Cure in place thermal interface material

Abstract

Methods and devices for providing an even distribution of waste heat in a vehicular battery pack, including a battery pack, a cold plate, a coolant reservoir, a support structure between the battery pack and the coolant reservoir, and a conformable thermal interface material for filling the space between cells of the battery pack and the coolant reservoir so as to provide thermal contact between the cells and the coolant reservoir for distributing the waste heat. In addition, methods and devices for providing an even distribution of waste heat and structural support in any heat source to heat sink for applications such as small devices such as computer motors.

Claims

1. A conformable thermal interface material comprising: a thermally conductive admixture including a thermally conductive ceramic within a polymer; and a conformable polymer that is mixable with the thermally conductive admixture and is cross-linkable; wherein the conformable thermal interface material is flowable onto a release liner for a first predetermined period of time after mixture of the thermally conductive admixture with the conformable polymer; and wherein the conformable thermal interface material is resilient, is cross-linked, is not flowable, and is physically removable from the release liner after the first predetermined period of time.

2. The conformable thermal interface material of claim 1, further comprising a processing aid.

3. The conformable thermal interface material of claim 2, wherein the processing aid is a fluorosurfactant.

4. The conformable thermal interface material of claim 3, wherein the fluorosurfactant is perfluorononanoic acid.

5. The conformable thermal interface material of claim 1, wherein the conformable polymer is selected from the group consisting essentially of polyvinylidene fluoride, poly(di-methyl siloxane), polyurethane, unsaturated polyesters, alkyds, epoxies, polycycloolefins, and copolymers thereof.

6. The conformable thermal interface material of claim 1, wherein the polymer is selected from the group consisting essentially of silicones, epoxies, alkyd resins with a styrene solvent, polyvinylidene fluoride copolymers, glues, polyoctenamers, or combinations thereof.

7. The conformable thermal interface material of claim 6, wherein the polymer is present in an amount between 50 wt % and 95 wt % on a basis of total weight of resin solids.

8. The conformable thermal interface material of claim 1, wherein the thermally conductive ceramic is selected from the group consisting essentially of boron nitride, alumina, and synthetic diamond.

9. The conformable thermal interface material of claim 1, wherein the thermally conductive ceramic is present in an amount between 0.1 wt % and 50 wt % on a basis of total weight of resin solids.

10. The conformable thermal interface material of claim 1, further comprising an electrically conductive powder in an amount such that the conformable thermal interface material is electrically conductive.

11. The conformable thermal interface material of claim 10, wherein the electrically conductive powder is graphite, carbon black, aluminum, copper, zinc, silver, or mixtures thereof.

12. The conformable thermal interface material of claim 1, wherein the conformable thermal interface material includes a thermal conductivity of at least about 2.5 W/mK.

13. The conformable thermal interface material of claim 1, wherein the conformable thermal interface material, on a basis of solids in the conformable thermal interface material, includes: the thermally conductive admixture in an amount from 5 wt % to 50 wt %; and and the balance being the conformable polymer in an amount from 50 wt % to 95 wt %.

14. The conformable thermal interface material of claim 1, wherein the polymer and the conformable polymer both consist of the same material.

15. The conformable thermal interface material of claim 1, wherein the thermally conductive admixture is present in an amount from 75 wt % to 90 wt % on a basis of solids in the conformable thermal interface material.

16. The conformable thermal interface material of claim 1, wherein the conformable thermal interface material is flowable onto the release liner and capable of filling a space having a thickness of from 6 mm to 25 mm during the first predetermined period of time.

Description

BRIEF DESCRIPTION OF THE FIGURES

(1) The following detailed description of specific embodiments can be best understood when read in conjunction with the following drawings, where like structure is indicated with like reference numerals and in which:

(2) FIG. 1 illustrates a schematic diagram of an embodiment of a system for providing the even distribution of the waste heat in the vehicular battery pack demonstrating the conformable thermal interface material;

(3) FIG. 2 illustrates a cross-section of the system of FIG. 1 along line 2-2 of FIG. 1;

(4) FIG. 3 illustrates example embodiments of cold plate shapes;

(5) FIG. 4 illustrates the vehicle that can contain therein one or more of the cells of one or more of the battery packs; and

(6) FIG. 5 illustrates the use of embodiments in an application where thermal distribution is required for a small heat sink to an external heat sink.

(7) The embodiments set forth in the drawings are illustrative in nature and are not intended to be limiting of the embodiments defined by the claims. Moreover, individual aspects of the drawings and the embodiments will be more fully apparent and understood in view of the detailed description that follows.

DETAILED DESCRIPTION

(8) Specific embodiments of the present disclosure will now be described. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

(9) Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of this invention belong. The terminology used herein is for describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and appended claims, the singular forms a, an, and the are intended to include the plural forms as well, unless the context clearly indicates otherwise.

(10) Unless otherwise indicated, all numbers expressing quantities of ingredients, properties such as molecular weight, reaction conditions, and so forth as used in the specification and claims are to be understood as being modified in all instances by the term about, which is intended to mean up to 10% of an indicated value. Additionally, the disclosure of any ranges in the specification and claims are to be understood as including the range itself and also anything subsumed therein, as well as endpoints. Unless otherwise indicated, the numerical properties set forth in the specification and claims are approximations that may vary depending on the desired properties sought to be obtained in embodiments of the present invention. Notwithstanding that numerical ranges and parameters setting forth the broad scope of embodiments of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical values, however, inherently contain certain errors necessarily resulting from error found in their respective measurements.

(11) Parts of methods described herein such as mathematical determinations, calculations, inputting of data for computations or determinations of equations or parts thereof can be performed on parts of or one or more computers or computer systems that can include one or more processors, as well as software to run or execute programs and run calculations or computations.

(12) Methods and systems and parts thereof described herein can be combined so as to implement embodiments of the invention. Forms of words used herein can have variations: for example when a word such as couple is used, this implies that variations such as coupled to, and coupling, and coupling to are understood to have been considered. When terms such as formula, formulate and formulation are used, all forms of such words have been considered for methods and systems herein.

(13) Within the present context, as used herein, vehicle can include a car, truck, van sport utility vehicle (SUV) or the like, and can be all electric, or can include other forms of power such as one or more conventional engines, such one or more internal combustion engines.

(14) FIG. 1 illustrates a schematic diagram of an embodiment of the system 1 for providing an even distribution of waste heat in the vehicular battery pack demonstrating the conformable thermal interface material 4. Also illustrated is the cell 2 of the battery pack; seven cells 2 are shown forming a battery pack, though there can be other numbers of cells 2, such as about one to about ten, or from about one to about thirty, or multiple battery packs of varying numbers of cells 2. Also illustrated is foam 3, such as a strip or strips that can extend between the cells 2, the cold plate top portion 5 (also herein called a solid fin), the coolant reservoir 6, the support structure 7, and the cold plate bottom portion 8. The coolant-in location 9 is illustrated, as is the coolant-out 10 location. In specific embodiments the coolant reservoir 6 has a convective coolant flow in the direction of arrow 11. In specific embodiments the direction of flow can be in the opposing direction. A cross-section of the system of FIG. 1 along line 2-2 is illustrated in FIG. 2. Also illustrated are the cell 2, the coolant reservoir 6, the cold plate bottom portion 8, and the conformable thermal interface material 4 which in specific embodiments flows above and below the cold plate bottom portion 8. In specific embodiments the coolant reservoir carries ethylene glycol mixtures and/or other cooling fluids such as organic refrigerants, phase change materials (such as ammonia) or short chained alcohols (for example, ethanol and/or methanol). If cooled, by gases, air or nitrogen can be used. Flow rates vary depending on cooling media. Typical flow rates for liquids are 10 liters per minute, air cooling rates are typically 200-300 m.sup.3/hr. Temperatures for steady state can be about 25 degrees Celsius or less). One or more of the cold plates can have an approximate L-shape (FIG. 1) where the bottom portion of the cold plate 8 has a length at the bottom of the L-shape (and in line with a longitudinal axis of the coolant reservoir 6) and the top portion 5 of the cold plate has a length at the top of the L-shape (and extends between and/or along the outer edge of one or more of the cells 2 along a plane in line with the direction of the cell's height). There can be one or more than one cold plates, such as four or more as shown. A technical difficulty in the art includes getting the cold plates aligned, and embodiments provided herein provide approximately one-hundred percent contact between each of the cells 2 and the coolant reservoir 6 when the cold plates are perfectly aligned (such that the bottom portions 8 of the cold plates form a single plane) as well as when they are not. Regarding the conformable thermal interface material 4, this can flow such that it is all around the bottom portion 8 of one or more of the cold plates, as well as a portion of the top portion 5 of the cold plate. FIG. 3 illustrates example embodiments of cold plate shapes, such as a split-shape 12, spring-fin 13, traditional 14, and wave plate 15; embodiments can have one, more than one, or all of the shapes in a single system 1.

(15) FIG. 4 illustrates the vehicle 16 that can contain therein one or more of the cells 2 of one or more of the battery packs. The battery pack or packs can be located in the front, middle, or rear of the car. The battery pack or packs can be coupled to the bottom of the car. Additionally, systems 1 outlined herein can involve cooling in computer applications within and/or outside of the vehicle 16, where thermal conduction is required between interfaces. In specific embodiments the vehicle includes use of the conformable thermal interface material 4 within a system 1 providing power to the vehicle 16, and also includes the thermal interface material 4 within a computer system having a power source and controlling an aspect of the car other than propulsion. FIG. 5 illustrates the use of embodiments in an application where thermal distribution is required for a small heat sink to an external heat sink. Illustrated are a heat source 17, such as a motor, a heat sink 18, and a solid structural interface 19. The solid structural interface 19 can comprise the conformable thermal material 4, which acts as a thermal conductor moving heat away from the source 17 to the solid structural interface 19.

(16) In specific embodiments of systems and methods described herein, the thermal conducting material is part of a formulation comprising the conformable thermal interface material (herein thermal conducting and thermal spreading are terms used synonymously). The formulation can include a combination of one or more of: a condensation polymer (polyvinylidene fluoride, poly(di-methyl siloxane), etc.), a processing aid (fluorosurfactant perfluorononanoic acid), and/or a thermal dissipating agent (such as boron nitride, though this can be used in combination with one or more ceramics) to spread the heat from affected areas in a coating, and a flame retardant

(17) The formulations can include one or more (or all) of: a thermally conductive silicone mixture, a thermally conductive epoxy mixture, a thermally conductive Alkyd resin with a styrene solvent mixture, a thermally conductive Kynar resin, a thermally conductive glue, and/or a thermally conductive polyoctenamer, as outlined below. Some resins described could be loaded with graphite and/or aluminum powders and give high thermal conductivity but can be electrically conductive as well which can entail the use of electrically conductive powders such as graphite, carbon black, aluminum, copper, zinc, silver, or mixtures thereof. The formulations can include one or more of parts or all of the examples provided in the text that follows.

Thermally Conductive Silicone Mixture (That can Include Quick-Sil)

(18) This mixture is a two part room temperature vulcanizing (RTV) silicone rubber that has a 1 to 2 minute working time and cures in approximately 15 minutes. Part A (or Part B) is kneaded at between 5 and 50 wt. percent (and preferably 33 wt. %) in specific embodiments with alumina, synthetic diamond or boron nitride powder (based on total resin solids) as a thermally conductive additive. Part B (or Part A) is then kneaded quickly with the second component and the putty material is quickly used as a potting material to protect automotive battery cells. The conductive silicone produces 100% solids, tough, strong, flexible, and long-lasting molds with 0% shrinkage.

Thermally Conductive Epoxy Mixture

(19) This mixture is a two-part epoxy resin system (Such as one or more of MasterBond, Loctite, Gorilla, or 3M, etc.) consisting of an epoxy resin and hardener that can be kneaded as an individual component or as a mixture of the components with between 5 and 50 wt. percent (and preferably 33 wt. %) in specific embodiments with alumina, synthetic diamond or boron nitride powder (based on total resin solids) as a thermally conductive additive. The putty material can be quickly used as a potting material to protect automotive battery cells. The thermally conductive epoxy resin produces 100% solids, tough, strong, flexible, and long-lasting molds with low shrinkage.

Thermally Conductive Alkyd Resin with Styrene Solvent Mixture

(20) This mixture is an unsaturated polyester (such as a fumaric acid-ethylene glycol based polyester or a propoxylated bisphenol-A fumarate resin) or other styrene soluble alkyd polyester resins (3M, Kao, Oxychem, etc.) that can be mixed with styrene monomer to form a paste and then methylethylketone peroxide is added. The putty can be kneaded at between 5 and 50 wt. percent (and preferably 33 wt. %) in specific embodiments with alumina, synthetic diamond or boron nitride powder (based on total resin solids) as a thermally conductive additive. The putty material can be quickly used as a potting material to protect automotive battery cells. The thermally conductive mixture produces 100% solids, tough, strong, flexible, and long-lasting molds with low shrinkage.

Thermally Conductive Kynar Resin

(21) This resin is a polyvinylidene fluoride copolymer (Arkema, Kynar 2751) that can be mixed with acetone (50 wt. % solids) to form a paste and then is kneaded at between 5 and 50 wt. percent (and preferably 33 wt. %) in specific embodiments with alumina, synthetic diamond or boron nitride powder (based on total resin solids) as a thermally conductive additive. The putty material can then be used as a potting material to protect automotive battery cells. The thermally conductive mixture produces tough, strong, flexible, and long-lasting molds with low shrinkage.

Thermally Conductive Booger Glue

(22) A brick of Booger Glue or credit card glue (polyisobutylene) can be kneaded at between 5 and 50 wt. percent (and preferably 33 wt. %) in specific embodiments with alumina, synthetic diamond or boron nitride powder (based on total resin solids) as a thermally conductive additive. The mixture can then used as a potting material to protect automotive battery cells. The thermally conductive mixture produces 100% solids, tough, strong, flexible, and long-lasting molds with low shrinkage.

Thermally Conductive Polyoctenamer

(23) Cyclooctene (Aldrich) and a catalyst are in specific embodiments combined at between 5 and 50 wt. percent (and preferably 33 wt. %) in specific embodiments with alumina, synthetic diamond or boron nitride powder (based on total resin solids) as a thermally conductive additive. The catalyst in specific embodiments is a ring opening metathesis polymerization catalyst (such as Grubb's catalyst). The mixture can then be used as a potting material to protect automotive battery cells. The thermally conductive mixture produces 100% solids, tough, strong, flexible, long-lasting, and rubbery molds with no shrinkage.

(24) Pastes can be utilized, and example thermal conductivities of example pastes are provided in Table 1, below. In specific embodiments the thermal conductivity of the paste is about 2.5 Watt/m.Math.K. In specific embodiments, the conductivity can be between about 2.5 and about 11.3 Watt/m.Math.K.

(25) TABLE-US-00001 TABLE 1 Thermal conductivity, Material Watt/m .Math. K Silicone with 10% boron nitride 4.28 Silicone with 33% boron nitride 5.54 Silicone with 50% boron nitride 8.58 Kynar with 50% boron nitride 7.92 Alkyd Resin with Styrene Solvent Mixture with 33% 7.18 boron nitride Alkyd Resin with Styrene Solvent Mixture with 33% 10.03 synthetic diamond (3.5 micron) Alkyd Resin with Styrene Solvent Mixture with 33% 11.3 (equal weights of synthetic diamond + boron nitride)

(26) The conformable thermal interface material can be part of a formulation comprising one or more of polyvinylidene fluoride, boron nitride, melamine, a processing aid, and a ceramic. In specific embodiments, the formulation comprises, by weight fraction: from about 0.65 to about 0.75 polyvinylidene fluoride; from about 0.10 to about 0.15 boron nitride; from about 0.05 to about 0.10 melamine; and from about 0.05 to about 0.1 the processing aid and the ceramic combined. In specific embodiments boron nitride is used having a heat transfer coefficient of about 1700 watts per square meter Kelvin. Other materials such as synthetic diamond and an aluminum oxide can be used as well.

(27) In yet other embodiments of systems and methods described herein, the conformable thermal interface material is part of a formulation comprising one or more of polydimethylsiloxane, boron nitride, melamine, a processing aid, and a ceramic. In specific embodiments the formulation comprises, by weight fraction: from about 0.1 to about 50 percent boron nitride; from about 0.05 to about 0.10 percent melamine; from about 0.05 to about 0.1 percent the processing aid and the ceramic combined; and the remaining balance in specific embodiments is polydimethylsiloxane.

(28) In specific embodiments one or more or any of the formulations described herein can have one or more of: alkyds, polyisobutylene, epoxy resin or resins, polyurethanes (foams), and polycycloolefins.

(29) In other specific embodiments of systems and methods described herein the battery pack comprises Lithium-Ion cells. Embodiments can also comprise prismatic pouch and/or can-type cells.

(30) Specific systems and methods described herein can comprise shaking and/or vibrating the system to distribute the conformable thermal interface material. For example in specific embodiments the shaking and/or the vibrating can be performed after the placing of the conformable thermal interface material into the support structure and before the cross-linking. In specific embodiments the cross-linking is performed, thus decreasing of the flowability of the conformable thermal interface material. In specific embodiments the decrease in flowability is such that the cross-linked thermal interface material forms a solid and in specific embodiments can provide support structure for the battery pack. As used herein, a solid would refer to a complete cross-linking of the liquid or gel such that a solid forms, and would indicate a fully cured liquid or gel. In specific embodiments, measure of cure is measured by sampling the material and testing on a nuclear magnetic resonance machine to give a degree of cure. Flow-ability can be performed before the material is cross linked with a dynamic mechanical analyzer.

(31) In yet other specific embodiments of systems and methods described herein a release liner can be placed on the reservoir. In specific embodiments the release liner is placed on the reservoir prior to the placing of the conformable thermal interface material onto the top of the coolant reservoir and/or into and/or on the support structure. In yet other specific embodiments, systems and methods described herein comprise the conformable thermal interface material being physically removable from the system and/or the release liner (either directly away from the release liner or the release liner itself being removable from the system with the conformable thermal interface), and/or the step of removing the thermal interface and/or the release liner (such as a thin polymer film or films, for example in specific embodiments one ore more of polyethylene, or polyethylene terephthalate). In specific embodiments the release liner is about 100 micrometers in thickness, and in other embodiments it is from about 75 to about 125 micrometers thick. The removability could be for service involving one or more of the cells.

(32) Specific embodiments provided herein include a polymer matrix. As used herein, polymer matrix refers to a mixture with polymers.

(33) Specific embodiments use one or more methods or parts of systems described herein in combination with one or more of an acrylic base ceramic or silicone base.