Power module
D0909310 ยท 2021-02-02
Assignee
Inventors
- Brice McPherson (Fayetteville, AR, US)
- Sayan Seal (Fayetteville, AR, US)
- Zachary Cole (Summers, AR, US)
- Jennifer Stabach (Fayetteville, AR, US)
- Brandon Passmore (Fayetteville, AR, US)
- Ty McNutt (Farmington, AR, US)
- Alexander B. Lostetter (Fayetteville, AR, US)
Cpc classification
H01L25/18
ELECTRICITY
the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
H01L2224/0603
ELECTRICITY
Bonding areas having different sizes, e.g. different heights or widths
H01L2924/00014
ELECTRICITY
the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L23/49811
ELECTRICITY
Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
H01L2224/49111
ELECTRICITY
the connectors connecting two common bonding areas, e.g. Litz or braid wires
H01L23/50
ELECTRICITY
for integrated circuit devices,; e.g. power bus, number of leads
H01L2924/00014
ELECTRICITY
the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2224/4903
ELECTRICITY
Connectors having different sizes, e.g. different diameters
H01L23/3735
ELECTRICITY
Laminates or multilayers, e.g. direct bond copper ceramic substrates
H01L2924/13091
ELECTRICITY
Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
International classification
Abstract
Claims
The ornamental design for a power module, as shown and described.
Description
(1) The sole FIGURE is a plan view of a power module showing our design.
(2) The broken lines shown in the drawings depict portions of the power module that form no part of the claimed design.