Low silver solder for welding the electric vacuum device and a preparation method thereof

Abstract

The application relates to a low-silver solder for welding an electric vacuum device and a preparation method thereof, The low-silver solder for welding the electric vacuum device is characterized by consisting of Ag, Cu, Ni and a trace element R, wherein the low-silver solder comprises the following components in percentage by mass: 65-71% of Ag, 0-0.1% of Ni, 0-0.1% of trace element R and the balance of Cu; the trace element R consists of one or more of P, Sc, Be, Zr and La. A method of producing the low silver solder, characterized by the steps of: Ag, Cu except from copper foil and Ni are evenly preset in a smelting crucible, the trace elements wrapped by the copper foil are placed above main raw materials consisting of the Ag,Cu except from copper foil and Ni, then smelting and casting are carried out by adopting a vacuum induction smelting furnace, the vacuum degree of a furnace body reaches 10.sup.−1 Pa during smelting and casting, and finally a strip material or a wire materialis prepared by a post treatment process, which has the advantages of good processing performance, good fluidity, low air content in a welding line and excellent thermal stability.

Claims

1. The low silver solder for welding the electric vacuum device is characterized by comprising Ag, Cu, Ni and a trace element R, wherein the low-silver solder comprises the following components in percentage by mass: 65-71% of Ag, 0-0.1% of Ni, 0-0.1% of trace element R and the balance of Cu; the trace element R comprises one or more components selected from P, Sc, Be, Zr and La.

2. A low silver solder for welding of electric vacuum devices according to claim 1, wherein the mass percent of the trace element R in the low-silver solder is 0.0001˜0.01 percent.

3. A method of preparing a low silver solder for welding of electric vacuum devices according to claim 1, characterized in that it comprises the following steps: Ag, Cu but not from copper foil and Ni evenly preset in a smelting crucible; the trace elements wrapped by the copper foil are placed above main raw materials comprising Ag, Cu but not from copper foil and Ni; then smelting and casting are carried out by adopting a vacuum induction smelting furnace, where the vacuum degree of the furnace body reaches 10.sup.−1 Pa during smelting and casting; and finally a strip materialor a wire material is prepared by a post treatment process.

4. A method for preparing a low silver solder for welding of electric vacuum devices according to claim 3, wherein the weight of the copper foil is 0.01˜30 grams.

Description

DETAILED DESCRIPTION

[0026] The present application will be described in further detail below by way of examples with reference to the accompanying drawings, which are illustrative of the present application and are not intended to limit the present application.

[0027] The low-silver solder for welding the electric vacuum device is characterized by comprising Ag, Cu, Ni and a trace element R, wherein the low-silver solder comprises the following components in percentage by mass: 65-71% of Ag, 0-0.1% of Ni, 0-0.1% of trace element R, and the balance (27.9-35%) of Cu; the trace element R consists of one or more of P, Sc, Be, Zr and La.

[0028] According to the solder, the wettability of the solder on the surfaces of steel, stainless steel and kovar alloy can be improved, the material structure is refined, the processing performance of the material is improved, the joint strength is improved, when 0-0.1% of Ni is added in the range, the influence on the melting temperature of the solder is small, the soldering temperature cannot be improved, the wettability of the solder and the joint strength are improved continuously along with the continuous increase of the Ni content, but when the Ni content exceeds 0.1%, a Ni-containing phase with the melting temperature is easy to generate, and the soldering of an electric vacuum device is not facilitated.

[0029] The addition of trace R elements has the functions of impurity removal and degassing during smelting, the addition of a small amount of trace R elements can increase the fluidity of the solder during soldering, fill up micropores in a welding seam when the solder is solidified and shrunk, play a role of secondary degassing during soldering and ensure the vacuum degree of a cavity when a device works. When the addition range of the trace element R is 0.0001-0.01%, the trace element R has high fluidity, welding seam filling performance and degassing effect, the degassing effect is enhanced along with the increase of the content of the trace element R, but the fluidity of the solder can be reduced, and when the addition amount reaches more than 0.1%, the fluidity of the solder is influenced to a great extent, and the defects of welding shortage, refractory property and the like can be caused.

[0030] In addition, as shown in figure, according to the “intergrowth” theory, for an alloy system capable of forming a binary eutectic structure, the composition of which is within a certain range of radiation near the eutectic point, the structure tends to grow toward the eutectic. The addition of the trace element R during smelting can enlarge the symbiotic region of the trace element R, so that the material components can still grow to the eutectic structure even if the material components slightly deviate from the original “symbiotic region”. In the silver-copper binary system, the physical processing performance and the soldering performance of the low-silver solder are closer to those of BAg72Cu by the existence of eutectic structures, and the low-silver solder is more suitable for soldering of electric vacuum devices. Meanwhile, the Ag content is controlled to be more than 65%, the material tends to grow towards an eutectic structure, when the Ag content is less than 65%, an obvious alpha-Cu phase appears in the structure, segregation easily appears during soldering, and defects such as infusibility, incomplete melting and the like are generated.

[0031] The embodiment is as follows:

[0032] the low-silver solder in the embodiment is prepared by using silver IC—Ag99.99, oxygen-free copper, Ni99.995 and a trace Cu—R alloy according to the proportion, smelting and casting by using a vacuum intermediate-frequency smelting furnace, and then performing processes such as sawing, extruding, drawing, forming, cleaning and the like.

[0033] According to the embodiment of the application, a main raw material consisting of Cu except from copper foil and Ni is evenly preset in a smelting crucible before smelting, trace elements wrapped by the copper foil are arranged above the main raw material and are not in direct contact with the crucible, the vacuum degree of a furnace body is required to reach 10.sup.−1 Pa during smelting and casting, and then the materials are prepared into strips or wires through the processes of sawing, rolling, drawing, cleaning and the like. The melting temperature of the obtained solder ranges from 780° C. to 795° C., and the solder can be processed into solders such as welding wires, thin strips and welding pieces with various specifications and sizes.

[0034] The low-silver solder for the electric vacuum device does not contain In, Sn and Ga low-melting-point elements, is low In total content of precious metals, low In cost, good In fluidity, low In gas content of welding seams and high In joint reliability, has main technical indexes close to those of silver solder BAg72Cu, and can replace the application of the low-silver solder In the electric vacuum device. The present application will be described in further detail with reference to specific examples, which are illustrative of the present application and are not intended to limit the present application.

[0035] Specific parameters in each example are shown in tables 1 to 2, table 1 is a table of data related to examples 1 to 6 of the present application, table 2 is a table of data related to examples 7 to 12 of the present application, and data in each table are mass percentages and are specifically as follows.

TABLE-US-00001 TABLE 1 data table relating to examples 1 to 6. Component or example example example example example example parameter names 1 2 3 4 5 6 Ag 71 70 69 68 67   66   Cu remainder remainder remainder remainder remainder remainder Ni 0 0.05 0.1 0.3 0.2 0.1 R 0.01 0.0005 0 0.001 0.1 0.2 Low air content low low high low low low of welding seam Excellent and medium excellent excellent excellent excellent excellent poor in stainless steel wettability Excellent fluidity excellent excellent excellent excellent medium poor

[0036] Note: wherein the combination of the R elements in each embodiment is as follows: Sc and Be in example 1, Zr in example 2, P in example 4, P, Zr, Be in example 5, and Zr, La in example 6.

TABLE-US-00002 TABLE 2 data sheet relating to examples 7 to 12 Component or example example example example example example parameter names 7 8 9 10 11 12 Ag 65 64.5 68 67.5 66.5 65.5 Cu remainder remainder remainder remainder remainder remainder Ni 0.2 0.5 0.02 1.5 0.08 0 R 0.01 0.003 0.005 0.002 0.1 0.15 Low air content low low low low low low of welding seam Excellent and excellent excellent excellent excellent excellent poor poor in stainless steel wettability Excellent fluidity excellent poor excellent excellent medium poor

[0037] Note: wherein the combination of the R elements in each embodiment is as follows: se and P in example 7, Be in example 8, Zr in example 9, Sc in example 10, La in example 11, and Be, La, Zr in example 12.

[0038] The formula of the embodiment of the application has the advantages of reasonable design, low production cost and high cost performance, and when the soldering alloy is used for solder electric vacuum devices, the soldering alloy has good wettability and fluidity, the surface of a brazed joint is smooth and clean, a welding line is compact, the problem of segregation and infusibility cannot be caused, and the soldering process performance is excellent.