INDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Abstract

A method of fabricating an inductor device includes preparing a conductive coil, connecting two terminals to one of two ends of the conductive coil, molding a pillar from a plurality of first composite material powders by a pressing process where each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin, placing the pillar in a surrounding space formed by the conductive coil, molding a cladding body from a plurality of second composite powders where the second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin, heating the cladding body, the conductive coil and the pillar cladded by the cladding body such that the plurality of first magnetic material powders are bonded by the cured first thermosetting resin and the plurality of second magnetic material powders are bonded by the cured second thermosetting resin.

Claims

1. A method of fabricating an inductor device, comprising the steps of: (a) preparing a conductive coil, wherein an outer surface of the conductive coil is overlaid by an insulating layer; (b) respectively electrically connecting two terminals to one of two ends of the conductive coil; (c) molding a pillar from a plurality of first composite material powders by a pressing process, wherein each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin; (d) placing the pillar in a surrounding space formed by the conductive coil; (e) molding a cladding body from a plurality of second composite powders, wherein each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin, the cladding body clads the conductive coil and the pillar, the two terminals are exposed outside the cladding body, a first weight ratio of the first thermosetting resin to the first composite material powders is less than a second weight ratio of the second thermosetting resin to the second composite material powders; and (f) heating the cladding body and the conductive coil and the pillar cladded by the cladding body to a curing temperature such that the plurality of first magnetic material powders are bonded by the cured first thermosetting resin and the plurality of second magnetic material powders are bonded by the cured second thermosetting resin.

2. The method of claim 1, wherein the first weight ratio is in a range of from 0 to 3.5%, and the second weight ratio is in a range of larger than 3.5%.

3. The method of claim 2, wherein the pillar has a molding density after being molded by the pressing process, and the molding density is equal to or greater than 4.9 g/cm.sup.3.

4. The method of claim 2, wherein a first outer diameter of a tail end of the pillar is smaller than an inner diameter of the surrounding space.

5. The method of claim 4, wherein the pillar comprises a flange formed at a top of the pillar, a second outer diameter of the flange is smaller than the inner diameter of the surrounding space.

6. The method of claim 2, between step (c) and step (d), further comprising the step of performing a sintering process for the pillar.

Description

BRIEF DESCRIPTION OF THE APPENDED DRAWINGS

[0017] FIG. 1 is an exploded view of some components and members of an inductor device according to a preferred embodiment of the invention.

[0018] FIG. 2 is a perspective view of the inductor device according to the preferred embodiment of the invention.

[0019] FIG. 3 is a cross sectional view of the inductor device taken along the A-A line of FIG. 2.

[0020] FIG. 4 is a cross-sectional view of a conductive coil, an essential component of the inductor device according to the preferred embodiment of the invention.

[0021] FIG. 5 is a cross-sectional view of a stage of an inductor device fabricated by a method according to a preferred embodiment of the invention.

[0022] FIG. 6 is a cross-sectional view of another stage of the inductor device fabricated by the method according to the preferred embodiment of the invention.

[0023] FIG. 7 is a cross-sectional view of another stage of the inductor device fabricated by the method according to the preferred embodiment of the invention.

[0024] FIG. 8 is a diagram showing the inductance value test results of three examples of the invention at different applied currents.

[0025] FIG. 9 is a diagram showing the inductance test results of two examples of powder-compacted inductors of the prior art at different applied currents.

[0026] FIG. 10 is a diagram showing the inductance test results of two examples of inductor devices using rigid magnetic pillars of another prior art at different applied currents.

DETAILED DESCRIPTION OF THE INVENTION

[0027] Referring to FIGS. 2 to 4, those drawings schematically illustrate an inductor device 1 according to the preferred embodiment of the invention. FIG. 1 is an exploded view schematically illustrating some components and members of the inductor device 1 according to the preferred embodiment of the invention. FIG. 2 is a perspective view schematically illustrating the inductor device 1 according to the preferred embodiment of the invention. FIG. 3 is a cross sectional view of the inductor device 1 taken along the A-A line of FIG. 2. FIG. 4 is a cross-sectional view of a conductive coil 10, an essential component of the inductor device 1 according to the preferred embodiment of the invention.

[0028] As shown in FIG. 1, FIG. 2 and FIG. 3, the inductor device 1 according to the preferred embodiment of the invention includes a conductive coil 10, an insulating layer 104, two terminals (12a, 12b), a pillar 14 and a cladding body 16.

[0029] As shown in FIG. 4, the insulating layer 104 is formed to overlay an outer surface 102 of the conductive coil 10.

[0030] The two terminals (12a, 12b) are respectively electrically connected to one of two ends (106a, 106b) of the conductive coil 10.

[0031] The pillar 14 is molded from a plurality of first composite material powders by a pressing process. Each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin.

[0032] In one embodiment, the first magnetic material powders can be carbonyl iron powders, iron-chromium-silicon alloy powders, iron-silicon alloy powders, amorphous iron-based alloy powders, iron-silicon alloy powders, iron-aluminum-silicon alloy powders, manganese-zinc ferrite powders, nickel-zinc ferrite powders, or other magnetic material powders.

[0033] The pillar 14 is placed in a surrounding space 108 formed by the conductive coil 10.

[0034] The cladding body 16 is molded from a plurality of second composite powders. Each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin.

[0035] In one embodiment, the second magnetic material powders can be carbonyl iron powders, iron-chromium-silicon alloy powders, iron-silicon alloy powders, amorphous iron-based alloy powders, iron-silicon alloy powders, iron-aluminum-silicon alloy powders, manganese-zinc ferrite powders, nickel-zinc ferrite powders, or other magnetic material powders. The material forming the second magnetic material powders can be the same as or different from the material forming the first magnetic material powders.

[0036] The cladding body 16 clads the conductive coil 10 and the pillar 14, and the two terminals (12a, 12b) are exposed outside the cladding body 16.

[0037] The cladding body 16, the conductive coil 10 and the pillar 14 cladded by the cladding body 16 are heated to a curing temperature such that the plurality of first magnetic material powders are bonded by the cured first thermosetting resin and the plurality of second magnetic material powders are bonded by the cured second thermosetting resin.

[0038] In particular, a first weight ratio of the first thermosetting resin to the first composite material powders is less than a second weight ratio of the second thermosetting resin to the second composite material powders. Thereby, the differences between the rigidity and thermal expansion coefficient of the pillar 14 and those of the part of the cladding body 16 adjacent to the pillar 14 will not be too different, so there are no cracks occurring the top surface of the inductor device 1 according to the invention near the pillar 14.

[0039] In one embodiment, the first weight ratio of the first thermosetting resin to the first composite material powders is in a range of from 0 to 3.5%. The second weight ratio of the second thermosetting resin to the second composite material powders is in a range of larger than 3.5%.

[0040] In one embodiment, the pillar 14 has a molding density after being molded by the pressing process, and the molding density is equal to or greater than 4.9 g/cm.sup.3.

[0041] In one embodiment, as shown in FIG. 1 and FIG. 3, a first outer diameter d1 of a tail end 142 of the pillar 14 is smaller than an inner diameter d2 of the surrounding space 108 formed by the conductive coil 10.

[0042] In one embodiment, also as shown in FIG. 1 and FIG. 3, the pillar 14 includes a flange 144 formed at a top 146 of the pillar 14. A second outer diameter d3 of the flange 144 is smaller than the inner diameter d2 of the surrounding space 108 formed by the conductive coil 10.

[0043] In one embodiment, the pillar 14, molded by the pressing process, first undergoes a sintering process, and then is placed in the surrounding space 108 formed by the conductive coil 10.

[0044] Referring to FIGS. 5 through 7, those drawings with cross sectional views schematically illustrate the method according to the preferred embodiment of the invention to fabricate the inductor device 1 as shown in FIG. 3.

[0045] Firstly, the method of the invention is to prepare a conductive coil 10, where an outer surface 102 of the conductive coil 10 is overlaid by an insulating layer 104, as shown in FIG. 4.

[0046] Next, the method of the invention is to respectively electrically connect two terminals (12a, 12b) to one of two ends (106a, 106b) of the conductive coil 10 as shown in FIG. 1. In one embodiment, the two terminals (12a, 12b) and other terminals can be integrally formed by punching a metal plate into a lead frame which includes these terminals and can be used for mass and automated production.

[0047] Then, as shown in FIG. 5, the method of the invention is to mold a pillar 14 from a plurality of first composite material powders by a pressing process by use of a first pressing equipment 20. Each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin.

[0048] In one embodiment, the first magnetic material powders can be carbonyl iron powders, iron-chromium-silicon alloy powders, iron-silicon alloy powders, amorphous iron-based alloy powders, iron-silicon alloy powders, iron-aluminum-silicon alloy powders, manganese-zinc ferrite powders, nickel-zinc ferrite powders, or other magnetic material powders.

[0049] Subsequently, as shown in FIG. 6, the method of the invention is to place the pillar 14 in a surrounding space 108 formed by the conductive coil 10.

[0050] Afterward, as shown in FIG. 7, the method of the invention is to mold a cladding body 16 from a plurality of second composite powders by use of a second pressing equipment 22. Each second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin. The cladding body 16 clads the conductive coil 10 and the pillar 14. The two terminals (12a, 12b) are exposed outside the cladding body 16.

[0051] In one embodiment, the second magnetic material powders can be carbonyl iron powders, iron-chromium-silicon alloy powders, iron-silicon alloy powders, amorphous iron-based alloy powders, iron-silicon alloy powders, iron-aluminum-silicon alloy powders, manganese-zinc ferrite powders, nickel-zinc ferrite powders, or other magnetic material powders. The material forming the second magnetic material powders can be the same as or different from the material forming the first magnetic material powders.

[0052] Finally, the method of the invention is to heat the cladding body 16, the conductive coil 10 and the pillar 14 cladded by the cladding body 16 to a curing temperature such that the plurality of first magnetic material powders are bonded by the cured first thermosetting resin and the plurality of second magnetic material powders are bonded by the cured second thermosetting resin. The two terminals (12a, 12b) can be bent to the bottom of the cladding body 16, as shown in FIG. 7.

[0053] In particular, a first weight ratio of the first thermosetting resin to the first composite material powders is less than a second weight ratio of the second thermosetting resin to the second composite material powders. Thereby, the differences between the rigidity and thermal expansion coefficient of the pillar 14 and those of the part of the cladding body 16 adjacent to the pillar 14 will not be very different, so there are no cracks occurring the top surface of the inductor device 1 according to the invention near the pillar 14. Therefore, the inductor device 1 fabricated by the method according to the invention has high yield rate.

[0054] In one embodiment, the first weight ratio of the first thermosetting resin to the first composite material powders is in a range of from 0 to 3.5%. The second weight ratio of the second thermosetting resin to the second composite material powders is in a range of larger than 3.5%.

[0055] In one embodiment, the pillar 14 has a molding density after being molded by the pressing process, and the molding density is equal to or greater than 4.9 g/cm.sup.3.

[0056] In one embodiment, also as shown in FIG. 1 and FIG. 3, a first outer diameter d1 of a tail end 142 of the pillar 14 is smaller than an inner diameter d2 of the surrounding space 108 formed by the conductive coil 10. Thereby, when the pillar 14 is placed in the surrounding space 108 formed by the conductive coil 10, the tail end 142 of the pillar 14 can be prevented from scratching the insulating layer 104.

[0057] In one embodiment, also as shown in FIG. 1 and FIG. 3, the pillar 14 includes a flange 144 formed at a top 146 of the pillar 14. A second outer diameter d3 of the flange 144 is smaller than the inner diameter d2 of the surrounding space 108 formed by the conductive coil 10. Thereby, when the pillar 14 is placed in the surrounding space 108 formed by the conductive coil 10, the flange 144 of the pillar 14 can lean on the top 101 of the conductive coil 10.

[0058] In one embodiment, the pillar 14, molded by the pressing process, first undergoes a sintering process, and then is placed in the surrounding space 108 formed by the conductive coil 10.

[0059] Please refer to FIG. 8, FIG. 9 and FIG. 10, FIG. 8 shows the inductance value test results of three embodiments of the invention (embodiment A, embodiment B and embodiment C) at different applied currents. In contrast, the inductance value test results of two examples of the prior art powder-compacted inductors (comparison A and comparison B) at different applied currents are shown in FIG. 9. Similarly, in contrast, the inductance test results of two examples of inductor devices of another prior art using rigid magnetic pillars (comparison C and comparison D) at different applied currents are shown in FIG. 10. The dimensions of the tested inductor devices are all 13 mm×13 mm×6 mm. The coil winding gauge of the tested inductor devices are all: wire diameter being 0.34 mm, the outer diameter of the cylinder being 4.6 mm, and the number of turns being 52.5 Ts. The material composition and electromagnetic properties of the above tested inductor devices are listed in Table 1.

TABLE-US-00001 TABLE 1 inductance value of tested inductor inductor material of cladding device device material of pillar body (μH) embodi- carbonyl iron powders, iron-chromium-silicon 151.35~164.20 ment average particle size: alloy powders, average A 5 μm, weight ratio particle size: 10 μm, of thermosetting weight ratio of resin <3.5 wt. % thermosetting resin: 4 wt. % embodi- iron-chromium- iron-chromium-silicon 162.00~167.00 ment silicon alloy powders, alloy powders, average B average particle size: particle size: 10 μm, 10 μm, weight ratio weight ratio of of thermosetting thermosetting resin: resin <3.5 wt. % 4 wt. % embodi- iron-chromium- iron-chromium-silicon 165.60~172.20 ment silicon alloy powders, alloy powders, average C average particle size: particle size: 10 μm, 24 μm, weight ratio weight ratio of of thermosetting thermosetting resin: resin <3.5 wt. % 4 wt. % compar- — iron-chromium-silicon 146.77~147.60 ison alloy powders, average A particle size: 10 μm, weight ratio of thermosetting resin: 4 wt. % compar- — amorphous iron-based 148.59~150.48 ison alloy powders, average B particle size: 15 μm, weight ratio of thermosetting resin: 4 wt. % compar- nickel-zinc alloy iron-chromium-silicon 184.80~197.90 ison alloy powders, average C particle size: 10 μm, weight ratio of thermosetting resin: 4 wt. % compar- manganese-zinc alloy iron-chromium-silicon 208.5 ison D alloy powders, average particle size: 10 μm, weight ratio of thermosetting resin: 4 wt. %

[0060] Regarding the cladding bodies of the above tested inductor devices, except that the inductance value of the powders forming the cladding body of comparison B is 148.59˜150.48 H, the inductance values of the powders forming the cladding bodies of the others are 146.77˜147.60 μH.

[0061] When inductor devices are in use, their inductance will decrease due to flowing through of current to cause the inductor devices to lose their functions, such as energy storage, filtering, and other functions. Therefore, when an inductor device is at a specific current (customer application current), a decrease rate in the inductance value of the inductor device is as little as possible. This specific current is generally called “saturation current”. In the above test of the inductor devices, the saturation current is set to 2.7˜2.8 A.

[0062] Regarding the decrease rate in inductance value of an inductor devices as the current flows through, it can be calculated. As an example, an inductor device has the inductance value of 148.3 pH as no current flows through, and the inductance value of 115.5 H as the saturation current is set to 2.8A. The decrease rate in inductance value of the aforesaid inductor device is calculated as the following:

the decrease rate in inductance value=(115.5−148.3)/148.3=−22.12%.

[0063] As the set saturation current is set to 2.7A, the calculated decrease rates (ΔL/L) in inductance values of the above tested inductor devices are listed in Table 2.

TABLE-US-00002 TABLE 2 tested inductor device decrease rate in inductance value embodiment A −13.24%~−13.97% embodiment B −20.98%~−22.75% embodiment C −20.47%~−21.33% comparison A −20.44%~−20.69% comparison B −16.71%~−16.86% comparison C −74.43%~−78.34% comparison D −73.38%

[0064] Taking comparison A and comparison B as the basis of comparison, the test results shown in FIGS. 8, 9 and 10 can confirm that the inductance values of the finished products of the embodiments of the invention (embodiment A, embodiment B and embodiment C), without current flowing through, is slightly increased and up to 1.17 times. The inductance value of the finished products of the examples (comparison C, comparison D) manufactured by using rigid magnetic pillars, without current flowing through, is significantly increased, and can be increased and up to 1.52 times. However, the inductance value of the inductor devices of the examples (comparison C, comparison D) manufactured by using rigid magnetic pillars has a significant decrease rate in inductance value, and the highest decrease among the inductance values of the inductor devices is 57.1%. In the embodiments of the invention (embodiment A, embodiment B and embodiment C), the decrease rates in inductance values are significantly improved, which can be improved by 7.2%. Obviously, the inductor device according to the invention has unexpected effects.

[0065] With detailed description of the invention above, it is clear that the inductor device according to the invention is made of two kinds of composite powders containing thermosetting resins in different weight ratios, and has excellent electromagnetic properties. The inductor device, fabricated according to the method of the invention, has high yield rate, and the quality risk of the inductor device in long-term use is low.

[0066] With the embodiment and explanations above, the features and spirits of the invention will be hopefully well described. Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teaching of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.