CIRCUIT ARRANGEMENT HAVING A SPACER ELEMENT, CONVERTER AND AIRCRAFT WITH SUCH A CIRCUIT ARRANGEMENT, AND METHOD FOR CURRENT MEASUREMENT

Abstract

A circuit arrangement is disclosed herein. The circuit arrangement includes a circuit carrier board, a power semiconductor arranged on the underside of the circuit carrier board, and a wiring carrier board arranged underneath the power semiconductor. The circuit arrangement further includes a metallic first spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor flows, wherein the first spacer element acts as a shunt through which current flows. The circuit arrangement further includes a voltage measuring unit, by which a voltage drop across the first spacer element, produced by the load current flow, may be determined. A converter having such a circuit arrangement, an aircraft having a converter, and a method for current measurement in power semiconductors are likewise specified.

Claims

1. A circuit arrangement comprising: a circuit carrier board; a power semiconductor arranged on an underside of the circuit carrier board; a wiring carrier board arranged underneath the power semiconductor; a first metallic spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor is configured to flow, wherein the first metallic spacer element is configured to act as a shunt through which current flows; and a voltage measuring unit configured to determine a voltage drop across the first metallic spacer element, wherein the voltage drop is produced by the load current flow.

2. The circuit arrangement of claim 1, wherein a height of the first metallic spacer element corresponds to a height of the power semiconductor.

3. The circuit arrangement of claim 1, wherein the circuit carrier board is a DCB-substrate board.

4. The circuit arrangement of claim 1, further comprising: electrical and/or electronic assemblies arranged on a top of the circuit carrier board.

5. The circuit arrangement of claim 4, further comprising: heat sinks arranged on the top of the circuit carrier board.

6. The circuit arrangement of claim 5, further comprising: a second metallic spacer element arranged between the circuit carrier board and the wiring carrier board, and via which the power semiconductor is configured to be activated and/or a current measurement is configured to be controlled.

7. A converter comprising: a circuit arrangement having: a circuit carrier board; a power semiconductor arranged on an underside of the circuit carrier board; a wiring carrier board arranged underneath the power semiconductor; a first metallic spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor is configured to flow, wherein the first metallic spacer element is configured to act as a shunt through which current flows; and a voltage measuring unit configured to determine a voltage drop across the first metallic spacer element, wherein the voltage drop is produced by the load current flow.

8. An aircraft comprising: a converter having a circuit arrangement comprising: a circuit carrier board; a power semiconductor arranged on an underside of the circuit carrier board; a wiring carrier board arranged underneath the power semiconductor; a first metallic spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor is configured to flow, wherein the first metallic spacer element is configured to act as a shunt through which current flows; and a voltage measuring unit configured to determine a voltage drop across the first metallic spacer element, wherein the voltage drop is produced by the load current flow; and an electric motor as an electric drive of the aircraft, wherein the electric motor is configured to be supplied with electrical energy by the converter.

9. The aircraft of claim 8, further comprising: a propeller configured to be driven by the electric motor.

10. A method for current measurement comprising: providing a circuit arrangement having a circuit carrier board, a power semiconductor arranged on an underside of the circuit carrier board, a wiring carrier board arranged underneath the power semiconductor; a first spacer element arranged between the circuit carrier board and the wiring carrier board, and a voltage measuring unit; passing a load current of the power semiconductor through the first spacer element; and determining, using the voltage measuring unit, the voltage drop across the first spacer element due to the load current.

11. The method of claim 10, further comprising: activating the power semiconductor by a second spacer element of the circuit arrangement, wherein the second spacer element is arranged between the circuit carrier board and the wiring carrier board of the circuit arrangement.

12. The method of claim 11, further comprising: controlling the current measurement by the second spacer element.

13. The method of claim 10, further comprising: controlling the current measurement by a second spacer element of the circuit arrangement, wherein the second spacer element is arranged between the circuit carrier board and the wiring carrier board of the circuit arrangement.

14. The circuit arrangement of claim 1, further comprising: heat sinks arranged on a top of the circuit carrier board.

15. The circuit arrangement of claim 1, further comprising: a second metallic spacer element arranged between the circuit carrier board and the wiring carrier board, and via which the power semiconductor is configured to be activated and/or a current measurement is configured to be controlled.

16. The aircraft of claim 8, wherein the circuit arrangement of the aircraft further comprises: electrical and/or electronic assemblies arranged on a top of the circuit carrier board.

17. The aircraft of claim 16, wherein the circuit arrangement of the aircraft further comprises: heat sinks arranged on the top of the circuit carrier board.

18. The aircraft of claim 17, wherein the circuit arrangement of the aircraft further comprises: a second metallic spacer element arranged between the circuit carrier board and the wiring carrier board, and via which the power semiconductor is configured to be activated and/or a current measurement is configured to be controlled.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Further special features and advantages of the disclosure are described in the following explanations of an exemplary embodiment using schematic drawings.

[0024] FIG. 1 depicts an example of a circuit arrangement with current measurement.

[0025] FIG. 2 depicts an example of a block diagram of a converter.

[0026] FIG. 3 depicts an example of an aircraft with an electric drive.

DETAILED DESCRIPTION

[0027] FIG. 1 shows a circuit arrangement with a circuit carrier board 1, on the underside of which an example of a power semiconductor 2 is arranged. For example, the circuit carrier board 1 is a DCB circuit board including an insulating ceramic carrier and copper coatings. In addition to the power semiconductor 2, a first spacer element 4 and a second spacer element 7 are arranged on the circuit carrier board 1. The two spacer elements 4, 7 have approximately the same overall height as the power semiconductor 2 and are contacted with a wiring board 3 arranged parallel to the circuit carrier board 1.

[0028] The load current of the power semiconductor 2 flows through the metallic first spacer element 4. The first spacer element 4 has a defined, known resistance and is used as a shunt for current measurement. To determine the load current, the voltage drop along the first spacer element 4 is determined using the voltage measuring unit 5, and the load current is determined from this. The first spacer element 4 is also referred to as a change-over because the current path changes over from the wiring carrier board 3 to the circuit carrier board 1.

[0029] Electrical or electronic assemblies 6, or simply heat sinks, are arranged on the side of the circuit carrier board 1 facing the power semiconductor 2.

[0030] The power semiconductor 2 may be activated and/or the current measurement may be controlled by the metallic second spacer element 7.

[0031] FIG. 2 shows a highly simplified block diagram of a converter 8 which has a DC link 10 and a power amplifier 9. The power amplifier 9 has a circuit arrangement according to FIG. 1.

[0032] FIG. 3 shows a highly simplified drawing of an electrically powered aircraft 11, (e.g., an airplane). The aircraft 11 has a propeller 13 driven by an electric motor 12. The electric motor 12 is supplied with electrical energy by the converter 8. The converter 8 is designed in accordance with the arrangements according to FIG. 1 and FIG. 2.

[0033] Although the disclosure has been illustrated and described in greater detail by the exemplary embodiments, the disclosure is not restricted by the examples disclosed, and other variations may be derived therefrom by the person skilled in the art without departing from the scope of protection of the disclosure.

[0034] It is to be understood that the elements and features recited in the appended claims may be combined in different ways to produce new claims that likewise fall within the scope of the present disclosure. Thus, whereas the dependent claims appended below depend from only a single independent or dependent claim, it is to be understood that these dependent claims may, alternatively, be made to depend in the alternative from any preceding or following claim, whether independent or dependent, and that such new combinations are to be understood as forming a part of the present specification.