Temperature detection device
11054316 ยท 2021-07-06
Assignee
Inventors
Cpc classification
G01K1/14
PHYSICS
International classification
G01K1/00
PHYSICS
G01K7/00
PHYSICS
G01K1/14
PHYSICS
Abstract
A temperature detection device includes a thermistor element that includes a thermosensitive body configured to sense heat of a coil element and an electric wire electrically connected to the thermosensitive body, and a holder assembling the thermistor element to the coil element. The holder includes a thermosensitive body holder that holds a reinforcing portion of the thermosensitive body disposed sideways along a front surface of the coil element and is provided with a first resin reservoir enclosing a thermosensitive body contact portion of the thermosensitive body, and an electric wire holder holding the electric wire. The thermosensitive body contact portion is in contact with the coil element while being enclosed with the first resin reservoir. According to the temperature detection device, it is possible to more accurately detect temperature of a coil with high responsiveness while promoting miniaturization of the temperature detection device.
Claims
1. A temperature detection device, comprising: a temperature sensor element that includes a thermosensitive body configured to sense heat of a coil element used as a part of a coil and an electric wire electrically connected to the thermosensitive body; a holder assembling the temperature sensor element to the coil element, wherein the holder includes a thermosensitive body holder that holds a part of the thermosensitive body disposed sideways along a surface of the coil element and is provided with a first resin reservoir enclosing another part of the thermosensitive body, and the another part of the thermosensitive body being in contact with the coil element while being enclosed with the first resin reservoir; and a resin mold mutually fixing the temperature sensor element, the holder, and the coil element.
2. The temperature detection device according to claim 1, wherein the thermosensitive body includes a thermosensitive main body electrically connected to the electric wire, a cover material covering the thermosensitive main body, and a reinforcing portion reinforcing a part where the electric wire is drawn out from the cover material, the reinforcing portion is held as the part of the thermosensitive body by the thermosensitive body holder, and the cover material is in contact with the coil element while being enclosed, as the another part of the thermosensitive body, with the first resin reservoir.
3. The temperature detection device according to claim 1, wherein the thermosensitive body is in contact with the coil element through a resin that is higher in thermal conductivity than the resin mold.
4. The temperature detection device according to claim 3, wherein an electric wire exposed part that is a part of the electric wire is disposed between the thermosensitive body holder and an electric wire holder, and the thermosensitive body holder and the electric wire holder include a second resin reservoir that encloses the electric wire exposed part.
5. The temperature detection device according to claim 1, wherein the thermosensitive body holder includes a grip part gripping the coil element from both sides in a width direction, a holding part holding the part of the thermosensitive body in contact with the coil element, and an accommodation part that accommodates the another part of the thermosensitive body and the first resin reservoir, and includes an opening communicating with outside of the thermosensitive body holder, and a resin configuring the first resin reservoir is filled inside the accommodation part from the opening.
6. The temperature detection device according to claim 5, wherein the accommodation part extends along a direction orthogonal to or substantially orthogonal to a surface of the coil element.
7. The temperature detection device according to claim 1, wherein the holder further comprises an electric wire holder holding the electric wire.
8. The temperature detection device according to claim 7, wherein the electric wire includes a first electric wire drawn out from the thermosensitive body and a second electric wire connected to the first electric wire, the second electric wire is inserted into the electric wire holder, and a crimping member that crimps a connection portion between the first electric wire and the second electric wire is locked to the electric wire holder.
9. The temperature detection device according to claim 7, wherein an electric wire exposed part that is a part of the electric wire is disposed between the thermosensitive body holder and the electric wire holder, and the thermosensitive body holder and the electric wire holder include a second resin reservoir that encloses the electric wire exposed part.
10. The temperature detection device according to claim 9, wherein at least the second resin reservoir out of the first resin reservoir and the second resin reservoir is a part of the resin mold.
11. The temperature detection device according to claim 9, wherein one of the thermosensitive body holder and the electric wire holder includes a protrusion that protrudes toward the other holder and relatively positions the thermosensitive body holder and the electric wire holder.
12. The temperature detection device according to claim 9, wherein the electric wire holder includes a partition wall that protrudes toward the thermosensitive body holder to separate the electric wire exposed part from a surface of the coil element.
13. A method of manufacturing a temperature detection device, the temperature detection device including a temperature sensor element that includes a thermosensitive body configured to sense heat of a coil element used as a part of a coil and an electric wire electrically connected to the thermosensitive body, and a holder assembling the temperature sensor element to the coil element, the thermosensitive body being disposed sideways along a surface of the coil element, the method comprising: a step of causing a thermosensitive body holder configuring the holder to hold a part of the thermosensitive body; a step of providing, in the thermosensitive body holder, a resin reservoir that encloses another part of the thermosensitive body after the part of the thermosensitive body is held by the thermosensitive body holder; a step of bringing the another part of the thermosensitive body into contact with the coil element while the another part of the thermosensitive body is enclosed with the resin reservoir; and an injection molding step of forming, by injection molding, a resin mold that mutually fixes the temperature sensor element, the holder, and the coil element.
14. The method of manufacturing the temperature detection device according to claim 13, further comprising a step of causing an electric wire holder configuring the holder to hold the electric wire.
15. The method of manufacturing the temperature detection device according to claim 13, wherein in the injection molding step, the injection molding of the resin mold is performed to integrate the resin mold and the resin reservoir.
16. The method of manufacturing the temperature detection device according to claim 15, wherein the thermosensitive body holder comprises an accommodation part which accommodates the another part of the thermosensitive body and includes an opening communicating with outside of the thermosensitive body holder, and the method further comprises, before the injection molding step, a step of supplying a resin higher in thermal conductivity than the resin mold to an inside of the accommodation part from the opening.
17. The method of manufacturing the temperature detection device according to claim 13, wherein in the injection molding step, the injection molding of the resin mold is performed to cause the resin mold to include the resin reservoir.
18. The method of manufacturing the temperature detection device according to claim 17, wherein the thermosensitive body holder comprises an accommodation part which accommodates the another part of the thermosensitive body and includes an opening communicating with outside of the thermosensitive body holder, and the method further comprises, before the injection molding step, a step of supplying a resin higher in thermal conductivity than the resin mold to an inside of the accommodation part from the opening.
Description
BRIEF DESCRIPTION OF DRAWINGS
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(2)
(3)
(4)
(5)
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(7)
(8)
(9)
(10)
DESCRIPTION OF EMBODIMENT
(11) An embodiment of the present invention is described below with reference to accompanying drawings.
(12) A temperature detection device 1 illustrated in
(13) The coil including the coil element 9 configures an unillustrated stator provided in the rotary electric machine.
(14) Temperature of the coil (stator coil) including the coil element 9 is detected based on heat of the coil element 9 that is sensed by a thermosensitive body 11 (
(15) A configuration of the temperature detection device 1 is described.
(16) (1) Coil Element
(17) The coil element 9 is electrically connected to other coil elements (not illustrated) that configure the stator coil, thereby being used as a part of the stator coil.
(18) As illustrated in
(19) The thermosensitive body 11 (
(20) The coil element 9 according to the present embodiment extends in one direction, and is formed in a linear shape as a whole; however, the coil element 9 may include a curved part or a bent part. In a case where the sensor assembly 2 is attached to a region including the curved or bent part, a holder 20 of the sensor assembly 2 is preferably formed in a shape following the shape of the coil element 9.
(21) (2) Sensor Assembly
(22) As illustrated in
(23) A configuration of the sensor assembly 2 is described in order below.
(24) (i) Thermistor Element
(25) As illustrated in
(26) (Thermosensitive Body)
(27) As illustrated in
(28) The thermosensitive main body 110 is a semiconductor having electric resistance that is largely varied in response to temperature variation. The electric wires 12 are electrically connected to an unillustrated electrode provided in the thermosensitive main body 110.
(29) The thermosensitive main body 110 may be made of ceramic that is obtained by sintering, as raw materials, some kinds of transition metal oxides mainly containing, for example, Mn, Ni, or Co.
(30) The cover glass 11G encloses the whole of the thermosensitive main body 110 and parts of the electric wires 12 connected to the thermosensitive main body 110 without a gap. The cover glass 11G is disposed on the front surface 9A of the coil element 9 (
(31) The cover glass 11G is wholly formed in a substantially columnar shape; however, may be formed in an appropriate shape.
(32) (Electric Wire)
(33) As illustrated in
(34) When a current flows through the coil element 9 (
(35) The paired extension wires 121 are disposed with a predetermined interval.
(36) A part of each of the extension wires 121 is enclosed in the cover glass 11G. Each of the extension wires 121 preferably includes a linear expansion coefficient equivalent to or close to a linear expansion coefficient of the cover glass 11G. In terms of the linear expansion coefficient, a conductive wire containing platinum or a platinum alloy, or a Dumet wire may be used as each of the extension wires 121. The Dumet wire includes a core wire that is made of an alloy containing iron and nickel, and a copper alloy film that covers the core wire.
(37) As illustrated in
(38) An end part of the core wire 122A exposed from the insulation coating 122B and an end part of the corresponding extension wire 121 are connected by a method such as laser welding and electric resistance heat welding, and a connection portion 124 is crimped with a crimping member 123. The crimping member 123 covers the connection portion 124 and is squeezed from outside. The crimping member 123 is made of an appropriate metal material.
(39) The method of connecting each of the extension wires 121 and the corresponding core wire 122A is not limited to the above-described method of welding the extension wire 121 and the core wire 122A and crimping them with the crimping member 123. The crimping member 123 is not necessarily provided, and the extension wire 121 and the core wire 122A may be connected by an appropriate method such as welding, crimping, and soldering.
(40) To prevent leakage of the current from the coil element 9 to the electric wires 12, it is necessary to separate the electric wires 12 from the front surface 9A of the coil element 9. Therefore, as illustrated in
(41) (Reinforcing Portion)
(42) The reinforcing portion 13 illustrated in
(43) The thermosensitive body 11 and the extension wires 121 are reinforced by the reinforcing portion 13, which makes the thermistor element 10 strong to external force such as vibrations.
(44) Since the reinforcing portion 13 includes sufficient rigidity, the reinforcing portion 13 is preferably pressed against the coil element 9 by a thermosensitive body holder 21 when the thermosensitive body holder 21 holds the thermosensitive body 11 to the coil element 9.
(45) (ii) Holder
(46) Next, as illustrated in
(47) The thermosensitive body holder 21 and the electric wire holder 22 are arranged in a length direction (front-rear direction) D1 of the thermistor element 10.
(48) When the thermistor element 10 is assembled to the coil element 9 by the thermosensitive body holder 21 and the electric wire holder 22, the thermosensitive body 11 is disposed sideways along the front surface 9A of the coil element 9, and the entire thermistor element 10 is also disposed in an attitude along an extending direction of the coil element 9 (
(49) The phrase disposed sideways along front surface of coil element indicates a state where the length direction D1 that connects the front end 11A (
(50) (Thermosensitive Body Holder)
(51) As illustrated in
(52) The thermosensitive body holder 21 includes an accommodation groove 21A that accommodates the reinforcing portion 13 (
(53) The bank 21D is formed in a U shape (C shape) in a planar view so as to rise from a peripheral edge of a top surface part of the thermosensitive body holder 21.
(54) The accommodation groove 21A (
(55) The accommodation hole 21B (
(56) As illustrated in
(57) As illustrated in
(58) As illustrated in
(59) In the present specification, the phrase thermosensitive body contact portion is enclosed with first resin reservoir includes not only a configuration in which the whole of the thermosensitive body contact portion 11S is enclosed with the first resin reservoir 41 as illustrated in
(60) The accommodation hole 21B is set to a size (diameter and height) with allowance so as to secure flow of the resin to enclose the thermosensitive body contact portion 11S and to cope with tolerance of the dimensions of each of the holders 21 and 22 and the thermistor element 10 (in particular, cover glass 11G).
(61) In the present specification, contact of the thermosensitive body contact portion to the coil element includes, in addition to direct contact of the thermosensitive body contact portion 11S to the coil element 9 without any substance between the thermosensitive body contact portion 11S and the front surface 9A of the coil element 9, indirect contact of the thermosensitive body contact portion 11S to the front surface 9A of the coil element 9 through a small amount of resin R (
(62) The thermosensitive body contact portion 11S and the coil element 9 does not include a gap in between at a part where the thermosensitive body contact portion 11S and the coil element 9 are in contact with each other.
(63) The thermosensitive body contact portion 11S is not necessarily in contact with the coil element 9 over the entire length, and it is sufficient that at least a part of the thermosensitive body contact portion 11S is in contact with the coil element 9.
(64) When the thermosensitive body contact portion 11S is in contact with the coil element 9 as described above, the heat of the coil element 9 is directly conducted to the thermosensitive body 11 without intervention of surrounding gas such as air. This makes it possible to perform temperature detection by the thermistor element 10 with high sensitivity and high responsiveness.
(65) The thermosensitive body contact portion 11S and the coil element 9 ideally come into direct contact with each other without intervention of a resin or another substance; however, the resin or the other substance may be interposed between the thermosensitive body contact portion 11S and the coil element 9 as long as the heat is directly conducted from the coil element 9 to the thermosensitive body 11.
(66) In the case where the resin R (
(67) To further improve heat conduction from the coil element 9 to the thermosensitive body 11 to enhance temperature measurement accuracy, thermal conductivity of the resin R is preferably high. In this respect, as the resin R, for example, an epoxy resin, silicone rubber, or heat conductive grease may be used. These resins each have thermal conductivity higher than the thermal conductivity of the resin used for the resin mold 3. In a case where the epoxy resin or the silicone rubber is used, the thermosensitive body 11 is fixed to the coil element 9 by adhesive force of the resin R. Even in a case where the resin R does not have adhesive force, the injection molding of the resin mold 3 is performed while the gap between the coil element 9 and the thermosensitive body 11 is filled with the resin R, which fixes the thermosensitive body 11 to the coil element 9.
(68) As described later, an uncured resin is supplied to the thermosensitive body 11 and the coil element 9 through the accommodation hole 21B and is cured, which forms the first resin reservoir 41 and the resin R.
(69) As illustrated in
(70) As illustrated in
(71) When the coil element 9 is received in an accommodation space between the paired grip claws 21E and the bottom part 21F while the thermosensitive body holder 21 in which the thermosensitive body 11 has been accommodated in the accommodation groove 21A and the accommodation hole 21B is pressed from above, front ends of the respective grip claws 21E are locked to a rear surface 9B of the coil element 9. At this time, the reinforcing portion 13 is retained in a state of being pressed against the coil element 9 by an inner wall (holding part) of the accommodation groove 21A.
(72) (Electric Wire Holder)
(73) As illustrated in
(74) The bank 22D is formed in a U shape (C shape) symmetrically with the bank 21D of the thermosensitive body holder 21, and the resin of the resin mold 3 is stored inside the bank 22D and the bank 21D.
(75) As illustrated in
(76) The electric wire holder 22 is disposed in series to the thermosensitive body holder 21 along the length direction D1 of the thermistor element 10.
(77) As illustrated in
(78) The lead wires 122 and the crimping members 123 are inserted from front openings of the respective insertion holes 22A. The lead wires 122 are drawn out from the rear end 22X of the electric wire holder 22 along the coil element 9 (
(79) As illustrated in
(80) As illustrated in
(81) As illustrated in
(82) The second resin reservoir 32 configures a part of the resin mold 3.
(83) If the thermosensitive body holder 21 and the electric wire holder 22 are disposed while the gap therebetween is shortened in the length direction D1 and the extension wires 121 are accommodated in a groove or the like provided in each of the holders 21 and 22, the extension wires 121 are not exposed. To more surely achieve insulation and mechanical holding of the extension wires 121 as compared with such a configuration, the thermosensitive body holder 21 and the electric wire holder 22 are separated in the length direction D1 to expose the parts of the extension wires 121, and the exposed parts (electric wire exposed parts 121A) of the respective extension wires 121 are enclosed with the second resin reservoir 32 in the present embodiment.
(84) The grip part 22B includes paired grip claws 22E (
(85) One of the grip claws 22E extends forward more than the other grip claw 22E illustrated on front side in
(86) As illustrated in
(87) As illustrated in
(88) The positioning part 231 and the partition wall 232 are integrally formed in an L shape in a planar view. As illustrated in
(89) Note that the positioning part 231 may be provided in the thermosensitive body holder 21 so as to protrude from the thermosensitive body holder 21 toward the electric wire holder 22.
(90) As illustrated in
(91) Before the second resin reservoir 32 (
(92) The positioning part 231 may be formed on each of both sides of the electric wire holder 22 in the width direction D2; however, to sufficiently secure flow of the resin when the second resin reservoir 32 is provided, one of the sides of the electric wire holder 22 in the width direction D2 is preferably released without being provided with the positioning part 231.
(93) The positioning part 231 is continuous with the one grip claw 22E that extends forward more than the other grip claw 22E, out of the grip claws 22E (
(94) As illustrated in
(95) To avoid interference between roots 121B of the respective extension wires 121 drawn out from the reinforcing portion 13 and the partition wall 232, a front end of the partition wall 232 is retracted rearward from the end surface 21S of the thermosensitive body holder 21.
(96) (3) Resin Mold
(97) As illustrated in
(98) As illustrated in
(99) The resin mold 3 is formed of an appropriate resin material such as polyphenylene sulfide (PPS) and nylon.
(100) The upper filling part 31 (
(101) As described above, the second resin reservoir 32 (
(102) The grip claw filling part 33 (
(103) The anchor part 34 (
(104) The anchor part 34 may be provided at an appropriate position (one or more positions) of the electric wire holder 22 without being limited to the rear end part of the electric wire holder 22. Alternatively, parts of the grip claws 21E of the thermosensitive body holder 21 may be omitted, and an anchor part similar to the anchor part 34 may be provided in the omitted parts.
(105) [Method of Manufacturing Temperature Detection Device]
(106) An example of a procedure of manufacturing the temperature detection device 1 is described below.
(107) First, as illustrated in
(108) As illustrated in
(109) Next, as illustrated in
(110) At this time, the lower end of the reinforcing portion 13 that protrudes downward from the accommodation groove 21A is pressed against the front surface 9A of the coil element 9 by the inner wall of the accommodation groove 21A as the holding part. Therefore, the thermosensitive body 11 is positioned and held with respect to the coil element 9 and the thermosensitive body holder 21.
(111) Subsequently, a resin with high thermal conductivity (e.g., epoxy resin) is supplied from the opening of the accommodation hole 21B toward the thermosensitive body contact portion 11S and the coil element 9, and is then cured (step S4).
(112) A predetermined amount of resin is supplied (potting) to form the first resin reservoir 41 in the thermosensitive body holder 21 as illustrated in
(113) The resin supplied inside the accommodation hole 21B is stored inside the accommodation hole 21B by the inner wall of the accommodation hole 21B without flowing out to the periphery. Therefore, the resin is stored and cured inside the accommodation hole 21B.
(114) The thermosensitive body contact portion 11S is enclosed and is fixed to the coil element 9 by the first resin reservoir 41. For example, even if a gap of a dimension corresponding to a difference between an outer diameter of the reinforcing portion 13 and an outer diameter of the thermosensitive body contact portion 11S exists between the thermosensitive body contact portion 11S and the front surface 9A of the coil element 9 before step S4, the gap is filled with a part of the resin (resin R in
(115) Steps S1 to S4 described above may be performed in an appropriate order without being limited to the above-described order as long as the thermistor element 10, the coil element 9, the thermosensitive body holder 21, and the electric wire holder 22 are assembled.
(116) Next, as illustrated in
(117) The molten resin is spread to a region inside the bank 21D, a region inside the bank 22D, the space between the holders 21 and 22, the space between the grip claws 21E and 21E, the space between the grip claws 22E and 22E, etc., and is cured so as to closely contact with the surface of each of the thermistor element 10, the holders 21 and 22, and the coil element 9. The thermistor element 10, the holders 21 and 22, and the coil element 9 are integrally fixed by the resin mold 3.
(118) The resin flowing into the upper part of the first resin reservoir 41 during the injection molding is cured while pressing the first resin reservoir 41 against the coil element 9. The thermosensitive body contact portion 11S is held on the coil element 9 in a state of being enclosed with the first resin reservoir 41 and further covered with the upper filling part 31.
(119) After the first resin reservoir 41 is provided in the thermosensitive body holder 21, the pressure of the injection-molded resin is applied to the thermosensitive body 11 through the first resin reservoir 41. As a result, the thermosensitive body 11 is moderately pressed and is brought sufficiently close to the front surface 9A of the coil element 9.
(120) The resin flowed into the space between the thermosensitive body holder 21 and the electric wire holder 22 sufficiently enters the gap between the front end of the partition wall 232 and the end surface 21S of the thermosensitive body holder 21, and configures the second resin reservoir 32 in a state of wholly enclosing the electric wire exposed parts 121A. The electric wire exposed parts 121A are insulated from the coil element 9 by the second resin reservoir 32, and the paired electric wire exposed parts 121A are also insulated from each other by the second resin reservoir 32. Further, the electric wire exposed parts 121A are mechanically held by the second resin reservoir 32, which prevents breakage of the roots of the respective electric wire exposed parts 121A, etc.
(121) The resin flowed into the space between the thermosensitive body holder 21 and the electric wire holder 22 is cured in a state of enclosing the partition wall 232 as well. As a result, the partition wall 232 functions as an anchor, which makes it possible to prevent the second resin reservoir 32 from being pulled out in the height direction D3 from the holders 21 and 22.
(122) The molded resin mold 3 is separated from the mold C to obtain the temperature detection device 1 illustrated in
(123) [Main Effects of Present Embodiment]
(124) As illustrated in
(125) In addition, since the thermosensitive body 11 is disposed sideways (in lying attitude) along the coil element 9, it is possible to further miniaturize the temperature detection device 1 in a thickness direction (height direction D3) as compared with a case where the thermosensitive body 11 is erected with respect to the coil element 9.
(126) Further, since the thermosensitive body contact portion 11S is in contact with the coil element 9 without a part of the holder 21, etc., heat is directly conducted from the coil element 9 to the thermosensitive body 11. This makes it possible to more accurately detect the temperature of the stator coil with high responsiveness, based on the heat of the coil element 9.
(127) In the present embodiment, the reinforcing portion 13 that is a part of the thermosensitive body 11 is held to the coil element 9 by the thermosensitive body holder 21, whereas the thermosensitive body contact portion 11S is not held by the thermosensitive body holder 21 or a member previously molded with a resin. In the present embodiment, the thermosensitive body contact portion 11S is accommodated inside the accommodation hole 21B that has a capacity with allowance with respect to the size of the thermosensitive body contact portion 11S, and the thermosensitive body contact portion 11S is held to the coil element 9 while being enclosed, without a gap, by the first resin reservoir 41 that is made of the resin supplied in a flowable state.
(128) This makes it possible to cope with fluctuation of the dimensions of each of the cover glass 11G and the thermosensitive body holder 21, and to surely bring the thermosensitive body contact portion 11S into contact with the front surface 9A of the coil element 9 while avoiding excess load from being applied to the thermosensitive body contact portion 11S. Further, since the thermosensitive body contact portion 11S is mechanically held while being enclosed with the first resin reservoir 41, it is possible to prevent breakage of the thermosensitive body contact portion 11S.
(129) In the present embodiment, the thermosensitive body 11 is disposed sideways along the front surface 9A of the coil element 9, and the extension wires 121 are drawn out from the thermosensitive body 11 along the front surface 9A of the coil element 9. Therefore, the extension wires 121 are located close to the coil element 9. However, even if the insulation film of the front surface 9A of the coil element 9 is worn due to vibrations, etc., and the conductor of the coil element 9 is exposed, it is possible to prevent leakage of the current from the coil element 9 to the extension wires 121 because the electric wire exposed parts 121A are enclosed with the second resin reservoir 32 and are accordingly insulated. In addition, since the partition wall 232 that separates the extension wires 121 and the coil element 9 from each other secures the distance therebetween, it is possible to more sufficiently prevent leakage of the current from the coil element 9 to the extension wires 121.
Modification of Present Invention
(130) In the above-described embodiment, the resin with high thermal conductivity that is different from the resin of the resin mold 3 is used for the first resin reservoir 41 (
(131) At this time, before the injection molding, a small amount of resin (e.g., epoxy resin) may be supplied from the opening of the accommodation hole 21B, which allows the resin R (
(132) To interpose the resin R between the thermosensitive body contact portion 11S and the coil element 9, the thermosensitive body contact portion 11S to which an uncured resin material has been previously adhered may be disposed on the front surface 9A of the coil element 9, instead of supply of the uncured resin material from the opening of the accommodation hole 21B in which the thermosensitive body contact portion 11S has been placed.
(133) In the present invention, after step S3 (
(134) The injection molding also makes it possible to cause the resin to spread inside the accommodation hole 21B without a gap, and to form the first resin reservoir including the resin R (
(135)
(136) The thermosensitive body holder 21 of the temperature detection device 8 includes an accommodation part 25 that accommodates the thermosensitive body contact portion 11S. The accommodation part 25 is formed in a notched C shape in a planar view, and is open toward the front end of the thermosensitive body holder 21.
(137) In the injection molding, the front end of the thermosensitive body holder 21 is abutted on a wall of an unillustrated mold, and the resin is filled in a space surrounded by the wall of the mold and an inner wall of the accommodation part 25. A first resin reservoir 51 is formed by the resin.
(138) Before the injection molding, the resin with high thermal conductivity may be supplied to the inside of the accommodation part 25 to interpose the resin between the thermosensitive body contact portion 11S and the front surface 9A of the coil element 9. Further, a tool may be abutted on the front end of the thermosensitive body holder 21 to perform potting with an epoxy resin or the like inside the accommodation part 25. In this case, the first resin reservoir 51 is formed by the potting resin.
(139) The present invention is applicable to a thermistor element 10 that does not include the ceramic reinforcing portion 13 (
(140) In this case, a part of the cover glass 11G is accommodated in the accommodation groove 21A, and is held and positioned. The holding and positioning are performed by the rear end part of the cover glass 11G in this example; however, the holding and positioning may be performed by the front end part of the cover glass 11G.
(141) The other part of the cover glass 11G is disposed inside the accommodation hole 21B. The part inside the accommodation hole 21B corresponds to the thermosensitive body contact portion 11S.
(142) The part of the cover glass 11G is accommodated in the accommodation groove 21A and the coil element 9 is gripped by the grip part 21C of the thermosensitive body holder 21 to assemble the thermosensitive body 11 to the coil element 9.
(143) In this state, potting with the resin with high thermal conductivity may be performed inside the accommodation hole 21B to provide the first resin reservoir 41 in the thermosensitive body holder 21. Alternatively, the first resin reservoir formed by the resin filled in the accommodation hole 21B in the injection molding may be provided in the thermosensitive body holder 21.
(144) In any case, it is possible to bring the thermosensitive body contact portion 11S into contact with the front surface 9A of the coil element 9 while enclosing the thermosensitive body contact portion 11S with the first resin reservoir.
(145) Other than the above description, the configurations described in the above-described embodiment may be selected or may be appropriately modified without departing from the scope of the present invention.
(146) When the holder 20 includes the thermosensitive body holder 21 and the electric wire holder 22 that are separated from each other as with the above-described embodiment, the thermistor element 10 and the coil element 9 are easily assembled to the holder 20, and flexibility is high in design that is performed in consideration of assembling easiness, etc.
(147) The thermosensitive body holder 21 and the electric wire holder 22, however, are not necessarily formed as members separated from each other. For example, it is possible to form the holder 20 integrally including the thermosensitive body holder 21 and the electric wire holder 22 by injection molding, as long as the thermosensitive body holder 21 and the electric wire holder 22 can be separated from the mold for injection molding in one direction by changing the extending direction of the accommodation hole 21B to a direction along the length direction D1.
(148) The resin mold 3 is not a requirement in the present invention. The resin may be dipped or applied to the structure in which the thermistor element 10, the holders 21 and 22, and the coil element 9 have been assembled, and the resin may be cured to form the first resin reservoir and the second resin reservoir, and to mutually fix the thermistor element 10, the holder 20, and the coil element 9.
REFERENCE SIGNS LIST
(149) 1, 8 Temperature detection device 2 Sensor assembly 3 Resin mold 9 Coil element 9A Front surface 9B Rear surface 10 Thermistor element (temperature sensor element) 11 Thermosensitive body 11A Front end 11B Rear end 11G Cover glass (cover material) 11S Thermosensitive body contact portion 12 Electric wire 13 Reinforcing portion 20 Holder 21 Thermosensitive body holder 21A Accommodation groove 21B Accommodation hole (accommodation part) 21C Grip part 21D Bank 21E Grip claw 21F Bottom part 21G Opening 21S End surface 22 Electric wire holder 22A Insertion hole 22B Grip part 22C Accommodation space 22D Bank 22E Grip claw 22F Bottom part 22G Space 22S End surface 22X Rear end 23 Protrusion 25 Accommodation part 31 Upper filling part 32 Second resin reservoir 33 Grip claw filling part 34 Anchor part 41 resin reservoir 91 Conductor 92 Film 110 Thermosensitive main body 121 Extension wire 121A Electric wire exposed part 121B Root 122 Lead wire 122A Core wire 122B Insulation coating 123 Crimping member 124 Connection portion 231 Positioning part 232 Partition wall 110 C Mold D1 Length direction D2 Width direction D3 Height direction R Resin