BISMUTH-BASED MODIFIED ELECTRODE, MANUFACTURING METHOD THEREOF AND USE THEREOF
20240003025 ยท 2024-01-04
Assignee
Inventors
- Chia-Yu Lin (Tainan, TW)
- Chia-sheng Su (Tainan, TW)
- Chia-hui Yen (Tainan, TW)
- Shih-ching Huang (Tainan, TW)
- Wei-hsin Lu (Tainan, TW)
Cpc classification
C25B11/091
CHEMISTRY; METALLURGY
C25D11/00
CHEMISTRY; METALLURGY
C23C28/00
CHEMISTRY; METALLURGY
C25B11/052
CHEMISTRY; METALLURGY
International classification
C25B11/091
CHEMISTRY; METALLURGY
C23C18/16
CHEMISTRY; METALLURGY
C23C28/00
CHEMISTRY; METALLURGY
C25B11/052
CHEMISTRY; METALLURGY
Abstract
A modified electrode, manufacturing method thereof and use thereof are provided. The manufacturing method includes steps of soaking a copper substrate in a solution to obtain a BiOI/copper(I) iodide, BiOI/copper(I) iodide/metallic bismuth, and copper(I) iodide/metallic bismuth composite modified electrodes by electroless plating method. The obtained electrodes, designated as bismuth-based modified electrode, can be used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
Claims
1. A method of manufacturing a bismuth-based modified electrode, comprising a step of: immersing a copper substrate in an aqueous solution for 1 to 20 minutes to obtain the bismuth-based modified electrode; wherein the aqueous solution comprises a bismuth solution and KI solution with a concentration between 0.4 M and 3.0 M, and the bismuth solution comprises bismuth nitrate, bismuth carbonate, bismuth acetate, or bismuth citrate with a concentration between 20 mM and 40 mM.
2. The method according to claim 1, wherein the concentration of the KI solution is 0.4 M, and the bismuth solution comprises 40 mM bismuth nitrate, 20 mM bismuth carbonate, 40 mM bismuth acetate, or 40 mM bismuth citrate.
3. The method according to claim 1, wherein the aqueous solution further comprises an oxidizing agent and the oxidizing agent comprises p-benzoquinone with a concentration between 0.5 mM and 50 mM, hydrogen peroxide with a concentration between 1 mM and 10 mM, or 2,2-azino-bis(3-ethylbenzthiazoline-6-sulfonic acid) diammonium salt with a concentration between 1 mM and 10 mM.
4. The method according to claim 3, after the step of immersing the copper substrate in the aqueous solution, the method further comprises a step of: immersing the copper substrate in an electrolyte with a concentration between 0.1 M and 0.5 M and a pH between 7.0 and 9.2, and performing an electrochemical reduction at an applied potential between 0.5 V and 1.75 V vs. NHE for 30 minutes to 2 hours, wherein the electrolyte comprises phosphate, borate, or carbonate with a concentration between 0.1 M and 0.5 M.
5. The method according to claim 3, wherein the oxidizing agent comprises 50 mM p-benzoquinone, 5 mM hydrogen peroxide, or 5 mM 2,2-azino-bis(3-ethylbenzothiazoline-6-sulfonic acid) diammonium salt.
6. The method according to claim 4, wherein the copper substrate is immersed in 0.1 M borate buffer, pH 9.2.
7. The method according to claim 4, wherein the electrochemical reduction is performed at the applied potential at 1.745 V vs. NHE for 30 minutes.
8. The method according to claim 1, wherein the copper substrate is immersed in the aqueous solution for 4 minutes.
9. A bismuth-based modified electrode, prepared by a method according to claim 1, has a surface consisting of CuI and metallic bismuth, wherein CuI has characteristic diffraction peaks at diffraction angle (2) of 25.5 and 42.3, and metallic bismuth has characteristic diffraction peaks at diffraction angle (2) of 27.2, 37.9, and 39.6.
10. A bismuth-based modified electrode, prepared by a method according to claim 2, has a surface consisting of CuI and metallic bismuth, wherein CuI has characteristic diffraction peaks at diffraction angle (2) of 25.5 and 42.3, and metallic bismuth has characteristic diffraction peaks at diffraction angle (2) of 27.2, 37.9, and 39.6.
11. A bismuth-based modified electrode, prepared by a method according to claim 3, has a surface consisting of a combination of CuI and metallic bismuth, a combination of CuI and BiOI, or a combination of CuI, BiOI, and metallic bismuth, wherein CuI has characteristic diffraction peaks at diffraction angle (2) of 25.5 and 42.3, metallic bismuth has characteristic diffraction peaks at diffraction angle (2) of 27.2, 37.9, and 39.6, and BiOI has characteristic diffraction peaks at diffraction angle (2) of 31.7 and 45.4.
12. A bismuth-based modified electrode, prepared by a method according to claim 5, has a surface consisting of a combination of CuI and metallic bismuth, a combination of CuI and BiOI, or a combination of CuI, BiOI, and metallic bismuth, wherein CuI has characteristic diffraction peaks at diffraction angle (2) of 25.5 and 42.3, metallic bismuth has characteristic diffraction peaks at diffraction angle (2) of 27.2, 37.9, and 39.6, and BiOI has characteristic diffraction peaks at diffraction angle (2) of 31.7 and 45.4.
13. A bismuth-based modified electrode, prepared by a method according to claim 4, has a surface consisting of t a nanosheet-structured metallic bismuth with characteristic diffraction peaks at diffraction angle (2) of 27.2, 37.9, and 39.6.
14. A bismuth-based modified electrode, prepared by a method according to claim 6, has a surface of nanosheet-structured metallic bismuth, with characteristic diffraction peaks at diffraction angle (2) of 27.2, 37.9, and 39.6.
15. A bismuth-based modified electrode, prepared by a method according to claim 7, has a surface consisting of a nanosheet-structured metallic bismuth with characteristic diffraction peaks at diffraction angle (2) of 27.2, 37.9, and 39.6.
16. A use of a bismuth-based modified electrode according to claim 9, wherein the bismuth-based modified electrode is used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
17. A use of a bismuth-based modified electrode according to claim 10, wherein the bismuth-based modified electrode is used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
18. A use of a bismuth-based modified electrode according to claim 11, wherein the bismuth-based modified electrode is used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
19. A use of a bismuth-based modified electrode according to claim 12, wherein the bismuth-based modified electrode is used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
20. A use of a bismuth-based modified electrode according to claim 13, wherein the bismuth-based modified electrode is used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
21. A use of a bismuth-based modified electrode according to claim 14, wherein the bismuth-based modified electrode is used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
22. A use of a bismuth-based modified electrode according to claim 15, wherein the bismuth-based modified electrode is used for the electrohydrodimerization of acrylonitrile to synthesize adiponitrile.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to explain the technical solutions of the present disclosure more clearly, the following will briefly introduce the drawings used in the description of the embodiments or the related art. Obviously, the drawings described below are only some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without making creative efforts.
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DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0062] The following describes the embodiment of the present disclosure through specific examples. Those skilled in the field can understand other advantages and effects of the present disclosure from the content disclosed in the present specification. However, the exemplary embodiments disclosed in the present disclosure are merely for illustrative purposes and should not be construed as a limiting the scope of the present disclosure. In other words, the present disclosure can also be implemented or applied by other different specific embodiments, and various details in the present specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present disclosure.
[0063] Unless otherwise described herein, the singular forms a and the used in the specification and the appended claims of the present disclosure comprise plural entities. Unless otherwise described herein, the term or used in the specification and the appended claims of the present disclosure comprises the meaning of and/or.
Preparation Example 1: Preparation of a First Electrode
[0064] The copper substrate is immersed in an electroplating solution containing 0.1 M Pb(NO.sub.3).sub.2 and 0.1 M H.sub.3BO.sub.3, a current density of 20 mA/cm.sup.2 is applied, and electrodeposition is performed for 75 seconds to obtain an electroplated lead film modified electrode (i.e., a Pb/Cu electrode). The electroplated lead film modified electrode is immersed in a mixed solution containing 0.5 M sodium phosphate (pH 8) and 30 mM tetrabutylammonium phosphate and the reduction pretreatment is performed by cyclic voltammetry to remove the lead oxide film on the surface of the electroplated lead film modified electrode, and obtain a reduction pretreated lead film modified electrode (i.e., a first electrode).
[0065] The surface morphologies of the Pb/Cu electrode and the first electrode are analyzed by a scanning electron microscope (SEM) (Hitachi SU-8010). Referring to
[0066] The crystal planes of the Pb/Cu electrode and the first electrode are analyzed by X-ray diffraction (XRD). Referring to
Preparation Example 2: Preparation of a Second Electrode
[0067] The copper substrate is immersed in an electroplating solution containing 30 mM Bi(NO.sub.3).sub.3 and 1 M HNO.sub.3, a current density of 5 mA/cm.sup.2 is applied, and electrodeposited is performed for 300 seconds to obtain an electroplated bismuth film modified electrode (i.e., a second electrode).
[0068] The surface morphology of the second electrode is analyzed by SEM (Hitachi SU-8010) to analyze. Referring to
[0069] The crystal plane of the second electrode is analyzed by XRD (RIGAKU, UltimaIV). Referring to
Preparation Example 3: Preparation of a Third Electrode by the Electrodeposition Method
[0070] The copper substrate is immersed in an electroplating solution containing 40 mM Bi(NO.sub.3).sub.3, 0.4 M KI, and 50 mM p-benzoquinone, and electrodeposition is performed at a constant potential of 0.1 V vs. Ag/AgCl for 4 minutes to obtain a BiOI modified electrode with a nanosheet structure (i.e., a BiOI.sub.EP/Cu electrode). The BiOI modified electrode is immersed in 0.1 M boric acid buffer (pH 9.2) and subjected to a electrochemical reduction process at an applied potential of 1.745 V vs. NHE for 30 minutes to obtain a bismuth-based modified electrode with a nanosheet structure (i.e., a third electrode).
[0071] The surface morphology of the BiOI.sub.EP/Cu electrode and the third electrode are analyzed by SEM (Hitachi SU-8010). Referring to
[0072] The crystal planes of the BiOI.sub.EP/Cu electrode and the third electrode are analyzed by XRD. Referring to
Preparation Example 4: Preparation of a Fourth Electrode by Electroless Plating Method
[0073] The copper substrate is immersed in an aqueous solution containing 40 mM Bi(NO.sub.3).sub.3, 0.4 M KI, and 50 mM p-benzoquinone for 4 minutes to obtain a composite modified electrode containing BiOI and CuI with a nanosheet structure (i.e., the fourth electrode).
[0074] The surface morphology of the fourth electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0075] The crystal plane of the fourth electrode is analyzed by XRD. Referring to
TABLE-US-00001 TABLE 1 Chemical composition of the fourth electrode Content (%) metallic copper CuI BiOI bismuth fourth 69.4 20.4 10.2 0 electrode
Preparation Example 5: Preparation of a Fifth Electrode by Electrochemical Reduction Method
[0076] The fourth electrode is immersed in a 0.1 M boric acid buffer (pH 9.2), and a reduction reaction is performed at an applied potential of 1.745 V vs. NHE for 30 minutes to obtain a bismuth-based modified electrode containing metallic bismuth with a nano-sheet structure (i.e., the fifth electrode).
[0077] The surface morphology of the fifth electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0078] The crystal plane of the fifth electrode is analyzed by XRD. Referring to
Preparation Example 6: Preparation of a Sixth Electrode by Electroless Plating Method
[0079] The copper substrate is immersed in an aqueous solution containing 20 mM bismuth carbonate (Bi.sub.2O.sub.2(CO.sub.3)), 0.4 M KI, and 50 mM p-benzoquinone for 4 minutes to obtain a bismuth-based modified electrode with a nanosheet structure and (i.e., the sixth electrode). The composition on the surface of the sixth electrode comprises BiOI and CuI.
[0080] The surface morphology of the sixth electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0081] The crystal plane of the sixth electrode is analyzed by XRD. Referring to
Preparation Example 7: Preparation of a Seventh Electrode by Electroless Plating Method
[0082] The copper substrate is immersed in an aqueous solution containing 40 mM bismuth acetate (Bi(CH.sub.3COO).sub.3), 0.4 M KI, and 50 mM p-benzoquinone for 4 minutes to obtain a bismuth-based modified electrode with a nanosheet structure (i.e., the seventh electrode). The composition on the surface of the seventh electrode comprises BiOI and CuI.
[0083] The surface morphology of the seventh electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0084] The crystal plane of the seventh electrode is analyzed by XRD. Referring to
Preparation Example 8: Preparation of an Eighth Electrode by Electroless Plating Method
[0085] The copper substrate is immersed in an aqueous solution containing 40 mM bismuth citrate (C.sub.6HSBiO.sub.7), 0.4 M KI, and 50 mM p-benzoquinone for 4 minutes to obtain a bismuth-based modified electrode with a nanosheet structure (i.e., the eighth electrode). The composition on the surface of eighth electrode comprises BiOI and CuI.
[0086] The surface morphology of the eighth electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0087] The crystal plane of the eighth electrode is analyzed by XRD. Referring to
Preparation Example 9: Preparation of a Ninth Electrode by Electroless Plating Method
[0088] The copper substrate is immersed in an aqueous solution containing 40 mM Bi(NO.sub.3).sub.3, 0.4 M KI, and 5 mM H.sub.2O.sub.2 for 4 minutes to obtain a bismuth-based modified electrode containing CuI and metallic bismuth (i.e., the ninth electrode).
[0089] The surface morphology of the ninth electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0090] The crystal plane of the ninth electrode is analyzed by XRD. Referring to
Preparation Example 10: Preparation of a Tenth Electrode by Electroless Plating Method
[0091] The copper substrate is immersed in an aqueous solution containing 40 mM Bi(NO.sub.3).sub.3, 0.4 M KI, and 5 mM 2,2-azino-bis(3-ethylbenzthiazoline-6-sulfonic acid) diammonium salt (ABTS) in an aqueous solution for 4 minutes to obtain a bismuth-based modified electrode with a sheet structure containing CuI and metallic bismuth (i.e., the tenth electrode).
[0092] The surface morphology of the tenth electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0093] The crystal plane of the tenth electrode is analyzed by XRD. Referring to
Preparation Example 11: Preparation of an Eleventh Electrode by Electroless Plating Method
[0094] The copper substrate is immersed in an aqueous solution containing 40 mM Bi(NO.sub.3).sub.3 and 0.4 M KI for 4 minutes to obtain a bismuth-based modified electrode with a bulk structure (i.e., the eleventh electrode). The composition on the surface of the eleventh electrode comprises CuI and metallic bismuth.
[0095] The surface morphology of the eleventh electrode is analyzed by SEM (Hitachi SU-8010). Referring to
[0096] The crystal plane of the eleventh electrode is analyzed by XRD. Referring to
TABLE-US-00002 TABLE 2 The chemical composition of the eleventh electrode Content (%) metallic copper CuI BiOI bismuth eleventh 50.0 34.8 0 15.3 electrode
Preparation Example 12: Preparation of a Twelfth Electrode, a Thirteenth Electrode, a Fourteenth Electrode, a Fifteenth Electrode, and a Sixteenth Electrode by Electroless Plating Method
[0097] The copper substrate is immersed in an aqueous solution containing 40 mM Bi(NO.sub.3).sub.3, 0.4 M KI, and p-benzoquinone with various concentrations, including 0.5 mM, 5 mM, 10 mM, 20 mM, and 40 mM for 4 minutes to obtain a bismuth-based modified electrodes with particles and a sheet structure (i.e., the twelfth electrode, the thirteenth electrode, the fourteenth electrode, the fifteenth electrode, and the sixteenth electrode, respectively).
[0098] The surface morphology of the twelfth electrode, the thirteenth electrode, the fourteenth electrode, the fifteenth electrode, and the sixteenth electrode are analyzed by SEM (Hitachi SU-8010). Referring to
[0099] The crystal planes of the twelfth electrode, the thirteenth electrode, the fourteenth electrode, the fifteenth electrode, and the sixteenth electrode are analyzed by XRD. Referring to
TABLE-US-00003 TABLE 3 Content percentages of CuI, BiOI, and metallic bismuth deposited on the twelfth electrode, the thirteenth electrode, the fourteenth electrode, the fifteenth electrode, and the sixteenth electrode Content (%) metallic copper CuI BiOI bismuth twelfth 49.2 41.4 0 9.4 electrode thirteenth 50.6 43.9 0 5.5 electrode fourteenth 61.9 35.7 1.3 1.1 electrode fifteenth 71.8 22.8 5.4 0 electrode sixteenth 70.0 19.7 10.3 0 electrode
Preparation Example 13: Preparation of a Seventeenth Electrode, an Eighteenth Electrode, a Nineteenth Electrode, and a Twentieth Electrode by Electroless Plating
[0100] The copper substrate is immersed in an aqueous solution containing 40 mM Bi(NO.sub.3).sub.3, 0.4 M KI, and 50 mM p-benzoquinone for 1 minute, 2 minutes, 10 minutes, and 20 minutes to obtain a bismuth-based modified electrode with a nanosheet structure (i.e., the seventeenth electrode, the eighteenth electrode, the nineteenth electrode, and the twentieth electrode, respectively). The compositions on the surfaces of the seventeenth electrode, the eighteenth electrode, the nineteenth electrode, and the twentieth electrode comprise BiOI and CuI.
[0101] The surface morphologies of the seventeenth electrode, the eighteenth electrode, the nineteenth electrode, and the twentieth electrode are analyzed by SEM (Hitachi SU-8010). Referring to
[0102] The crystal planes of the seventeenth electrode, the eighteenth electrode, the nineteenth electrode, and the twentieth electrode are analyzed by XRD. Referring to
Example 1: Characterization of the Electrocatalytic Performance of the First Electrode, the Second Electrode, the Third Electrode, and the Fifth Electrode
[0103] The first electrode, the second electrode, and the third electrode are respectively immersed in a 0.5 M sodium phosphate solution (pH 8) containing 30 mM tetrabutylammonium phosphate and 0.6 M acrylonitrile and subjected to constant potential electrolysis for 2 hours. The products are analyzed to characterize the electrocatalytic performance. Referring to
[0104] From the above, it can be seen that the third electrode which exhibits the highest faradaic efficiency under may be obtained by the electrolysis reaction at the applied potential of 1.6 V vs. NHE for 2 hours. Accordingly, the electrocatalytic performances of the first electrode, the second electrode, the third electrode, and the fifth electrode are further compared at the applied potential of 1.6 V vs. NHE. The first electrode, the second electrode, the third electrode, and the fifth electrode are respectively immersed in a 0.5 M sodium phosphate solution (pH 8) containing 30 mM tetrabutylammonium phosphate and 0.6 M acrylonitrile, and subjected to constant potential electrolysis for 2 hours. The products are then analyzed. Referring to
Example 2: Characterization of the Electrocatalytic Performance of the First Electrode and the Fourth Electrode
[0105] The electrocatalytic performance of the first electrode and the fourth are characterized at the potential of 1.6 V vs. NHE. The first electrode and the fourth electrode are respectively immersed in a 0.5 M sodium phosphate solution (pH 8) containing 30 mM tetrabutylammonium phosphate and 0.6 M acrylonitrile and subjected to constant potential electrolysis for 2 hours. The products are analyzed to characterize the electrocatalytic performance. Referring to
Example 3: Characterization of the Electrocatalytic Performance of the Fourth Electrode, the Ninth Electrode, and the Tenth Electrode
[0106] The electrocatalytic performances of the fourth electrode, the ninth electrode, and the tenth electrode are characterized at the potential of 1.6 V vs. NHE. The fourth electrode, the ninth electrode, and the tenth electrode are respectively immersed in a 0.5 M sodium phosphate solution (pH 8) containing 30 mM tetrabutylammonium phosphate and 0.6 M acrylonitrile and subjected to constant potential electrolysis for 2 hours. The products are analyzed to characterized the electrocatalytic performance. Referring to
[0107] The above provides a detailed introduction to the implementation of the present disclosure, and specific examples are used herein to describe the principles and implementations of the present disclosure, and the description of the implementations above is merely used to help understand the present disclosure. Moreover, for those skilled in the art, according to a concept of the present disclosure, there will be changes in the specific embodiment and the scope of present disclosure. In summary, the content of the specification should not be construed as a limitation to the present disclosure.