A CIRCUIT AND DEVICE INCLUDING A TRANSISTOR AND DIODE

Abstract

An inverter logic circuit includes a bipolar junction transistor and a zener diode. The zener diode is connected between the base of the bipolar junction transistor and ground (or other reference voltage). The zener diode is reverse biased such that a leakage current through the zener diode allows for sufficient current through the emitter-base terminals of the bipolar junction transistor when a voltage is applied across the emitter and base terminals of the bipolar junction transistor to turn the transistor ON in the absence of an external signal to the base. As such the bipolar junction transistor functions as a normally ON bipolar junction transistor.

Claims

1. A circuit comprising: a bipolar transistor; a base terminal of the bipolar transistor being switchably connectable to a signal source; a diode having a first terminal connected to the base terminal of the bipolar transistor, and a second terminal connected to a reference voltage; the circuit arranged such that when the signal source is not connected to the base terminal of the bipolar transistor, a voltage applied at an emitter terminal of the bipolar transistor causes a current flow through the base terminal of the bipolar transistor and through the diode such that the bipolar transistor is in an ON state; an impedance of the signal source being lower than an impedance of the bipolar transistor through emitter and base terminals of the bipolar junction transistor; and the diode being selected to provide a current limiting function such that when the signal source is connected to the base terminal of the bipolar transistor, current flow through the base terminal reduces such that the bipolar transistor switches to an OFF state.

2. The circuit according to claim 1 wherein the diode is arranged in the circuit to be reversed biased when the voltage is applied to the emitter terminal of the bipolar transistor.

3. The circuit according to claim 1 wherein the diode has a temperature coefficient in a range 2 mV to 2 mV per degree Centigrade inclusive.

4. The circuit according to claim 1 wherein the diode is a zener diode.

5. The circuit according to claim 4 wherein the zener diode has a zener voltage between 4 and 5.6 Volts inclusive.

6. The circuit according to claim 5 wherein the zener diode has a zener voltage of about 5.6 volts.

7. An inverter logic gate circuit comprising the circuit of claim 1.

8. A method of operating a circuit; the circuit comprising a bipolar transistor, a diode having a first terminal connected to a base terminal of the bipolar transistor; and a second terminal of the diode connected to a reference voltage; a voltage being applied across and emitter terminal of the bipolar transistor and the second terminal of the diode; the method comprising switchably connecting the base terminal of the bipolar transistor and the first terminal of the diode to a signal source having an impedance lower than an impendence across an emitter terminal and a base terminal of the bipolar transistor such that: when not connected, so as to cause a current flow through the base terminal of the bipolar transistor and through the diode to, turn the bipolar transistor ON; and when connected current flow through a control terminal of the bipolar transistor reduces to switch the bipolar transistor OFF.

9. A method according to claim 8 wherein the voltage is applied across being applied across and emitter terminal of the bipolar transistor and the second terminal of the diode such that the diode is reverse biased.

10. A method according to claim 8 wherein the diode is a zener diode and the voltage applied across the diode when the bipolar transistor is ON is less than a zener diode breakdown voltage of the zener diode.

11. A semiconductor device comprising: a bipolar transistor comprises: first and second regions of a first type of semiconductor material that provide collector and emitter regions of the bipolar transistor, and a first region of a second type of semiconductor material that provides a base region of the bipolar transistor, interposed between and in contact with each of the first and second regions of the first type of semiconductor material; and a diode comprises: the first region of the second type of semiconductor material; and a further region of the first type of semiconductor material in contact with a highly doped portion of the first region of the second type of semiconductor material to form a diode junction.

12. The semiconductor device according to claim 11 wherein the diode is comprised from a portion of the first region of the second type that is relatively highly doped compared with a remainder of the first region of the second type.

13. The semiconductor device according to claim 12 comprising a base contact for the bipolar transistor, the base contact being in direct contact with the relatively highly doped portion of the first region of the second type.

14. The semiconductor device according to claim 11 wherein the relatively highly doped portion of the first region of the second type of semiconductor material and the further region of the first type of semiconductor material provide a zener diode.

15. The semiconductor device according to claim 11 wherein the bipolar transistor is a lateral bipolar junction transistor, the first and second regions of the first type of semiconductor material being laterally spaced apart from one another about the first region of the second type and lie on a same side as the first region of the second type of semiconductor material.

16. The semiconductor device according to claim 11 comprising an electrical terminal connected to the further region of the first type of semiconductor material that provides a terminal of the diode.

17. The semiconductor device according to claim 11 wherein the further region of the first type of semiconductor material is provided by a semiconductor layer that has been deposited onto a semiconductor wafer which defines, at least in part, the first region of the second type of semiconductor material that provides the base region of the bipolar transistor.

18. The semiconductor device according to claim 11 the first and second regions of the first type of semiconductor material are provided by a semiconductor layer deposited onto a semiconductor wafer which defines, at least in part, the first region of the second type of semiconductor material that provides the base region of the bipolar transistor.

19. The semiconductor device according to claim 11 comprising a contact terminal for the diode that is in direct contact with the further region of the first type of semiconductor material.

20. The semiconductor device according to claim 11 wherein the further region of the first type of semiconductor material comprises a first portion that is highly doped and together with the first region of the second type of semiconductor material provides the diode, and a second portion which is lightly doped relative to the first portion and provides a substrate layer.

21. The semiconductor device according to claim 20 comprising multiple first regions of the second type within the substrate layer and isolated from one another by the substrate layer.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0028] The invention will now be described by way of example with reference to the following figures in which:

[0029] FIG. 1 is a schematic of an example circuit comprising a PNP bipolar junction transistor and a reversed biased zener diode, which implements an inverter logic gate (NOT gate);

[0030] FIG. 2 is a schematic of an example circuit comprised from a NPN bipolar junction transistor and a reversed biased zener diode, which implements the function of an inverter logic gate (NOT gate);

[0031] FIG. 3 is a schematic of an example circuit that implements the function of a buffer comprised from two normally ON transistors using two of the circuit fragments of FIG. 1;

[0032] FIG. 4 is a schematic of an example circuit to implement a NAND gate comprised of normally ON transistors implemented using two circuit fragments of FIG. 1;

[0033] FIG. 5 is a schematic of an example circuit to implement a NOR gate comprised of normally ON transistors implemented using two of the circuits of FIG. 1; and

[0034] FIGS. 6A, 6B and 6C are example cross section side views of variant semiconductor layer structures to provide a lateral PNP bipolar transistor and zener diode.

DETAILED DESCRIPTION

[0035] With reference to FIG. 1 there is shown a circuit 10 comprising a PNP bipolar junction transistor 11. The emitter E of the transistor is connected to the high side rail and the collector of the transistor C connected to ground or some other low side reference voltage. The base B of the transistor 110 is switchably connectable through switch 12 to a current source 13.

[0036] A first terminal of a zener diode 14 is connected to both the base B of the transistor 11 and the current source 13 through switch 12. A second terminal of the diode 14 is connected to ground or some other low side reference voltage. The zener diode 14 is oriented such as to be reverse biased. A zener diode 14 is chosen with a zener voltage of about 5.6V in order that it has a temperature coefficient as close as possible to 0 mV per degree Celsius. This ensures the diode's characteristics remain stable with any change in the diode's temperature, e.g., as a result of external conditions.

[0037] With switch 12 open, such that the current source 13 is isolated from the base terminal B, there is a voltage drop across the transistor 11 and diode 14, and hence conventional current flow through the emitter base terminals of the transistor 11 and through the reverse biased diode 14; current flow through the diode 14 attributable to a leakage current.

[0038] The circuit 10 is arranged such that the voltage drop across the diode 14 is below the breakdown voltage of the diode 14. The leakage current thus though to be a consequence of quantum tunneling effect within the diode 14.

[0039] The diode 14 is selected that, for the expected voltage drop across it, there is sufficient leakage current flows through it and therefore also between the emitter E and base B of the transistor to allow for current flow between the emitter E and collector C of the transistor 11; i.e., the transistor is ON.

[0040] Additionally, it is preferable that the diode is selected that, for the expected voltage across it, the leakage current flow is kept as low as possible whilst ensuring the transistor is ON. This has the advantage of reducing the voltage drop across the transistor when the transistor is ON and therefore reduces the change in potential of the base of the transistor (relatively to ground or some reference voltage) when the transistor is switched between OFF and ON. This minimizes static fields between transistors formed in the same wafer. In one example it is preferred that the switching voltage across the transistor is limited to around 0.5V.

[0041] When the switch 12 is closed the current source is connected to the base terminal B of the transistor 11. The impedance of the current source is selected to be lower than the impedance through the emitter base terminals of the transistor 11 causing the diode 14 to preferentially draw current from the current source 13 rather than the base B of the transistor 11. This results in current through the emitter-base of the transistor 11 reducing, e.g., substantially to zero, such that current between the emitter and collector reduces, if not ceases, to an extent that it the transistor is considered OFF.

[0042] In order to ensure that current through the transistor 11 reduces when the switch 12 is closed, the diode 14 needs to be current limiting, i.e., it does not have the capacity to carry the maximum current that can be supplied by the current source 13 as well as the current from the transistor 11.

[0043] In the afore described circuit arrangement the transistor 11 can be treated as operating as a normally ON transistor as the transistor is ON when there is no signal applied to the base.

[0044] The example circuit of FIG. 1 can be used to implement an inverter (NOT) logic gate. When the base is connected to a signal source (input ON), i.e., the current source 13, current flow at the collector side of the transistor 11 will be substantially zero (output OFF). In contrast when the base is disconnected from the signal source (input OFF) there will be current through the collector (output ON).

[0045] FIG. 2 illustrates a variant example circuit 20 that implements the same function as the circuit of FIG. 1 but in which the PNP bipolar transistor is replaced with an NPN bipolar transistor. The circuit 20 operates in a similar way except that the polarities are reversed and that the current source is replaced with a current sink 23.

[0046] When switch 22 is open the potential across the reverse biased diode 24 and transistor 21 causes a leakage current flow through the diode and thus current into the base of the transistor 21 sufficient to switch the transistor ON.

[0047] When switch 22 is closed, such that the current sink 23 is connected to the base B of the transistor 21, current through the diode is preferentially drawn through to the current sink 23 by virtue of its lower impendence compared with the impedance of the transistor 21 between the base B and emitter E terminals. As a consequence, current into the base B of the transistor 21 reduces, e.g., ceases, switching the transistor OFF.

[0048] FIG. 1 illustrates the current source 13 and switch 12 generically to ease understanding. In most practical implementations the base of the transistor will be connected to the output of another logic circuit(s), with current ultimately derived from the high rail as opposed to an independent current source. Where so, the circuit is designed so that the impedance of the circuitry from the high rail to the base terminal is lower than the impedance between the emitter and the base of the transistor. The same is applied to FIG. 2 mutatis mutandis.

[0049] FIGS. 3, 4, and 5, illustrate example circuits, according to various embodiments, comprised from combining multiple inverter logic circuits of FIG. 1 to implement other functions.

[0050] The example circuit of FIG. 3 comprises two inverter circuits of FIG. 1 arranged with the output of a first of them (left hand side) provided by the collector of the transistor of the first circuit providing an input connected to the base of the transistor of the second circuit (right hand side) to implement a buffer circuit.

[0051] The example circuit of FIG. 4 implements a NAND logic gate. It comprises two inverter circuits of FIG. 1 in which each is arranged to receive a different input: INA, INB. The outputs of the two circuits, i.e., output from collectors of respective transistors, are connected together to provide an output of the logic circuit.

[0052] The example circuit of FIG. 5 implements a NOR logic gate. It comprises two inverter circuits of FIG. 1 in which each is arranged to receive a different input: INA, INB. The output of the collector of the transistor of the first circuit (above) is connected to the emitter of the transistor of the second circuit (below). The collector of the transistor of the second circuit provides the output of the logic circuit.

[0053] It will be appreciated that any of the circuits of FIGS. 3 to 5 could be implemented instead by combining multiples of the circuit of FIG. 2.

[0054] FIGS. 6A, 6B, 6C are schematics of variant example semiconductor layer structures to implement the PNP bipolar junction transistor and zener diode of FIG. 1.

[0055] With reference to FIG. 6A, a lateral bipolar junction transistor is provided from a first n-type semiconductor region 100, which provides a base region of the transistor, formed in a p-type layer 101 (e.g., substrate in which multiple regions 100 may be provided and isolated from one another by the substrate to form multiple transistor zener diode circuit devices). A portion of the n-type region 100 is heavily doped to provide an n+ type region 102. The n+ region 102 is in contact with the both the p substrate 101 and a base contact B of the transistor. The n+ region 102 extends beneath the less heavily doped part of the n-type region 100.

[0056] A pattern of polysilicon is provided on the n-type region 100 (e.g., on the surface of the silicon wafer) to define separate p-type regions 103, 104 that provide the collector and emitter regions of the transistor. Contacts for the collector and base are provided on region 103, 104 to provide emitter and connector contacts.

[0057] The p-type 103, 104 regions are favorably manufactured by depositing undoped or lightly doped polysilicon on the wafer and then doping in situ. The conditions of the doping process favorably cause portions of the n-type region 100 immediately adjacent the polysilicon to be counter-doped so that they form part of the p-type regions 103, 104.

[0058] A portion of the p-type substrate 101 is heavily doped to provide a further p+ region 105 that is in direct contact with the n+ region 102 of the base to form a diode junction 106 which provides, by virtue of their high doping levels, the zener diode. An electrical contact D is provided on the p substrate 101 to provide the second terminal of the zener diode.

[0059] FIG. 6B shows a variant example structure in which the further p+ region 105 of FIG. 6A which forms one half of the zener diode, is provided instead by a heavily doped polysilicon layer 105A deposited on the surface of the doped silicon wafer (e.g., in the same process that created p-type regions 103, 104). The polysilicon layer 105A extends laterally across a PN junction within the wafer between the n+ base region 102 of the transistor and the relatively lightly doped p-type substrate 100 (though in a variant it may extend over the p-type substrate only). As before, undoped or relatively lightly doped polysilicon may be deposited on the silicon wafer and then doped in situ to form a heavily doped p-type layer (p+ layer). Favorably the doping conditions are selected to convert a portion of the p-type substrate immediately adjacent the n+ layer 102 so as to form part of the heavily doped p+ layer 105A.

[0060] The provision of a base region comprising an n region 100 that has beneath it a buried n+ type region reduces the efficiency of any parasitic vertical transistors inadvertently created as a result of the lateral transistor structure. However, providing this layer structure is complex because it is difficult to create lightly doped material in a region that is already heavily doped. Nevertheless this could be done using multiple epitaxial layers, e.g., by placing a N+ layer across the entire wafer, then a lighter N layer.

[0061] FIG. 6C illustrates a further variant example structure, similar to that of FIG. 6B in which the n+ region 102 of the base lies adjacent the n region 100 of the base but does not extend beneath it. This structure is easier to form compared with that of FIG. 6B as the n+ region 102 can be easily formed after the n-region 100 is formed through a further doping process. A further difference of this embodiment to that of FIG. 6A is that the second terminal D of the diode is connected directly to the p+ layer 105A rather than on the p substrate 101 allowing it to be provided on the same side of the wafer as the base, emitter and collector terminals.

[0062] A low energy P-type ion implant may be used to reduce the N type material 100 at the surface of the wafer. This allows a higher concentration of N dopant to be used to form 100, reducing the gain of a vertical parasitic transistor, while keeping the lateral transistor gain high.

[0063] It will be appreciated that the variants structures of FIGS. 6A to 6C can be adapted to form NPN bi-polar transistors with zener diodes by swapping the layer types around.

[0064] The use of a zener diode in a reverse biased arrangement with a voltage across it that is below its zener voltage is preferred because it provides operationally stability, especially when the zener voltage is selected to minimize the diode thermal coefficient. Nevertheless, other diode configurations are possible. For example where the diode is small enough and thus highly current limiting, it may be used in a normal biased arrangement. It is also possible that other type of diode be used, e.g., tunnel diodes. A tunnel diode may be used in a forward biased condition with the voltage across the diode being below the higher voltage that demarks the negative resistance region of the tunnel diode.

[0065] It will be appreciated that the above describes only a few example configurations of a transistor device and associated circuitry and that the actual operations performed by the transistor device and associated circuitry can be selected by the user depending on the intended function of the transistor device.