Angled slit design for computed tomographic imaging of electron beams
10888284 ยท 2021-01-12
Assignee
Inventors
Cpc classification
H01J37/244
ELECTRICITY
G01R19/0061
PHYSICS
International classification
Abstract
Computed tomographic method and apparatus includes an electron or ion beam having a beam axis, a refractory metal disk; at least one slit in the refractory metal disk that receive the beam, wherein the slit is at an angle to the beam axis; a beam entrance opening in the slit that allows the beam to enter; an effective beam exit opening in the slit that allow the beam to exit, wherein the beam effective exit opening is smaller than the beam entrance opening; and a system for moving the beam across the refractory metal disk, wherein the beam enters the slit through the beam entrance opening and exits the slit through the effective beam exit opening; and a computed tomographic device for measuring the beam that enters and exits the slit for analyzing the beam.
Claims
1. A computed tomographic apparatus, comprising: an electron or ion beam, wherein said beam has a beam axis; a refractory metal disk; a multiplicity of slits in said refractory metal disk that receive said beam, wherein said slits are at an angle to said beam axis; beam entrance openings in said slits that allow said beam to enter; effective beam exit openings in said slits that allow said beam to exit, wherein said beam effective exit openings are smaller than said beam entrance openings; a system for moving said beam across said refractory metal disk, wherein said beam enters said slits through said beam entrance openings and exits said slits through said effective beam exit openings; and a computed tomographic device for measuring said beam that enters and exits said slits for analyzing said beam.
2. The computed tomographic apparatus for analyzing an electron or ion beam of claim 1 wherein said beam has a beam diameter that is smaller than said beam entrance openings.
3. The computed tomographic apparatus for analyzing an electron or ion beam of claim 1 wherein said beam has a beam diameter that is larger than said beam entrance openings.
4. The computed tomographic apparatus for analyzing an electron or ion beam of claim 1 wherein said beam has a beam diameter that is the same size as said beam entrance openings.
5. The computed tomographic apparatus for analyzing an electron or ion beam of claim 1 wherein said multiplicity of slits in said refractory metal disk are radial slits.
6. The computed tomographic apparatus for analyzing an electron or ion beam of claim 1 wherein said multiplicity of slits in said refractory metal disk are annular slits.
7. A computed tomographic method, comprising the steps of: providing an electron or ion beam, wherein said beam has a beam axis; providing a refractory metal disk; providing a multiplicity of slits in said refractory metal disk that receive said beam, wherein said slits are at an angle to said beam axis; providing beam entrance openings in said slits that allow said beam to enter; providing effective beam exit openings in said slits that allow said beam to exit, wherein said beam effective exit openings are smaller than said beam entrance openings; moving said beam across said refractory metal disk, wherein said beam enters said slits through said beam entrance openings and exits said slits through said effective beam exit openings; and using a computed tomographic device for measuring said beam that enters and exits said slits for analyzing said beam.
8. The computed tomographic apparatus for analyzing an electron or ion beam of claim 7 wherein said beam has a beam diameter that is smaller than said beam entrance openings.
9. The computed tomographic apparatus for analyzing an electron or ion beam of claim 7 wherein said beam has a beam diameter that is larger than said beam entrance openings.
10. The computed tomographic apparatus for analyzing an electron or ion beam of claim 7 wherein said beam has a beam diameter that is the same size as said beam entrance openings.
11. The computed tomographic apparatus for analyzing an electron or ion beam of claim 7 wherein said multiplicity of slits in said refractory metal disk are radial slits.
12. The computed tomographic apparatus for analyzing an electron or ion beam of claim 7 wherein said multiplicity of slits in said refractory metal disk are annular slits.
13. A computed tomographic apparatus, comprising: an electron or ion beam, wherein said beam has a beam axis; a refractory metal disk; a multiplicity of radial slits in said refractory metal disk that receive said beam, wherein said radial slits are at an angle to said beam axis; beam entrance openings in said radial slits that allow said beam to enter; effective beam exit openings in said radial slits that allow said beam to exit, wherein said beam effective exit openings are smaller than said beam entrance openings; a system for moving said beam across said refractory metal disk, wherein said beam enters said radial slits through said beam entrance openings and exits said radial slits through said effective beam exit openings; and a computed tomographic device for measuring said beam that enters and exits said radial slits for analyzing said beam.
14. The computed tomographic apparatus for analyzing an electron or ion beam of claim 13 wherein said beam has a beam diameter that is smaller than said beam entrance openings.
15. The computed tomographic apparatus for analyzing an electron or ion beam of claim 13 wherein said beam has a beam diameter that is larger than said beam entrance openings.
16. The computed tomographic apparatus for analyzing an electron or ion beam of claim 13 wherein said beam has a beam diameter that is the same size as said beam entrance openings.
17. A computed tomographic apparatus, comprising: an electron or ion beam, wherein said beam has a beam axis; a refractory metal disk; at least one annular slit in said refractory metal disk that receives said beam, wherein said slit is at an angle to said beam; a beam entrance opening in said slit that allows said beam to enter; an effective beam exit opening in said slit that allow said beam to exit, wherein said beam effective exit opening is smaller than said beam entrance opening; a system for moving said beam on said refractory metal disk, wherein said beam enters said slit through said beam entrance opening and exits said slit through said effective beam exit opening; and a computed tomographic device for measuring said beam that enters and exits said slit for analyzing said beam.
18. The computed tomographic apparatus for analyzing an electron or ion beam of claim 17 wherein said beam has a beam diameter that is smaller than said beam entrance opening.
19. The computed tomographic apparatus for analyzing an electron or ion beam of claim 17 wherein said beam has a beam diameter that is larger than said beam entrance opening.
20. The computed tomographic apparatus for analyzing an electron or ion beam of claim 17 wherein said beam has a beam diameter that is the same size as said beam entrance opening.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The accompanying drawings, which are incorporated into and constitute a part of the specification, illustrate specific embodiments of the apparatus, systems, and methods and, together with the general description given above, and the detailed description of the specific embodiments, serve to explain the principles of the apparatus, systems, and methods.
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DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS
(11) Referring to the drawings, to the following detailed description, and to incorporated materials, detailed information about the apparatus, systems, and methods is provided including the description of specific embodiments. The detailed description serves to explain the principles of the apparatus, systems, and methods. The apparatus, systems, and methods are susceptible to modifications and alternative forms. The application is not limited to the particular forms disclosed. The application covers all modifications, equivalents, and alternatives falling within the spirit and scope of the apparatus, systems, and methods as defined by the claims.
(12) Referring now to the drawings and in particular to
(13) The system 100 for tomographic imaging of small diameter electron beams illustrates the condition where a small diameter beam 106 is passing over a slit 104 that is wider than the beam 106. The beam 106 passes entirely through the slit 104. This complicates the computed tomographic (CT) reconstruction and reduces the resolution of the computed results. Significant errors are generated if the slit 104 is more than 50% the width of the beam 106.
(14) A possible solution would be to provide finer slits 104. Producing finer slits in refractory metals would have an advantage in that smaller beams could be analyzed, and the spatial resolution of the CT reconstruction would be improved for all measured beams. However, there is a practical limitation on how fine a slit can be manufactured in a refractory metal disk, and slits smaller than 100 microns tend to be either cost prohibitive or not possible at all. Applicants' apparatus, systems, and methods solves this problem by manufacturing the slits of normal width, but oriented at an angle to the path of the electron beam that is being measured.
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(16) The inventors' new apparatus, systems, and methods allow the slit, e.g. 100 micron slit, to have an effectively smaller width when placed at an angle relative to the electron beam. This allows a 100 micron slit, for example, to analyze beams with diameters less than 100 microns. In principle, there is no lower limit on beam diameters that can be measured with Applicants' new apparatus, systems and methods.
(17) As illustrated in
(18) Referring now to the drawing and in particular to
(19) Reference Numeral 201center hole,
(20) Reference Numeral 202refractory metal disk, and
(21) Reference Numeral 204slits.
(22) The identification and description of the first embodiment 200 components illustrated in
(23) Referring now to
(24) As shown in
(25) Referring now to
(26)
(27) As illustrated in
(28) This method works as long as the beam diameter is several times larger than the slit that is approximately 100 microns wide. Newer machines are generating finer beam diameters. Producing finer slits in refractory metals would have an advantage in that these smaller beams could be analyzed, and the spatial resolution of the CT reconstruction would be improved for all measured beams. However, there is a practical limitation on how fine a slit can be manufactured in a refractory metal disk, and slits smaller than 100 microns tend to be either cost prohibitive or not possible at all. Applicants' apparatus, systems, and methods solves this problem by manufacturing the slits of normal width, but oriented at an angle to the direction of the electron beam that is being measured.
(29) Referring now to
(30) Reference Numeral 501center hole,
(31) Reference Numeral 502refractory metal disk, and
(32) Reference Numeral 504slits.
(33) This section provides background information related to the present disclosure which is not necessarily prior art.
(34) The identification and description of the second embodiment 500 components illustrated in
(35) Referring now to
(36) A portion of the refractory metal disk 602 is shown in
(37) Referring now to
(38) Reference Numeral 701center hole,
(39) Reference Numeral 702refractory metal disk, and
(40) Reference Numeral 704annular slit.
(41) The identification and description of the embodiment 700 components illustrated in
(42) Referring now to
(43) Reference Numeral 802refractory metal disk,
(44) Reference Numeral 804center hole,
(45) Reference Numeral 806first lower slit edge,
(46) Reference Numeral 808second lower slit edge,
(47) Reference Numeral 810first upper slit edge, and
(48) Reference Numeral 812second upper slit edge,
(49) The identification and description of the depiction 800 of the third embodiment components illustrated in
(50) Applicant's annular slit embodiment is complicated by the fact that (1) the annular slot is at an angle to centerline of the electron beam and (2) the slot itself is also at an angle to centerline of the electron beam. As illustrated in
(51) Referring now to
(52) Reference Numeral 902refractory metal disk,
(53) Reference Numeral 904center hole,
(54) Reference Numeral 906first lower slit edge,
(55) Reference Numeral 908second lower slit edge,
(56) Reference Numeral 910first upper slit edge, and
(57) Reference Numeral 912second upper slit edge,
(58) Reference Numeral 914refractory metal disk center line,
(59) Reference Numeral 916center line of the beam,
(60) Reference Numeral 918angle of beam to refractory disk center line,
(61) Reference Numeral 920angle of slit to beam center line,
(62) Reference Numeral 922width of slit, and
(63) Reference Numeral 924width of beam.
(64) The identification and description of the depiction 900 components illustrated in
(65) The refractory metal disk 902 includes a center hole 904, an annular slit that located at fixed annular distance from the center hole 904, and a beam with a width 924 that is at an angle to the refractory metal disk 902. This type of electron beam diagnostic system is shown in U.S. Pat. No. 9,105,448,755 for an electron beam diagnostic system using computed tomography and an annular sensor.
(66) The depiction 900 shows that the annular slot is at an angle 918 to centerline of the refractory metal disk 902. Further, the slot itself is at an angle 920 to the centerline 916 of the electron beam. The annular slit has a width 922. By inclining the annular slit at the angle 920 to the beam centerline 916 the effective slit width is reduced to less than what the slit width would be if the annular slit was parallel to the to the beam centerline 916.
(67) As illustrated in
(68) The inventors' apparatus, systems, and methods provide a new angled slit design whereby the slit walls are not oriented parallel to the electron beam being measured, but instead are oriented at an angle to the electron beam. The inventors' new angled slit utilizes the steps of providing an electron or ion beam, wherein the beam has a beam axis; providing a refractory metal disk; providing at least one slit in the refractory metal disk that receives the beam, wherein the slit is at an angle to the beam axis; providing a beam entrance opening in the slit that allows the beam to enter; providing an effective beam exit opening in the slit that allows the beam to exit, wherein the beam effective exit opening is smaller than the beam entrance opening; moving the beam across the refractory metal disk, wherein the beam enters the slit through the beam entrance opening and exits the slit through the effective beam exit opening; and using a computed tomographic device for measuring the beam that enters and exits the slit for analyzing the beam.
(69) Although the description above contains many details and specifics, these should not be construed as limiting the scope of the application but as merely providing illustrations of some of the presently preferred embodiments of the apparatus, systems, and methods. Other implementations, enhancements and variations can be made based on what is described and illustrated in this patent document. The features of the embodiments described herein may be combined in all possible combinations of methods, apparatus, modules, systems, and computer program products. Certain features that are described in this patent document in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination. Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. Moreover, the separation of various system components in the embodiments described above should not be understood as requiring such separation in all embodiments.
(70) Therefore, it will be appreciated that the scope of the present application fully encompasses other embodiments which may become obvious to those skilled in the art. In the claims, reference to an element in the singular is not intended to mean one and only one unless explicitly so stated, but rather one or more. All structural and functional equivalents to the elements of the above-described preferred embodiment that are known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the present claims. Moreover, it is not necessary for a device to address each and every problem sought to be solved by the present apparatus, systems, and methods, for it to be encompassed by the present claims. Furthermore, no element or component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the claims. No claim element herein is to be construed under the provisions of 35 U.S.C. 112, sixth paragraph, unless the element is expressly recited using the phrase means for.
(71) While the apparatus, systems, and methods may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and have been described in detail herein. However, it should be understood that the application is not intended to be limited to the particular forms disclosed. Rather, the application is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the application as defined by the following appended claims.