Abstract
A heating plate for the thermal-medical treatment of skin includes an acting section for being applied to the skin on a top side of the heating plate; a connecting section for attaching the heating plate to a printed circuit board on a bottom side of the heating plate; and a recess on the bottom side of the heating plate. A device for the thermal-medical treatment of skin and a method of manufacturing a heating plate are also disclosed.
Claims
1. A heating plate (14) for the thermal-medical treatment of skin, comprising: an acting section (24) for being applied to the skin on a top side (20) of the heating plate; a connecting section (26) for attaching the heating plate to a printed circuit board (12) on a bottom side (28) of the heating plate; and a recess (32) on the bottom side of the heating plate.
2. The heating plate (14) according to claim 1, wherein the recess (32) is designed for accommodating of a component on the printed circuit board (12) when the heating plate is attached to the printed circuit board, in particular an LED (52), preferably a soldered-on surface-mounted LED.
3. The heating plate (14) according to claim 1, wherein the recess (32) comprises areas (32a, 32b) with different depths.
4. The heating plate (14) according to claim 1, wherein the recess (32) extends through the connecting section (26) and into the acting section (24).
5. The heating plate (14) according to claim 1, wherein the recess (32) in an area within the acting section (24) is open in exactly one spatial direction; is designed to be closed off from an environment by the printed circuit board (12); and/or has, at least in a partial area, a bone-shaped cross-sectional area with a central area (36) and two external areas (38a, 38b) widened relative to the central area.
6. The heating plate (14) according to claim 1, wherein the acting section (24) is formed of a ceramic material; and the connecting section (26) is preferably formed of a different material connected to the ceramic material using a baking process.
7. The heating plate (14) according to claim 1, wherein the acting section (24) in the area of the recess (32) has a thickness of between 0.2 mm and 0.8 mm, preferably about 0.4 mm; the heating plate has a maximum thickness between 0.5 mm and 1.5 mm; and/or the acting section has rounded edges.
8. The heating plate (14) according to claim 1, comprising a further recess (40) on the top side (20) of the heating plate in the acting section (24), wherein the further recess (40, 40a, 40b, 40c, 40d) preferably has a depth which is selected such that a bottom of the further recess is brought into contact with the skin when the acting section is applied to the skin by pressing in the skin.
9. The heating plate (14) according to claim 1, wherein the connecting section (26) comprises a metal layer (34) for soldering the heating plate onto the printed circuit board (12), in particular a copper layer; and the metal layer preferably comprises multiple areas (34a, 34b, 34c, 34d, 34e, 34f, 34g) not electrically connected to one another for soldering onto multiple soldering surfaces of the printed circuit board.
10. The heating plate (14) according to claim 1, wherein an edge section (30) which is set back relative to the acting section (24) on the top side (20) of the heating plate, wherein the edge section preferably circulates the acting section step-like and/or is formed of the same material as the acting section.
11. A device (10) for thermal-medical treatment of skin, comprising: a printed circuit board (12), in particular a flexible printed circuit board; a heating plate (14) according to claim 1, which is attached to the printed circuit board; and a heating element (16) thermally connected to the heating plate for heating the heating plate to a treatment temperature.
12. The device (10) according to claim 11, comprising a component attached to the printed circuit board (12) in the recess (32) of the heating plate (14), in particular an LED.
13. A method of manufacturing a heating plate (14) according to claim 1, comprising a step of creating the recess (32), a further recess (40, 40a, 40b, 40c, 40d) and/or an edge section (30) by ablative laser processing of the heating plate.
14. A method of manufacturing a heating plate (14), according to claim 1, comprising a step of creating the recess (32), a further recess (40, 40a, 40b, 40c, 40d) and/or an edge section (30) by pressing a ceramic powder into a mold.
15. A The method of manufacturing a heating plate (14) according to claim 13, wherein parallel processing of multiple heating plates in a panel is performed.
Description
[0037] The invention is described and explained in more detail below with reference to some selected embodiments in connection with the accompanying drawings. They show:
[0038] FIG. 1 a schematic view of the design of a device for the thermal-medical treatment of skin according to the invention;
[0039] FIG. 2 a schematic perspective view of the top side of a heating plate according to the invention;
[0040] FIG. 3 a schematic perspective view of the top side of a further embodiment of a heating plate according to the invention;
[0041] FIG. 4 a schematic perspective view of the bottom side of an embodiment of a heating plate according to the invention with a connecting section and a rectangular recess;
[0042] FIG. 5 a schematic view of a bottom side of a heating plate according to the invention with multiple areas of the connecting section that are not electrically connected to one another;
[0043] FIG. 6 a schematic view of a recess having a bone-shaped cross-sectional area;
[0044] FIG. 7 a schematic view of a recess in the connecting section;
[0045] FIG. 8 a schematic view of a recess in the connecting section with small depth;
[0046] FIG. 9 a schematic view of a bone-shaped recess extending into the connecting section and into the acting section;
[0047] FIG. 10 a schematic view of a bone-shaped recess extending only into the connecting section;
[0048] FIG. 11 a schematic view of a recess with areas of varying depth;
[0049] FIG. 12 a schematic view of another embodiment with areas of the recess having different depths;
[0050] FIG. 13 a schematic view of an embodiment with a recess divided in two parts;
[0051] FIG. 14 a schematic view of a top side of a heating plate according to the invention with a further recess;
[0052] FIG. 15 a schematic view of an arrangement of the heating plate in a device according to the invention;
[0053] FIG. 16 a perspective view of a further arrangement in a device according to the invention; and
[0054] FIG. 17 a perspective sectional view of a further arrangement in a device according to the invention.
[0055] FIG. 1 shows a schematic view of a device 10 according to the invention for the thermal-medical treatment of skin. The illustration is to be understood as a sectional view in which the components of the device 10 are visualized. The device 10 comprises a printed circuit board 12, a heating plate 14, and a heating element 16. In the illustrated embodiment, the device 10 is designed as a couplable portable device for coupling to a mobile device 18, in particular a smartphone or a tablet. For example, the device 10 may be configured to plug into a USB-C or lightning port of the mobile device 18 to be powered and/or controlled from the mobile device 18. It is understood that other embodiments of the device 10 according to the invention are also possible, in particular a stand-alone device.
[0056] In the illustrated embodiment, the heating plate 14 and the heating element 16 are attached on different sides of the printed circuit board 12, which is designed as a flexible printed circuit board. In this case, the heating plate 14 serves to contact the skin (not shown) and to transfer heat to the skin. The heating element 16 can be designed, for example, as a heating resistor or a heating transistor and serves for heat generation. The heat is directed through the printed circuit board 12 into the heating element 16. On its top side 20 the heating plate 14 comprises an acting section to be placed on the skin. On a bottom side 28, the heating plate 14 comprises a connecting section for attaching the heating plate 14 to the printed circuit board 12, for example by soldering.
[0057] In FIG. 2, a heating plate 14 according to the invention is shown schematically in perspective view. In particular, the top side 20 of the heating plate 14 can be seen. The acting section 24 arranged on the top side 20 of the heating plate 14 is designed to apply the heating plate 14 to the skin. In particular, the acting section 24 may be formed of a ceramic material. For example, aluminum nitride or aluminum oxide can be used. The acting section 24 may have rounded edges to allow for an easy application without risk of injury. Furthermore, the connection-compliant heating plate 14 comprises a connecting section 26 by means of which the heating plate 14 can be fixed to a printed circuit board. The connecting section 26 is arranged on the bottom side 28 of the heating plate 14. The heating plate 14 can have a total thickness of between 0.5 mm and 1.5 mm, for example.
[0058] In the embodiment shown in FIG. 2, the heating plate 14 has an edge section 30 which is arranged on the top side 20 of the heating plate 14 and is set back relative to the acting section 24. In the illustrated embodiment, the edge section 30 is designed as a circumferential step, which facilitates assembly.
[0059] FIG. 3 shows a schematic view of an embodiment of a heating plate 14 according to the invention, in which the acting section 24 on the top side 20 comprises both the offset upper area with the rounded edge and the edge section 30. Thereby, the edge section 30 is formed of the same material as the acting section. Not shown in FIG. 3 is the connecting section, which is not visible in the illustration due to the perspective view.
[0060] In comparison of FIGS. 2 and 3, the circumferential edge section 30 in FIG. 2 is thus part of the connecting section 26, whereas the circumferential edge section 30 in FIG. 3 is part of the acting section 24.
[0061] FIG. 4 shows a schematic view of the bottom side 28 of a heating plate 14 according to the invention. In the embodiment shown in FIG. 4, the acting section 24 corresponds to a 3D-formed ceramic layer. The connecting section 26 corresponds to a metal layer connected to this ceramic layer, in particular a copper layer. A recess 32 is provided on the bottom side 28 of the heating plate 14 according to the invention. In the illustrated embodiment, the recess 32 extends through the connecting section 26 into the acting section 24. In various embodiments of the invention, the acting section 24 may have a thickness of between 0.2 mm and 1 mm in the area of the recess 32, for example, preferably approximately 0.4 mm. This ensures sufficient stability.
[0062] The invention provides that the heating plate 14 is manufactured by ablative laser processing and/or by pressing a ceramic powder into a mold. By means of these manufacturing processes, it is possible for the heating plate 14 to obtain a 3D shaping. In particular, by applying such manufacturing processes to a ceramic material, a variety of different shapes can be realized. By using a 3D manufacturing process, such as ablative laser processing, a recess 32 can be created.
[0063] The recess 32 can accommodate, for example, a component that is attached to the printed circuit board. The heating plate 14 is arranged in the manner of a lid, so to speak, above a component on the printed circuit board. The component is then located in the recess 32. For example, the recess 32 can thereby be dimensioned such that an LED can be arranged therein. In this case, it is possible for light to be generated by this LED, with, for example, a ceramic material being translucent, so that, due to the generation of light in the recess 32, illumination of the heating plate 14 through the acting section 24 and thus illumination of a skin area to be treated is possible.
[0064] In the illustrated embodiment, the recess 32 is open in an area within the acting section in exactly one spatial direction, in direction of the bottom side 28. In this respect, the design of the recess provides, in particular, that it is closed off from an environment when the heating plate 14 is fixed to the printed circuit board at its bottom side 28.
[0065] FIG. 5 schematically shows an embodiment of the heating plate 14 according to the invention, in which the connecting section 26 comprises a metal layer 34. By means of the metal layer 34, the heating plate 14 can be soldered onto the printed circuit board. In particular, a copper layer may be provided. In the embodiment shown in FIG. 5, the metal layer 34 comprises multiple areas 34a, 34b, 34c and 34d which are not electrically connected to one another and which can be soldered onto multiple soldering surfaces of the printed circuit board. By using multiple soldering surfaces, it is possible for the soldering surfaces to be directly electrically and thermally connected to soldering surfaces of a heating element, in particular a heating resistor. In addition, the use of further areas that are no longer electrically connected also makes it possible to connect different components with different voltage levels. This can be particularly advantageous for connecting a temperature sensor or various potentials of the heating element, since this is only thermally coupled, but not electrically. Another area of the metal layer 34 can be connected to a ground conductor.
[0066] FIG. 5 further shows that the recess 32 is arranged in a first area within the connecting section 26, said first area having a connection to an environment when the heating plate 14 is soldered onto the printed circuit board. In a second area of the recess 32 within the acting section 24, the recess 32 is merely open in one spatial direction (toward the printed circuit board). In this respect, it is possible that the recess 32 has different cross-sections in different areas.
[0067] FIG. 6 shows a further embodiment in which the connecting section 26 comprises a metal layer 34. Also shown in FIG. 6 is that the metal layer 34 comprises multiple areas 34a, 34b, 34c, 34d, 34e that are not electrically connected to one another. Different arrangements are possible here. It is understood that further embodiments are also conceivable and advantageous in order to enable different forms of connection in this respect.
[0068] FIG. 6 also shows that the recess 32, at least partially, has a bone-shaped cross-section or bone-shaped cross-sectional area in a plane parallel to the heating plate or parallel to the printed circuit board. The bone-shaped cross-sectional area has a central area 36 and two external areas 38a and 38b which are wider than the central area 36. The cross-sectional area is to be understood as an area parallel to the heating plate or parallel to the printed circuit board in the area where the heating plate is attached to the printed circuit board.
[0069] FIG. 7 schematically shows an embodiment of the heating plate 14 according to the invention in which the recess 32 is located only within the connecting section 26 and does not extend into the acting section 24. In this respect, the connecting section 26 is comparatively thick. In particular, the connecting section 26 can be designed as a thicker metal layer 34, in particular a copper layer.
[0070] The acting section 24 does not comprise any part of the recess 32. Due to the comparatively thick metal layer 34 or the comparatively thick connecting section 26 it is possible for a component to be arranged within the recess 32. The recess 32 is large enough, so to speak, to accommodate a component on the printed circuit board when the heating plate 14 is attached to the printed circuit board.
[0071] FIG. 8 schematically shows a perspective view of the bottom side 28 of the heating plate 14 in which the connecting section 26 comprises a metal layer 34. The recess 32 extends only into the connecting section 26, but not into the acting section 24. Due to the fact that the recess 32 has only a comparatively small depth, under certain circumstances no component can be accommodated in the recess 32 if the heating plate 14 is soldered onto a printed circuit board. However, light may nevertheless be transmitted through the printed circuit board and through the acting section 24, for example, by an LED disposed on another side of a printed circuit board (i.e., a side opposite the side of the heating plate), so that the skin area to be treated can be illuminated. This is advantageous, for example, if the material of the acting section 24 is translucent, while the material of the connecting section 26 is not.
[0072] FIG. 9 shows a schematic view of an embodiment of the heating plate 14 according to the invention in the area of the bottom side 28. At least in a partial area within the acting section 24, the recess 32 has a bone-shaped cross-section or bone-shaped cross-sectional area. Furthermore, in the illustrated embodiment in FIG. 9, different areas of the metal layer 34 of the connecting section 26 that are not electrically connected to one another are provided, which can be soldered onto multiple soldering surfaces of a printed circuit board.
[0073] FIG. 10 shows a schematic view of an embodiment in which the connecting section 26 comprises a comparatively thick metal layer 34 which, in the illustrated embodiment, is also composed of multiple areas 34a, 34b, 34c, 34d, 34e, 34f, 34g. In the illustrated embodiment in FIG. 10, the recess 32 does not extend into the acting section 24, but only into the connecting section 26. Also in FIG. 10, the recess 32 has a substantially bone-shaped cross-sectional area, but only in a partial area within the connecting section 26.
[0074] FIG. 11 shows a schematic view of an embodiment of a heating plate 14 according to the invention in which a metal layer 34 of the connecting section 26 comprises multiple areas 34a, 34b, 34c, 34d, 34e, 34f. In addition, the recess 32 is intended to include areas having different depths. In a first area 38a, the recess 32 extends deeper into the acting section 24 than in a second area 38b divided in two parts.
[0075] FIG. 12 shows a schematic view of an embodiment of the heating plate 14 according to the invention, in which the recess 32 comprises areas with different depths. In addition, the connecting section 26 comprises a metal layer 34 with different areas.
[0076] FIG. 13 shows a schematic view of an embodiment of a heating plate 14 according to the invention, in which the recess 32 is designed as consisting of two parts. In a first area 32a of the recess, for example, a first component can be accommodated, and in a second area 32b of the recess, for example, a second component can be accommodated when the heating plate 14 is attached to the printed circuit board. It is understood that other arrangements and embodiments are also conceivable.
[0077] FIG. 14 shows a schematic view of an embodiment in which the heating plate 14 has a further recess 40 on its top side 20 in the acting section 24. In the illustrated embodiment, the recess 40 is designed as consisting of four parts with four areas 40a to 40d. In particular, it is advantageous if the further recess 40 has a depth selected such that a bottom of the further recess 40 can be brought into contact with the skin by pressing in the skin when the acting section 24 is applied to the skin. A depth between 0.03 mm and 0.1 mm has proven to be particularly advantageous for this purpose. In the embodiment shown, the logo lettering is thus only so far offset or so deeply inserted into the top side 20 of the heating plate 14 that contacting the skin is nevertheless possible even in the area of the further recess 40 or the lettering, in order to heat the skin area to be treated.
[0078] FIG. 15 schematically shows a design of the components of the device 10 according to the invention. An LED 52 is attached so that light can be directed through the heating plate 14 onto the skin area to be treated. In this regard, it is sufficient that the recess is located in the connecting section, i.e., that an area of the connecting section is provided where no metal surface is applied. Since the ceramic material is translucent, the skin area to be treated can be illuminated.
[0079] In this respect, FIG. 16 shows a perspective view, from which it becomes apparent that the printed circuit board 12 can also have a cutout, so that the recess 32 in the heating plate 14 is accessible from below in order to allow light from the LED 52 to pass through.
[0080] In FIG. 17, a view of a further advantageous design according to the invention is shown. The illustration consists of a sectional view transverse to a longitudinal axis of the device 10, in which the upper layer of the heating plate 14 or its acting section is not visible (sectional plane striped). A total of 4 heating elements 16a, 16b, 16c, 16d and an LED 52 are arranged in the recess 32.
[0081] The invention has been comprehensively described and explained with reference to the drawings and the description. The description and explanation are to be understood as an example and not restrictive. The invention is not limited to the disclosed embodiments. Other embodiments or variations will be apparent to those skilled in the art upon use of the present invention and upon close analysis of the drawings, the disclosure and the following claims.
[0082] In the claims, the word comprising does not exclude other elements or steps, and the indefinite article a or an does not exclude a plurality. A single element or single unit may fulfill the functions of several items recited in the claims. An element, a unit, a device and a system may partially or completely be implemented by corresponding hardware and/or software. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Reference signs in the claims are not to be understood restrictively. Identical reference signs in the figures denote the same elements in each case.
