MANUFACTURING METHOD OF CONTINUOUS SHEET FOR CIRCUIT BOARD PRODUCTION AND CONTINUOUS SHEET FOR CIRCUIT BOARD PRODUCTION MANUFACTURED THEREFROM

Abstract

The present disclosure relates to a manufacturing method of a continuous sheet for circuit board production providing reel type laminates in a roll-to-roll continuous process without a belt press by connecting at least two or more sheet type metal laminates using an adhesion substrate which includes a reinforcement film and a conductor, the manufacturing method providing improved mechanical properties, and excellent chemical resistance and productivity, and the continuous sheet for circuit board production manufactured therefrom.

Claims

1. A manufacturing method of a continuous sheet for circuit board production comprising: providing at least two or more sheet type metal laminates adjoined in series in the direction of a metal foil, and winding an adhesion substrate one or more turns around the perimeter of the adhesion surface of the adjoined sheet type metal laminates.

2. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the step of winding an adhesion substrate includes; winding one type of the adhesion substrate 1.5 turns to 2.5 turns around the perimeter of the adhesion surface of the adjoined sheet type metal laminates.

3. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the step of winding an adhesion substrate includes; winding a first adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adhesion surface of the adjoined sheet type metal laminates; and winding a second adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adhesion surface of the adjoined sheet type metal laminates subsequently to the first adhesion substrate.

4. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the adhesion substrate includes at least one of: 1) a reinforcement adhesion substrate including a reinforcement film layer, and an adhesive layer coated onto at least one surface of the reinforcement film layer; or 2) a conductor adhesion substrate including a conductor layer, and an adhesive layer coated onto at least one surface of the conductor layer.

5. The manufacturing method of a continuous sheet for circuit board production according to claim 4, wherein the conductor layer has a thickness of 7 m to 35 m and includes Cu, SUS, or aluminum foil.

6. The manufacturing method of a continuous sheet for circuit board production according to claim 4, wherein the reinforcement film layer has a thickness of 5 m to 25 m and includes one or more polymer resins selected from the group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate glycol, polycarbonate and polyphenylene sulfide.

7. The manufacturing method of a continuous sheet for circuit board production according to claim 4, wherein the adhesive layer has a thickness of 1 m to 10 m and is formed using a varnish containing an adhesive resin and a conductive powder in a weight ratio of 1:0.005 to 1:0.015.

8. The manufacturing method of a continuous sheet for circuit board production according to claim 7, wherein the conductive powder includes one or more selected from the group consisting of copper, aluminum, nickel, silver, and iron.

9. The manufacturing method of a continuous sheet for circuit board production according to claim 7, wherein the adhesive resin includes one or more selected from the group consisting of polyimide-based resin, epoxy-based resin, acrylic-based resin, phenoxy-based resin and polyisocyanate-based resin, having a weight average molecular weight of 33000 g/mol to 38000 g/mol.

10. The manufacturing method of a continuous sheet for circuit board production according to claim 1, further comprising a step of forming a metal layer on the outermost part of the adhesion substrate.

11. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the sheet type metal laminate is manufactured by a method comprising: producing a prepreg by impregnating a fabric substrate into a thermosetting resin vanish and then semi-curing the thermosetting resin vanish, laminating one or more of the prepregs, and laminating a metal foil on one or both sides of the prepreg, followed by heating and pressing.

12. The manufacturing method of a continuous sheet for circuit board production according to claim 1, further comprising a step of winding at least two or more sheet type metal laminates connected by the adhesion substrate in a horizontal direction via a guide means.

13. The manufacturing method of a continuous sheet for circuit board production according to claim 1, wherein the step of providing at least two or more sheet type metal laminates comprises: providing the at least two or more sheet type metal laminates cut into a predetermined size; and placing the at least two or more sheet type metal laminates horizontally and so as to be in contact with each other.

14. A continuous sheet for circuit board production which includes: at least two or more sheet type metal laminates adjoined in series in the direction of a metal foil, and an adhesion substrate that is wound one or more turns around the perimeter of the adhesion surface of the adjoined sheet type metal laminates.

15. The continuous sheet for circuit board production according to claim 14, wherein two or more adhesion substrate layers are formed on upper and lower surfaces of the sheet type metal laminates.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0166] FIG. 1 schematically illustrates the structure of a continuous sheet for circuit board production to which an adhesive substrate according to Example 1 of the present invention is applied.

[0167] FIG. 2 schematically illustrates the structure of a continuous sheet for circuit board production to which the adhesion substrate according to Example 3 of the present invention is applied.

[0168] FIG. 3 schematically illustrates a form in which a continuous sheet for circuit board production of the Example is collected in a reel type.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0169] Hereinafter, the present invention is described in further detail with reference to examples. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

PREPARATION EXAMPLE

Preparation Example 1: First Adhesion Substrate (Cu Foil Substrate)

[0170] 1) Preparation of Conductive Adhesive Varnish

[0171] A conductive varnish was prepared by mixing 100% by weight of a general-purpose polyimide-based resin and 1% by weight of Cu powder (4 to 4.5 m based on the particle size D50) as a conductive metal powder with stirring.

[0172] 2) Preparation of Adhesion Substrate

[0173] The conductive varnish prepared in 1) was coated onto a copper foil, which is a conductor layer having a thickness of 12 m, using a comma coater, and then coated to a thickness of 10 m to form an adhesive layer, and then slitted to a predetermined width (10 mm) to make a tape form.

Preparation Example 2: Second Adhesion Substrate (PI Substrate)

[0174] 1) Preparation of Conductive Adhesive Varnish

[0175] A conductive varnish was prepared by mixing 100% by weight of a general-purpose polyimide resin and 1% by weight of Cu powder (4 to 4.5 m based on the particle size D50) as a conductive metal powder with stirring.

[0176] 2) Preparation of Adhesion Substrate

[0177] The conductive varnish prepared in 1) was coated onto a polyimide film (SK Kolon PI, mil) which is a reinforcement film layer having a thickness of 12 m, using a comma coater, and then coated to a thickness of 10 m to form an adhesive layer, and then slitted to a predetermined width (10 mm) to make a tape form.

Example 1

[0178] The first adhesion substrate obtained in Preparation Example 1 was placed vertically on a temporary adhesion heating wire, and then CCLs having an insulating layer thickness of 100 m cut into 340 mm*1030 mm (or 1250 mm) was displaced in parallel with the temporary adhesion heating wire to a width of 5 mm so that the adhesion surface between CCLs was placed on the adhesive layer of the first adhesion substrate, and then fixed. Then, the opened part at one end of the first adhesion substrate was cut in parallel with the CCL surface.

[0179] The CCL lower surface and the first adhesion substrate were temporarily adhered at a temperature of 110 C. and a pressure of 2 kgf/cm.sup.2 for 2.5 to 5 seconds. Then, the remaining first adhesion substrate that was not adhered was wound one turn around the perimeter of all the adhesion surfaces between CCLs (in the order of lower->side->upper->side of the adhesion surface of CCL) and the CCL upper surface and the first adhesion substrate were temporarily adhered in the same manner.

[0180] Subsequently, while the first adhesion substrate was further wound one turn on the first adhesion substrate around the perimeter of all the adhesion surfaces between CCLs (in the order of lower->side->upper->side of the adhesion surface of CCLs), the first adhesion substrate was temporarily adhered at the lower surface of CCL in the same manner, and the first adhesion substrate was temporarily adhered even at the upper surface of CCL in the same manner. Then, the opened part of the first adhesion substrate was cut in parallel with the CCL surface.

[0181] Then, it was pressed at a temperature of 180 C. to 220 C. and a pressure of 6.5 to 12.5 kgf/cm.sup.2 for 1 to 5 minutes using a vacuum hot press. The end of the adhered CCL was fixed using a nip bar and then wound on a winding roll by transferring the unit length using a linear servo. (Tension 150-500 N).

[0182] Through the above process, a continuous sheet for circuit board production was manufactured.

Example 2

[0183] A continuous sheet for circuit board production was manufactured in the same manner as in Example 1, except that the second adhesion substrate of Preparation Example 2 was used instead of the first adhesion substrate of Preparation Example 1.

Example 3

[0184] The first adhesion substrate obtained in Preparation Example 1 was placed vertically on a temporary adhesion heating wire, and then CCLs having an insulating layer thickness of 100 m cut into 340 mm*1030 mm (or 1250 mm) was displaced in parallel with the temporary adhesion heating wire to a width of 5 mm so that the adhesion surface between CCLs was placed on the adhesive layer of the first adhesion substrate, and then fixed. Then, the opened part at one end of the first adhesion substrate was cut in parallel with the CCL surface.

[0185] The CCL lower surface and the first adhesion substrate were temporarily adhered at a temperature of 110 C. and a pressure of 2 kgf/cm.sup.2 for 2.5 to 5 seconds. Then, the remaining first adhesion substrate that was not adhered was wound 0.9 turns around the perimeter of all the adhesion surfaces between CCLs (in the order of lower->side->upper->side of the adhesion surface of CCL) and the CCL upper surface and the first adhesion substrate were temporarily adhered in the same manner. Then, the first adhesion substrate was cut from the open side of the CCL.

[0186] Subsequently, while the second adhesion substrate obtained in Preparation Example 2 was wound 1.1 turns on the first adhesion substrate around the entire perimeter of the adhesion surfaces between CCLs (in the order of side->lower->side->upper->side of the adhesion surface of CCLs) from the cutting surface, the second adhesion substrate was temporarily adhered at the lower surface of CCL in the same manner, and the second adhesion substrate was temporarily adhered even at the upper surface of CCL in the same manner. Then, the opened part of the second adhesion substrate was cut in parallel with the CCL surface.

[0187] Then, it was pressed at a temperature of 180 C. to 220 C. and a pressure of 3.5 to 12.5 kgf/cm.sup.2 for 1 to 5 minutes using a vacuum hot press. The end of the adhered CCL was fixed using a nip bar and then wound on a winding roll by transferring the unit length using a linear servo. (Tension 150-500 N).

[0188] Through the above process, a continuous sheet for circuit board production was manufactured.

Example 4

[0189] A continuous sheet for circuit board production was manufactured in the same manner as in Example 3, except that the second adhesion substrate of Preparation Example 2 was used instead of the first adhesion substrate of Preparation Example 1 and the first adhesion substrate of Preparation Example 1 was used instead of the second adhesion substrate of Preparation Example 2.

EXPERIMENTAL EXAMPLE

[0190] In Examples 1 to 4, the alkali resistance and acid resistance of the adhesion substrate part were tested, and the results are shown in Table 1 below.

TABLE-US-00001 TABLE 1 Category Drug name Test condition Result Example 1 Alkali NaOH 10 wt %, 80 C., 10 min immersion Highest resistance 25 wt %, 80 C., 5 min immersion Highest NaClO.sub.3 10 wt %, 80 C., 10 min immersion Highest 20 wt %, 80 C., 5 min immersion Highest Acid HCl 35 wt %, 25 C., 10 min immersion Highest resistance 35 wt %, 50 C., 5 min immersion Highest Example 2 Alkali NaOH 10 wt %, 80 C., 10 min immersion Good resistance 25 wt %, 80 C., 5 min immersion Bad NaClO.sub.3 10 wt %, 80 C., 10 min immersion Excellent 20 wt %, 80 C., 5 min immersion Excellent Acid HCl 35 wt %, 25 C., 10 min immersion Highest resistance 35 wt %, 50 C., 5 min immersion Highest H.sub.2SO.sub.4 60 wt %, 25 C., 5 min immersion Highest Example 3 Alkali NaOH 10 wt %, 80 C., 10 min immersion Excellent resistance 25 wt %, 80 C., 5 min immersion Excellent NaClO.sub.3 10 wt %, 80 C., 10 min immersion Highest 20 wt %, 80 C., 5 min immersion Highest Acid HCl 35 wt %, 25 C., 10 min immersion Highest resistance 35 wt %, 50 C., 5 min immersion Highest H.sub.2SO.sub.4 60 wt %, 25 C., 5 min immersion Highest Example 4 Alkali NaOH 10 wt %, 80 C., 10 min immersion Good resistance 25 wt %, 80 C., 5 min immersion Bad NaClO.sup.3 10 wt %, 80 C., 10 min immersion Excellent 20 wt %, 80 C., 5 min immersion Excellent Acid HCl 35 wt %, 25 C., 10 min immersion Highest resistance 35 wt %, 50 C., 5 min immersion Highest H.sub.2SO.sub.4 60 wt %, 25 C., 5 min immersion Highest

[0191] It was confirmed that the adhering part of the continuous sheet according to Examples of the present invention was excellent in alkali resistance and acid resistance and thus can be usefully used in the process without breakage when manufacturing a circuit board.

EXPLANATION OF SYMBOLS

[0192] 10: adhesive layer [0193] 20: conductor layer [0194] 30: CCL cross section [0195] 40: reinforcement film layer [0196] 100: adhesion substrate [0197] 200: sheet type metal laminate [0198] 300: continuous sheet for circuit board production [0199] 500: reeling means