102 g, 89%). .sup.1H NMR (500 MHz, DMSO-d.sub.6): =8.71 (dd, J=7.9, 1.4 Hz, 1H), 8.69-8.65 (m, 2H), 8.64 (t, J=1.1 Hz, 1 H), 8.31 (ddd, J=7.9, 4.6, 0.8 Hz, 2H), 7.47 (d, J=8.8 Hz, 1 H), 7.45 (dd, J=2.8, 0.8 Hz, 1 H), 7.37 (dd, J=8.6, 2.9 Hz, 1H), 2.26 (s, 3H) ppm.

4. Synthesis of [1,1-biphenyl]-4,4-diylbis(1,3-dioxo-1,3-dihydroiso-benzo-furan-5-carboxylate (4)

[0256] ##STR00042##

[0257] 4,4-Dihydroxybiphenyl (60 g, 0.32 mol) was dissolved in a mixed solvent of dry DMF (0.6 L) and pyridine (80 mL, 0.97 mol). Trimellitic anhydride chloride (139 g, 0.64 mol) was dissolved in anhydrous DMF (0.4 L) and added dropwise to the 4,4-dihydroxybiphenyl solution at 0 C. with continuous stirring over 1 h, then subsequently reacted at 80 C. for 20 h. The reaction mixture was filtered off to collect the yellow precipitate consisting of crude product and pyridine/hydrochloride salt as by-product. The precipitate was repeatedly washed with water and dry THF to remove the salt. Since the product undergoes partial hydrolysis toward anhydride ring opening on the procedure, it was heated at 160 C. for 24 h in vacuum to ensure ring closure dehydration to yield the product as a yellow solid (138 g, 80%). .sup.1H-NMR (500 MHz, DMSO-d.sub.6): =8.72-8.64 (m, 4H), 8.31 (d, J=8.6, 2H), 7.86 (d, J=8.3 Hz, 4H), 7.53 (J=8.3 Hz, 4H) ppm.

5. Synthesis of 1,4-phenylene bis(4-hydroxybenzoate) (5)

[0258] ##STR00043##

[0259] A mixture of 4-hydroxybenzoic acid (49 g, 0.35 mol), hydroquinone (20 g, 0.176 mol), p-toluenesulfonic acid monohydrate (3.4 g, 0.017 mol) and p-xylene (0.2 L) was heated to reflux using a Dean-Stark apparatus for 20 h. The reaction mixture was cooled to room temperature and the product was isolated by filtration, washed with methanol (400 mL) and vacuum-dried at 40 C. for 12 h to yield the product as a white crystalline solid (59 g, 95%). .sup.1H-NMR (500 MHz, DMSO-d.sub.6): =10.54 (s, 2H), 8.04-7.97 (m, 4H), 7.33 (s, 4H), 6.98-6.91 (m, 4H) ppm. LC-MS (ESI-MS): m/z=351 g/mol [M+1H].sup.1+.

6. Synthesis of ((1,4-phenylenebis(oxy))bis(carbonyl))bis (4,1-phenylene) bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate) (6)

[0260] ##STR00044##

[0261] Trimellitic anhydride chloride (TMAC, 147 g, 0.685 mol) was dissolved in dry THF (1.0 L) in the presence of pyridine (50.8 g, 0.64 mol). In a separated flask diphenol 5 (75 g, 0.21 mol) was dissolved in dry THF (0.8 L) and slowly added to the TMAC solution at 0 C. After stirring for 20 h at reflux the formed precipitate was filtered, washed with THF, water and again THF and vacuum-dried at 160 C. for 20 h (104 g, 71%). .sup.1H-NMR (500 MHz, DMSO-d.sub.6): =8.74-8.62 (m, 3H), 8.36-8.27 (m, 6H), 8.22 (dd, J=8.9, 2.9 Hz, 2H), 7.68 (dd, J=8.8, 2.4 Hz, 2H), 7.50-7.35 (m, 5H) ppm.

7. Synthesis of 4,4-((1s,3s,5r,7r)-adamantane-1,3-diyl)diphenol (7)

[0262] ##STR00045##

[0263] Phenol (47 g, 0.5 mol, dissolved in 920 mL TFA) was treated with 1,3-adamantanediol (40 g, 0.24 mol) and heated at reflux for 20 h. The reaction mixture was cooled to room temperature and quenched cautiously with H.sub.2O (1 L). A white solid precipitated, which was suspended in DCM and stirred overnight at 35 C. The solid was filtered off, washed with DCM and dried under vacuum to yield 58 g (76%) of white crystalline solid.

[0264] .sup.1H-NMR (500 MHz, DMSO-.sub.d6) =8.99 (broad s), 7.20-7.16 (m, 4H), 6.72-6.67 (m, 4H), 2.21 (p, J=3.0, 2H), 1.87-1.79 (m, 10H), 1.71 (d, J=3.1 Hz, 2H) ppm.

8. Synthesis of ((1s,3s,5r,7r)-adamantane-1,3-diyl)bis(4,1-phenylene) bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxylate) (8)

[0265] ##STR00046##

[0266] Trimellitic anhydride chloride (TMAC, 43 g, 0.2 mol) was dissolved in dry THF (0.3 L) in the presence of pyridine (14.8 g, 0.19 mol). In a separated flask diphenol 7 (20 g, 0.062 mol) was dissolved in dry THF (0.3 L) and slowly added to the TMAC solution at 0 C. After stirring for 20 h at reflux the formed precipitate was filtered, washed with THF, water and again THF and vacuum-dried at 45 C. for 20 h. An excess of Ac.sub.2O was added to the partially hydrolyzed product and heated at 120 C. for 12 h to ensure cyclodehydration. The reaction mixture was filtered, washed with THF and vacuum-dried at 100 C. for 12 h (29.6 g, 71% of a lightly yellow solid). .sup.1H-NMR (500 MHz, DMSO-d.sub.6): =8.67-8.59 (m, 4H), 8.28 (d, J=7.9 Hz, 2H), 7.58 (d, J=8.4 Hz, 4H), 7.33 (d, J=8.2 Hz, 4H), 2.31 (s, 2H), 2.06 (s, 2H), 2.02-1.91 (m, 8H), 1.79 (s, 2H) ppm.

[0267] B Synthesis of Oligomers

9. Example 1

[0268] ##STR00047##

[0269] Dianhydride 2 (30 g, 0.04 mol) was dissolved in NMP/toluene (0.3 L, 1/1, v/v). A solution of hexamethylenediamine (9.8 g, 0.08 mol) in NMP (50 mL) was added and the reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and maleic anhydride (9.8 g, 0.1 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 100 mL of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol to precipitate the oligomer. After filtering and drying 11.7 g (85%) of the oligomer was yielded as brown powder.

10. Example 2

[0270] ##STR00048##

[0271] Dianhydride 2 (30 g, 0.04 mol) was dissolved in NMP/toluene (0.3 L, 1/1, v/v) followed by the addition of priamine (45 g, 0.08 mol). The reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and maleic anhydride (9.8 g, 0.1 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 50 mL of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol (0.6 L) to precipitate the oligomer. After removing the solvent the crude product was washed twice with methanol and vacuum-dried to produce 65 g (81%) of a brown waxy resin.

11. Example 3

[0272] ##STR00049##

[0273] Dianhydride 4 (21 g, 0.04 mol) was suspended in NMP/toluene (0.3 L, 1/1, v/v) followed by the addition of priamine (45 g, 0.08 mol). The reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and maleic anhydride (10 g, 0.1 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 50 mL of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol (0.6 L) to precipitate the oligomer. After removing the solvent the crude product was washed twice with methanol and vacuum-dried to produce 61 g (88%) of a dark waxy resin.

12. Example 4

[0274] ##STR00050##

[0275] Dianhydride 4 (21 g, 0.04 mol) was dissolved in NMP/toluene (0.3 L, 1/1, v/v). A solution of hexamethylenediamine (9.8 g, 0.08 mol) in NMP (50 mL) was added and the reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and maleic anhydride (9.8 g, 0.1 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 100 mL of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol to precipitate the oligomer. After filtering and drying 25 g (70%) of the oligomer was yielded as brown powder.

13. Example 5

[0276] ##STR00051##

[0277] Dianhydride 2 (15 g, 0.02 mol) was suspended in NMP/toluene (0.2 L, 1/1, v/v) followed by the addition of decane-1,10-diamine (7.3 g, 0.04 mol). The reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and maleic anhydride (5.2 g, 0.052 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 0.2 L of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol (0.8 L) to precipitate the oligomer. After removing the solvent the crude product was washed twice with methanol and vacuum-dried to produce 24 g (96%) of a brown solid.

14. Example 6

[0278] ##STR00052##

[0279] Dianhydride 2 (30 g, 0.04 mol) was dissolved in NMP/toluene (0.3 L, 1/1, v/v) followed by the addition of priamine (45 g, 0.08 mol). The reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and 2,3-dimethylmaleic anhydride (13.7 g, 0.1 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 100 mL of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol (0.5 L) to precipitate the oligomer. After removing the solvent the crude product was washed twice with methanol and vacuum-dried to produce 54 g (65%) of a brown waxy resin.

15. Example 7

[0280] ##STR00053##

[0281] Dianhydride 3 (13 g, 0.028 mol) was suspended in NMP/toluene (0.3 L, 1/1, v/v) followed by the addition of 1,12-diaminododecane (11.5 g, 0.056 mol). The reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and maleic anhydride (7.0 g, 0.07 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 0.2 L of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol (0.8 L) to precipitate the oligomer. After removing the solvent the crude product was washed twice with methanol and vacuum-dried to produce 20 g (71%) of a brown solid.

16. Example 8

[0282] ##STR00054##

[0283] Dianhydride 8 (10 g, 0.015 mol) was dissolved in NMP/toluene (0.1 L, 1/1, v/v) followed by the addition of priamine (16.5 g, 0.03 mol). The reaction mixture was heated to reflux using a Dean-Stark apparatus for 12 h. The reaction mixture was cooled to room temperature and maleic anhydride (3.7 g, 0.04 mol) was slowly added. The mixture was heated again to reflux using a Dean-Stark apparatus for 12 h. An additional 50 mL of toluene was added after the mixture had been cooled down to room temperature. The mixture was finally added drop-wise to methanol (0.2 L) to precipitate the oligomer. After removing the solvent the crude product was washed twice with methanol and vacuum-dried to produce 20 g (71%) of a brown waxy resin.

[0284] C Mechanical Testing

17. Example

Tensile Strength and Elongation at Break

[0285] Tensile strength and elongation at break were measured from some of the example polymer specimens (film dimension 25 mm long, 15 mm wide, typically 50-60 m thick) on a mechanical testing machine (500 N Zwicki) (see Table 1). The measurements were performed according to the following parameter set: premeasurement: 0.1 N at an extension rate of 10 mm/min; main extension rate of 50 mm/min. All experiments were conducted at room temperature (232 C.).

TABLE-US-00001 TABLE 1 Measurement of elongation at break and tensile strength. UV dose Elongation at Tensile strength [min] break [%] [MPa] Example 2 M.sub.n = 9.600 Da 0.5 245 6 3 206 17 M.sub.n = 14.000 Da 0.5 231 22 3 157 19 Example 6 M.sub.n = 7.000 Da 0.5 255 4 3 209 8 M.sub.n = 15.000 Da 0.5 288 24 3 242 14

[0286] D Electrical Properties

18. Example

Evaluation of the Dielectric Constant

[0287] ITO (indium tin oxide) glass was coated via spin coating process with a defined thickness of the materials. The thickness was measured with a profilometer from Bruker. Subsequently, a silver layer was vacuum deposited via a mask process to avoid short cuts on the coated area. The resistance of the layer stacks was determined with an LCR meter and the dielectric constant was calculated. The results are shown in Table 2.

TABLE-US-00002 TABLE 2 Calculation of dielectric constants Layer Capacitance Dielectric Material thickness [m] [nF] constant Example 3 (a) 3.66 0.17 3.6 Example 3 (b) 3.18 0.2 3.7 Example 3 (c) 2.99 0.21 3.6 Example 6 (a) 3.21 0.21 3.9 Example 6 (b) 3.23 0.19 3.5 Example 6 (c) 4.04 0.17 4.0