KEYBOARD DEVICE AND ASSEMBLY METHOD THEREOF

Abstract

The present invention provides a keyboard device, including a plurality of key structures, where each key structure includes a thin-film circuit board, a key frame, an elastic element and a press assembly. The key frame is arranged on the thin-film circuit board, and includes a frame body and a bottom plate that are of an integrally formed structure. The bottom plate is located between the frame body and the thin-film circuit board, and has a through hole, and the thin-film circuit board covers the through hole. The elastic element is arranged on the thin-film circuit board, and a part of the elastic element is located in the through hole in the bottom plate. The press assembly is arranged in the key frame, and the elastic element is located between the press assembly and the thin-film circuit board. The present invention further provides a keyboard device assembly method.

Claims

1. A keyboard device, comprising: a plurality of key structures, wherein each key structure comprises: a thin-film circuit board; a key frame, arranged on the thin-film circuit board, and comprising a frame body and a bottom plate that are of an integrally formed structure, wherein the bottom plate is located between the frame body and the thin-film circuit board and has a through hole, and the thin-film circuit board covers the through hole; an elastic element, arranged on the thin-film circuit board, wherein a part of the elastic element is located in the through hole in the bottom plate; and a press assembly, arranged in the key frame, wherein the elastic element is located between the press assembly and the thin-film circuit board.

2. The keyboard device according to claim 1, wherein the elastic element has a bottom surface facing the thin-film circuit board, the bottom surface of the elastic element is connected to the thin-film circuit board, and an area of the bottom surface is smaller than an area of the through hole.

3. The keyboard device according to claim 1, wherein the elastic element has a bottom surface facing the thin-film circuit board, the bottom surface of the elastic element is connected to the thin-film circuit board, and an area of the bottom surface is larger than an area of the through hole, so that the elastic element and the through hole are in a tight fit state.

4. The keyboard device according to claim 1, wherein the press assembly comprises a keycap and a scissors-type connection element, and the scissors-type connection element is located between the bottom plate of the key frame and the keycap.

5. The keyboard device according to claim 1, wherein the bottom plate of the key frame has a first surface and a second surface opposite to each other, the press assembly is connected to the first surface of the bottom plate, and the thin-film circuit board is attached on the second surface of the bottom plate.

6. The keyboard device according to claim 1, wherein a material of the key frame comprises plastics.

7. A keyboard device assembly method, applicable to the keyboard device according to claim 1, wherein the keyboard device assembly method comprises the following steps: assembling the press assembly onto a first surface of the bottom plate in a direction from above the key frame towards the key frame; assembling the elastic element onto the thin-film circuit board; and assembling the thin-film circuit board onto a second surface of the bottom plate in a direction from below the key frame towards the key frame, and passing the elastic element through the through hole in the bottom plate, so that a part of the elastic element is located in the through hole, wherein the second surface is opposite to the first surface.

8. The keyboard device assembly method according to claim 7, wherein the press assembly comprises a keycap and a scissors-type connection element, and the step of assembling the press assembly onto the first surface of the bottom plate comprises: assembling the scissors-type connection element onto the first surface of the bottom plate in a direction from above the key frame towards the key frame; and assembling the keycap to the scissors-type connection element, so that the scissors-type connection element is located between the keycap and the bottom plate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG. 1 is a schematic structural diagram of appearance of a conventional keyboard device;

[0019] FIG. 2 is a schematic cross-sectional view of a part of the structure of the keyboard device shown in FIG. 1;

[0020] FIG. 3 is a schematic exploded view of elements in the part of the structure of the keyboard device shown in FIG. 2;

[0021] FIG. 4 is a schematic structural diagram of appearance of a keyboard device according to an embodiment of the present invention;

[0022] FIG. 5 is a schematic cross-sectional view of a part of the structure of the keyboard device shown in FIG. 4;

[0023] FIG. 6 is a schematic exploded view of elements in the part of the structure of the keyboard device shown in FIG. 5;

[0024] FIG. 7A to FIG. 7D are schematic diagrams of an assembly process of the keyboard device shown in FIG. 5 and FIG. 6; and

[0025] FIG. 8 is a schematic cross-sectional view of a part of the structure of a keyboard device according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0026] FIG. 4 is a schematic structural diagram of appearance of a keyboard device in an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a part of the structure of the keyboard device shown in FIG. 4. FIG. 6 is a schematic exploded view of elements in the part of the structure of the keyboard device shown in FIG. 5. To make the illustration clearer, FIG. 5 and FIG. 6 only show a single key and related elements. Referring to FIG. 4 to FIG. 6, as shown in FIG. 4, a keyboard device 2 includes a plurality of key structures 20, the key structures 20 may be classified into general keys, number keys and function keys and the like, which may be separately pressed by a user with fingers to enable the keyboard device 2 to generate corresponding key signals to a computer, and then the computer performs corresponding functions. For example, general keys are used to input symbols such as English letters, number keys are used to input numbers, and function keys are used to provide various shortcut functions such as F1 to F12.

[0027] Other detailed structures of the keyboard device 2 of this embodiment of the present invention are further described below.

[0028] As shown in FIG. 5 and FIG. 6, each key structure 20 of the keyboard device 2 of this embodiment includes a thin-film circuit board 201, a key frame 202, an elastic element 203 and a press assembly 204. The thin-film circuit board 201 has a thin-film switch 2011. The key frame 202 is arranged on the thin-film circuit board 201, and includes a frame body 2021 and a bottom plate 2022 that are of an integrally formed structure. The bottom plate 2022 is located between the frame body 2021 and the thin-film circuit board 201, and has a through hole H. Specifically, the thin-film circuit board 201 covers a lower opening of the through hole H, and the thin-film switch 2011 of the thin-film circuit board 201 is located in the through hole H. The elastic element 203 is arranged on the thin-film circuit board 201, and a part of the elastic element 203 is located in the through hole H in the bottom plate 2022 and covers the thin-film switch 2011 that is also located in the through hole H. The press assembly 204 is arranged in the key frame 202, and the elastic element 203 is located between the press assembly 204 and the thin-film circuit board 201.

[0029] Referring further to FIG. 5 and FIG. 6, the press assembly 204 of this embodiment includes a keycap 2041 and a scissors-type connection element 2042. The scissors-type connection element 2042 is located between the key frame 202 and the keycap 2041. Specifically, the scissors-type connection element 2042 is arranged on the bottom plate 2022 of the key frame 202, and the scissors-type connection element 2042 and the bottom plate 2022 are connected, for example, by means of disposing a hook (not shown in the figure) on the bottom plate 2022 for the connection of the scissors-type connection element 2042. However, the present invention does not limit the connection manner between the scissors-type connection element 2042 and the bottom plate 2022, and different connection manners may be selected according to requirements of actual situations. The scissors-type connection element 2042 of this embodiment operates in the same way as the conventional technology, and details are not described in the present invention.

[0030] Referring again to FIG. 5 and FIG. 6, the bottom plate 2022 of the key frame 202 of this embodiment has a first surface S1 and a second surface S2 that are opposite to each other. The press assembly 204 is connected to the first surface of the bottom plate 2022, that is, the keycap 2041 is connected, by using the scissors-type connection element 2042, to the first surface S1 of the bottom plate 2022. The thin-film circuit board 201 is attached on the second surface S2 of the bottom plate 2022, and covers the lower opening of the through hole H, where the lower opening is located in the second surface S2. According to the above descriptions, the key frame 202 is formed by the frame body 2021 and the bottom plate 2022 that are of an integrally formed structure, so that an assembly process of each key structure 20 of the keyboard device 2 of this embodiment is obviously different from the assembly process of a conventional keyboard device: the keycap 2041 and the scissors-type connection element 2042 of this embodiment are assembled onto the first surface S1 of the bottom plate 2022 in a first direction D1 from above the key frame 202, the thin-film circuit board 201 is assembled onto the second surface S2 of the bottom plate 2022 in a second direction D2 from below the key frame 202, and the elastic element 203 arranged on the thin-film circuit board 201 may pass through the through hole H when the thin-film circuit board 201 is attached on the second surface S2 of the bottom plate 2022. The assembly process of the keyboard device 2 of this embodiment is described below.

[0031] In this embodiment, a material of the key frame 202 is, for example, plastics, that is, the frame body 2021 and the bottom plate 2022 use a plastics material and are of an integrally formed structure. However, the present invention does not limit the material of the key frame 202, and the material of the key frame 202 may be changed according to requirements of actual situations. An advantage of the key frame 202 made of the plastics material is that, the weight of each key structure 20 may be reduced, so that the overall weight of the keyboard device 2 is greatly reduced. In addition, the key frame 202 of this embodiment, for example, uses the frame body 2021 and the bottom plate 2022 that are integrally formed in one step or by means of multi-shot injection molding, but the present invention does not limit the production process of the key frame 202.

[0032] In this embodiment, the elastic element 203 has a bottom surface 2031 facing the thin-film circuit board 201, where the bottom surface 2031 of the elastic element 203 is connected to the thin-film circuit board 201, and an area A1 of the bottom surface 2031 of the elastic element 203 is smaller than an area A2 of the through hole H, so that the elastic element 203 can pass through the through hole H in the key frame 202 when the thin-film circuit board 201 is attached on the second surface S2 of the bottom plate 2022. It should be noted in particular that, the area A1 of the bottom surface 2031 of the elastic element 203 is larger than an area of any horizontal cross-section of the elastic element 203.

[0033] Referring to FIG. 7A to FIG. 7D, schematic diagrams of an assembly process of the keyboard device shown in FIG. 5 and FIG. 6 are depicted. The keyboard device assembly process of this embodiment includes the following steps: first, as shown in FIG. 7A, the scissors-type connection element 2042 is assembled onto the first surface S1 of the bottom plate 2022 in the first direction D1 (that is, in a direction towards the key frame 202) from above the key frame 202; then, as shown in FIG. 7B, the keycap 2041 is assembled to the scissors-type connection element 2042 in the first direction D1 from above the key frame 202, so that the scissors-type connection element 2042 is located between the keycap 2041 and the bottom plate 2022; then, as shown in FIG. 7C, the elastic element 203 is assembled onto the thin-film circuit board 201; and then, as shown in FIG. 7D, the thin-film circuit board 201 is assembled onto the second surface S2 of the bottom plate 2022 in the second direction D2 (that is, in a direction towards the key frame 202) from below the key frame 202, and at the same time, the elastic element 203 passes through the through hole H in the bottom plate 2022, so that a part of the elastic element 203 is located in the through hole H. It should be noted in particular that, in the steps in FIG. 7A and FIG. 7B in another order, that is, the keycap 2041 is assembled to the scissors-type connection element 2042 first, and then the scissors-type connection element 2042 is assembled onto the first surface S1 of the bottom plate 2022.

[0034] FIG. 8 is a schematic cross-sectional view of a part of the structure of a keyboard device according to another embodiment of the present invention. Referring to FIG. 8, a key structure 20a of this embodiment is similar to the key structure 20 shown in FIG. 4 to FIG. 6, and a difference lies in that, an area A1 of a bottom surface 2031 of an elastic element 203 of this embodiment is larger than an area A2 of a through hole H in a bottom plate 2022 of a key frame 202. When the elastic element 203 passes through the key frame 202 and a part of the elastic element 203 is located in the through hole H, because of an elastic recovery force of the elastic element 203, the elastic element 203 and the through hole H are in a tight fit state. As the elastic element 203 and the through hole H are in a tight fit state, almost no gap exists between the elastic element 203 and an inner wall of the through hole H. Therefore, under such a structural design, external moisture may be effectively prevented from entering the bottom of the key frame 202 and causing damage to the thin-film circuit board 201.

[0035] In conclusion, each key structure of the keyboard device of the embodiments of the present invention has the key frame composed of the frame body and the bottom plate that are of an integrally formed structure, so that the key frame needs only one mold and can be produced in one step or by means of multi-shot injection molding, thereby effectively reducing the production cost of the keyboard. Moreover, because the key frame is of an integrally formed structure, no assembly joint exists between the bottom plate and the frame body, so that it is not easy for moisture to enter the keyboard device to cause damage to the thin-film circuit board, thereby effectively prolonging the service life of the keyboard device. In addition, on the condition that the key frame is of an integrally formed structure, in the keyboard device assembly process, the keycap and the scissors-type connection element are assembled from above the key frame, and the thin-film circuit board and the elastic element are assembled from below the key frame. In this way, the assembly process is simplified and requires fewer holes in the structure, thereby greatly improving waterproof and weather-resistant effects.

[0036] The above descriptions are only preferred embodiments of the present invention, and an implementation scope of the present invention shall not be limited by the embodiments. All simple equivalent changes and modifications made in accordance with the claims and the specification of the present invention are still within the protection scope of the present invention. In addition, any one of the embodiments or the claims of the present invention need not to achieve all the objectives or advantages or features disclosed in the present invention. Moreover, the abstract and the title are used only to assist in the search of patent documents, and are not used to limit the scope of the present invention. In addition, the terms first, second and the like mentioned in the specification or in the claims are only used to name elements or to distinguish between different embodiments or scopes, and are not used to limit the upper or lower limit of a quantity of the elements.