Flexible colloidal crystal heterostructure and manufacturing method thereof
10875004 ยท 2020-12-29
Inventors
- Mohammad Mahdi Tehranchi (Tehran, IR)
- Zahra Sadat Azizi Yarand (Tehran, IR)
- Saeed Pourmahdian (Tehran, IR)
Cpc classification
G02B6/1225
PHYSICS
B82Y20/00
PERFORMING OPERATIONS; TRANSPORTING
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
International classification
B01J13/20
PERFORMING OPERATIONS; TRANSPORTING
G02B1/00
PHYSICS
Abstract
Disclosed herein is a method for fabricating a flexible colloidal crystal heterostructure. The method may include applying cold plasma treatment on a top surface of a flexible polymer substrate, horizontally depositing monodispersed polystyrene colloidal particles onto the top surface of the flexible polymer substrate, and creating a vertical temperature gradient in layers of monodispersed polystyrene colloidal particles. The vertical temperature gradient may be perpendicular to the top surface and may be created by heating an opposing bottom surface of the flexible polymer substrate.
Claims
1. A method for fabricating a flexible colloidal crystal heterostructure, the method comprising: applying cold plasma treatment on a top surface of a flexible polymer substrate; horizontally depositing monodispersed polystyrene colloidal particles onto the top surface of the flexible polymer substrate; and creating a vertical temperature gradient in layers of the monodispersed polystyrene colloidal particles by heating an opposing bottom surface of the flexible polymer substrate, the vertical temperature gradient perpendicular to the top surface of the flexible polymer substrate.
2. The method according to claim 1, wherein horizontally depositing the monodispersed polystyrene colloidal particles onto the top surface of the flexible polymer substrate comprises dropwise addition of an emulsion of the monodispersed polystyrene colloidal particles on the top surface of the flexible polymer substrate.
3. The method according to claim 1, wherein heating the opposing bottom surface of the flexible polymer substrate includes placing a flat heating system with a predetermined temperature in contact with the opposing bottom surface.
4. The method according to claim 3, wherein the predetermined temperature is in a range between 35 C. and 110 C.
5. The method according to claim 4, wherein heating the opposing bottom surface of the flexible polymer substrate is carried out for a duration between 10 minutes and 60 minutes.
6. The method according to claim 1, wherein creating the vertical temperature gradient in the layers of the monodispersed polystyrene colloidal particles includes creating a vertical temperature gradient of 20 C. mm.sup.1.
7. The method according to claim 1, wherein the flexible polymer substrate comprises a polyethylene terephthalate substrate.
8. The method according to claim 1, wherein horizontally depositing the monodispersed polystyrene colloidal particles onto the top surface of the flexible polymer substrate includes horizontally depositing an emulsion of the monodispersed polystyrene colloidal particles with a concentration between 1.5 wt. % to 2 wt. % based on a total weight of the emulsion.
9. The method according to claim 1, wherein applying the cold plasma treatment on the top surface of the flexible polymer substrate includes exposing the top surface to a 1200 W gliding arc discharge plasma for a duration between 4 seconds and 8 seconds.
10. The method according to claim 9, wherein exposing the top surface to the 1200 W gliding arc discharge plasma includes exposing the top surface to the 1200 W gliding arc discharge plasma by placing the top surface at a distance between 3 cm and 10 cm from the 1200 W gliding arc discharge plasma.
11. A method for depositing a colloidal crystal heterostructure on a flexible polymer substrate, the method comprising: applying cold plasma treatment on a top surface of the flexible polymer substrate; depositing a layer of an emulsion of monodispersed polystyrene colloidal particles onto the top surface; and self-assembling a colloidal crystal heterostructure on the top surface by drying the layer of the emulsion of the monodispersed polystyrene colloidal particles, wherein drying the layer of the emulsion of the monodispersed polystyrene colloidal particles includes creating a vertical temperature gradient in the layer of the emulsion of the monodispersed polystyrene colloidal particles, the vertical temperature gradient perpendicular to the top surface.
12. The method according to claim 11, wherein creating the vertical temperature gradient in the layer of the emulsion of the monodispersed polystyrene colloidal particles includes creating a vertical temperature gradient of 20 C. mm.sup.1.
13. The method according to claim 11, wherein creating the vertical temperature gradient in the layer of the emulsion of the monodispersed polystyrene colloidal particles includes creating a vertical temperature gradient of 20 C. mm.sup.1 for a duration between 10 minutes and 60 minutes.
14. The method according to claim 11, wherein creating the vertical temperature gradient in the layer of the emulsion of the monodispersed polystyrene colloidal particles includes heating an opposing bottom surface of the flexible polymer substrate by a flat heating system with a temperature between 35 C. and 110 C.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The drawing figures depict one or more implementations in accord with the present teachings, by way of example only, not by way of limitation. In the figures, like reference numerals refer to the same or similar elements.
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DETAILED DESCRIPTION
(9) In the following detailed description, numerous specific details are set forth by way of examples in order to provide a thorough understanding of the relevant teachings. However, it should be apparent that the present teachings may be practiced without such details. In other instances, well known methods, procedures, components, and/or circuitry have been described at a relatively high-level, without detail, in order to avoid unnecessarily obscuring aspects of the present teachings.
(10) The following detailed description is presented to enable a person skilled in the art to make and use the methods and devices disclosed in exemplary embodiments of the present disclosure. For purposes of explanation, specific nomenclature is set forth to provide a thorough understanding of the present disclosure. However, it will be apparent to one skilled in the art that these specific details are not required to practice the disclosed exemplary embodiments. Descriptions of specific exemplary embodiments are provided only as representative examples. Various modifications to the exemplary implementations will be readily apparent to one skilled in the art, and the general principles defined herein may be applied to other implementations and applications without departing from the scope of the present disclosure. The present disclosure is not intended to be limited to the implementations shown, but is to be accorded the widest possible scope consistent with the principles and features disclosed herein.
(11) Disclosed herein is a method for fabricating a flexible colloidal crystal heterostructure. The flexible colloidal heterostructure may be fabricated by depositing a colloidal crystal heterostructure on a flexible polymer substrate. An emulsion of monodispersed colloidal particles may be deposited onto the surface of a flexible polymer substrate of exemplary embodiments of the present disclosure and then by creating a vertical temperature gradient in the emulsion, a colloidal crystal heterostructure may be self-assembled on the flexible polymer substrate. The exemplary self-assembled colloidal crystal heterostructure may include an ordered stack of photonic crystals with different lattice constants.
(12)
(13) Referring to
(14)
(15) Referring to
(16) According to one or more exemplary embodiments, step 104 includes synthesizing polystyrene colloidal nano-spheres by an emulsifier-free emulsion polymerization (EFEP). Anionic polystyrene nano-spheres may be obtained using potassium persulfate (KPS) as an initiator. In an exemplary embodiment, the EFEP method may be carried out in a three-necked, round-bottomed flask equipped with a reflux condenser and a nitrogen inlet. Here, 6 ml of styrene and 5 g/l of a polyvinylpyrrolidone (PVP) solution may be added to 50 ml of deionized water under gentle magnetic stirring at room temperature. The mixture of styrene, PVP, and water may be stirred at about 600 rpm for 30 min. Before adding the initiator, the mixture may be placed in a liquid silicone bath at 80 C. with the protection of nitrogen gas. When the temperature of the mixture reaches 80 C., a solution of KPS may be added to the mixture to initiate polymerization. The reaction may continue at 80 C. for 24 hours. Finally, the resultant mixture may be slowly cooled down to room-temperature. The resultant mixture is an emulsion of monodispersed single-sized polystyrene colloidal nano-spheres.
(17) Referring to
(18) With reference to
(19) For purposes of explanation,
(20) Referring to
(21) Referring to
Example 1
(22) In this example, a colloidal crystal heterostructure is fabricated by method 100 of
(23)
(24) Referring to
(25) Referring to
Example 2
(26) In this example, three samples of colloidal crystal heterostructures were synthesized with the same method as described in EXAMPLE 1, but at three different heating temperatures of 35 C., 50 C., and 60 C. In other words, the vertical temperature gradients created in the drying process of the three samples were different. Sample 1 was dried by heating a bottom surface of the flexible substrate by a flat heating system at a temperature of 35 C., Sample 2 was dried by heating a bottom surface of the flexible substrate by a flat heating system at a temperature of 50 C., and Sample 3 was dried by heating a bottom surface of the flexible substrate by a flat heating system at a temperature of 60 C.
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(28) While the foregoing has described what are considered to be the best mode and/or other examples, it is understood that various modifications may be made therein and that subject matter disclosed herein may be implemented in various forms and examples, and that the teachings may be applied in numerous applications, only some of which have been described herein. It is intended by the following claims to claim any and all applications, modifications and variations that fall within the true scope of the present teachings.
(29) Unless otherwise stated, all measurements, values, ratings, positions, magnitudes, sizes, and other specifications that are set forth in this specification, including in the claims that follow, are approximate, not exact. They are intended to have a reasonable range that is consistent with the functions to which they relate and with what is customary in the art to which they pertain.
(30) The scope of protection is limited solely by the claims that now follow. That scope is intended and should be interpreted to be as broad as is consistent with the ordinary meaning of the language that is used in the claims when interpreted in light of this specification and the prosecution history that follows and to encompass all structural and functional equivalents. Notwithstanding, none of the claims are intended to embrace subject matter that fails to satisfy the requirement of Sections 101, 102, or 103 of the Patent Act, nor should they be interpreted in such a way. Any unintended embracement of such subject matter is hereby disclaimed.
(31) Except as stated immediately above, nothing that has been stated or illustrated is intended or should be interpreted to cause a dedication of any component, step, feature, object, benefit, advantage, or equivalent to the public, regardless of whether it is or is not recited in the claims.
(32) It will be understood that the terms and expressions used herein have the ordinary meaning as is accorded to such terms and expressions with respect to their corresponding respective areas of inquiry and study, except where specific meanings have otherwise been set forth herein. Relational terms such as first and second and the like may be used solely to distinguish one entity or action from another without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms comprises, comprising, or any other variation thereof, as used herein and in the appended claims are intended to cover a non-exclusive inclusion, encompassing a process, method, article, or apparatus that comprises a list of elements that does not include only those elements but may include other elements not expressly listed to such process, method, article, or apparatus. An element proceeded by a or an does not, without further constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
(33) The Abstract of the Disclosure is provided to allow the reader to quickly ascertain the nature of the technical disclosure. It is not intended to be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in various implementations. Such grouping is for purposes of streamlining this disclosure, and is not to be interpreted as reflecting an intention that the claimed implementations require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed implementation. Thus, the following claims are hereby incorporated into this Detailed Description, with each claim standing on its own as a separately claimed subject matter.
(34) While various implementations have been described, the description is intended to be exemplary, rather than limiting and it will be apparent to those of ordinary skill in the art that many more implementations are possible that are within the scope of the implementations. Although many possible combinations of features are shown in the accompanying figures and discussed in this detailed description, many other combinations of the disclosed features are possible. Any feature of any implementation may be used in combination with or substituted for any other feature or element in any other implementation unless specifically restricted. Therefore, it will be understood that any of the features shown and/or discussed in the present disclosure may be implemented together in any suitable combination. Accordingly, the implementations are not to be restricted except in light of the attached claims and their equivalents. Also, various modifications and changes may be made within the scope of the attached claims.