PROCESS AND ARRANGEMENT FOR MANUFACTURING A BOARD ELEMENT COMPRISING CAVITIES
20230417063 · 2023-12-28
Assignee
Inventors
Cpc classification
B44C5/0453
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A process for manufacturing a board element including at least one cavity in a rear side thereof. The process includes providing a substrate including a thermoplastic material, wherein the substrate includes a substrate portion, and creating the at least one cavity in a rear side of the substrate by impressing the substrate portion by an impression device including at least one protruding impression element, thereby obtaining the board element. The substrate portion is disposed at an elevated temperature (TS) of 40-295 C. when creating the at least one cavity. The process includes creating at least one tapering cavity by means of at least one tapering impression element.
Claims
1. Process for manufacturing a board element comprising at least one cavity in a rear side thereof, wherein the process comprises: providing a substrate comprising a thermoplastic material, wherein the substrate comprises a substrate portion, and creating said at least one cavity in a rear side of the substrate by impressing the substrate portion by an impression device comprising at least one protruding impression element, thereby obtaining said board element, wherein the substrate portion is disposed at an elevated temperature (TS) when creating the at least one cavity, the elevated temperature (TS) being 40-295 C., and wherein the at least one protruding impression element is a tapering impression element, and wherein the tapering impression element creates a tapering cavity.
2. The process according to claim 1, wherein a draft angle between a lateral wall portion of the at least one tapering impression element and an overall normal direction of the impression device exceeds 0.5.
3. The process according to claim 1, wherein the tapering impression element comprises a tapering lateral wall portion and/or a bevel, and the tapering cavity comprises a tapering cavity wall and/or a chamfer.
4. The process according to claim 1, further comprising forming at least one chamfer in the at least one tapering cavity, each chamfer being disposed between a cavity wall and said rear side or between the cavity wall and a bottom wall of the tapering cavity.
5. The process according to claim 1, wherein the impression device comprises at least one roller.
6. The process according to claim 1, wherein the impression device comprises an impression press plate provided with a structured surface comprising said at least one protruding impression element.
7. The process according to claim 1, wherein the elevated temperature is in the range of 100-295 C.
8. The process according to claim 1, wherein said elevated temperature is obtained by heating the substrate portion.
9. The process according to claim 8, wherein said elevated temperature is obtained during a forming of the substrate under heat and, optionally, pressure.
10. The process according to claim 1, wherein said impressing comprises applying a pressure of 0.4-5.0 MPa to the substrate portion.
11. The process according to claim 1, further comprising cooling at least a cavity region of the substrate or the board element during and/or after creating the at least one cavity.
12. The process according to claim 11, wherein said cavity region is cooled to a cooling temperature which is within a range of 0.8 to 1.9 of a glass-transition temperature of the thermoplastic material, wherein the cooling temperature and the glass-transition temperature are specified in Kelvin.
13. The process according to claim 1, further comprising supporting at least an inner portion of the created at least one cavity during lamination of a layer to the board element and/or during cooling of at least a cavity region of the board element.
14. The process according to claim 1, further comprising pre-shaping the substrate before said creating of the at least one cavity.
15. The process according to claim 1, wherein the board element is provided in the form of a panel or is dividable into at least one panel, such as at least two panels, each panel being a building panel, floor panel, wall panel, ceiling panel or furniture component.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0090] The disclosure will in the following be described in connection to exemplary embodiments and in greater detail with reference to the appended exemplary drawings, wherein:
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DETAILED DESCRIPTION
[0115] Next, various embodiments of an arrangement 20 for manufacturing a board element 1 comprising at least one cavity 2, preferably a plurality of cavities, in a rear side 5 of the board element, as well as embodiments of a related board element per se, will be described with reference to the embodiments in, e.g.,
[0116] The arrangement 20 extends in a longitudinal X, a transverse Y, and a vertical Z direction. As shown in, e.g., the embodiments in
[0117] A substrate 3 in which the cavities are to be created may be provided between, such as fed, between the impression 10a and mating 10b members. During a creation of the cavities 2 in the substrate, the impression member 10a and mating member 10b may be configured to face a rear side 3b and the front side 3c of the substrate, respectively.
[0118] In some embodiments, as shown in, e.g.,
[0119] In some embodiments, as shown in, e.g.,
[0120] The impression 10a and mating 10b members, such as the impression press plate 12a and the mating plate 12b, may be relatively displaceable with respect to each other along a, preferably vertical, direction V.
[0121] The press plate assembly 12 may be provided in a static press 13a, such as a short-cycle press (see, e.g.,
[0122] In some embodiments, the static press 13a may comprise at least two impression press plates 12a, and preferably at least two mating plates 12b, see, e.g., the generic schematic embodiment in
[0123] In, for example,
[0124] The double belt-press may comprise an upper 27a and a lower 27b endless belt unit. The impression press plate 12a may be provided as a portion of a belt 28b of the lower 27b (or upper 27a) endless belt unit, see, e.g.,
[0125] In some embodiments, and as shown in
[0126] In some embodiments, and as shown in
[0127] The impression member 10a, for example the impression press plate 12a or the flexible member 12e, such as the impression elements 9, e.g., in any of
[0128] The substrate 3 may be transported from an inlet of the double-belt press to a pressing member 29 thereof. The pressing member 29 may comprise an upper 29a and/or a lower 29b press member configured to apply pressure, and preferably heat, to the substrate 3 for creating the cavities 2.
[0129] Generally herein, a feeding speed of an arrangement 20 comprising an extruder may be 0.5-10 m/min, preferably 1-8 m/min, more preferably 1.5-6.0 m/min. Moreover, a feeding speed of an arrangement 20 comprising a continuous press, such as a double-belt press, may be 2-20 m/min, preferably 3-15 m/min, more preferably 4-13 m/min. The arrangement 20 in, e.g.,
[0130] The protruding impression elements 9 (or the support elements 7 defined below) in any embodiment herein, such as in
[0131] As shown in, e.g.,
[0132] The at least one impression element 9 may be tapering, preferably in a direction away from the base portion 10c, such as in the overall normal direction N. In any of the embodiments in
[0133] Other types of tapering impression elements are equally conceivable. In some embodiments, the at least one impression element 9 may comprise a bevel, such as an outer 9a and/or an inner 9b bevel, see, e.g.,
[0134] The arrangement 20 may comprise a substrate forming arrangement 16, preferably provided upstream from the impression device 10, see, e.g.,
[0135] As shown in the embodiment in, e.g.,
[0136] In some embodiments, and may be seen in, e.g.,
[0137] The roller assembly 16b in any of
[0138] The arrangement 20 may comprise a substrate heating device 14. In some embodiments, and as shown in, e.g.,
[0139] Alternatively or additionally to the substrate heating device 14, the arrangement 20 may comprise a cooling unit 15 and/or 15a preferably arranged downstream of and/or at the substrate heating device 14. The cooling unit 15 (15a) may be adapted to face the rear side 3b (front side 3c) and may be configured to cool the rear side 3b (front side 3c). The cooling unit 15 and/or 15a may be separately arranged and may be provided in the form of one or several tempered rollers, see for example
[0140] In some embodiments, the cavities 2 may be created in the substrate 3 by means of an isochoric pressing operation. This may be particularly advantageous when the substrate 3 is formed in a substrate forming arrangement 16, such as when it is provided in the form of a low-viscosity paste when creating the cavities. Thereby, a control of the thickness of the substrate may become improved. In a first example and, e.g., in any of
[0141] In some embodiments, the cavities 2 may be created in the substrate 3 by means of an isobaric pressing operation, for example in a static 13a or a continuous 13b press. This may be particularly advantageous when the substrate 3 is preformed and when a substrate portion 3a thereof is separately heated, see, e.g.,
[0142] Optionally, the substrate forming arrangement 16 may comprise a top layer roller arrangement 22 comprising a decorative layer 22a and/or a wear layer 22b roller arrangement. Such a top layer roller arrangement 22 is shown in more detail in
[0143] At least one layer 8 may be in some embodiments be laminated to the board element 1 in a pressing member 29, such as a static press, preferably under heat, see, e.g.,
[0144] In some embodiments, as shown in
[0145] The support member 18 may comprise at least one protruding support element 7, preferably a plurality of them. The support elements 7 are provided on a base member 18c of the support member and protrude therefrom in an overall normal direction N of the support member 18, for example of the base member 18c. The support member 18 may be a support roller 18a (see
[0146] In
[0147] The support member 18 and abutment member 17, such as the support plate 18b and the abutment plate 17b, may be relatively displaceable with respect to each other along a, preferably vertical, direction W.
[0148] As indicated elsewhere herein, a form of the support elements 7 may be the same as the form of the impression elements 9. Moreover, the support member 18, for example the support plate 18a and/or the support elements 7, e.g., in any of
[0149] In some embodiments, e.g., as shown in
[0150] In some embodiments, the arrangement 20 may comprise a pre-shaping device 19, see, e.g.,
[0151] As shown most clearly in
[0152] Preferably, a cross-section CG of the grooves 2 is substantially constant along a longitudinal extension L of the grooves 2g. The cross-section CG may be an area delimited by a plane PR extending along the rear side 3b. An opening 19d of the die may thereby be stationary. For example, the projections 19b may be fixedly mounted in the die 19a. However, in some embodiments, the cross-section CG may vary along the longitudinal extension L. For example, the varying cross-section may be obtained by means of a die 19a comprising an adjustable opening 19d. The opening 19d may comprise one or several movable parts 19e, preferably in the form of movable projections 19b (see broken line in
[0153] After pre-shaping the substrate 3, cavities 2 may be created in the rear side 3b by an impression device 10, for example comprising roller(s) 11 as shown in
[0154] Hence, as shown in
[0155] As shown in, e.g.,
[0156] As illustrated in, e.g.,
[0157] The arrangement 20 in, e.g., any of
[0158] First, a substrate 3 comprising a thermoplastic material 4 is provided (Box 31 or 41). The substrate 3 may be preformed and a substrate portion 3a thereof may be heated by a substrate heating device 14 (Box 32 or 42), such that the substrate portion 3a or even the entire substrate 3 becomes disposed at an elevated temperature TS. In some embodiments, the elevated temperature TS may be obtained during a forming of the substrate 3 under heat and, preferably, pressure (Box 33 or 43). For example, the substrate 3 may be at least partially formed in a (co-) extruder 16a or in a pressing device. In some embodiments, the substrate 3 may be pre-shaped in a pre-shaping device 19, which may be provided by the (co-)extruder 16a. The pre-shaped substrate 3 may comprise grooves 2g. In any of the embodiments above, the elevated temperature TS may exceed 40 C., preferably being 40-295 C., more preferably 100-295 C.
[0159] The substrate portion 3a, preferably the entire substrate 3, may comprise a thermoplastic material 4 comprising thermoplastic polymers 4a, such as PVC, PE, PP, TPU, PET, EVA, PA, PS, PVAc, PMMA, PVB, PC, ABS, PAM, PBT, or CPVC, and a filler 4b. The filler 4b may comprise, or may be, an inorganic filler, such as a mineral material, for example calcium carbonate (CaCO.sub.3), limestone, such as chalk, talc, fly ash, or a stone material, such as stone powder. When the thermoplastic material 4 comprises PVC, the elevated temperature TS may be 50-210 C., preferably 60-180 C., more preferably 110-180 C. When the thermoplastic material 4 comprises PP, the elevated temperature TS may be 60-220 C., preferably 70-175 C., more preferably 100-175 C. When the thermoplastic material 4 comprises PET, the elevated temperature TS may be 70-295 C., preferably 110-280 C., more preferably 130-280 C.
[0160] Thereafter, the cavities 2 are created in a rear side 3b of the substrate 3 by impressing the heated substrate portion 3a by impression elements 9 (Box 34 or 44). This may be implemented by any of the impression devices 10 disclosed herein, such as in any of
[0161] An impression press cycle of the static press 13a, preferably the short-cycle press, may exceed 5 seconds, such as exceeding 10 seconds, preferably when the substrate 3 is provided at the elevated temperature TS. In a non-limiting example, the press cycle may be 20-50 seconds. In some embodiments, an impression press cycle in the static press 13a, preferably the multi-daylight press, including heating may be 10-40 minutes, such as 15-35 minutes, such as 20-30 minutes, potentially followed by a cooling cycle of 5-40 minutes, such as 10-30 minutes, such as 15-25 minutes. An impression press cycle of the continuous press, such as the double-belt press, may be 20-400 seconds, such as 25-220 seconds, such as 30-180 seconds.
[0162] When a pre-shaped substrate 3 with grooves 2g is provided, the heated substrate portion 3a may include the inner section 2k of the grooves 2g, and the cavities 2 may be created by impressing the inner section 2k by impression elements 9 (Box 34).
[0163] The act of impressing may comprise applying a pressure of 0.4-5.0 MPa to the substrate portion 3a, such as 0.5-4.0 MPa or 0.6-3.0 MPa. For example, the applied pressure may be 0.7-2.5 MPa, such as 1.0-2.0 MPa. Any of the pressures above may be conceivable for the static press or the continuous press disclosed herein.
[0164] In some embodiments, the process may comprise forming at least one chamfer 2a, 2b in the cavity or cavities 2. The chamfers, such as an outer 2a and/or an inner 2b chamfer, may be formed by the bevels, such as the inner 9b and/or outer 9a bevels, of the impression elements 9. The chamfers 2a, 2b may be provided along a longitudinal LE and/or a transverse extension TE of the cavities 2, such as along the entire circumference of the cavities. Each chamfer 2a, 2b may be disposed between a cavity wall 2c and the rear side 3b, 5 or between the cavity wall 2c and a bottom wall 2d of the cavity 2. The chamfer 2a, 2b may be inclined with respect to a normal direction M of the substrate 3 or board element 1 by a chamfer angle y, see, e.g.,
[0165] More generally, the process may comprise creating a tapering cavity or cavities 2 by means of tapering impression elements 9, see, e.g.,
[0166] The wall angle may exceed 0.5, such as exceeding 1.0 or even exceeding 3.0. Alternatively, or additionally, the wall angle may be less than 80, such as being less than 70, or even less than 50. For example, the wall angle may be 0.5-70, such as 0.5-45 or 1-30. Alternatively, or additionally, to the tapering cavity wall 2c, the tapering cavities 2 may comprise a chamfer 2a, 2b described above.
[0167] Generally herein, a form of the cavities 2 may correspond to a form of the impression elements 9. For example, the draft angle and wall angle may correspond to each other and/or the bevel angle and the chamfer angle may correspond to each other.
[0168] In some embodiments, and as illustrated in, e.g.,
[0169] In a first example, the impression member 10a comprises a first 9g and a second 9h set of impression elements 9 separated by a blank portion 10e. In a second example, the impression member 10a comprises a first 9g and a second 9h set of impression elements 9 separated by a blank portion 10f. In a third example, the impression member 10a comprises a first 9g and a second 9h set of impression elements 9 separated by a blank portion 10e and a first 9g and a second 9h set of impression elements 9 separated by a blank portion 10f. It is emphasized that in any of the examples above, there may be additional second sets 9h, 9h, 9h defined in a similar manner w.r.t. to an adjacent first set 9h, 9h, 9h, e.g., as shown in
[0170] In
[0171] Preferably, the impression elements 9 described herein are spaced from an edge section 10g of the impression member 10a by a space 10f, such as in a direction perpendicular to the operational direction OD. Thereby, the cavities 2 may be provided in an interior 5a of the rear side 5 as described elsewhere herein. During operation of the impression device 10, the edge section 10g may extend transversely to, and optionally along, the feeding direction F, e.g., along the separation direction(s) S1 and/or S2.
[0172] Likewise, as illustrated in, e.g.,
[0173] Optionally, the cavity region 2e of the board element 1 or the substrate 3, preferably the rear side 3b, 5, may be cooled by the cooling unit 15 adapted to face the rear side 3b (Box 36 or 45) during and/or after creating the cavities 2. The cavity region 2e may be cooled from the elevated temperature TS to a cooling temperature T.sub.c below the elevated temperature.
[0174] In some embodiments, the cavity region 2e may be cooled to a cooling temperature T.sub.c, such that 0.8T.sub.c/T.sub.g1.9. When the thermoplastic material 4 comprises PVC, the range may be 0.8T.sub.c/T.sub.g1.9. When the thermoplastic material 4 comprises PET, the range may be 1.0T.sub.c/T.sub.g1.4. When the thermoplastic material 4 comprises PP, the range may be 1.0T.sub.c/T.sub.g1.9.
[0175] In non-limiting examples, the cavity region 2e may be cooled from (i.e., below) the elevated temperature by at least 20 C., preferably 20-120 C. for semi-crystalline polymers, such as PET, and by at least 30 C., preferably 30-90 C., for amorphous polymers, such as PVC.
[0176] In some embodiments, the cavity region 2e may be cooled from the elevated temperature TS by at least 10 C., preferably 10-100 C., below T.sub.m of the thermoplastic material 4, e.g., comprising PP, PE, TPU or EVA.
[0177] In some embodiments, the inner portion 2f of the created cavities 2 may be supported during the cooling (Boxes 35, 36 and 45).
[0178] Alternatively, or in addition, to the cooling of the cavity region 2e, the front side 3c may be cooled during and/or after creating the cavities 2 by the cooling unit 15a adapted to face the front side 3c (Box 36 or 45). The cooling may be such that a well-defined and uniform front side is provided.
[0179] Optionally, a layer 8 may be attached, such as laminated or adhered, to the board element 1 (Box 37 or 44). In some embodiments, as shown in
[0180] As an alternative or complement to supporting the inner portion 2f during attachment of the layer 8, the substrate portion 3a or the board element 1 may be cooled after creating the cavities 2 and before attaching the layer 8, see, e.g.,
[0181] The board element 1 herein may be provided in the form of a panel 1 or may dividable into at least one panel 1, such as at least two panels, wherein each panel is a building panel, floor panel, wall panel, ceiling panel or furniture component. In fact, embodiments of the process disclosed herein (see, e.g., Box 30 or 40) may further comprise dividing the board element 1 into at least one panel, such as at least two panels 1, by the board dividing device 21a. For example, the board element 1 may be divided into board members 1 by a first dividing unit 21a, which in turn may be further divided into at least two panels 1 by a second dividing unit 21a, wherein the panels preferably are divided into a substantially final format. Preferably, the board element 1 or board member 1 is divided while provided above an initial temperature of the substrate 3 and/or an ambient temperature. Any dividing disclosed herein may be implemented by machining, such as by using knives, rotating cutting tools, and similarly.
[0182] In some embodiments, the board element 1 is divided into board members 1 at a dividing portion DP in the form of a separation portion 5b, cf.
[0183] Indeed, in some embodiments, and as shown in, e.g.,
[0184] As shown in
[0185] Optionally, one or several of the edge portions 1a-1d of the substrate 3 may be trimmed after creating the cavities 2, such as by cutting with a rotating cutting device or with one or several knives, or by punching. An excess portion if to be trimmed is illustrated in
[0186] Alternatively, or additionally, the process may further comprise producing a locking device 6a, 6b on at least one edge portion 1a, 1b, 1c, 1d by the profiling unit 21b. Preferably, the locking device 6a, 6b is produced on two opposite edge portions of the panel(s) 1.
[0187] The separation portion 5b (or 5b) may function as a strengthening board area in which no cavities 2 are arranged. Alternatively, it may function as a dividing portion DP (or DP) of the board element 1, cf.
[0188] In some embodiments, the arrangement 20 may further comprise an annealing unit 21c, preferably arranged after at least a part of the board dividing device 21a and before the profiling unit 21b, see, e.g.,
[0189] The annealing (Box 38 or 46) may comprise heating the board element 1 or board member 1 to an annealing temperature of 80-170 C., such as 120-145 C., such as 130-140 C., preferably when the thermoplastic material 4 comprises PVC and a filler 4b, such as an inorganic filler. By way of example, the annealing unit 21c may comprise at least one of a heat oven, a hot-air heater, and a heat bath comprising a fluid, such as water.
[0190]
[0191] Any, some, or each layer 8, 8a, 8b, 8c, 8d, 8e, 8f may comprise a thermoplastic material 4 comprising thermoplastic polymers 4a, such as PVC, and a filler 4b. Other materials, such as PE, PP, TPU, PET, EVA, PA, PS, PVAc, PMMA, PVB, PC, ABS, PAM,
[0192] PBT, or CPVC, are equally conceivable. The filler 4b may comprise, or may be, an inorganic filler, such as a mineral material. Generally herein, the thermoplastic material 4 may further comprise additives 4c, such as at least one of a stabilizer, a blowing agent or a foaming agent, a plasticizer, a colourant, pigments, a lubricant, an impact modifier, a processing aid, etc. For example, a layer 8 of the panel 1, such as the core 8a, e.g., obtainable by embodiments of the process described herein, may comprise 10-40 wt % PVC, 50-90 wt % inorganic filler, such as chalk, and 0-20 wt %, such as 5-20 wt %, additives.
[0193] Additives 4c, such as a plasticizer and/or a lubricant, in the thermoplastic material 4 may contribute to an increased flow of the material, such as in the (co-)extruder 16a, and hence a more controlled impression may be obtained. The plasticizer, such as dioctyl terephthalate, DOTP, may soften the thermoplastic material 4. The lubricant may be an internal lubricant, such as fatty alcohols or fatty glycerol esters, and/or an external lubricant, such as wax, e.g., a PE wax or a paraffin wax. For example, a degree of plasticizer may be 1-25 wt %, preferably 3-20 wt %, and/or a degree of lubricant may be 0.2-5 wt % , preferably 1-2 wt %. Moreover, additives 4c, such as a processing aid, may be included for improving the fusion of the thermoplastic material 4 during forming of the substrate 3 and/or for mitigating the formation of cracks during impression. For example, a degree of processing aid, such as an acrylic processing aid, may be 0.5-5 wt %, preferably 1-3 wt %.
[0194] In some embodiments, the thermoplastic polymers 4a may comprise a PVC-PVAc copolymer and, optionally PVC. Thereby, the thermoplastic material 4 may become softer and more easily processed, whereby the impression may become simplified. For example, a degree of PVC/PVAc copolymer may be 5-100 wt %, preferably 8-25 wt %.
[0195] In any of the embodiments of the substrate 3 or board element 1 or panel 1 herein, such as in
[0196] In some embodiments, and as shown, e.g., in
[0197] In some embodiments, as illustrated in, e.g.,
[0198] In some embodiments, the impressed cavities 2 may be elongated, whereby the longitudinal extension LE exceeds the transverse extension TE. For instance, the elongated cavities 2 may be created by elongated impression elements 9, e.g., provided on an impression roller 11a or on an impression press plate 12a. As shown in
[0199] In any of the embodiments herein, the elongated cavities 2 may be continuous, as shown, e.g., in
[0200] Generally herein, e.g., in
[0201] The cavities 2, for example in any of
[0202] Alternatively, or additionally, to the chamfer(s) 2a, 2b, the cavities 2 in any of
[0203] The substrate 3 or board element 1, such as the panel 1, herein may have a, preferably maximal, thickness T of 2-10 mm.
[0204] In some embodiments, the cavities 2 may intersect at least a portion of the locking device 6a and/or 6b. For example, the cavities 2 may be open horizontally outwards, such as along a transverse TD and/or longitudinal LD direction of the board element 1. By means of these intersections, parts of the locking device may be impaired along the edge portions. Nevertheless, for many applications the resulting locking strength may be sufficient, especially when the cavities 2 intersect the locking device 6a. Indeed, the long edge portions 1a, 1b have a larger extension and hence, in total, may provide a larger locking portion.
[0205] It is emphasized that intersecting cavities 2 may be created by any means, such as by impression or by removing material, for example by a rotating processing device or by carving or scraping, e.g., as described in WO 2020/180237 on page 58, line 26 to page 63, line 6 and
[0206] The cavities 2 may at least partially intersect the locking device 6a on one long edge portion 1a (see
[0207] In some embodiments, the locking device 6b may be absent of cavities 2, see, e.g.,
[0208] In some embodiments, the cavities 2 may at least partially intersect the locking device 6b, see, e.g.,
[0209] In some embodiments, the depth DC of the cavities 2 may be smaller at the long 1a, 1b and/or short 1c, 1d edge portions than in the interior 5a. The depth DC of the cavities 2 may be smaller at the locking device 6a and/or 6b, for example at the strip 6c, than in the interior 5a, cf.
[0210] As shown in
[0211] The backing layer 8e may be continuous at least at a location of the cavities 2. Preferably, the entire backing layer 8e is continuous, such as shown in
EXAMPLE
[0212] A dependency of a degree of impression on temperature variations was tested on a set of sample pairs Q1-Q9 (and Q1-Q9) consisting of identical SPC panels (and identical LVT panels), each in the form of a homogeneous core with a density of 2083 kg/m.sup.3 and a flexural modulus 8240 N/mm.sup.2 (and a density of 1948 kg/m.sup.3 and a flexural modulus of 1599 N/mm.sup.2). The flexural modulus was tested according to ISO 178:2010/A1:2013. Each pair contained two identical samples. Each sample had dimensions 100100 mm and a thickness of 5 mm.
[0213] The samples of each pair were heated to a uniform temperature as specified in Tables 1 and 2. The heated samples in the pairs Q1-Q7 and Q1-Q7 were each impressed during about 10 seconds by an impression device comprising a cylindrical impression element having a diameter =8 mm, see
[0214] Closed surfaces of the rear sides of the two samples in each pair were impressed identically at the same temperature by applying a constant force of f0=98 N on the impression element and against the respective sample, see the test systems in
TABLE-US-00001 TABLE 1 Average impression depths of heated samples Temperature ( C.) Samples Depth (mm) Samples Depth (mm) 40 Q1 0 Q1 0.04 60 Q2 0 Q2 0.09 100 Q3 0.11 Q3 0.22 140 Q4 0.57 Q4 1.26 160 Q5 0.78 Q5 1.72 180 Q6 1.74 Q7 3.10 220 Q7 3.30 Q7 3.30
[0215] It may be seen from Tables 1 and 2 that, for a given impression element, the impression depths w0 increased when the sample temperature increased. It may also be concluded that a more substantial degree of impression started at a temperature at or exceeding 100 C.
TABLE-US-00002 TABLE 2 Average impression depths of heated samples Temperature ( C.) Samples Depth (mm) Samples Depth (mm) 140 Q8 0.83 Q8 1.33 160 Q9 1.03 Q9 2.30
[0216] By comparing Table 1 and 2 it may be seen that, for a fixed temperature, the impression depths w0 increased when the tapering impression element was used. It was also found that smoother surface structures were obtained at the impressed rear side. For example, the closed surfaces of the rear sides were maintained to a higher degree. Finally, it was found to be easier to remove the impression elements from the samples in the pairs Q8, Q9, Q8 and Q9.
[0217] Aspects of the disclosure have mainly been described above with reference to a few embodiments. However, as is readily appreciated by a person skilled in the art, other embodiments than the ones disclosed above are equally possible within the scope of the disclosure. For example, it is stressed that the blank portion 10e and/or 10f may in some embodiments optionally comprise embossing elements 10h, preferably being smaller than the impression elements 9, such as being 50%, preferably 70%, more preferably 90%, smaller than the impression elements in height HS and/or extension, preferably in the horizontal directions E1, E2, see
EMBODIMENTS
[0218] Further aspects of disclosure are provided below. Embodiments, examples etc. of these aspects are largely analogous to the embodiments, examples, etc. as described above, whereby reference is made to the above for a detailed description.
[0219] Item 1. Process for manufacturing a board element (1) comprising at least one cavity (2), preferably a plurality of cavities, in a rear side (5) thereof, wherein the process comprises: [0220] providing a substrate (3) comprising a thermoplastic material (4), wherein the substrate comprises a substrate portion (3a), and creating said at least one cavity (2) in a rear side (3b) of the substrate (3) by impressing the substrate portion (3a) by an impression device (10) comprising at least one protruding impression element (9), thereby obtaining said board element (1).
[0221] Item 2. The process according to item 1, wherein the impression device (10) comprises at least one roller (11).
[0222] Item 3. The process according to item 1, wherein the impression device (10) comprises an impression press plate (12a) provided with a structured surface (12c) comprising said at least one protruding impression element (9).
[0223] Item 4. The process according to any of the preceding items, wherein a first (9g) and a second (9h; 9h) set of impression elements (9) are separated from each other along a separation direction (S1; S2) by a blank portion (10e; 10f), a distance (L2; L2) between the impression elements along the separation direction (S1; S2) between the first and the second sets being larger than a distance (L1; L1) between the impression elements within each of the first and the second sets.
[0224] Item 5. The process according to any of the preceding items, wherein the substrate portion (3a) is disposed at an elevated temperature (TS) when creating the at least one cavity (2).
[0225] Item 6. The process according to item 5, wherein said elevated temperature (TS) is obtained by heating the substrate portion (3a).
[0226] Item 7. The process according to item 5, wherein said elevated temperature (TS) is obtained during a forming of the substrate (3) under heat and, preferably, pressure.
[0227] Item 8. The process according to any of the preceding items 5-7, wherein the elevated temperature (TS) exceeds 40 C., preferably being 40-295 C., more preferably 100-295 C.
[0228] Item 9. The process according to any of the preceding items, wherein said impressing comprises applying a pressure of 0.4-5.0 MPa to the substrate portion (3a).
[0229] Item 10. The process according to any of the preceding items, further comprising forming the substrate (3) under heat, preferably under pressure and/or by (co-) extrusion.
[0230] Item 11. The process according to any of the preceding items, further comprising cooling at least a cavity region (2e) of the substrate (3) or the board element (1) during and/or after creating the at least one cavity (2).
[0231] Item 12. The process according to item 11, wherein said cavity region (2e) is cooled to a cooling temperature (T.sub.c) which is within a range of 0.8 to 1.9 of a glass-transition temperature (T.sub.g) of the thermoplastic material (4), wherein the cooling temperature (T.sub.c) and the glass-transition temperature (T.sub.g) are specified in Kelvin.
[0232] Item 13. The process according to any of the preceding items, further comprising attaching a layer (8) to the board element (1).
[0233] Item 14. The process according to any of the preceding items, further comprising supporting at least an inner portion (2f) of the created at least one cavity (2) during lamination of a layer (8) to the board element (1) and/or during cooling of at least a cavity region (2e) of the board element (1).
[0234] Item 15. The process according to item 13 or 14, wherein the layer (8) is a decor structure (8b) and/or a backing layer (8e).
[0235] Item 16. The process according to any of the preceding items, further comprising forming at least one chamfer (2a, 2b) in the at least one cavity (2), each chamfer being disposed between a cavity wall (2c) and said rear side (3b; 5) or between the cavity wall (2c) and a bottom wall (2d) of the cavity (2).
[0236] Item 17. The process according to any of the preceding items, further comprising creating at least one tapering cavity (2) by means of at least one tapering impression element (9).
[0237] Item 18. The process according to any of the preceding items, wherein a draft angle (a) between a lateral wall portion (9c) of the at least one impression element (9) and an overall normal direction (N) of the impression device (10) exceeds 0.5.
[0238] Item 19. The process according to any of the preceding items, further comprising displacing the substrate (3) in a feeding direction (F), preferably during said creating of the at least one cavity.
[0239] Item 20. The process according to any of the preceding items, further comprising pre-shaping the substrate (3) before said creating of the at least one cavity (2).
[0240] Item 21. The process according to any of the preceding items, wherein the board element (1) is provided in the form of a panel (1) or is dividable into at least one panel, such as at least two panels, each panel being a building panel, floor panel, wall panel, ceiling panel or furniture component.
[0241] Item 22. The process according to any of the preceding items, further comprising annealing the board element (1) after creating the at least one cavity (2).
[0242] Item 23. A board element (1), such as a panel (1), obtainable by the process according to any of the preceding items 1-22.
[0243] Item 24. A panel (1) comprising at least one layer (8) comprising a thermoplastic material (4), wherein the panel comprises at least one cavity (2) in a rear side (5) of the panel, preferably a plurality of cavities.
[0244] Item 25. The panel according to item 24, wherein the at least one cavity (2) comprises at least one chamfer (2a, 2b), each chamfer being disposed between a cavity wall (2c) and said rear side (5) or between the cavity wall (2c) and a bottom wall (2d) of the cavity (2).
[0245] Item 26. The panel according to item 24 or 25, wherein the at least one cavity (2) taper.
[0246] Item 27. The panel according to item 26, wherein a cavity wall (2c) is inclined with respect to a normal direction (M) of the substrate (3) by a wall angle () exceeding 0.5.
[0247] Item 28. The panel according to any of the preceding items 24-27, wherein said at least one cavity (2) is provided in an interior (5a) of the rear side (5) being spaced from a pair of opposite edge portions (1a, 1b; 1c, 1d), such as opposite short edge portions, of the panel, optionally being spaced from all edge portions of the panel.
[0248] Item 29. The panel according to any of the preceding items 24-28, wherein the panel is rectangular, and wherein the at least one cavity (2) intersects at least a portion of a locking device (6a; 6b) provided on a long (1a, 1b) and/or a short (1c, 1d) edge portion of the panel.
[0249] Item 30. The panel according to any of the preceding items 24-29, comprising a core (8a) and a decor structure (8b), such as a decorative layer (8c) and/or a wear layer (8d).
[0250] Item 31. The panel according to any of the preceding items 24-30, wherein any layer (8; 8a, 8b, 8c, 8d, 8e, 8f), some layers, or each layer comprises a thermoplastic material (4) comprising thermoplastic polymers (4a), such as PVC, and preferably a filler (4b).
[0251] Item 32. The panel according to any of the preceding items 24-31, wherein a surface of an inner portion (2f) of the at least one cavity (2) is closed.
[0252] Item 33. The panel according to any of the preceding items 24-32, wherein the at least one cavity (2) is elongated, a ratio between longitudinal (LE) and transverse (TE) extensions thereof being 1<LE/TE150, such as 6LE/TE120, preferably 10LE/TE100.
[0253] Item 34. The panel according to any of the preceding items 24-33, wherein the at least one cavity (2) has an extension along a pair of non-parallel, such as perpendicular, horizontal directions (D1, D2) that are substantially the same.
[0254] Item 35. The panel according to any of the preceding items 24-34, wherein a depth (DC) of a plurality of cavities (2) is smaller at long (1a, 1b) and/or short (1c, 1d) edge portions of the panel than in an interior (5a) of the rear side (5).
[0255] Item 36. The panel according to any of the preceding items 24-35, wherein a first (2m) and a second (2n; 2n) group of cavities (2) are separated from each other along a panel direction (PD; PD) by a separation portion (5b; 5b), a distance (K2; K2) between the cavities along the panel direction (PD; PD) between the first and the second group being larger than a distance (K1; K1) between the cavities within each of the first and the second groups.
[0256] Item 37. The panel according to any of the preceding items 24-36, further comprising a backing layer (8e), wherein the backing layer is continuous at least at a location of said at least one cavity (2).
[0257] Item 38. Process for manufacturing a board element (1) comprising at least one cavity (2), preferably a plurality of cavities, in a rear side (5) thereof, wherein the process comprises: [0258] providing a substrate (3) comprising a thermoplastic material (4), wherein the substrate comprises a substrate portion (3a), [0259] creating said at least one cavity (2) in a rear side (3b) of the substrate (3) by impressing the substrate portion (3a) by an impression device (10) comprising at least one protruding impression element (9), thereby obtaining said board element (1), and
annealing the board element (1) after creating the at least one cavity (2).
[0260] Item 39. The process according to item 38 and according to any of the preceding items 2-21.
[0261] Item 40. Process for manufacturing a board element (1) comprising a plurality of cavities in a rear side (5) thereof, wherein the process comprises: [0262] providing a substrate (3) comprising a thermoplastic material (4), wherein the substrate comprises a substrate portion (3a), and [0263] creating said cavities (2) in a rear side (3b) of the substrate (3) by impressing the substrate portion (3a) by an impression device (10) comprising at least one protruding impression element (9), thereby obtaining said board element (1),
wherein a first (9g) and a second (9h; 9h) set of impression elements (9) are separated from each other along a separation direction (S1; S2) by a blank portion (10e; 10f), a distance (L2; L2) between the impression elements along the separation direction (S1; S2) between the first and the second sets being larger than a distance (L1; L1) between the impression elements within each of the first and the second sets,
such that a first (2m) and a second (2n; 2n) group of cavities (2) are created that are separated from each other along a panel or board direction (PD; PD) by a separation portion (5b; 5b), a distance (K2; K2) between the cavities along the panel or board direction (PD; PD) between the first and the second group being larger than a distance (K1; K1) between the cavities within each of the first and the second groups.
[0264] Item 41. The process according to item 40 and according to any of the preceding items 2-22.