MICRO-MECHANICAL TIMEPIECE PART
20210034015 · 2021-02-04
Inventors
Cpc classification
G04D3/0087
PHYSICS
G04D3/0069
PHYSICS
International classification
G04B15/14
PHYSICS
Abstract
The micromechanical clockwork part is cut from a plate-like silicon substrate. The cut edges of the part include portions intended to serve as contact surfaces arranged to slide against corresponding contact zones of another micromechanical part in a clockwork piece. The cut edges have a ribbed surface including an alternating set of ribs and furrows, the ribs and the furrows being straight and each contained in a plane parallel to the plate. Moreover, the ribs and furrows which the cut edges have form a stepped pattern on the cut edge, with first intervals in which the spacing separating the ribs from one another is equal to a first distance, and at least one second interval in which the spacing between the ribs is equal to a second distance different from the first distance.
Claims
1. Micro-mechanical timepiece part (1; 10; 20; 100; 200) cut out in a silicon substrate in the form of a plate and the cut edges of which comprise portions provided to serve as contact surfaces arranged to slide against corresponding contact zones of another micro-mechanical part in a timepiece, and wherein the cut edges have a ribbed surface comprising an alternation of ribs (21a; 21b; 21c; 121; 221) and furrows (23a; 23b; 23c; 123; 223), the ribs and the furrows being straight; wherein the ribs and the furrows form a spaced-apart pattern, comprising a plurality of first intervals (25a; 25b; 25c; 125; 225) in which the spacing separating the ribs from each other is equal to a first distance, and at least one second interval (27a; 27b; 27c; 127; 227) in which the spacing between the ribs is equal to a second distance different from the first distance, the first distance being between 200 nm and 5 m.
2. The micro-mechanical timepiece part (1; 10; 20; 100; 200) as claimed in claim 1, wherein the first distance is between 200 nm and 2 m.
3. The micro-mechanical timepiece part (1; 10; 20; 100) as claimed in claim 1, wherein the ribs and the furrows are each contained within a plane parallel to the plate.
4. The micro-mechanical timepiece part (200) as claimed in claim 1, wherein the ribs and the furrows are perpendicular to the main faces of the plate.
5. The micro-mechanical timepiece part (1; 10; 20; 100; 200) as claimed in claim 1, wherein the second distance is greater than the first distance.
6. The micro-mechanical timepiece part (1; 10; 20; 100; 200) as claimed in claim 3, wherein the furrows belonging to the first intervals (25a, 25b, 25c; 125; 225) are all of the same depth.
7. The micro-mechanical timepiece part (1; 10; 20; 200) as claimed in claim 5, wherein the spaced-apart pattern comprises a plurality of second intervals (27a; 27b; 27c; 227), and wherein the second distance is between 200 nm and 50 m.
8. The micro-mechanical timepiece part (1; 10; 20; 200) as claimed in claim 7, wherein the furrows belonging to the second intervals (27a; 27b; 27c; 227) are all of the same depth, and wherein the second depth is between 10 nm and 10 m.
9. The micro-mechanical timepiece part (100) as claimed in claim 5, wherein the spaced-apart pattern comprises a single second interval (127) comprising a single furrow (123), and wherein the second distance is between 200 nm and of the total height of the part.
10. The micro-mechanical timepiece part (100) as claimed in claim 9, wherein the depth of the single furrow (123) of the second interval (127) is between 10 nm and 50 m.
11. The micro-mechanical timepiece part (1; 10; 20; 100) as claimed in claim 6, wherein the first depth is between 10 nm and 2 m.
12. The micro-mechanical timepiece part (200) as claimed in claim 4, wherein the furrows belonging to the first intervals (25a, 25b, 25c; 125; 225) are all of the same depth, and the first depth is between 500 nm and 4 m.
13. Method of manufacturing a micro-mechanical part of monocrystalline or polycrystalline silicon and which is as claimed in claim 3, method comprising the following steps: a) obtaining a silicon substrate; b) depositing and structuring an openwork etching resist on a horizontal surface of the substrate; c) etching by reactive-ion etching the surface of the substrate through the openings in the resist so as to hollow out the substrate down to a first distance; d) depositing a chemically inert passivation layer on the surfaces exposed by the etching during the preceding step; e) repeating the execution of a first sequence of steps comprising step (c) followed by step (d) until the first sequence has been effected a predetermined first number (n) of times, in as far as the reactive-ion etching has not hollowed through the entire thickness of the substrate; f) releasing the micro-mechanical part from the resist and from the substrate; wherein between step e) and step f), the method comprises a second sequence of steps to be effected only if step e) has not yet been effected a specific third number (v) of times during the execution of the method, the second sequence comprising the following steps: x) etching by reactive-ion etching the surface of the substrate through the openings in the resist so as to hollow out the substrate down to a second distance different from the first distance; y) depositing a chemically inert passivation layer on the surfaces exposed by the etching during the preceding step; z) repeating the execution of a second sequence of steps comprising step x) followed by step y) until the second sequence has been effected a predetermined second number (m) of times; then returning to step c).
14. Method of manufacturing a micro-mechanical part of monocrystalline or polycrystalline silicon and which is as claimed in claim 4, method comprising the following steps: a) obtaining a silicon substrate; b) depositing and structuring an openwork etching resist on a horizontal surface of the substrate; c) etching by reactive-ion etching the surface of the substrate through the openings in the resist so as to hollow out the substrate down to a first distance; d) depositing a chemically inert passivation layer on the surfaces exposed by the etching during the preceding step; e) repeating the execution of a sequence of steps comprising step (c) followed by step (d) until the sequence has been effected a specific number of times or the reactive-ion etching has hollowed through the entire thickness of the substrate; f) releasing the micro-mechanical part from the resist and from the substrate; wherein, during step (b), the etching resist is structured so that the edges of the openings in the openwork resist are not smooth but, on the contrary, have a scalloped profile formed by an alternation of projections and hollows which form a spaced-apart pattern with a plurality of first intervals in which the spacing separating the projections from each other is equal to a first distance, and at least one second interval in which the spacing between the projections is equal to a second distance different from the first distance, the first distance being between 500 nm and 4 m.
15. The method of manufacturing a micro-mechanical part as claimed in claim 14, wherein the first distance is between 200 nm and 2 m.
16. The micro-mechanical timepiece part (1; 10; 20; 100) as claimed in claim 2, wherein the ribs and the furrows are each contained within a plane parallel to the plate.
17. The micro-mechanical timepiece part (200) as claimed in claim 2, wherein the ribs and the furrows are perpendicular to the main faces of the plate.
18. The micro-mechanical timepiece part (1; 10; 20; 100; 200) as claimed in claim 2, wherein the second distance is greater than the first distance.
19. The micro-mechanical timepiece part (1; 10; 20; 100; 200) as claimed in claim 3, wherein the second distance is greater than the first distance.
20. The micro-mechanical timepiece part (1; 10; 20; 100; 200) as claimed in claim 4, wherein the second distance is greater than the first distance.
Description
BRIEF DESCRIPTION OF THE FIGURES
[0022] Other features and advantages of the present invention will become clear upon reading the following description, given solely by way of non-limiting example, and given with reference to the attached drawings in which:
[0023]
[0024]
[0025]
[0026]
[0027]
DETAILED DESCRIPTION OF EMBODIMENTS
[0028] The invention will be described hereinunder in the context of a Swiss lever escapement. However, it will be understood that the invention is not limited to this restricted area of application but that, on the contrary, it relates to all micro-mechanical timepiece devices in which two components are caused to slide and thus to rub against each other.
[0029]
[0030]
[0031] The pattern on the ribbed surface of the cut edge of the part illustrated in
[0032] The pattern on the ribbed surface of the cut edge of the part illustrated in
[0033]
[0034] The present invention also relates to a method permitting manufacture of micro-mechanical timepiece parts such as those illustrated in the appended
[0035] The method of the invention comprises a first step consisting of obtaining a silicon substrate in the form of a plate. Of course, it would be possible for the substrate not to be entirely formed of silicon or even to be formed of doped silicon. The substrate could be formed of silicon on insulator (SOI). As a person skilled in the art will know, such a substrate with a sandwich structure comprises two layers of silicon connected by an intermediate layer of silicon dioxide. The substrate could alternatively be formed of a layer of silicon attached to another type of base such as e.g. metal.
[0036] The following step of the method consists of depositing and structuring an openwork etching resist on a horizontal surface of the substrate. The etching resist is formed on one of the two main faces of the substrate in the form of a plate. Reference to
[0037] The method continues by means of a step consisting of etching by reactive-ion etching the exposed surface of the substrate through the openings in the resist so as to hollow out the substrate to a depth equal to a first distance. Reactive-ion etching is known per se to a person skilled in the art. The gas most commonly used for the etching step is SF6, and the main parameters permitting optimisation of the etching are the flow of SF6 which is advantageously between 200 and 780 sccm, preferably between 350 and 600 sccm; the radio frequency power serving to excite the plasma which is advantageously between 1000 and 3000 Watts at 2.45 GHz, and preferably between 1500 and 2600 Watts at 2.45 GHz; and the duration of an etching step which is advantageously between 0.8 seconds and 35 seconds and preferably between 1.5 and 7 seconds. The parameters are selected so that, at the end of the step, the ion etching has hollowed out the silicon substrate to a depth equal to a predefined first distance (e.g. 2 microns in the case of the example of
[0038] The following step of the method consists of depositing a chemically inert passivation layer on the surfaces exposed by the etching during the preceding step. The gas most commonly used for the passivation step is C4F8, and the main parameters permitting optimisation of the deposition of the passivation layer are the flow of C4F8 which is advantageously between 10 and 780 sccm, preferably between 50 and 400 sccm; the radio frequency power serving to excite the plasma which is advantageously between 1000 and 3000 Watts at 2.45 GHz, and preferably between 1500 and 2600 Watts at 2.45 GHz; and the duration of a passivation step which is advantageously between 0.8 seconds and 20 seconds and preferably between 1 and 4 seconds.
[0039] The method sequence comprising the etching step and the passivation step just described is then repeated. This first iterative sequence is executed consecutively a predetermined first number (n) of times, or in an equivalent manner, the first iterative sequence is carried out as many times as there are furrows in a first interval (in other words, twice in the example shown in
[0040] In order to etch deeper furrows while retaining the same furrow width it is possible to adapt the parameters of the etching process. For example, it is possible to vary the flow of reactive gas and the duration of an etching step simultaneously. In fact, by increasing the flow of active gas, the etching is accelerated. However, this also increases the density of the molecules of reactive gas, which renders the etching more isotropic, and thus makes the furrows deeper. In order to influence the depth of the furrows, the gas flow factor is thus more important than the duration of the etching step.
[0041] When the method has terminated the etching of a first interval as above, the following step of the method consists of etching by reactive-ion etching the exposed surface of the substrate through the openings in the resist so as to hollow out the substrate to a depth equal to a second distance different from the first distance. The etching parameters are selected so that, at the end of the step, the ion etching has hollowed out the silicon substrate to a depth equal to a predefined second distance (e.g. 8 microns in the case of the example of
[0042] The sequence of the method comprising the etching step and the passivation step just described is then repeated. This second iterative sequence is executed consecutively a predetermined second number (m) of times, or in an equivalent manner, the second iterative sequence is carried out as many times as there are furrows in a second interval (in other words, once in each of the examples illustrated in
[0043] The method sequence consisting of first etching a first interval and then a second interval can itself be repeated. This third iterative sequence is executed a specific third number (v) of times, or in an equivalent manner, the third iterative sequence is carried out once for each second interval on the ribbed surface of the cut edge of the part.
[0044] The micro-mechanical timepiece part is then freed of its resist before, preferably, being covered with a silicon dioxide layer before it is finally released from the substrate.
[0045]
[0046] It has been shown that, in accordance with the invention, the surface of the cut edges of the micro-mechanical timepiece part is ribbed and comprises an alternation of straight ribs and furrows. According to both embodiments described thus far, these ribs and these furrows were horizontal or, in other words, each contained within a plane parallel to the plate. The partial schematic plan view of
[0047] In order to produce a batch of micro-mechanical timepiece parts which conform to the invention and comprise vertically textured surfaces it is possible to use a method of manufacturing a micro-mechanical part of mono-crystalline or poly-crystalline silicon comprising the following steps: [0048] a) obtaining a silicon substrate; [0049] b) depositing and structuring an openwork etching resist on a horizontal surface of the substrate; [0050] c) etching by reactive-ion etching the surface of the substrate through the openings in the resist so as to hollow out the substrate down to a first distance; [0051] d) depositing a chemically inert passivation layer on the surfaces exposed by the etching during the preceding step; [0052] e) repeating the execution of a sequence of steps comprising step (c) followed by step (d) until the sequence has been effected a specific number of times or the reactive-ion etching has hollowed through the entire thickness of the substrate; [0053] f) releasing the micro-mechanical part from the resist and from the substrate; [0054] characterised in that, during step (b), the etching resist is structured so that the edges of the openings in the openwork resist are not smooth but, on the contrary, have a scalloped profile formed by an alternation of projections and hollows which form a spaced-apart pattern with a plurality of first intervals in which the spacing separating the projections from each other is equal to a first distance, and second intervals in which the spacing between the projections is equal to a second distance different from the first distance, the first distance being between 200 nm and 5 m, and preferably between 200 nm and 2 m.
[0055] It will also be understood that various modifications and/or improvements obvious to a person skilled in the art can be made to the embodiments being described in the present description without departing from the scope of the present invention defined by the accompanying claims. In particular, although the invention has been described in relation to an escapement wheel and a lever it is clear that the invention does not relate only to the components of escapements but that it relates in a completely general way to all micro-mechanical timepiece parts.