OXYGEN GETTERS FOR ACTIVATION OF GROUP V DOPANTS IN II-VI SEMICONDUCTOR MATERIALS

Abstract

Disclosed herein are the use of materials that have high affinity for oxygen, oxygen getters (e.g. Al), in conjunction with group V dopants (e.g. As) in II-VI materials (e.g. CdTe, Cd(Se)Te), that enable p-type doping by reducing group V oxides found in as-grown II-VI materials, thereby freeing up the anionic form of the Group V element.

Claims

1. A method for making a II-VI semiconductor material comprising a group V dopant wherein the method comprises the use of an oxygen getter composition of matter.

2. The method of claim 1, wherein the II-VI semiconductor material comprises CdTe.

3. The method of claim 1, wherein the II-VI semiconductor material comprises Cd(Se)Te.

4. The method of claim 1, wherein the getter is Al.sub.2O.sub.3.

5. The method of claim 1, wherein the getter is AlCl.sub.3.

6. The method of claim 1, wherein the getter comprises Aluminum.

7. The method of claim 1, wherein the getter comprises Boron.

8. The method of claim 1, wherein the getter comprises Gallium.

9. The method of claim 1, wherein the getter comprises elements selected from the group consisting of Magnesium, Titanium, and Zirconium.

10. The method of claim 1, wherein the getter comprises elements selected from the group consisting of Hafnium, Scandium, Yttrium, Lanthanum, Chromium, and Iron.

11. A II-VI semiconductor material comprising a group V dopant and further comprising an oxygen getter composition of matter.

12. The II-VI semiconductor material of claim 11, wherein the II-VI semiconductor material comprises CdTe.

13. The II-VI semiconductor material of claim 11, wherein the II-VI semiconductor material comprises Cd(Se)Te.

14. The II-VI semiconductor material of claim 11, wherein the getter is Al.sub.2O.sub.3.

15. The II-VI semiconductor material of claim 11, wherein the getter is AlCl.sub.3.

16. The II-VI semiconductor material of claim 11, wherein the getter comprises Aluminum.

17. The II-VI semiconductor material of claim 11, wherein the getter comprises Boron.

18. The II-VI semiconductor material of claim 11, wherein the getter comprises Gallium.

19. The II-VI semiconductor material of claim 11, wherein the getter comprises elements selected from the group consisting of Magnesium, Titanium, and Zirconium.

20. The II-VI semiconductor material of claim 11, wherein the getter comprises elements selected from the group consisting of Hafnium, Scandium, Yttrium, Lanthanum, Chromium, and Iron.

Description

DETAILED DESCRIPTION

[0009] A challenge remaining in improving the performance of CdTe PV devices is in raising the open-circuit voltage of these devices, which is still relatively small compared to the CdTe material bandgap. One way to improve the Voc is to improve the ability to more-highly dope the absorber material, thus increasing the carrier concentration and raising the built-in electronic field. Recently, new methods to dope CdTe materials with Group V dopants (P, As, Sb, Bi) have been investigated as a promising alternative to improve the doping profile of CdTe films.

[0010] One problem with using Group V dopants, however, is their high affinity for forming Group V-oxide compounds, rather than exist in their ionic state on the Te-site in the CdTe crystal lattice. Disclosed herein are methods that provide an oxygen getter material (such as aluminum) that outcompetes available oxygen to from getter-oxides rather than Group V oxides. These getter-oxides are benign in the crystal lattice and result in more available Group V atoms to freely dope the material.

[0011] Aluminum and other materials that can form oxides having large negative enthalpies of formation can be used to getter oxygen away from the group V elements while still maintaining the p-n junction interfacial oxides.

[0012] Previous work has used materials that exhibit a significant voltage deficit with interface recombination being likely for holding this technology back. Oxygen getters may enable group V doping without compromising the interface. In an embodiment, and as disclosed herein, are methods for the use of materials that have high affinity for oxygen, oxygen getters (e.g. Al), in conjunction with group V dopants (e.g. As) in II-VI materials (e.g. CdTe, Cd(Se)Te) that enables p-type doping by reducing group V oxides found in as-grown II-VI materials, thereby freeing up the anionic form of the Group V element.

[0013] Potential oxygen getters include B, Al, Ga, Mg, Ti, Zr, Hf, Sc, Y, La, Cr, Fe and their compounds, particularly halide compounds

[0014] Some considerations for choosing candidate oxygen getters include the enthalpy of formation of the getter oxide (e.g. Al.sub.2O.sub.3) relative to the group V oxide (e.g. As.sub.2O.sub.3), as well as the getter chloride (e.g. AlCl.sub.3) and potentially any relevant oxychlorides. Without being limited by theory, a reason why the chloride (oxychloride) compounds may be of import is that chlorine will likely be present in the devices due to CdCl.sub.2 or similar treatments. Optimally, the getter and any reactants it forms will be electronically inert (not introduce traps).

[0015] Examples with Aluminum and Arsenic are as follows:

Hf(kJ/mol): Al.sub.2O.sub.3=1675.7; AlCl.sub.3=705.6; As.sub.2O.sub.3=657.3

[0016] Application of Hess's Law to the above formation energies indicates that the reaction between arsenic oxide and aluminum metal to form alumina and free arsenic is strongly favored:

As.sub.2O.sub.3+2Al>Al.sub.2O.sub.3+2As, H.sub.reaction=1018 kJ/mol

[0017] Because Al.sub.2O.sub.3 has a more negative enthalpy of formation, it should be energetically favorable to have Aluminum introduced either in its elemental form or as a chloride to strip oxygen from any oxidized arsenic. Similarly, because aluminum oxide is more negative than its chloride, the oxide is also energetically favored. The wide bandgap of Al.sub.2O.sub.3 makes it insulating (electrically inert). It has been used for passivating in double heterostructures, so is known to be benign with CdTe and its alloys.

[0018] The foregoing disclosure has been set forth merely to illustrate the invention and is not intended to be limiting.