SYSTEMS AND METHODS FOR COOLING SENSOR PACKAGES
20230417603 ยท 2023-12-28
Inventors
- Yueqi Li (San Jose, CA, US)
- Gabriella Levine (San Francisco, CA, US)
- Erich Schlaepfer (Sunnyvale, CA, US)
Cpc classification
G01K1/026
PHYSICS
B05B12/004
PERFORMING OPERATIONS; TRANSPORTING
B05B1/20
PERFORMING OPERATIONS; TRANSPORTING
A01M7/0042
HUMAN NECESSITIES
G01K3/005
PHYSICS
A01G25/09
HUMAN NECESSITIES
International classification
G01K3/00
PHYSICS
B05B1/20
PERFORMING OPERATIONS; TRANSPORTING
B05B12/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Implementations are disclosed for a cooling system for cooling sensor packages disposed on an agricultural vehicle, robot, etc. In various implementations, the cooling system includes: a reservoir containing a coolant; one or more sprayers to dispense the coolant from the reservoir at a target; a conduit that fluidly couples the reservoir with the one or more sprayers; and a sensor package that includes at least one processor. At least a portion of the sensor package is in contact with the conduit so that heat is dissipated from the sensor package by the coolant flowing through the conduit.
Claims
1. A cooling system, the system comprising: a reservoir containing a coolant; one or more sprayers to dispense the coolant from the reservoir at a target; a conduit that fluidly couples the reservoir with the one or more sprayers; and a sensor package including at least one processor, at least a portion of the sensor package being in contact with the conduit; wherein heat is dissipated from the sensor package by the coolant flowing through the conduit.
2. The cooling system of claim 1, wherein the sensor package is in thermal contact with the conduit through one or more thermal interface materials.
3. The cooling system of claim 1, wherein the conduit is an irrigation boom and the coolant is water, liquid fertilizer, liquid pesticide, or a combination thereof.
4. The cooling system of claim 1, wherein the coolant is gaseous.
5. The cooling system of claim 1, wherein the conduit is constructed of a metal and the metal is a heat sink for heat dissipated by the sensor package.
6. The cooling system of claim 1, wherein the conduit is part of a hydraulic system.
7. The cooling system of claim 1 further comprising a temperature sensor disposed proximate the sensor package and coupled to one or more processors, wherein the one or more processors are configured to: detect, by the temperature sensor, a temperature; and based the detected temperature satisfying a threshold, alter a flow of the coolant through the conduit.
8. The cooling system of claim 7, wherein the one or more processors include the at least one processor of the sensor package.
9. The cooling system of claim 7, wherein the sensor package is a first sensor package of a plurality of sensor packages, and wherein the temperature sensor is a first temperature sensor of a plurality of temperature sensors; wherein each sensor package of the plurality of sensor packages includes one temperature sensor of the plurality of temperature sensors; wherein a computing device is further configured to: detect, for each of the plurality of temperature sensors, a temperature; determine, for each of the plurality of temperature sensors, whether the detected temperature is above a predetermined threshold temperature; and alter the flow of the coolant based on the determination that the detected temperature is above the predetermined threshold temperature.
10. A sensor package, the sensor package comprising: a processor; wherein at least a portion of the sensor package is configured to contact a conduit that fluidly couples a reservoir containing a coolant with one or more sprayers to dispense the coolant; wherein heat is dissipated from the sensor package by the coolant flowing through the conduit, when the sensor package is coupled with the conduit.
11. The sensor package of claim 10, wherein the sensor package is configured to be in thermal contact with the conduit through one or more thermal interface materials.
12. The sensor package of claim 10, wherein the sensor package is configured to contact the conduit of an irrigation boom and the coolant is water, liquid fertilizer, liquid pesticide, or a combination thereof.
13. The sensor package of claim 10, wherein the sensor package is configured to contact the conduit that is part of a hydraulic system.
14. The sensor package of claim 10, wherein the sensor package is configured to contact the conduit that is constructed of a metal and the metal is a heat sink for heat dissipated by the sensor package.
15. The sensor package of claim 10 further comprising a temperature sensor disposed proximate the sensor package and coupled to one or more processors, wherein the one or more processors are configured to: detect, by the temperature sensor, a temperature; and based the detected temperature satisfying a threshold, alter a flow of the coolant through the conduit.
16. The sensor package of claim 15, wherein the sensor package is a first sensor package of a plurality of sensor packages, and wherein the temperature sensor is a first temperature sensor of a plurality of temperature sensors; wherein each sensor package of the plurality of sensor packages includes one temperature sensor of the plurality of temperature sensors; wherein a computing device is further configured to: detect, for each of the plurality of temperature sensors, a temperature; determine, for each of the plurality of temperature sensors, whether the detected temperature is above a predetermined threshold temperature; and alter the flow of the coolant based on the determination that the detected temperature is above the predetermined threshold temperature.
17. A method implemented using one or more processors, comprising: obtaining, from a temperature sensor disposed proximate a sensor package attached to a conduit that fluidly couples a reservoir containing a coolant with one or more sprayers to dispense the coolant, temperature data; altering a flow of the coolant through the conduit, wherein the altering includes: processing the temperature data using a machine learning model; determining, based on the processed temperature data, that the sensor package requires targeted cooling; and rerouting the coolant in the conduit to the sensor package.
18. The method of claim 17, wherein the rerouting the coolant in the conduit to the sensor package further includes using one or more feedback loops.
19. The method of claim 17, wherein rerouting the coolant in the conduit to the sensor package further includes opening or closing one or more valves in the conduit.
20. The method of claim 17, wherein the conduit is integral with an irrigation boom and the coolant is water, liquid fertilizer, liquid pesticide, or a combination thereof.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0019]
[0020]
[0021]
[0022]
[0023]
DETAILED DESCRIPTION
[0024] Implementations are described herein for leveraging a coolant (e.g. water, fertilizer, etc.) that is already being deployed, e.g., for purposes such as being applied to crops, to cool sensor packages and/or other modular computing devices. More particularly, but not exclusively, a sensor package may be in contact with a conduit (e.g., along a boom affixed to a tractor, along a center pivot deployed in a field, or the like) which has one or more materials flowing therethrough and one or more sprayers for dispensing the material flowing therethrough. In some implementations, the conduit may be an irrigation boom that is conventionally used for dispensing water, liquid fertilizer, liquid pesticides, and/or other liquid substances that may be dispensed onto an agriculture field. The material flowing through the conduit may be used to cool the sensor package(s) in contact with the conduit, such that heat may dissipate between a heat-producing device, in this instance the sensor package, and a heat-dissipating device, in this instance the conduit.
[0025]
[0026] As shown by the called-out window at top right, sensor package 134.sub.M may, in some implementations, include one or more sensors in the form of vision sensors 136.sub.1-N, one or more lights 138, a light controller 141, and processor 142 that is configured to carry out selected aspects of the present disclosure. Such components, in particular light(s) 138, may produce heat that may contribute a sensor package's proclivity to overheat. Other sensor packages may or may not be similarly configured. Vision sensors 136.sub.1-N may take various forms, and may or may not be the same as each other. These forms may include, for instance, an RGB digital camera, a stereoscopic camera, an infrared camera, a 1.5D camera, a 3D camera, a light detection and ranging (LIDAR) sensor, and so forth.
[0027] The sensor package 134.sub.M may also include one or more wireless antenna 144.sub.1-P. In some implementations, each wireless antenna 144 may be configured to transmit and/or receive different types of wireless data. For example, where a temperature sensor (not illustrated in
[0028] Processor 142 may include various types of circuitry (e.g. FPGA, ASIC) that is configured to carry out selected aspects of the present disclosure. For example, and as shown in the called-out window at top left in
[0029]
[0030] The sensor packages 234.sub.1-6 may, in some implementations, be attached to the conduit 238 through the use of one or more thermal interface materials (not visible in
[0031] Although illustrated in
[0032] In some implementations, it may not be desirable (for any number of reasons) to dispose the sensor package(s) 234 directly on the conduit 238 utilized to convey the coolant to the sprayers 210 of the boom sprayer 230. In such instances, the cooling system may include an additional conduit loop(s) 242 (illustrated in broken line) coupled with the conduit 238 of the boom sprayer 230 onto which the sensor package(s) may be disposed. This may allow for the positioning of the sensor package(s) to vary from the predefined route of the conduit 238 of the boom sprayer 230. The illustrated location of the additional conduit loop 242 in
[0033] The conduit 238 and/or additional conduit loop 242, in some implementations, may additionally include one or more valves 244 to control the flow of the coolant therethrough. These one or more valves 244 may be coupled to a computing device (e.g. computing device 510 of
[0034] In some implementations, the conduit and/or the sensor packages 234.sub.1-6 may additionally include one or more temperature sensors 240.sub.1-6. Although illustrated in
[0035] The computing device (e.g. computing device 510 of
[0036] In other implementations, the computing device (e.g. computing device 510 of
[0037] In implementations where artificial intelligence and/or machine learning is used to determine which sensor packages 234.sub.1-6 and/or regions of the conduit 238 are currently in need of the greatest amount of cooling and/or subjected to greater amounts of heat, various types of machine learning models may be trained, e.g. to detect and/or classify the sensed temperature to a corresponding location of the sensor package(s) 234.sub.1-6. In some implementations, various types of neural networks may be trained to generate output of correspondence data of the temperatures and locations.
[0038] In some implementations the conduit may not be an irrigation boom, but rather a part of a hydraulic system 300 of a vehicle, robot, etc. An example of such a hydraulic system 300 is illustrated in
[0039] The exemplary hydraulic system 300 of
[0040] In some implementations, like illustrated in
[0041] In some implementations, for example where an agricultural vehicle or robot carries the sensor package(s) 334, the vehicle's hydraulic system (system 300 in
[0042] As discussed with other implementations herein, the illustrated location and/or number of sensor packages 334 is not intended to be limiting. The location, spacing, and/or number of sensor packages 334 with respect to the conduit 310 may be determined by the particular sensors contained in the sensor packages 334 and/or the resulting use thereof.
[0043]
[0044] At block 402, temperature data, including one or more temperatures and associated information, may be obtained by the one or more temperature sensors. As described herein, these temperature sensors may be disposed proximate one or more sensor packages and/or included within the sensor packages.
[0045] At block 404, the flow of the fluid (e.g. coolant) flowing through the conduit may be altered based on the obtained temperatures. In some implementations, altering the flow of the fluid may include processing the data collected by the temperature sensors through a machine learning model (block 406), determining if the sensor needs cooling (block 408) and/or determining how to reroute the fluid flowing through the conduit (block 410) to the locations/sensors targeted for cooling. In some implementations, the alteration of the flow of the fluid through conduit may include using one or more feedback loops (optional 412) to reroute or direct the flow of the fluid. In other implementations, altering the flow of the fluid may include opening and/or closing one or more valves (optional block 414) within conduit in order to route fluid to targeted locations of the conduit. Targeted locations may include, for example, locations where the temperature was detected as being higher than a predetermined or preset threshold and/or the warmest x-number of locations as determined by the temperature sensors. In further implementations, it may be desirable to utilize the data collected by the temperature sensors and the machine learning model to adjust additional components of the sensor package or agricultural vehicle (e.g. lights, engines, and/or other heat producing elements).
[0046]
[0047] User interface input devices 522 may include a keyboard, pointing devices such as a mouse, trackball, touchpad, or graphics tablet, a scanner, a touch screen incorporated into the display, audio input devices such as voice recognition systems, microphones, and/or other types of input devices. In some implementations in which computing device 510 takes the form of a HMD or smart glasses, a pose of a user's eyes may be tracked for use, e.g., alone or in combination with other stimuli (e.g., blinking, pressing a button, etc.), as user input. In general, use of the term input device is intended to include all possible types of devices and ways to input information into computing device 510 or onto a communication network.
[0048] User interface output devices 520 may include a display subsystem, a printer, a fax machine, or non-visual displays such as audio output devices or haptic feedback devices. The display subsystem may include a cathode ray tube (CRT), a flat-panel device such as a liquid crystal display (LCD), a projection device, one or more displays forming part of a HMD, or some other mechanism for creating a visible image. The display subsystem may also provide non-visual display such as via audio output devices. In general, use of the term output device is intended to include all possible types of devices and ways to output information from computing device 510 to the user or to another machine or computing device.
[0049] Storage subsystem 524 stores programming and data constructs that provide the functionality of some or all of the modules described herein. For example, the storage subsystem 524 may include the logic to perform selected aspects of the method 400 described herein, as well as to implement various components depicted in
[0050] These software modules are generally executed by processor 514 alone or in combination with other processors. Memory 525 used in the storage subsystem 524 can include a number of memories including a main random access memory (RAM) 530 for storage of instructions and data during program execution and a read only memory (ROM) 532 in which fixed instructions are stored. A file storage subsystem 526 can provide persistent storage for program and data files, and may include a hard disk drive, a floppy disk drive along with associated removable media, a CD-ROM drive, an optical drive, or removable media cartridges. The modules implementing the functionality of certain implementations may be stored by file storage subsystem 526 in the storage subsystem 524, or in other machines accessible by the processor(s) 514.
[0051] Bus subsystem 512 provides a mechanism for letting the various components and subsystems of computing device 510 communicate with each other as intended. Although bus subsystem 512 is shown schematically as a single bus, alternative implementations of the bus subsystem may use multiple busses.
[0052] Computing device 510 can be of varying types including a workstation, server, computing cluster, blade server, server farm, or any other data processing system or computing device. Due to the ever-changing nature of computers and networks, the description of computing device 510 depicted in
[0053] While several implementations have been described and illustrated herein, a variety of other means and/or structures for performing the function and/or obtaining the results and/or one or more of the advantages described herein may be utilized, and each of such variations and/or modifications is deemed to be within the scope of the implementations described herein. More generally, all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and/or configurations will depend upon the specific application or applications for which the teachings is/are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific implementations described herein. It is, therefore, to be understood that the foregoing implementations are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, implementations may be practiced otherwise than as specifically described and claimed. Implementations of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein. In addition, any combination of two or more such features, systems, articles, materials, kits, and/or methods, if such features, systems, articles, materials, kits, and/or methods are not mutually inconsistent, is included within the scope of the present disclosure.