SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT

Abstract

The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.

Claims

1. A substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising: a first element, a second element, a magnetic locking unit, and a reduced pressure holding unit, wherein the first element and the second element are configured to hold the substrate between each other, wherein the magnetic locking unit is configured to lock the first element and the second element with each other, wherein the magnetic locking unit comprises a magnet control and at least a magnet, wherein the magnet is a permanent magnet and is arranged at one of the first element and the second element, wherein the magnet control is configured to control a magnetic force between the first element and the second element and to reverses the magnetic force of the permanent magnet to allow a repelling of the second element relative to the first element, and wherein the reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure.

2. A system according to claim 1, wherein the reduced pressure holding unit further comprises an energy supply for the pump, wherein the energy supply is arranged at the first element and/or the second element.

3. A system according to claim 1, wherein the reduced pressure holding unit further comprises a data transmitter to supply data to control the interior pressure, wherein the data transmitter is arranged at the first element and/or the second element.

4. A system according to claim 3, wherein the reduced pressure holding unit further comprises a sensor unit to provide data for the data transmitter, wherein the sensor unit is arranged at the first element and/or the second element.

5. A system according to claim 5, wherein the reduced pressure holding unit further comprises a valve unit to implement a control of the interior pressure in the substrate holding and locking system, wherein the valve unit is arranged at the first element and/or the second element.

6. A system according to claim 1, wherein the first element is a first contact ring and the second element is a second contact ring, both configured to hold one substrate between each other.

7. A system according to claim 1, wherein the first element is a substrate holder and the second element is a contact loop, both configured to hold one substrate between each other.

8. A system according to claim 8, further comprising an additional contact loop configured to hold an additional substrate between a reverse side of the substrate holder and the additional contact loop.

9. A system according to claim 1, wherein the magnetic locking unit comprises several permanent magnets distributed at the first element along the substrate to be held, and wherein the second element at least partially comprises a magnetic material.

10. (canceled)

11. A system according to claim 1, wherein the magnet control is configured to control the magnetic force between the first element and the second element by applying a voltage.

12. A system according to claim 8, further comprising a sealing unit arranged between the first element and the second element and configured to ensure a liquid-tight connection between the substrate, the first element and the second element, wherein the sealing unit comprises an inner sealing configured to ensure a liquid-tight connection between the substrate and the contact loop and an outer sealing configured to ensure a liquid-tight connection between the substrate holder and the contact loop.

13. A system according to claim 9, wherein the magnetic locking unit is configured to simultaneously lock both contact loops and the substrate holder with each other or to independently lock each contact loop and the substrate holder with each other.

14. A substrate holding and locking method for chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising the following steps: arranging a substrate between a first element and a second element, and locking the first element and the second element with each other by means of a magnetic locking unit, and reducing an interior pressure inside the substrate holding and locking system below atmospheric pressure by means of a pump of a reduced pressure holding unit, wherein the magnetic locking unit comprises a magnet control and at least a magnet, wherein the magnet is a permanent magnet and is arranged at one of the first element and the second element, wherein the magnet control is configured to control a magnetic force between the first element and the second element, and to reverse the magnetic force of the permanent magnet to allow a repelling of the second element relative to the first element.

15. System according to claim 1, wherein the pump is arranged at the first element and/or the second element to control the interior pressure in case the substrate holding and locking system is surrounded by the process fluid.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Exemplary embodiments of the invention will be described in the following with reference to the accompanying drawings:

[0055] FIG. 1 shows schematically and exemplarily an embodiment of a device for chemical and/or electrolytic surface treatment of the substrate in the process fluid.

[0056] FIG. 2 shows schematically and exemplarily an embodiment of a substrate holder holding two substrates.

[0057] FIG. 3 shows schematically and exemplarily another embodiment of a substrate holding and locking system for chemical and/or electrolytic surface treatment of the substrate in the process fluid according to the invention.

[0058] FIG. 4 shows schematically and exemplarily an embodiment of the second element.

[0059] FIG. 5 shows schematically and exemplarily a cross section of a portion of the substrate holder as shown in FIG. 2.

[0060] FIG. 6 shows schematically and exemplarily an even closer cross-section of a portion of the substrate holding and locking system according to the invention.

[0061] FIG. 7 shows schematically and exemplarily a further embodiment of a substrate holding and locking system for chemical and/or electrolytic surface treatment of the substrate in the process fluid according to the invention.

[0062] FIG. 8 shows different views of the further embodiment of a substrate holding and locking system of FIG. 7.

[0063] FIG. 9 shows schematically and exemplarily an exploded view of the embodiment of FIGS. 7 and 8.

[0064] FIG. 10 shows schematically and exemplarily an embodiment of a substrate holding and locking system for chemical and/or electrolytic surface treatment of the substrate in the process fluid according to the invention.

[0065] FIG. 11 shows schematically and exemplarily an embodiment of a substrate holding and locking system for chemical and/or electrolytic surface treatment of the substrate in the process fluid according to the invention.

[0066] FIG. 12 shows basic steps of an example of a distribution method for chemical and/or electrolytic surface treatment of a substrate in a process fluid according to the invention.

DETAILED DESCRIPTION OF EMBODIMENTS

[0067] FIG. 1 shows schematically and exemplarily an embodiment of a device 100 for chemical and/or electrolytic surface treatment of a substrate 30 in a process fluid. The device 100 for chemical and/or electrolytic surface treatment comprises a substrate holding and locking system 10 for chemical and/or electrolytic surface treatment of here two substrates 30 in a process fluid. The substrates 30 are hold by a substrate holder 20.

[0068] FIG. 2 shows schematically and exemplarily an embodiment of the substrate holder 20. It is configured to hold one or two substrates 30, one substrate 30 on each side of the substrate holder 20. The substrate holder 20 here holds rectangular substrates 30 with rounded corners and a size of e.g. 370×470 mm. Of course, the device 100 for chemical and/or electrolytic surface treatment may also be used with a substrate holder, which is configured to hold only one substrate 30 for single or dual side surface treatment in a preferably horizontal arrangement. The substrate 30 may be an essentially plate-shaped workpiece for the production of electric or electronic components, which is mechanically fixed in the substrate holder 20, and the surface of which to be treated is bathed in the process fluid as the treatment medium coming from a distribution body 21. In a special case, the substrate 30 may be a masked or unmasked conductor plate, a semi-conductor substrate, or a film substrate, or even any metal or metallized workpiece having an approximately planar surface.

[0069] Referring back to FIG. 1, the device 100 for chemical and/or electrolytic surface treatment further comprises a distribution body 21. The distribution body 21 produces targeted flow and current density patterns for the chemical and/or electrolytic surface treatment and is submerged in the process fluid (not shown). Opposite of each distribution body 21 is the substrate 30 that is attached to the substrate holder 20. The surface of the substrate 30 is wetted by the process fluid. The distribution body 21 comprises a plurality of distribution openings (not shown) directed of the substrate 30. The plurality of distribution openings comprise outlet openings to direct a flow of process fluid to the substrate 30 and/or backflow openings to receive a backflow of process fluid from the substrate 30. The substrate 30 acts as a counter electrode to the anode or, in other words, as a cathode. The distribution body 21 may advantageously comprise plastic, in particularly advantageous manner polypropylene, polyvinyl chloride, polyethylene, acrylic glass, i.e. polymethyl methacrylate, polytetrafluoroethylene, or another material that will not be decomposed by the process fluid.

[0070] The device 100 for chemical and/or electrolytic surface treatment further comprises anodes 22 that are each located on a side of one of the distribution bodies 21 opposite of the substrate 30 and are also bathed in the process fluid. Each anode 22 is attached in a rear region of the respective distribution body 21, in mechanical contact with, or spatially separated from, the distribution body 21 such that the electric current flow is carried out between the anode 22 and the substrate 30 acting as counter electrode within the process fluid. Depending on the surface treatment method used, the anode 22 may comprise a material that is insoluble in the process liquid, such as platinizized titanium, or otherwise a soluble material, such as for example, the metal to be galvanically separated.

[0071] FIGS. 3 to 6 show schematically and exemplarily embodiments of a substrate holding and locking system 10 for chemical and/or electrolytic surface treatment of the substrate 30 in the process fluid according to the invention. The substrate holding and locking system 10 comprises a first element A, a second element B, a reduced pressure holding unit (shown in FIGS. 10 and 11) and a magnetic locking unit 50. The first element A and the second element B are configured to hold the substrate 30 between each other. The first element A is here the substrate holder 20 and the second element B is a contact ring or contact loop 40. The substrate holding and locking system 10 here further comprises an additional contact loop 41 holding an additional substrate 30 between a reverse side of the substrate holder 20 and the additional contact loop 41 (see also a more detailed cross section in FIG. 5). The substrate holder 20 then holds two substrates 30, one on each side of the substrate holder 20.

[0072] The magnetic locking unit 50 is configured to lock the first element A, the substrate holder 20, and the second element B, the contact loop 40, with each other. The magnetic locking unit 50 comprises a magnet control (not shown) and several magnets 51 arranged at and distributed along the first element A, the substrate holder 20. The magnet control controls a magnetic force between the first element A, the substrate holder 20, and the second element B, the contact loop 40, to close, lock and hold the substrate 30 or to unlock, open and release the substrate 30 from the substrate holder 20. As a result, the substrate holding and locking system 10 according to the invention allows a very easy and flexible handling of the substrate 30 and the substrate holder 20.

[0073] The magnets 51 are here permanent magnets distributed along the substrate holder 20, while the contact loop 40 is made of a magnetic material. The magnet control controls the magnetic force between the first element A (substrate holder 20) and the second element B (contact loop 40) by applying a voltage.

[0074] FIG. 4 shows schematically and exemplarily an embodiment of the second element B, which is here the contact loop 40. The contact loop 40 comprises several arrays of magnetic contact fingers 42, which will be, in a closed configuration, in contact with the magnets 51 distributed along the substrate holder 20. The contact fingers 42 are here upright or standing. The contact loop 40 further comprises several arrays of contact fingers 43, which will be in contact with the substrate 30 and may therefore be planar or lying.

[0075] FIG. 5 shows schematically and exemplarily a cross section of a portion of the substrate holder 20 as shown in FIG. 2. So-called electrical conductor rods 27 at least partially extend along at least some of the four edges of the substrate holder 20. Here, a first conductor rod 27 extends along a longer side of the substrate holder 20 and meets in a corner a second conductor rod 27 extending along a shorter side of the substrate holder 20. A free end of the contact finger array 42 contacts the magnet 51 at the substrate holder 20, which contacts the electrical conductor rod 27.

[0076] FIG. 6 shows schematically and exemplarily an even closer cross-section of a portion of the substrate holding and locking system 10. It further comprises a sealing unit 44, 45. The sealing unit comprises an outer sealing 44, which sits between the contact loop 40 and the substrate holder 20 and ensures a liquid-tight connection between the first element A and the second element B. The substrate holding and locking system 10 further comprises an inner sealing 45, which sits between the contact loop 40 and the substrate 30 and ensures a liquid-tight connection between the substrate 30 and the second element B.

[0077] FIGS. 7 to 9 show schematically and exemplarily further embodiments of a substrate holding and locking system 10 for chemical and/or electrolytic surface treatment of the substrate 30 according to the invention. The substrate holding and locking system 10 comprises a first element A, a second element B, a reduced pressure holding unit (shown in FIGS. 10 and 11) and a magnetic locking unit 50.

[0078] The first element A and the second element B are here two contact rings 46 holding one substrate 30 between them. There is no substrate holder. The two contact rings 46 here hold a single substrate 20 for dual side surface treatment. The two contact rings 46 are therefore provided with a recess to make the substrate 20 accessible from both sides.

[0079] The magnetic locking unit 50 locks the first element A and the second element B with each other. The magnetic locking unit 50 comprises a magnet control (not shown) and several magnets 51 arranged at and distributed along the first element A, one of the two contact rings 46. The magnet control controls a magnetic force between the two contact rings 46 as first element A and second element B to close, lock and hold the substrate 30 or to unlock, open and release the substrate 30. As a result, the substrate locking system 10 according to the invention allows a very easy and flexible handling of the substrate 30.

[0080] The magnets 51 are here permanent magnets distributed along one of the contact rings 46, while the other of the contact rings 46 is made of a magnetic material. The magnet control controls the magnetic force between the contact rings 46 by applying a voltage.

[0081] FIGS. 10 and 11 show schematically and exemplarily embodiments of a substrate holding and locking system 10 for chemical and/or electrolytic surface treatment of the substrate 30 in the process fluid according to the invention. It is shown a substrate holder 20 as first element A, magnets 51 of the magnetic locking unit and a reduced pressure holding unit. The reduced pressure holding unit comprises a pump 80 to reduce an interior pressure inside the substrate holding and locking system 10 below atmospheric pressure and optionally to vacuum. The pump 80 is arranged at the substrate holder 20 or first element A.

[0082] An additional external reduced pressure system (not shown) is arranged outside the substrate holder 20. The additional external reduced pressure system can be used to reduce the pressure inside the substrate holder 20 and its components as shown by the arrows V in FIG. 10. The pump 80 can be used to control the already achieved reduced pressure inside the substrate holder 20 and its components as shown by the arrow V in FIG. 11. The pump 80 then controls the interior pressure inside the substrate holder 20 and its components also in case the substrate holding and locking system 10 is surrounded by the process fluid and/or in case of a passage between different handling modules. As a result, the pump 80 maintains the reduced pressure in the interior of the substrate holder 20 and its components independent of an external vacuum supply.

[0083] The reduced pressure holding unit further comprises an energy supply 60. The energy supply is e.g. a battery and arranged at the substrate holder 20 as first element A. The energy supply 60 provides energy to the substrate holder 20, as shown by the arrow E in FIG. 11. The energy supply 60 here provides energy to run the pump 80, to control the magnets 51 of the magnetic locking unit, and to provide energy to a data transmitter 70. The energy supply 60 thereby supplies energy to keep the magnetic locking unit closed and to maintain a reduced pressure in the interior of the substrate holder 20 and its components independent of an external energy supply. The energy supply 60 then provides energy also in case the substrate holding and locking system 10 is surrounded by the process fluid and/or in case of a passage between different handling modules. The external energy supply E by the additional external reduced pressure system is closed in FIG. 11 in contrast to FIG. 10.

[0084] The energy supply 60 reduced pressure holding unit further comprises a data transmitter 70 to supply data to monitor and/or control the interior pressure. The data transmitter 70 is arranged at the substrate holder 20 as first element A. The data transmitter 70 may be an (RFID) sender or receiver. The other part of the sender or receiver can be arranged outside the substrate holder 20 and its components and can be e.g. wirelessly connected to the data transmitter 70 arranged inside the substrate holder 20 and its components. The data transmitter 70 transmits data detected inside the substrate holder 20 and its components (e.g.

[0085] by means of a sensor unit) to a control unit outside the substrate holder 20.

[0086] FIG. 12 shows a schematic overview of steps of a method for chemical and/or electrolytic surface treatment of a substrate 30 in a process fluid. The method for chemical and/or electrolytic surface treatment comprises the following steps:

[0087] In a first step S1, arranging a substrate 30 between a first element A and a second element B.

[0088] In a second step S2, locking the first element A and the second element B with each other by means of a magnetic locking unit 50.

[0089] In a third step S3, reducing an interior pressure inside the substrate holding and locking system below atmospheric pressure by means of a pump of a reduced pressure holding unit.

[0090] The magnetic locking unit 50 comprises a magnet control and at least a magnet 51. The magnet 51 is arranged at one of the first element A and the second element B. The magnet control is configured to control a magnetic force between the first element A and the second element B.

[0091] The systems and methods are suitable, in particular, for the processing of structured semi-conductor substrates, conductor plates, and film substrates, but also for processing of the entire surface of planar metal and metallized substrates. System and method may also be used according to the invention for the production of large surface photoelectric panels for solar energy generation, or large-scale monitor panels.

[0092] It has to be noted that embodiments of the invention are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the system type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.

[0093] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed invention, from a study of the drawings, the disclosure, and the dependent claims.

[0094] In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.