Sensor element and method for producing a sensor element

Abstract

A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.

Claims

1. A sensor element for temperature measurement comprising: a ceramic carrier comprising a top side and an underside; a respective NTC layer arranged on the top side and on the underside of the carrier, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer; and at least two electrodes adjacent each of the NTC layers, wherein the electrodes belonging to the respective NTC layer are separated from each other by a free region between the electrodes, the free region running parallel to the top side and the underside of the carrier.

2. The sensor element according to claim 1, wherein the carrier is printed with the NTC layers, and wherein the NTC layers have different printing geometries.

3. The sensor element according to claim 1, wherein the carrier is printed with the NTC layers, and wherein a printing of the top side and of the underside of the carrier with the respective NTC layer is performed partially.

4. The sensor element according to claim 1, wherein the respective NTC layer has two opposite side surfaces, and wherein the respective electrodes are arranged at the side surfaces.

5. The sensor element according to claim 1, wherein the respective electrodes comprise at least one sputtered layer.

6. The sensor element according to claim 5, wherein the sputtered layer is directly arranged at the respective NTC layer.

7. The sensor element according to claim 1, wherein the respective electrodes comprise at least one printed layer.

8. The sensor element according to claim 7, wherein the printed layer is directly printed onto the respective NTC layer.

9. The sensor element according to claim 1, wherein at least one of the NTC layers has a cutout, and wherein the cutout sets the resistance of the NTC layer.

10. The sensor element according to claim 1, wherein the free region is embodied as a web, and wherein the electrodes are separated from one another by the web.

11. The sensor element according to claim 1, wherein the carrier is printed with the NTC layers, and wherein a printing of the top side and of the underside of the carrier with the respective NTC layer is performed over a whole area.

12. A method for producing a sensor element, the method comprising: providing a ceramic carrier material; printing a first surface of the carrier material with an NTC paste in a first printing geometry forming a first NTC layer; sintering a system comprising the carrier material and the first NTC layer; printing a second surface of the carrier material with an NTC paste in a second printing geometry forming a second NTC layer; sintering a system comprising the carrier material and the second NTC layer, wherein the surfaces of the carrier material are printed with the NTC pastes partially or over a whole area; and applying at least two electrodes to each NTC layer, wherein the electrodes belonging to a respective NTC layer are separated from each other by a free region between the electrodes, the free region running parallel to a top side and an underside of the carrier material.

13. The method according to claim 12, further comprising partially removing at least one of the NTC layers in order to set a predetermined resistance value.

14. The method according to claim 12, wherein the surfaces of the carrier material are partially printed with the NTC pastes.

15. The method according to claim 12, wherein the surfaces of the carrier material are printed with the NTC pastes over the whole area.

16. A sensor element for temperature measurement comprising: a ceramic carrier comprising a top side and an underside; a respective NTC layer arranged on the top side and on the underside of the carrier, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer; and at least one electrode adjacent the respective NTC layer, wherein a first electrode is located on the top side of the carrier, wherein a first NTC layer is arranged on a partial region of the first electrode, wherein a second electrode is arranged on the first NTC layer, wherein a second NTC layer is arranged on the underside of the carrier, wherein two electrodes are arranged at the second NTC layer, and wherein the two electrodes are separated from one another by a free region, the free region running parallel to a top side and an underside of the carrier.

17. The sensor element according to claim 16, wherein the first electrode is arranged directly on the top side of the carrier.

18. The sensor element according to claim 16, wherein the second electrode completely covers the first NTC layer on the top side of the carrier.

19. The sensor element according to claim 16, wherein only two electrodes are arranged at the second NTC layer.

20. The sensor element according to claim 16, wherein the carrier is printed with the NTC layers, and wherein the NTC layers have different printing geometries.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The drawings described below should not be interpreted as true to scale. Rather, for the sake of better illustration, individual dimensions may be illustrated in an enlarged, reduced or even distorted manner.

(2) Elements that are identical to one another or perform the same function are designated by identical reference signs.

(3) FIG. 1 shows a sensor element in a first embodiment;

(4) FIG. 2 shows the sensor element in a further embodiment;

(5) FIG. 3 shows the sensor element in a further embodiment;

(6) FIG. 4 shows the sensor element in a further embodiment;

(7) FIG. 5 shows the sensor element in another embodiment; and

(8) FIG. 6 shows the sensor element in yet another embodiment.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

(9) FIG. 1 shows a sensor element 1, in particular a sensor chip. The sensor element 1 is preferably configured for measuring a temperature. The sensor element 1 comprises a ceramic sensor material (NTC layer 4). In particular, the sensor material is an NTC ceramic. By way of example, the ceramic has a Perovskite structure. In particular, the ceramic can be based on the YCaCrAlO system with diverse dopings. Such a sensor element 1 is particularly suitable for high-temperature applications. Alternatively, the sensor element 1, particularly in the case of lower application temperatures, can comprise a ceramic having a spinel structure. By way of example, the ceramic can be based on the NiCoMnO system with diverse dopings.

(10) On account of the R-T characteristic curve of an NTC temperature sensor according to the prior art, it is not possible to effect measurement over a wide temperature range with consistently high accuracy. Proceeding from the nominal temperature of the resistance, the tolerance thereof increases. Therefore, the accuracy of the temperature detection at very high or low temperatures, far away from the nominal temperature of the resistance, is significantly lower. In the case of a use temperature that can be narrowly delimited, it is then possible to adapt the specification such that the nominal temperature is near the use temperature and in return an accurate measurement is thus made possible. However, if a wide temperature range is to be detected with high accuracy, two or more NTC temperature sensors having different characteristic curves or nominal temperatures have to be used for this purpose. This often leads to space problems during mounting on the DCB board or the circuit board.

(11) Therefore, FIG. 1 shows a sensor element 1 in which two characteristic curves are realized in one component. The sensor element 1 comprises the sensor material described above. The sensor material is an NTC layer 4 or is incorporated in the form of at least one NTC layer 4. The sensor element 1 furthermore comprises a ceramic carrier 2. A ceramic substrate based on, e.g., Al.sub.2O.sub.3, ZrO.sub.2, ATZ or ZTA materials or MgO serves as the carrier 2. The NTC pastes are based, as described above, either on Perovskites in the YCaCrAlO system with diverse dopings or on the spinels in the NiCoMnO system with diverse dopings.

(12) The carrier 2 is printed with an NTC layer 4 on both sides. In particular, a first outer face or surface (e.g., a top side) of the carrier 2 is printed with a first NTC layer 4. A second outer face or surface of the carrier 2 (e.g., an underside) is printed with a second NTC layer 4. The sensor element 1 is thus a double NTC thick-film sensor.

(13) The NTC layers 4 in each case completely cover the top side and the underside of the carrier 2. After a sintering process, electrodes 3 are fitted to the NTC layers 4. The electrodes 3 are applied to the NTC layers 4 by means of thick- or thin-film technology, as will be described in detail later.

(14) In the case of resistances stipulated with very narrow tolerances, it is furthermore possible to carry out a so-called trimming process for setting the resistance at nominal temperature by means of partial laser removal, as will be explained in even further detail in association with Figure s 3 and 4.

(15) The contacting of the sensor to the DCB board or the circuit board can be carried out by means of Ag sintering, soldering or adhesive bonding. Wires can be mounted on the top side by means of soldering, bonding or welding.

(16) FIG. 2 shows a double NTC thick-film sensor 1 having a free edge 6. In contrast to the sensor element 1 shown in FIG. 1, in the case of the sensor element 1 from FIG. 2 a circumferential edge region of the carrier 2 is free of sensor material or free of the NTC layer 4. In particular, the NTC layers 4 do not completely cover the top side and/or the underside of the carrier 2. Rather, a circumferential edge region of the carrier 2 is discernible, which is not covered by sensor material. In this exemplary embodiment, the free edge 6 is implemented on the top side and the underside of the carrier 2.

(17) The free edge 6 can thus be present on both sides of the carrier 2. As an alternative thereto, the free edge 6 can also be present only on one side of the carrier 2. In other words, the NTC layers 4 can have a different printing geometry. By way of example, a first NTC layer 4 can completely cover a first outer face or surface of the carrier (for example, the top side of the carrier 2). A second NTC layer 4 can only partly cover a second outer face or surface of the carrier 2 (for example, the underside of the carrier 2), such that preferably an edge region of the carrier 2 is free of the NTC layer 4. As a result, it is possible to achieve different resistance values for the NTC layers 4. The thickness of the NTC layers 4 can also be different. By means of different thicknesses of the NTC layers 4, it is possible to achieve different resistance values for the NTC layers 4.

(18) FIG. 3 shows a trimmed double NTC thick-film sensor 1.

(19) The trimming serves for setting the resistance at nominal temperature by means of partial laser removal. In this exemplary embodiment, the trimming was affected here both on a top side and on an underside of the sensor element 1.

(20) In this case, the NTC layers 4 each have a cutout 7. The cutout 7 is arranged in an intermediate region between the electrodes 3. This leads to an altered geometry of the respective NTC layer 4, as a result of which the resistance of the respective NTC layer 4 is set. Otherwise the construction of the sensor element 1 from FIG. 3 substantially corresponds to the construction of the sensor element 1 from FIG. 1.

(21) In an alternative exemplary embodiment (not explicitly illustrated), it is also possible for only one of the two NTC layers 4 to be trimmed. In this case, only one NTC layer 4 has a cutout 7. As an alternative thereto, the NTC layers 4 can be trimmed differently. In this case, the NTC layers 4 have cutouts 7 of different sizes.

(22) FIG. 4 shows a trimmed double NTC thick-film sensor having a free edge 6. As in the case of the sensor element 1 from FIG. 3, in this case a partial removal is carried out by laser treatment (cutout 7). The cutout 7 is found at both NTC layers 4. However, the cutout 7 can alsoas explained in association with FIG. 3be implemented only in the case of one NTC layer 4 or the NTC layers 4 can have cutouts of different sizes.

(23) Furthermore, a circumferential edge region of the carrier 2 is discernible, which is not covered by sensor material (NTC layer 4). The free edge 6 is arranged on the top side and the underside of the carrier 2. As an alternative thereto, the free edge 6 can also be embodied only at one outer face or surface of the carrier 2, for example, at the top side or at the underside. As an alternative thereto, the free edge 6 also need not be embodied circumferentially, but rather can be embodied only partially.

(24) To summarize, the sensor element in accordance with FIGS. 1 to 6 is constructed as follows:

(25) Firstly, the carrier material is printed on both sides with NTC paste. The printing can be carried out over the whole area or partially. In this case, the two NTC thick layers 4 of the sensor need not have the same printing geometry. The NTC thick layers 4 can have either the same or different characteristic curves and be driven individually in order to cover a greater range of use and different applications. The resistance of the NTC layers 4 can be set individually by means of the respective thickness of the NTC layer 4 and the geometry thereof.

(26) When applying the electrodes 3, it is possible to differentiate between thin- and thick-film technology. Thin-film electrodes can be produced by sputtering or vapor deposition. In this case, the basic electrode consists, in a first embodiment, of a nickel layer, which can comprise proportions of vanadium, or, in a second embodiment, of two layers, wherein the lower layer comprises chromium or titanium and the second layer consists of nickel, which can likewise comprise proportions of vanadium. The basic electrode can be protected by a cap layer consisting of an oxidation-inhibiting metal such as, e.g., silver, gold, copper, aluminum, etc. Said cap electrode may either serve purely for protection against corrosion (oxidation) of the nickel basic electrode or else be advantageous or even necessary for the contacting. In the case of a linking by means of Ag sintering with finely dispersed silver pastes, a silver cap electrode, for example, is advantageous. For a migration-resistant, silver- and lead-free linking, it is possible to apply a gold cap layer.

(27) Depending on the later contacting method by means of Ag sintering or soldering, the thickness of the basic electrode is less than 10 m, advantageously less than 3 m, ideally less than 0.5 m. The thickness of the cap electrode can be up to 1 m, in exceptional cases up to 20 m.

(28) Thick-film electrodes can be produced by means of a screenprinting process with subsequent firing. The pastes used can contain Ag and/or Au or possible admixtures.

(29) The design of the electrodes 3 can be implemented in accordance with three different variants:

(30) In accordance with a first variant, two electrode pads are applied on the NTC thick layer 4, said electrode pad beings spatially separated from one another by a free region 5. This can be affected on both NTC thick layers 4 as shown in FIG. 5.

(31) Variant 2: the metallization of the lower NTC thick layer 4 is carried out as described in variant 1 with two electrode pads separated from one another. On the top side 10, a first electrode 3c is applied to the carrier material 2 over the whole area. Afterward, said electrode 3c is printed with NTC paste 4 over the whole area or partially, the latter in turn being provided with an electrode 3a. This is shown in FIG. 6. The sintering process can be carried out jointly for all three plies or with intermediate firings of the individual plies. The contacting of the upper NTC thick layer 4 can be realized, e.g., by soldering, bonding or welding of wires. The electrode 3c applied on the top side of the ceramic carrier 2 over the whole area must comprise an electrically conductive material or an electrically conductive material composite which is suitable for joint sintering at temperatures of up to 1400 C. of the NTC layer 4 situated thereon. Pd- or Pt-containing Ag pastes are usually involved here.

(32) For setting the resistance, the metallized substrates are electrically premeasured. The geometry of the double NTC thick-film sensor is defined on the basis of the premeasurement data. Since the length is fixed, the width as setting parameter remains as a variable quantity. For resistances stipulated with particularly close tolerances at nominal temperature, it is possible to set the resistance of the individual components by means of an additional trimming process. In this case, ceramic material or electrode material is partially removed by, e.g., laser cutting, grinding, sawing in such a way that the resistance is adapted by the geometry alteration.

(33) In order to improve the long-term stability of the ceramic, a thin nonconductive protective layer can be applied over the unmetallized region, said protective layer consisting of, e.g., ceramics, glasses, plastics or metal oxides. This can be achieved by means of sputtering, vapor deposition, lithography or printing and firing.

(34) For use on circuit boards, the three variants of the sensor can be adhesively bonded, soldered or sintered onto the conductor tracks. The Ag sintering process can be carried out under pressure or without pressure. By means of soldering, welding or bonding, the top side of the sensor can be contacted with wires.

(35) By virtue of the novel design of a sensor element 1 in accordance with FIGS. 1 to 6, two characteristic curves are realized in one component. As a result, it is possible to save space during mounting on the DCB board or the circuit board. The mechanical stability of the sensor element 1 is increased by the use of ceramic carrier materials based on, e.g., Al.sub.2O.sub.3, ZrO.sub.2, ATZ or ZTA materials or MgO.

(36) The process for producing a double NTC thick-film sensor according to the invention is explained in greater detail by way of example below:

(37) In a first step, NTC powder is produced. This includes weigh-in, wet pre-grinding, drying, sieving, calcination, wet post-grinding, drying, and sieving again. The NTC powder is weighed in for production of the paste. Furthermore, organic components for the paste are weighed in.

(38) In a further step, the paste components are pre-homogenized by stirring. Afterward, the paste components are homogenized using a 3-roll mill.

(39) In a subsequent step, ceramic carrier material is printed with NTC paste on one side by means of screenprinting. By way of example, the underside of the carrier material is printed with NTC paste in this step. As an alternative thereto, it is also possible for the top side to be printed with NTC paste. The printing is carried out in a specific or first printing geometry. By way of example, in this case, the corresponding carrier surface is printed only partially or alternatively completely. By way of example, an edge region of the carrier material can be omitted during the printing. However, other printing geometries are also conceivable. Furthermore, a thickness of the later NTC layer can be set in this step. The thicker the NTC layer, the higher the resistance thereof.

(40) The system comprising ceramic carrier material and NTC layer is then decarburized. Afterward, the system comprising ceramic carrier material and NTC layer is sintered.

(41) In a subsequent step, the second carrier material side is printed with NTC paste by means of screenprinting. By way of example, the top side of the carrier material is printed with NTC paste in this step. As an alternative thereto, it is also possible for the underside to be printed with NTC paste. That outer face or surface of the carrier material which was omitted during the printing process on one side is printed.

(42) The printing is carried out in a specific or second printing geometry. The second printing geometry can correspond to the first printing geometry. As an alternative thereto, the first and second printing geometries can be different. By way of example, the corresponding carrier surface is printed only partially or alternatively completely. By way of example, an edge region of the carrier material can be omitted during the printing. However, other printing geometries are also conceivable for the second printing geometry. Furthermore, a thickness of the later NTC layer can be set in this step. The thicker the NTC layer, the higher the resistance thereof. The thicknesses of the two NTC layers can be identical. As an alternative thereto, the NTC layers can also have different thicknesses.

(43) The system is then decarburized. Afterward, the system is sintered. As an alternative thereto, it is also possible for both NTC layers to be printed successively and the system can subsequently be decarburized and sintered in a joint process. The iteration of decarburizing and sintering would be superfluous in this case.

(44) In a further step, Ni/Ag thin-film electrodes are applied to the sintered sensor on both sides by means of sputtering technology. As an alternative thereto, the electrodes can also be applied by printing (thick-film electrodes). The electrodes are applied in accordance with variants 1 to 3 described above.

(45) A further step involves electrically measuring the resistances of the individual sensor sides at nominal temperature on the carrier material, which has not yet been separated.

(46) Afterward, the individual NTC layers are trimmed to the required resistance value by laser removal.

(47) The sensor chips are singulated by sawing the carrier material between the printed NTC regions. The final geometry is produced by the separating process.

(48) Finally, the visual inspection and a check measurement in a manner like random sampling are carried out.

(49) The description of the subjects specified here is not restricted to the individual specific embodiments. Rather, the features of the individual embodiments can be combinedinsofar as technically expedientarbitrarily with one another.