SP3-BONDED CARBON MATERIALS, METHODS OF MANUFACTURING AND USES THEREOF
20210206640 ยท 2021-07-08
Inventors
Cpc classification
C01B2204/04
CHEMISTRY; METALLURGY
C01B32/05
CHEMISTRY; METALLURGY
International classification
C01B32/05
CHEMISTRY; METALLURGY
Abstract
The present invention provides an ultrathin and crystalline sp3-bonded carbon sheet, a stack structure, heterostructure and composite material comprising said ultrathin and crystalline sp3-bonded carbon sheet, and a method of manufacture of ultrathin and crystalline sp3-bonded carbon sheets. The method comprises the steps of providing a few-layer graphene starting material, disposing the few-layer graphene starting material on a substrate within a chemical vapour deposition chamber comprising a vacuum chamber and a feed gas inlet, and flowing a feed gas comprising hydrogen over the substrate at a substrate temperature of 325 C. or less and a pressure of 100 Torr or less to at least partially convert the few-layer graphene starting material into ultrathin and crystalline sp3-bonded carbon sheets. The method according to the present invention is the first method for successful production of ultrathin and crystalline sp3-bonded carbon sheets, including e.g. lonsdaleite sheets and diamond sheets. Advantageously it may also be relatively low cost, low waste, may avoid the use of complex apparatus having multiple components, and may allow operation under mild processing conditions.
Claims
1. An ultrathin and crystalline sp.sup.3-bonded carbon sheet.
2. The ultrathin and crystalline sp.sup.3-bonded carbon sheet according to claim 1 comprising 2 to 10 atomic layers of sp.sup.3-bonded carbon.
3. The ultrathin and crystalline sp.sup.3-bonded carbon sheet according to claim 1 wherein the sheet has a maximum thickness of 22 .
4. The ultrathin and crystalline sp.sup.3-bonded carbon sheet according to claim 1 wherein at least a portion of the sheet has a structure selected from: lonsdaleite, diamond, or another diamond polytype, or a combination of two or more of these structures.
5. The ultrathin and crystalline sp.sup.3-bonded carbon sheet according to claim 1 wherein the sheet is electronically doped.
6. A structure comprising one or more ultrathin and crystalline sp.sup.3-bonded carbon sheets, wherein the structure is selected from the group consisting of: a stack structure; a heterostructure further comprising graphene; and a composite material further comprising a matrix material.
7. (canceled)
8. The structure according to claim 6 wherein the structure is a stack structure further comprising a material selected from: a one-dimensional material, a two-dimensional material, nanotubes, or nanowires.
9.-10. (canceled)
11. The structure according to claim 6, wherein the structure is a composite material, and wherein the matrix material comprises a polymer, a semiconductor, a ceramic, a metal, or combinations thereof.
12. A method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets comprising the steps of: providing a few-layer graphene starting material; disposing the few-layer graphene starting material on a substrate within a chemical vapour deposition chamber comprising a vacuum chamber and a feed gas inlet; and flowing a feed gas comprising hydrogen over the substrate at a substrate temperature of 325 C. or less and a pressure of 100 Torr or less to at least partially convert the few-layer graphene starting material into ultrathin and crystalline sp.sup.3-bonded carbon sheets.
13. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 wherein the few-layer graphene starting material comprises 2-10 atomic layer graphene sheets
14. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 wherein the substrate temperature is from 325 to 170 C.
15. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 wherein the step of flowing the feed gas is performed at a pressure from 5 to 100 Torr.
16. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 comprising the step of flowing an additional feed gas over the substrate.
17. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 wherein the feed gas(es) comprise a gas selected from: PH.sub.4, B.sub.2H.sub.6, BH.sub.3, SF.sub.6, F.sub.2, Br.sub.2, N.sub.2, H.sub.2S, NH.sub.4, B.sub.3N.sub.3H.sub.6, Ar, He.
18. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 wherein hydrogen gas is the sole feed gas.
19. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 further comprising the step of providing an additional solid source.
20. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12, wherein the chemical vapor deposition chamber comprises a filament, and the filament is heated as the feed gas is flowed over the substrate to promote thermal decomposition of the feed gas.
21. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 20 wherein the filament comprises a material selected from the group consisting of tungsten, rhenium, tantalum and platinum.
22. The method of manufacture of ultrathin and crystalline sp.sup.3-bonded carbon sheets according to claim 12 wherein the step of flowing feed gas over the substrate is performed for a time of 6 minutes to 8 hours.
23.-25. (canceled)
Description
SUMMARY OF THE FIGURES
[0061] Embodiments and experiments illustrating the principles of the invention will now be discussed with reference to the accompanying figures in which:
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DETAILED DESCRIPTION OF THE INVENTION
[0071] The compositions and methods provided herein are based, in part, on previous investigations of the use of hot-filament chemical vapour deposition (HFCVD) for the growth of nanocrystalline diamond thin films and the conformal coating of carbon nanotube bundles by diamond and silicon carbide nanocrystals at low substrate temperature by the present inventors, as described in U.S. Pat. No. 9,458,017, Piazza, 2015. The preferred embodiments of the present invention demonstrate a simple and efficient route to production of detectable ultrathin and crystalline sp.sup.3 bonded carbon sheets. In the more preferred embodiments, the sheets have a lonsdaleite or diamond crystal structure, or a combination of these two structures.
[0072] Preferred methods of the present invention use an HFCVD for production of such materials. Use of HFCVD may be particularly advantageous due to its simplicity and ease of implementationpreviously, it has been used in a number of processes for the production of microcrystalline and nanocrystalline diamond films [M. A. Prelas et al. (1998); J. E. Butler et al. (2008); J. Zimmer. Et al. (2006)], because of the efficiency of production of atomic hydrogen, which has been shown to play an important role for the conventional synthesis of metastable diamond at low pressure from a dilute mixture of a hydrocarbon in H.sub.2. [M. A. Prelas at al. (1998); M. Frenklach et al. (1991); J. Stiegler, et al. (1997); S. A. Redman et al. (1999)]. When an HFCVD process is used, atomic hydrogen, H, is produced heterogeneously by the thermal decomposition of H.sub.2 on the hot filament surface, which then rapidly diffuses into the bulk gas. H recombination reactions are sufficiently slow at the process pressures used in the present invention that much of the atomic H diffuses to the reactor walls. Atomic H is present at super-equilibrium concentrations throughout most of the reactor. HFCVD process advantageously reduces the presence on ions accelerated towards the substrate, in comparison to e.g. low pressure plasma techniques. Accordingly, damage to the graphene starting material and/or the crystalline sp.sup.3-bonded carbon sheets can be reduced or avoided, because production of high kinetic energy ions (which tend to etch the sheets instead of participating in a hydrogenation process) is inhibited.
[0073]
[0074] The substrate support is disposed on substrate holder 11, which comprises a fluid cooling system (not visible), a thermocouple 13 disposed immediately adjacent the substrate 7 for detecting the temperature of the substrate to allow for monitoring and control of the temperature of the substrate (e.g. by operation of the cooling system within the substrate holder) during operation of the HFCVD system. The substrate holder 11 is vertically moveable in the vacuum chamber 1. This allows for the substrate to be moved closer to, or further from, the filaments 5 as appropriate for the process being performed.
[0075] The temperature of the substrate 7 is controlled to be 325 C. or less, such that the temperature of the FLG on the substrate is about 325 C. or less.
[0076] A feed gas (here, H.sub.2) is flowed into the vacuum chamber at a flow rate of between 1 and 250 sccm. At the same time, the vacuum pump is operated, to maintain pressure in the vacuum chamber at a pressure of 100 Torr or less. The gas flow may be regulated by e.g. a mass flow controller, in a manner well known to the skilled person. The pressure may be regulated by e.g. an automatic valve located below the substrate holder.
[0077] The step of flowing the feed gas over the substrate is performed for a time sufficient to at least partially convert the few-layer graphene disposed on the substrate into ultrathin and crystalline sp.sup.3-bonded carbon sheets. The FLG is converted by hydrogenation of the few-layer graphene, followed by subsequent transformation of few-layer graphene into few-layer crystalline sp.sup.3-bonded carbon. Such hydrogenation of few-layer graphene can be detected by Fourier Transform Infrared (FTIR) spectroscopy and microscopy.
[0078] The precise configuration (number of layers, crystal structure etc.) of the ultrathin crystalline sp.sup.3-bonded carbon sheets can be detected and/or analyzed by a number of methods. For example, such sheets may be analyzed using one or more techniques selected from: visible or ultraviolet (UV) Raman spectroscopy; transmission electron microscopy (TEM); electron diffraction (ED); or electron energy loss spectroscopy (EELS).
[0079] In particular, for determining the crystallinity of the produced material, Raman spectroscopy is a particularly useful technique, due to its simplicity. A crystalline structure will generally display clear, sharp and distinct peaks corresponding to the various vibrational modes of the material. Comparatively, a Raman spectrum of an amorphous carbon sheet (e.g. ta-C, or diamond-like carbon), will generally display 2 broad and overlapping bands (the D and G bands). An example of a typical Raman spectrum from ta-C (tetrahedral sp.sup.3 amorphous carbon) can be seen in FIG. 48 of J. Robertson, Diamond-like amorphous carbon, Materials Science and Engineering. R 37, 129-281 (2002). For comparison with Raman spectra discussed below in relation to materials produced according to the present invention, the relevant spectra is that taken at an excitation wavelength of 244 nm.
EXAMPLES
Example 1
[0080] As received commercial chemical vapour deposition (CVD) graphene film deposited on 3 mm ultrafine copper transmission electron microscopy (TEM) grids (2000 Mesh) were used as graphene materials (from Graphene Supermarket, SKU # SKU-TEM-CU-2000-025). Graphene was grown by CVD from CH.sub.4 at 1000 C. on Ni substrate and transferred to a commercial TEM grid using polymer-free transfer methods to minimize contamination as described in W. Regan et al. (2010). The thickness of CVD graphene film was between 0.3-2 nm (1-6 monolayers). Typical graphene coverage of the TEM grid is between 60 and 90%.
[0081] A commercial HFCVD system from Blue Wave Semiconductors (BWI 1000 model) was used for hydrogenation and subsequent structure conversion of few-layer graphene into ultrathin and crystalline sp.sup.3-bonded carbon sheets. A schematic of this system is shown in
[0082] The reactor is a six-way cross stainless steel vacuum chamber. It is fluid cooled (15% water, 75% glycol at 18 C.) with brazed copper tubing covered with an aluminium foil. The reactor is equipped with a molybdenum filament cartridge that accommodates between one and three 0.5 mm diameter straight metallic wires. Typically tungsten or rhenium wires are used. In this example, tungsten was used. Typically two 5.7 cm length wires, 1 cm apart, are used. Substrates were placed on the movable and fluid-cooled 5 cm diameter sample stage. The few-layer graphene grids were placed vertically on the substrate holder and were pinched by two (100) silicon pieces (500-550 m thickness, 14 mm14 mm) to keep their position fixed during operation.
[0083] The substrate temperature and the temperature of the few-layer graphene were estimated by a thermocouple tip located on top of the surface of the substrate holder located in front of the filaments. Before synthesis, the HFCVD system was evacuated to below 410.sup.4 mbar using a turbomolecular pump backed with a hydrocarbon oil pump.
[0084] For hydrogenation, ultra-high purity (UHP) H.sub.2 gas (about 99.999% pure) was the only gas introduced into the chamber via a stainless steel tube located on top of the chamber. Gas flow was regulated by an Omega mass flow controller. The pressure, P, was regulated via an automatic valve located below the substrate holder. The filament temperature, TF, was monitored with a two colour pyrometer (M90R2 model from Mikron Infrared, Inc.). The pressure and flow were 50 Torr and 1 sccm, respectively. Before synthesis, the tungsten filament was not exposed to activated hydrocarbon gas for carburization or conditioning as it is necessary for the conventional growth of diamond by HFCVD to stabilize filament temperature. This was to avoid carbon contamination from a carburized filament. The distance between the substrate holder and the filaments, d, was 22.8 mm. The current for both filaments, was kept constant, at 55 , which resulted in a filament temperature of 2330 C. The resulting substrate holder temperature was about 300 C. The maximum few-layer graphene temperature was of about 325 C., due to the closer proximity of the TEM grid substrate to the filaments. The duration of the hydrogenation process was 6 minutes and 20 seconds.
[0085] Material Analysis & Methods
[0086] Multi-wavelength Raman spectroscopy (RS) was employed to examine the material structure before and after hydrogenation. Raman spectra were recorded with a Renishaw InVia Reflex Spectrometer System with a stigmatic single pass spectrograph using the 244, 488 and 514.5 nm lines of Ar ion lasers. In the visible, 50 and 100 objectives were used. In the UV, 40 objective was employed. The laser power on the sample and acquisition time were adjusted to obtain optimum signal without any sample modification. No visible damage and no change of the spectral shape during measurements have been observed. Silicon and highly-oriented pyrolytic graphite (HOPG) were used for peak position calibration: silicon for spectra excited with visible radiation, and HOPG for spectra excited with deep UV radiation. Raman mapping was employed using high speed encoded mapping stage and a 1 CCD to generate high definition 2D chemical images over hundreds of microns square. CH bonds were directly detected using Fourier Transform Infrared (FTIR) spectroscopy. FTIR images and spectra were recorded with an Agilent Technologies Cary 670 FTIR spectrometer coupled to a Cary 620 FTIR microscope equipped with a 6464 focal plane array (FPA) mercury cadmium telluride (MCT) detector. Attenuated Total Reflection (ATR) mode, with a Germanium crystal as internal reflection element, was employed.
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[0092] The shift, by around 56 cm.sup.1, of the position of the C(sp.sup.3)-H mode peak, as compared to the corresponding position in free molecules, is theorised to result from the stress generated by the hydrogenation of few-layer graphene, the subsequent conversion of sp.sup.2 hybridization into sp.sup.3 hybridization and interlayer sp.sup.3-C bond formation.
[0093] The narrow, one component CH stretching band reveals that carbon atoms are bonded to one hydrogen atom. This one component narrow CH stretching band has never before been reported for hydrogenated graphene. Known disclosures on FTIR spectroscopy analysis of hydrogenated graphene report on a multi-component CH stretching band including C(sp.sup.3)-H.sub.3 modes instead of C(sp.sup.3)-H mode, consistent with graphene domains of reduced size which are hydrogenated only on their edges. Comparatively, the one component narrow CH stretching band shown here is representative of large-sized hydrogenated graphene planes.
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[0096] The spectrum shown in
[0097] In amorphous carbon, the FWHM of the T peak is wide because of the amorphous structure of the material. In lonsdaleite, the FWHM is much lower because of the crystal structure of the material. The FWHM value of the lonsdaleite peak reveals confinement effects in few atomic layers. The detection of CC sp.sup.3 vibration and lonsdaleite in Raman spectra is consistent with the detection of only one component in the FTIR CH stretching band (
[0098] In some regions of the grid, on the mesh and on the grid material, the peaks observed in
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[0100] In some regions of the grid, on the mesh and on the material grid, the T and diamond peaks as shown in the
CONCLUSIONS
[0101] To summarize, a new process has been developed to obtain ultrathin and crystalline sp.sup.3-bonded carbon sheets, including ultrathin diamond sheets and including ultrathin lonsdaleite sheets, which are new nanomaterials, from the hydrogenation and subsequent interlayer sp.sup.3-C bond formation of few-layer graphene at low graphene and substrate temperature, below 325 C. and down to about 170 C., and at low pressure, below 100 Torr and down to about 5 Torr.
[0102] The synthesis of ultrathin and crystalline sp.sup.3-bonded carbon sheets, including ultrathin diamond sheets and including ultrathin lonsdaleite sheets, has been successfully demonstrated for the first time, via the exposure of few-layer graphene, to pure H.sub.2 activated by HFCVD. The inventors theorise that, depending on relative orientation of the graphene layers and when it is energetically favourable, the chemisorption of elements such as hydrogen on the graphene planes leads to the interlayer sp.sup.3-C bond formation required for formation of the ultrathin and crystalline sp.sup.3-bonded carbon sheet structure, in line with previous theoretical works in this field.
[0103] Large area of the planes of the few-layer graphene, exposed to hydrogen, are hydrogenated and carbon atoms are bonded to one hydrogen atom. The number of the sheets is typically between 2 and 6, but may be up to e.g. 10.
[0104] The temperature of the few-layer graphene and substrate during the process is about 325 C. This method is suitable for mass-production of ultrathin and crystalline sp.sup.3-bonded carbon sheets, including ultrathin diamond sheets and including ultrathin lonsdaleite sheets. The new process can also be used to obtain heterostructures of graphene and ultrathin and crystalline sp.sup.3-bonded carbon sheets.
[0105] Potential applications of these ultrathin and crystalline sp.sup.3-bonded carbon sheets elaborated from this method include but are not restricted to passive or active components in transistors and integrated circuits, components of thermal management devices, electrical field shields, components of field emission devices, components of quantum computing devices, building materials for micro-electro-mechanical systems, building materials for nano-electro-mechanical systems, components of ultrathin protective coatings, components of wear-resistant coatings, components of composite materials, components of tunnel devices, components of optical linear waveguides, components of lithium batteries, components of supercapacitors, components of biodevices, components of sensors, components of biosensors, components of an active laser medium, and components of optoelectronic sensors.
[0106] The features disclosed in the foregoing description, or in the following claims, or in the accompanying drawings, expressed in their specific forms or in terms of a means for performing the disclosed function, or a method or process for obtaining the disclosed results, as appropriate, may, separately, or in any combination of such features, be utilised for realising the invention in diverse forms thereof.
[0107] While the invention has been described in conjunction with the exemplary embodiments described above, many equivalent modifications and variations will be apparent to those skilled in the art when given this disclosure. Accordingly, the exemplary embodiments of the invention set forth above are considered to be illustrative and not limiting. Various changes to the described embodiments may be made without departing from the spirit and scope of the invention.
[0108] For the avoidance of any doubt, any theoretical explanations provided herein are provided for the purposes of improving the understanding of a reader. The inventors do not wish to be bound by any of these theoretical explanations.
[0109] Any section headings used herein are for organizational purposes only and are not to be construed as limiting the subject matter described.
[0110] Throughout this specification, including the claims which follow, unless the context requires otherwise, the word comprise and include, and variations such as comprises, comprising, and including will be understood to imply the inclusion of a stated integer or step or group of integers or steps but not the exclusion of any other integer or step or group of integers or steps.
[0111] It must be noted that, as used in the specification and the appended claims, the singular forms a, an, and the include plural referents unless the context clearly dictates otherwise. Ranges may be expressed herein as from about one particular value, and/or to about another particular value. When such a range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by the use of the antecedent about, it will be understood that the particular value forms another embodiment. The term about in relation to a numerical value is optional and means for example +/10%.
REFERENCES
[0112] A number of publications are cited above in order to more fully describe and disclose the invention and the state of the art to which the invention pertains. Full citations for these references are provided below.
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