Hyperspectral imaging system and method for providing a hyperspectral image of an area of a remote object
10897585 ยท 2021-01-19
Assignee
Inventors
Cpc classification
G01J3/0229
PHYSICS
H04N23/11
ELECTRICITY
G02B6/0076
PHYSICS
G01J3/0205
PHYSICS
G02B6/4215
PHYSICS
International classification
Abstract
A hyperspectral imaging system and method are described herein for providing a hyperspectral image of an area of a remote object. In one embodiment, the hyperspectral imaging system includes an optic, a stack of waveguide plates, a spectral filter array, a detector array, and a controller.
Claims
1. A hyperspectral imaging system comprising: an optic; first stacked waveguide plates, the first stacked waveguide plates comprising a first plurality of waveguide plates stacked on top of one another, each of the first plurality of waveguide plates being configured to disperse light that is output from the optic; a first slit located on the first stacked waveguide plates; a spectral filter array configured to receive the dispersed light from the first stacked waveguide plates and output multiple arrays of different wavelength filtered light; and a detector array configured to receive the multiple arrays of different wavelength filtered light from the spectral filter and output multiple arrays of electrical signals, wherein the first stacked waveguide plates are positioned between the optic and the spectral filter array, and wherein the spectral filter array is positioned between the first stacked waveguide plates and the detector array.
2. The hyperspectral imaging system of claim 1, further comprising a controller coupled to the detector array.
3. The hyperspectral imaging system of claim 1, further comprising: second stacked waveguide plates, the second stacked waveguide plates comprising a second plurality of waveguide plates stacked on top of one another; and a second slit located on the second stacked waveguide plates, wherein the second stacked waveguide plates are positioned adjacent to the first stacked waveguide plates, and wherein the second stacked waveguide plates are positioned between the optic and the spectral filter array, and wherein the spectral filter array is positioned between the second stacked waveguide plates and the detector array.
4. The hyperspectral imaging system of claim 1, wherein the first stacked waveguide plates have an entrance end, the entrance end having a coating located thereon, the coating configured to form the first slit.
5. The hyperspectral imaging system of claim 1, wherein each of the first plurality of waveguide plates has a rectangular shape.
6. The hyperspectral imaging system of claim 1, wherein each of the first plurality of waveguide plates has an entrance pupil, the entrance pupil forming a portion of the first slit.
7. The hyperspectral imaging system of claim 1, wherein each of the first plurality of waveguide plates is made from one of: (i) a transmissive glass material; (ii) a transmissive crystal material; and (iii) germanium.
8. The hyperspectral imaging system of claim 1, wherein the spectral filter array comprises a plurality of different wavelength passband filters, the passband filters being aligned with each of the first plurality of waveguide plates.
9. The hyperspectral imaging system of claim 8, wherein the plurality of different wavelength passband filters has a wavelength filter range from an ultraviolet band through a long wave infrared band.
10. The hyperspectral imaging system of claim 1, wherein the detector array comprises a plurality of rows of pixels, wherein each of the rows of pixels is aligned with each of the first plurality of waveguide plates.
11. The hyperspectral imaging system of claim 10, wherein each of the rows of pixels has a thickness that matches a thickness of one of the first plurality of waveguide plates.
12. A method for providing a hyperspectral image of an area of a remote object, the method comprising the steps of: providing a hyperspectral imaging system comprising: an optic; stacked waveguide plates, the stacked waveguide plates comprising a plurality of waveguide plates stacked on top of one another, the stacked waveguide plates having an entrance end and an exit end opposite the entrance end; a slit located on the entrance end of the stacked waveguide plates; a spectral filter array; a detector array, wherein the stacked waveguide plates are positioned between the optic and the spectral filter array, and wherein the spectral filter array is positioned between the stacked waveguide plates and the detector array; and a controller coupled to the detector array; positioning the hyperspectral imaging system with respect to the remote object system such that: the optic receives light associated with the area of the remote object, and outputs light associated with the area of the remote object; the slit receives at least a portion of the light output from the optic and the stacked waveguide plates output multiple dispersed lights at the exit end, wherein each of the plurality of waveguide plates outputs one of the multiple dispersed lights; the spectral filter array receives the multiple dispersed lights output from the exit end of the stacked waveguide plates, and outputs multiple arrays of different wavelength filtered lights, wherein each of the multiple dispersed lights is associated with one of the multiple arrays of different wavelength filtered lights; the detector array receives the multiple arrays of different wavelength filtered lights from the spectral filter array and outputs multiple arrays of electrical signals, wherein each of the multiple arrays of different wavelength filtered lights is associated with one of the multiple arrays of electrical signals; and, the controller receives the multiple arrays of electrical signals from the detector array, combines the multiple arrays of electrical signals to generate the hyperspectral image of the area of the remote object, and outputs the hyperspectral image of the area of the remote object.
13. The method of claim 12, further comprising repeatedly operating the hyperspectral imaging system to generate and output a plurality of hyperspectral images of a plurality of different areas of the remote object.
14. The method of claim 12, wherein the entrance end has a coating located thereon, the coating configured to form the slit.
15. The method of claim 12, wherein each of the plurality of waveguide plates has a rectangular shape.
16. The method of claim 12, wherein each of the plurality of waveguide plates has an entrance pupil, the entrance pupil forming a portion of the slit.
17. The method of claim 12, wherein each of the plurality of waveguide plates is configured to disperse the light output from the optic in only one dimension.
18. The method of claim 12, wherein the spectral filter array comprises a plurality of different wavelength passband filters, the passband filters being aligned with each of the waveguide plates.
19. The method of claim 12, wherein the detector array comprises a plurality of rows of pixels, wherein each of the rows of pixels is aligned with each of the waveguide plates.
20. A waveguide comprising: stacked waveguide plates, the stacked waveguide plates comprising a plurality of waveguide plates stacked on top of one another, each of the plurality of waveguide plates being configured to disperse light, the stacked waveguide plates each having an entrance end, a rectangular shape, and an entrance pupil located on the entrance end; and a coating on the entrance end of the stacked waveguide plates such that a continuous slit extends through the coating on the entrance end of each of the stacked waveguide plates, the slit comprising the entrance pupils.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) A more complete understanding of the present disclosure may be had by reference to the following detailed description when taken in conjunction with the accompanying drawings wherein:
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
DETAILED DESCRIPTION
(10) Referring to
(11) Referring to
(12) The hyperspectral imaging system 100 is operable such that the optic 110 directs the light 172 to the slit 124 in the stacked waveguide plates 120. Each waveguide plate 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 has a refractive index that reduces the angle of refraction of its specific received portion of light 172 and therein spreads the respective specific portion of light 174.sub.1, 174.sub.2, 174.sub.3, 174.sub.4, 174.sub.5, 174.sub.6, 174.sub.7, 174.sub.8, 174.sub.9, 174.sub.10 in only one direction (e.g., x-direction as shown in
(13) The Optic 110
(14) The optic 110 (e.g., a lens as shown in
(15) The Stacked Waveguide Plates 120
(16) An important feature of the present disclosure, is the multitude of waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 that are stacked on top of each other.
(17)
(18)
(19) The waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 could be made from a material that includes (for example): (i) transmissive glass materials such as fused silica, BK7 and others; (ii) crystal materials such as bariumfluoride, calciumfluoride, zinc selenide, zinc sulfide, and others; and (iii) germanium. The material chosen would typically be based on the manufacturability and the required transmission of the waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10. Each of the waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 can have their top surface, bottom surface and thin sides coated with a reflective coating to reflect more light to the imaging plane (i.e., the detector array 140). Further, the waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 could be manufactured like a fiber by starting with a much thicker waveguide that would be needed to be bonded together in a similar way that a fiber is and then the thicker waveguide would be drawn down to the size that is needed for the application. Alternatively, each of the waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 could be created by a coating process which includes coating multiple layers of material on top of one another to form each waveguide plate 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 of the stacked waveguide plates 120.
(20) The Spectral Filter Array 130
(21)
(22) The Detector Array 140
(23)
(24) The Controller 150
(25) The controller 150 is operable to (i) receive the multiple arrays of electrical signals 180.sub.1, 180.sub.2, 180.sub.3, 180.sub.4, 180.sub.5, 180.sub.6 from the detector array 140; (ii) process the multiple arrays of electrical signals 180.sub.1, 180.sub.2, 180.sub.3, 180.sub.4, 180.sub.5, 180.sub.6 to generate the hyperspectral image 102 of the area 103 of the remote object 104; and (iii) output the hyperspectral image 102 of the area 103 of the remote object 104. In one example, the controller 150 may comprise a processor 152 and a memory 154 that stores processor-executable instructions, wherein the processor 152 interfaces with the memory 154 to execute the processor-executable instructions, whereby the controller 150 is operable to (i) receive the multiple arrays of electrical signals 180.sub.1, 180.sub.2, 180.sub.3, 180.sub.4, 180.sub.5, 180.sub.6 from the detector array 140; (ii) process the multiple arrays of electrical signals 180.sub.1, 180.sub.2, 180.sub.3, 180.sub.4, 180.sub.5, 180.sub.6 to generate the hyperspectral image 102 of the area 103 of the remote object 104; and (iii) output the hyperspectral image 102 of the area 103 of the remote object 104.
(26) Referring to
(27) In operation, the hyperspectral imaging system 100 is positioned with respect to the remote object 104 such that the optic 110 is able to receive light 170a, 170b, 170c associated with an area 103 of the remote object 104, and output light 172a, 172b, 172c associated with the area 103 of the remote object 104. Each slit 124a, 124b, 124c located on the entrance ends 122a, 122b, 122c of the multiple stacked waveguide plates 602a, 602b, 602c respectively receives at least a portion of the light 172a, 172b, 172c which is output from the optic 110. Each exit end 126a, 126b, 126c of the stacked waveguide plates 602a, 602b, 602c respectively outputs a set 176a, 176b, 176c of multiple dispersed lights 176.sub.1, 176.sub.2, 176.sub.3, 176.sub.4, 176.sub.5, 176.sub.6, 176.sub.7, 176.sub.8, 176.sub.9, 176.sub.10 (e.g., one dispersed light 176 is output from each one of the waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10). The spectral filter array 130 receives the multiple sets 176a, 176b, 176c of dispersed lights 176.sub.1, 176.sub.2, 176.sub.3, 176.sub.4, 176.sub.5, 176.sub.6, 176.sub.7, 176.sub.8, 176.sub.9, 176.sub.10 output from the exit ends 126a, 126b, 126c of the stacked waveguide plates 602a, 602b, 602c, and outputs multiple sets 178a, 178b, 178c of multiple arrays of different wavelength filtered lights 178.sub.1, 178.sub.2, 178.sub.3, 178.sub.4, 178.sub.5, 178.sub.6 (e.g., 3 sets 178 (which correspond to 3 stacked waveguide plates 120) of 10 arrays (which correspond to the 10 waveguide plates) of 6 different filtered lights 178 are shownbut there can be any number of sets and any number of arrays and any number of different wavelength filtered lights 178). The detector array 140 receives the multiple sets 178a, 178b, 178c of the multiple arrays of different wavelength filtered lights 178.sub.1, 178.sub.2, 178.sub.3, 178.sub.4, 178.sub.5, 178.sub.6 from the spectral filter array 130, and outputs multiple sets 180a, 180b, 180c of arrays of electrical signals 180.sub.1, 180.sub.2, 180.sub.3, 180.sub.4, 180.sub.5, 180.sub.6 (e.g. 3 sets of 10 arrays of 6 electrical signals 180 corresponding to the 3 sets of 10 arrays of 6 wavelength filtered lights 178 are shownbut there can be any number of sets, any number of arrays and any number of electrical signals 180). The controller 150 receives the multiple sets 180a, 180b, 180c of multiple arrays of electrical signals 180.sub.1, 180.sub.2, 180.sub.3, 180.sub.4, 180.sub.5, 180.sub.6 from the detector array 140. The controller 150 then processes the received multiple sets 180a, 180b, 180c of multiple arrays of electrical signals 180.sub.1, 180.sub.2, 180.sub.3, 180.sub.4, 180.sub.5, 180.sub.6 to generate the hyperspectral image 102 of the area 103 of the remote object 104. Thereafter, the controller 150 outputs the hyperspectral image 102 of the area 103 of the remote object 104. The hyperspectral imaging system 100 can be repeatedly operated in the above described manner to obtain different hyperspectral images 102 of different areas 103 of the remote object 104.
(28) The hyperspectral imaging system 100 with multiple sets of stacked waveguide filters 602a, 602b, 602c used in parallel as shown enables multiple sets of spatial rows to be acquired at the same time or could be used in conjunction with different waveguide dimensions to allow for different spatial or spectral resolutions at the same time. For instance, the first stacked waveguide filter 602a could collect 400 nm-1000 nm in 20 nm band widths, while the second stacked waveguide filter 602b could collect 400 nm-1000 nm in 2 nm bands, and the third stacked waveguide filter 602c could collect 400 nm-1000 nm in 1 nm bands. Different wavelength ranges could also be used like e.g., 500 nm-600 nm in 2 nm bands while a different waveguide collects 600 nm-1000 nm in 10 nm bands. This could also be done for different spatial resolutions as follows: The first stacked waveguide filter 602a could collect 400 nm-1000 nm with individual waveguides width of a single pixel, say 5 m, while the second stacked waveguide filter 602b could collect 400 nm-1000 nm with individual waveguide widths of two pixels, 10 m, and the third stacked waveguide filter 602c could collect 400 nm-1000 nm with individual waveguide width of 4 pixels, 20 m. This would enable the ability to choose different spatial resolutions.
(29) The spectral filter array 130 can be attached directly to the exit ends 126a, 126b, 126c of the stacked waveguide plates 602a, 602b, 602c and/or to the detector array 140 (note: the same is true for the hyperspectral imaging system 100). The detector array 140 (e.g., a camera) may have quantum efficiencies that are uneven spectrally and to address this issue the spectral filter array 130 could be arranged such that these higher illuminated areas could be matched with the lower quantum efficiency wave lengths of the detector array 140 (e.g. a focal plane array). This would even out the spectral intensities on the detector array 140. Plus, this allows for a higher signal strength in the lower quantum efficiency areas (typically 380 nm-450 nm and 700 nm-1000 nm on Si chips) of the detector array 140. Further, because of the geometry of the stacked waveguide plates 602a, 602b, 602c, it is likely that the center of the stacked waveguide plates 602a, 602b, 602c will receive more light than the edges of the stacked waveguide plates 602a, 602b, 602c (e.g. uneven in the x-dimension). This being said, the different wavelength passband filters 132.sub.1, 132.sub.2, 132.sub.3, 132.sub.4, 132.sub.5, 132.sub.6 of spectral filter array 130 could be arranged such that the higher illuminated areas are matched with the lower camera quantum efficiencies (such as >700 nm or <450 nm on Si chips) of the detector array 140.
(30) In view of the foregoing discussions of the hyperspectral imaging systems 100 and 100, it can be appreciated that one or more stacked waveguide plates 120, 602a, 602b, 602c used in conjunction with the spectral filter array 130 and the detector array 140 can transform a slit image to a plurality of spectral slices of the area 103 of the remote object 104. The waveguides plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 can be different shapes, but are typically rectangular shape and can have different entrance apertures 124.sub.1, 124.sub.2, 124.sub.3, 124.sub.4, 124.sub.5, 124.sub.6, 124.sub.7, 124.sub.8, 124.sub.9, 124.sub.10 to match the particular pixel sizes of the detector array 140. If desired, the number of waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 can correspond to the number of rows 142.sub.1, 142.sub.2, 142.sub.3, 142.sub.4, 142.sub.5, 142.sub.6, 142.sub.7, 142.sub.8, 142.sub.9, 142.sub.10 of pixels in the detector array 140 in order to maximize spatial resolution. The stacked waveguide plates 120, 602a, 602b, 602c allow for a compact broadband spreading device.
(31) If desired, multiple stacked waveguide plates 602a, 602b, 602c with multiple slits 124a, 124b, 124c can be used to create multiple lines of scanning as discussed above with respect to the hyperspectral imaging system 100 (see
(32) The spectral filter array 130 can be attached directly to the stacked waveguide plate(s) 120, 602a, 602b, 602c or to the detector array 140. Alternatively, the spectral filter array 130, the stacked waveguide plate(s) 120, 602a, 602b, 602c, and the detector array 140 could be bonded together and have no air gap.
(33) If desired, an imaging lens could be placed between the stacked waveguide plate(s) 120, 602a, 602b, 602c and the detector array 140 to collimate the dispersed light 176.sub.1, 176.sub.2, 176.sub.3, 176.sub.4, 176.sub.5, 176.sub.6, 176.sub.7, 176.sub.8, 176.sub.9, 176.sub.10 output from the stacked waveguide plate(s) 120, 602a, 602b, 602c or to change the projected output of the dispersed light 176.sub.1, 176.sub.2, 176.sub.3, 176.sub.4, 176.sub.5, 176.sub.6, 176.sub.7, 176.sub.8, 176.sub.9, 176.sub.10 from the stacked waveguide plate(s) 120, 602a, 602b, 602c. Alternatively, an imaging lens (or yet another imaging lens) could be placed between the spectral filter array 130 and the detector array 140.
(34) If desired, the stacked waveguide plate(s) 120, 602a, 602b, 602c could have an entrance end 122, 122a, 122b, 122c coated to be reflective so that any light 174, 174a, 174b, 174c inside the waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 that is reflected back from the spectral filter array 130 could be recycled to end up at a different location on the spectral filter array 130 so that all the light 174, 174a, 174b, 174c ends up being received by the spectral filter array 130. That is, without a reflective coating, the light that is reflected by the spectral array filter 130 could propagate towards the top of the waveguide plates 120.sub.1, 120.sub.2, 120.sub.3, 120.sub.4, 120.sub.5, 120.sub.6, 120.sub.7, 120.sub.8, 120.sub.9, 120.sub.10 and be lost. Thus, a reflective coating will reflect that light back to the spectral filter array 130, thus limiting the loss of light and increasing the signal strength to improve performance.
(35) The present disclosure enables one to make inexpensive and compact hyperspectral imaging system 100 and 100. Plus, the present disclosure allows the hyperspectral imaging system 100 and 100 to function like both the scalable filter solution and the complex optical system that were described in the background section and as such essentially have the best features of both technologies. For instance, the hyperspectral imaging system 100 and 100 implements a filtered solution which has the advantage of size and cost, while functioning similar to a complex optical system (Offner/Dyson system) by collecting all the wavelengths at once to reduce processing time and errors in the imaging data. Further, the hyperspectral imaging system 100 and 100 also allows for a much higher spatial resolution system than is available from the traditional Offner/Dyson solution.
(36) The hyperspectral imaging system 100 and 100 also allows the collection of a slice of an image 102 of the remote object 104 with all of the wavelength information similar to a typical Offner or Dyson spectrometer. However, the size and cost of the hyperspectral imaging system 100 and 100 could be similar to a filter based solution described in the background section that has either very limited spatial/spectral resolution or needs to scan to get every wavelength. The hyperspectral imaging system 100 and 100 has the following advantages (for example): (i) reduced cost and size over spectrometer-based designs; and (ii) better image capture of a moving remote object 104 in e.g., an airborne application or machine vision application than the filter-based designs described in the background section.
(37) It will be appreciated that the various disclosed embodiments may involve particular features, elements or steps that are described in connection with that particular embodiment. It will also be appreciated that a particular feature, element or step, although described in relation to one particular embodiment, may be interchanged or combined with alternate embodiments in various non-illustrated combinations or permutations.
(38) It is also to be understood that, as used herein the terms the, a, or an, mean at least one, and should not be limited to only one unless explicitly indicated to the contrary. Thus, for example, reference to an opening includes examples having two or more such openings unless the context clearly indicates otherwise.
(39) Ranges can be expressed herein as from about one particular value, and/or to about another particular value. When such a range is expressed, examples include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent about, it will be understood that the particular value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
(40) All numerical values expressed herein are to be interpreted as including about, whether or not so stated, unless expressly indicated otherwise. It is further understood, however, that each numerical value recited is precisely contemplated as well, regardless of whether it is expressed as about that value. Thus, a dimension less than 10 mm and a dimension less than about 10 mm both include embodiments of a dimension less than about 10 mm as well as a dimension less than 10 mm.
(41) Unless otherwise expressly stated, it is in no way intended that any method set forth herein be construed as requiring that its steps be performed in a specific order. Accordingly, where a method claim does not actually recite an order to be followed by its steps or it is not otherwise specifically stated in the claims or descriptions that the steps are to be limited to a specific order, it is no way intended that any particular order be inferred.
(42) While various features, elements or steps of particular embodiments may be disclosed using the transitional phrase comprising, it is to be understood that alternative embodiments, including those that may be described using the transitional phrases consisting or consisting essentially of, are implied. Thus, for example, implied alternative embodiments to a method comprising A+B+C include embodiments where a method consists of A+B+C, and embodiments where a method consists essentially of A+B+C.
(43) Although multiple embodiments of the present disclosure have been illustrated in the accompanying Drawings and described in the foregoing Detailed Description, it should be understood that the disclosure is not limited to the disclosed embodiments, but is capable of numerous rearrangements, modifications and substitutions without departing from the disclosure as set forth and defined by the following claims.