VIBRATION ATTENUATION VIA TAILORED METASTRUCTURES
20240003403 ยท 2024-01-04
Inventors
- Fabio Semperlotti (West Lafayette, IN, US)
- Mehdi Jokar (Riverside, RI, US)
- Siddharth Nair (West Lafayette, IN, US)
Cpc classification
B32B3/263
PERFORMING OPERATIONS; TRANSPORTING
B32B2307/54
PERFORMING OPERATIONS; TRANSPORTING
F16F2224/025
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B32B2307/10
PERFORMING OPERATIONS; TRANSPORTING
F16F15/022
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B32B25/04
PERFORMING OPERATIONS; TRANSPORTING
F16F13/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F16F15/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B32B25/04
PERFORMING OPERATIONS; TRANSPORTING
B32B3/26
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The vibration attenuation system includes a load bearing layer, a non-load bearing layer, and a rigid beam connector. The load bearing layer has a first density and a first stiffness. The non-load bearing layer has a second density and a second stiffness. The second density is lower than the first density. The rigid beam connector has a third density and a third stiffness. The rigid beam connector couples the load bearing layer to the non-load bearing layer. The coupling of the non-load bearing layer to the load bearing layer is enabled through the use of the rigid beam connector which provides a nonlocal connection to transfer energy from the load bearing layer to the non-load bearing layer.
Claims
1. A vibration attenuation system, comprising: a load bearing layer having a first density and a first stiffness; a non-load bearing layer having a second density and a second stiffness; and a rigid beam connector having a third density and a third stiffness, the rigid beam connector couples the load bearing layer to the non-load bearing layer, the third density is different from each of the first density and the second density.
2. The vibration attenuation system of claim 1, wherein the third stiffness is greater than each of the first stiffness and the second stiffness.
3. The vibration attenuation system of claim 1, wherein the third density is less than each of the first density and the second density.
4. The vibration attenuation system of claim 1, wherein the load bearing layer is a substantially flat-surfaced plate.
5. The vibration attenuation system of claim 1, wherein a surface of the load bearing layer includes a taper.
6. The vibration attenuation system of claim 5, wherein the surface of the load bearing layer includes a plurality of tapers.
7. The vibration attenuation system of claim 5, wherein a terminal end of the rigid beam connector is coupled to an apex of the taper.
8. The vibration attenuation system of claim 1, wherein the non-load bearing layer is a substantially flat-surfaced plate.
9. The vibration attenuation system of claim 1, wherein a surface of the non-load bearing layer includes a substantially concave surface.
10. The vibration attenuation system of claim 1, wherein the non-load bearing layer includes a primary non-load bearing layer and a secondary non-load bearing layer, the primary non-load bearing layer is substantially disposed between the load bearing layer and the secondary non-load bearing layer.
11. The vibration attenuation system of claim 10, wherein each of the primary non-load bearing layer and the secondary non-load bearing layer include a concave surface, a bottom-most point of the concave surface of the primary non-load bearing layer is substantially offset from a bottom-most point of the concave surface of the secondary non-load bearing layer.
12. The vibration attenuation system of claim 1, wherein the non-load bearing layer is flexible.
13. The vibration attenuation system of claim 1, further comprising a viscoelastic layer coupled to the non-load bearing layer, the viscoelastic layer is configured to attenuate localized energy in the non-load bearing layer.
14. The vibration attenuation system of claim 13, wherein the viscoelastic layer is constructed from at least one of rubber and polyurethane.
15. The vibration attenuation system of claim 1, wherein a surface of the load bearing layer includes a taper having a first diameter and a surface of the non-load bearing layer includes a substantially concave surface having a second diameter, and the second diameter is greater than the first diameter.
16. A method of using a vibration attenuation system to dissipate a vibration, the method comprising the steps of: providing a load bearing layer, a non-load bearing layer, and a rigid beam connector, the load bearing layer having a first density, the non-load bearing layer having a second density, the rigid beam connector having a third density, the rigid beam connector coupling the load bearing layer to the non-load bearing layer, and the third density is different from each of the first density and the second density; applying a vibration to the load bearing layer; transferring the vibration from the load bearing layer to the non-load bearing layer; and attenuating the vibration.
17. The method of claim 16, wherein the vibration is transferred from the load bearing layer to non-load bearing layer via the rigid beam connector.
18. The method of claim 16, wherein a surface of the load bearing layer includes a taper, the step of transferring the vibration includes directing the vibration to an apex of the taper.
19. The method of claim 16, wherein a surface of the non-load bearing layer includes a substantially concave surface, the step of transferring the vibration includes directing the vibration to a bottom-most point of the concave surface.
20. The method of claim 16, wherein the non-load bearing layer further includes a viscoelastic layer, and the energy of the vibration is dampened by the viscoelastic layer.
Description
DRAWINGS
[0017] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations and are not intended to limit the scope of the present disclosure.
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DETAILED DESCRIPTION
[0031] The following description of technology is merely exemplary in nature of the subject matter, manufacture, and use of one or more inventions, and is not intended to limit the scope, application, or uses of any specific invention claimed in this application or in such other applications as may be filed claiming priority to this application, or patents issuing therefrom. Regarding methods disclosed, the order of the steps presented is exemplary in nature, and thus, the order of the steps can be different in various embodiments, including where certain steps can be simultaneously performed. A and an as used herein indicate at least one of the item is present; a plurality of such items may be present, when possible. Except where otherwise expressly indicated, all numerical quantities in this description are to be understood as modified by the word about and all geometric and spatial descriptors are to be understood as modified by the word substantially in describing the broadest scope of the technology. About when applied to numerical values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by about and/or substantially is not otherwise understood in the art with this ordinary meaning, then about and/or substantially as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters.
[0032] Although the open-ended term comprising, as a synonym of non-restrictive terms such as including, containing, or having, is used herein to describe and claim embodiments of the present technology, embodiments may alternatively be described using more limiting terms such as consisting of or consisting essentially of. Thus, for any given embodiment reciting materials, components, or process steps, the present technology also specifically includes embodiments consisting of, or consisting essentially of, such materials, components, or process steps excluding additional materials, components or processes (for consisting of) and excluding additional materials, components or processes affecting the significant properties of the embodiment (for consisting essentially of), even though such additional materials, components or processes are not explicitly recited in this application. For example, recitation of a composition or process reciting elements A, B and C specifically envisions embodiments consisting of, and consisting essentially of, A, B and C, excluding an element D that may be recited in the art, even though element D is not explicitly described as being excluded herein.
[0033] As referred to herein, disclosures of ranges are, unless specified otherwise, inclusive of endpoints and include all distinct values and further divided ranges within the entire range. Thus, for example, a range of from A to B or from about A to about B is inclusive of A and of B. Disclosure of values and ranges of values for specific parameters (such as amounts, weight percentages, etc.) are not exclusive of other values and ranges of values useful herein. It is envisioned that two or more specific exemplified values for a given parameter may define endpoints for a range of values that may be claimed for the parameter. For example, if Parameter X is exemplified herein to have value A and also exemplified to have value Z, it is envisioned that Parameter X may have a range of values from about A to about Z. Similarly, it is envisioned that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping, or distinct) subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges. For example, if Parameter X is exemplified herein to have values in the range of 1-10, or 2-9, or 3-8, it is also envisioned that Parameter X may have other ranges of values including 1-9,1-8,1-3,1-2,2-10,2-8,2-3,3-10,3-9, and so on.
[0034] When an element or layer is referred to as being on, engaged to, connected to, or coupled to another element or layer, it may be directly on, engaged, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being directly on, directly engaged to, directly connected to or directly coupled to another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., between versus directly between, adjacent versus directly adjacent, etc.). As used herein, the term and/or includes any and all combinations of one or more of the associated listed items.
[0035] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer, or section. Terms such as first, second, and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of the example embodiments.
[0036] Spatially relative terms, such as inner, outer, beneath, below, lower, above, upper, and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the FIG. is turned over, elements described as below, or beneath other elements or features would then be oriented above the other elements or features. Thus, the example term below can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0037] As shown in
[0038] A possible idealized 1D discrete model of the nonlocal Acoustic Black Hole (ABH) metastructure is illustrated in
[0039] The vibration attenuation system 100 may include various ways to attenuate a vibration while maintaining the strength of the load bearing layer 102. For instance, the second density may be less than the first density. In a more specific non-limiting example, the third density may be less than the first density. In a specific example, the third stiffness of the rigid beam connector 108 may be greater than each of the first stiffness of the load bearing layer 102 and the second stiffness of the non-load bearing layer 104, 106. In a more specific example, the first stiffness of the load bearing layer 102 may be greater than the second stiffness of the non-load bearing layer 104, 106, yet still lesser than the third stiffness of the rigid beam connector 108. Additionally, the shape of the vibration attenuation system 100 may be configured to further attenuate a vibration. The load bearing layer 102 may be a primary thin-walled structure for which broadband vibration attenuation performance is sought. As shown in
[0040] In certain circumstances, the non-load bearing layer 104, 106 may be configured to control the distribution of nonlocal forces. As shown in
[0041] As shown in
[0042] The non-load bearing layer 104, 106 may be connected to the load bearing layer 102 by the rigid beam connectors 108. In a practical implementation, the rigid beam connectors 108 may be designed as structural linkages having significantly higher stiffness compared to the layers 102, 104, 106, for example, a ratio of E of connector: ELBL=12:1. Here, E is Young's modulus between the load bearing layer 102 and the supporting structure. Their spacing influences where the nonlocal forces mediated by the non-load bearing layer 104, 106 are transferred to the load bearing layer 102. Both the number and location of these rigid beam connectors 108 may be treated as design variables whose values would be obtained by means of an optimization approach. From a more qualitative perspective, these links allow the vibrational energy to flow between the two layers 102, 104, 106, hence it is reasonable to locate these rigid beam connectors 108 close to structural locations on the load bearing layer 102 with high energy density. Equivalently, given that nonlocal forces are driven by the state of strain within the horizon of nonlocality, rigid beam connectors 108 may be optimally located in regions with high strain energy density. As a non-limiting example, the center points of ABH tapers 110 (known to be points with high energy density) may be optimal locations of interest to place the rigid beam connectors 108. One skilled in the art may select other suitable number, locations, or positions for the rigid beam connector 108, within the scope of the present disclosure.
[0043] In certain circumstances, the non-load bearing layer 104, 106 may include a viscoelastic layer 114 configured to further dampen and/or attenuate the vibration. In a specific example, the viscoelastic layer 114 may be disposed on the non-load bearing ABH 112 of the non-load bearing layer 104, 106 to attenuate the localized energy in the non-load bearing layer 104, 106. It is contemplated that a plurality of viscoelastic layers 114 may be utilized on the non-load bearing layer 104, 106. The viscoelastic layer 114 may be constructed from any viscoelastic/dampening materials, such as rubber and/or polyurethane. In another specific example, the viscoelastic layer 114 may be disposed on the load bearing layer 102. In a more specific example, the viscoelastic layer 114 may include a plurality of viscoelastic layers 114 disposed on the load bearing layer 102. In an even more specific example, the viscoelastic layer 114 may be disposed on each of the load bearing layer 102 and the non-load bearing layer 104, 106. One skilled in the art may select other suitable materials to construct the viscoelastic layer 114, within the scope of the present disclosure.
[0044] Various ways of using the vibration attenuation system 100 are provided. For instance, as shown in
[0045] Advantageously, the vibration attenuation system 100 utilizes intentional nonlocality to improve the broadband and low frequency attenuation performance of ABH metastructures 112, 114. In a specific example, the nonlocal design integrates a local ABH metastructure, which leverages multiple periodic ABH tapers 110, with additional flexible layers 104, 106 intentionally introduced to achieve a nonlocal dynamic behavior. The new structural design implements, at the macroscopic scale, an equivalent concept of action at a distance typically seen in systems with prominent scale effects. In linear elasticity, the traditional material nonlocality is mathematically defined as a function of the location-dependent nonlocal attenuation function. However, as the nonlocal behavior of the vibration attenuation system 100 was achieved by using geometrically tailored physical connections, a semi-analytical methodology was developed to extract the effective dynamic nonlocal attenuation functions endowed with both spatial and temporal dependence. The qualitative agreement between the semi-analytical and the numerical dispersion structure of an infinite nonlocal ABH metastructure allowed validating the semi-analytical technique. While this method could certainly be useful to obtain homogenized models of large-scale nonlocal ABH metastructures, in the present disclosure its development was motivated by the understanding of the effects that different design parameters have on the occurrence of the nonlocal behavior.
[0046] In a specific, non-limiting example, the additional nonlocal layer (the non-load bearing layer 104, 106) may increase the overall weight of the system 100 by around fifteen percent for a flat plate configuration and around twenty six percent for a tapered/concave surface plate configuration. However, with continued reference to the non-limiting example, an average reduction of around twenty-seven percent for a nonlocal flat plate configuration and around forty percent for a nonlocal tapered/concave surface plate configuration in the steady state response amplitude was obtained for the nonlocal design in the low-frequency range. Accordingly, the results clearly indicate that the vibration response of ABH metastructures can be significantly attenuated via the nonlocal design.
[0047] Another very remarkable effect is observed on the position of the first frequency bandgap. In another specific, non-limiting example, the local ABH metastructure (tapered load bearing plate 102) may present a first bandgap around 170 Hz (center frequency), the nonlocal design can reduce its center frequency to approximately 2 Hz (a 98% reduction). The width and location of the bandgaps at low frequencies could be tuned by selecting the type of non-load bearing layer 104, 106 and its geometrical parameters. The present disclosure particularly describes how the combination of intentional (macroscopic) nonlocality and of ABH technology can achieve very low frequency bandgaps without compromising the structural integrity of the system 100. Desirably, this characteristic can be very useful for structural dynamics applications and passive vibration control.
[0048] Example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Equivalent changes, modifications and variations of some embodiments, materials, compositions, and methods can be made within the scope of the present technology, with substantially similar results.