THREE-DIMENSIONAL LIGHT EMITTING APPLIANCE
20200408367 ยท 2020-12-31
Inventors
Cpc classification
F21K9/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
H05K1/0284
ELECTRICITY
G06F2115/12
PHYSICS
H05K2201/2054
ELECTRICITY
H01L25/167
ELECTRICITY
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21K9/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/69
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area. Further, a three-dimensional light emitting appliance is disclosed.
Claims
1. A method for manufacturing a three-dimensional light emitting appliance, the method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, the plurality of spots being substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, a position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the position of the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area.
2. The method according to claim 1, wherein each of the spots of the first data model for the light emitting devices on the three-dimensional area is arranged substantially equidistant to adjoining spots for the light emitting devices.
3. The method according to claim 1, wherein each of the spots for the light emitting devices of the two-dimensional and flat surface is arranged substantially non-equidistant to adjoining spots for the light emitting devices.
4. The method according to claim 1, wherein pads selected from selections including at least one of each pad and at least one pad from each column of pads of the printed circuit board are coupled with one conductive track each so that the selected one of the selections including each pad and at least one pad from each column of pads can be controlled separately.
5. The method according to claim 1, wherein the pads of the printed circuit board are equipped with LEDs, including at least one type of LED selected from RGB-LEDs and RGBW-LEDs as light emitting devices.
6. The method according to claim 1, wherein while or after equipping the pads with the light emitting devices, at least one film selected from films including a reflection film, an optical resin, and an optical film is applied on the printed circuit board.
7. The method according to claim 1, wherein a diffuser, especially a diffuser plate (16) or a diffuser layer, is attached to the printed circuit board (4).
8. The method according to claim 1, wherein a distance between the spots of the three-dimensional model is between about 0.25 m and about 2 cm.
9. The method according to claim 1, wherein the first data model is a computer aided design data model of a three-dimensional surface of a car interior.
10. The method according to claim 1, wherein the second data model is a computer aided manufacturing data model.
11. A three-dimensional light emitting appliance, characterized in that, the three-dimensional light emitting appliance is manufactured according to claim 1; and the first data model is a computer aided design data model of a three-dimensional surface of a car interior.
12. The method according to claim 1, wherein a distance between the spots of the three-dimensional model is between about 0.75 cm and about 1.5 cm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Examples of the invention will now be described in detail with reference to the accompanying drawing, in which:
[0030]
[0031]
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0032] The following description serves to deepen the understanding of the present invention and shall be understood to complement and be read together with the description as provided in the above summary section of this specification.
[0033]
[0034] As can be seen in
[0035] The next step is to arrange spots or positions for light emitting devices on the three-dimensional CAD data model of the three-dimensional area. These spots are positioned evenly over the three dimensional area so that each spot is positioned substantially equidistant to a neighboring spot.
[0036] Afterwards, the three-dimensional CAD data model is transformed into a two-dimensional CAM model. This is done by deriving the position of the spots from the three-dimensional area to the substantially flat and two-dimensional surface. The spots thus are unevenly distributed over the two-dimensional surface so that the spots are not positioned equidistant to each other.
[0037] Now a PCB is manufactured according to the two-dimensional CAM data model. This is preferably done by a photolithographical process. Further, pads are arranged on the positions of the spots. Each of these pads is preferably connected individually with a conductor path and isolated to the other pads of the PCB.
[0038] Subsequently, the PCB is equipped with the light emitting devices wherein preferably one light emitting device is placed onto one pad of the PCB respectively. The PCB can furthermore be equipped with a reflection film, an optical resin, an optical film and/or a diffuser.
[0039] Finally, the PCB is brought into a three-dimensional form which corresponds to the three-dimensional form of the initial three-dimensional CAD data model. This leads to a light emitting appliance in which all light emitting devices are substantially equidistant to each other and evenly arranged over the surface of the three-dimensional light emitting appliance.
[0040]
[0041] In the present specification, any presented connection in the described embodiments is to be understood in a way that the involved components are operationally coupled. Thus, the connections can be direct or indirect with any number or combination of intervening elements, and there may be merely a functional relationship between the components.
[0042] Moreover, any of the methods, processes and actions described or illustrated herein may be implemented using executable instructions in a general-purpose or special-purpose processor and stored on a computer-readable storage medium (e.g., disk, memory, or the like) to be executed by such a processor.
[0043] The expression A and/or B is considered to comprise any one of the following three scenarios: (i) A, (ii) B, (iii) A and B. Furthermore, the article a is not to be understood as one, i.e. use of the expression an element does not preclude that also further elements are present. The term comprising is to be understood in an open sense, i.e. in a way that an object that comprises an element A may also comprise further elements in addition to element A.
[0044] It will be understood that all presented embodiments are only exemplary, and that any feature presented for a particular example embodiment may be used with any aspect of the invention on its own or in combination with any feature presented for the same or another particular example embodiment and/or in combination with any other feature not mentioned. In particular, the example embodiments presented in this specification shall also be understood to be disclosed in all possible combinations with each other, as far as it is technically reasonable and the example embodiments are not alternatives with respect to each other. It will further be understood that any feature presented for an example embodiment in a particular category (method/appliance) may also be used in a corresponding manner in an example embodiment of any other category. It should also be understood that presence of a feature in the presented example embodiments shall not necessarily mean that this feature forms an essential feature of the invention and cannot be omitted or substituted.
[0045] The statement of a feature comprises at least one of the subsequently enumerated features is not mandatory in the way that the feature comprises all subsequently enumerated features, or at least one feature of the plurality of the subsequently enumerated features. Also, a selection of the enumerated features in any combination or a selection of only one of the enumerated features is possible. The specific combination of all subsequently enumerated features may as well be considered. Also, a plurality of only one of the enumerated features may be possible.
[0046] The sequence of all method steps presented above is not mandatory, also alternative sequences may be possible. Nevertheless, the specific sequence of method steps exemplarily shown in the figures shall be considered as one possible sequence of method steps for the respective embodiment described by the respective figure.
[0047] The invention has been described above by means of example embodiments. It should be noted that there are alternative ways and variations which are obvious to a skilled person in the art and can be implemented without deviating from the scope of the appended claims.