Abstract
A blister package comprises a plastic foil molding furnished with cavities and an opaque cover foil having at least one transparent region arranged outside of the cavities. The plastic foil molding defines the front side of the blister package and the opaque cover foil defines the back side of the blister package, and the blister package additionally has in a certain region, which is formed outside of the region of the cavities of the plastic foil molding and is arranged overlapping at least the transparent region of the opaque cover foil, a semi-transparent function layer. The semi-transparent function layer is constituted such that the blister package has in the transparent region of the opaque cover foil upon viewing in incident light a first, visually recognizable color and upon viewing in transmitted light has a second, visually recognizable color.
Claims
1. A blister package comprising: a plastic foil molding furnished with cavities; and an opaque cover foil having at least one transparent region arranged outside of the cavities, wherein the plastic foil molding defines the front side of the blister package and the opaque cover foil defines the back side of the blister package, and wherein the blister package further comprises a semi-transparent function layer in a certain region, which is formed outside of the region of the cavities of the plastic foil molding and is arranged overlapping at least the transparent region of the opaque cover foil, and wherein the semi-transparent function layer is constituted such that the blister package has in the transparent region of the opaque cover foil, upon viewing in incident light a first, visually recognizable color and upon viewing in transmitted light, a second, visually recognizable color.
2. The blister package according to claim 1, wherein the semi-transparent function layer is formed on a carrier substrate and the carrier substrate furnished with the semi-transparent function layer is arranged between the plastic foil molding and the opaque cover foil.
3. The blister package according to claim 1, wherein the semi-transparent function layer is formed on a carrier substrate, and the opaque cover foil is arranged between the plastic foil molding and the carrier substrate furnished with the semi-transparent function layer.
4. The blister package according to claim 1, wherein the semi-transparent function layer is formed either directly on the plastic foil molding or within the plastic foil molding.
5. The blister package according to claim 1, wherein the semi-transparent function layer has a multilayer construction having two semi-transparent metallic layers and a dielectric layer arranged between the two semi-transparent metallic layers.
6. The blister package according to claim 5, wherein the two semi-transparent metallic layers are formed independently of each other from a metal and the metal respectively is chosen from the group consisting of Al, Ag, Ni, Cr, Cu, Au and an alloy of one or several of the hereinabove mentioned elements and the dielectric layer is a SiO2 layer, a ZnO layer, an Al2O3 layer, a TiO2 layer, a layer of a nitride or oxynitride of the elements Si, Zn, Al or Ti or a MgF2 layer or a nitrocellulose layer, obtainable by printing technology.
7. The blister package according to claim 6, wherein the two semi-transparent metallic layers are chosen from Al or Ag and the dielectric layer is a Si02 layer.
8. The blister package according to claim 5, wherein the blister package in the transparent region of the opaque cover foil upon viewing in incident light appears gold-colored and upon viewing in transmitted light has a blue color tone.
9. The blister package according to claim 1, wherein the semi-transparent function layer is obtainable by printing technology by means of an effect pigment composition.
10. The blister package according to claim 1, wherein the opaque cover foil is a metallic foil and the transparent region of the opaque cover foil is formed in the form of a recess in the opaque cover foil.
11. The blister package according to claim 1, wherein the blister package is a blister for pharmaceutical products.
12. A method for manufacturing a blister package, the method comprising: providing a plastic foil molding furnished with cavities; providing an opaque cover foil having at least one transparent region; a covering the plastic foil molding furnished with the cavities with the cover foil such that the at least one transparent region is arranged outside of the cavities, the plastic foil molding defines the front side of the blister package and the opaque cover foil defines the back side of the blister package; and providing a semi-transparent function layer to the blister package in a certain region, which is formed outside of the region of the cavities of the plastic foil molding and is arranged overlapping at least the transparent region of the opaque cover foil, wherein the semi-transparent function layer is constituted such that the blister package has in the transparent region of the opaque cover foil, upon viewing in incident light, a first, visually recognizable color and upon viewing in transmitted light, a second, visually recognizable color.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) There are shown:
(2) FIGS. 1 to 7 an inventive blister package according to a first embodiment example;
(3) FIGS. 8 to 14 an inventive blister package according to a second embodiment example;
(4) FIG. 15 an alternative embodiment of the semi-transparent function layers represented in FIG. 2 or in FIG. 9; and
(5) FIG. 16 an further alternative embodiment of the semi-transparent function layers represented in FIG. 2 or in FIG. 9.
(6) FIGS. 1 to 7 illustrate the mode of function of an inventive blister package according to a first embodiment example. The blister package is described in the present example with the help of a tablet blister.
DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS
(7) FIG. 1 shows the cross-sectional view of a tablet blister 1 which comprises a transparent plastic foil molding 2 and an opaque cover foil 4. The block arrow 6 symbolizes the viewing of the tablet blister 1 from the front side, the block arrow 7 symbolizes the viewing of the tablet blister 1 from the back side. The opaque cover foil 4 is based on an aluminum foil furnished with a heat-seal coating with a thickness of 20 micrometers. The opaque cover foil 4 has transparent regions 5, namely recesses generated by means of punching or by means of laser cutting. Between the opaque cover foil 4 and the plastic foil molding 2, a carrier substrate furnished with a semi-transparent function layer 3 is arranged, namely a polyethylene terephthalate (PET) foil. The carrier substrate 3 furnished with a semi-transparent function layer is fastened by means of an adhesive layer with the plastic foil molding 2. The plastic foil molding 2 has cavities in which tablets are located (not shown in the figure).
(8) The semi-transparent function is based on the layer sequence 20 nm Ag/240 nm SiO.sub.2/20 nm Ag and shows a gold/blue color change in incident light/transmitted light viewing. The semi-transparent function layer is obtainable by means of vapor deposition.
(9) FIG. 2 shows the shape of the carrier substrate furnished with the semi-transparent function layer 3 in plan view. The carrier substrate 3 is left blank in the regions 8 which correspond to the contour lines of the cavities of the plastic foil molding 2.
(10) FIG. 3 shows the shape of the opaque cover foil 4 in plan view. The opaque cover foil 4 is left blank in the regions 5.
(11) FIG. 4 shows the front side of the tablet blister 1, namely the plastic foil molding 2, upon viewing in incident light. Optionally present perforations are represented with the reference number 10. The viewer perceives the tabloids 9 through the transparent plastic foil molding 2. As a background to the tablets 9, the viewer recognizes the carrier substrate furnished with the semi-transparent function layer 3 in the form of a homogeneous, gold-colored metallization.
(12) FIG. 5 shows the front side of the tablet blister 1, namely the plastic foil molding 2, upon viewing in transmitted light. The viewer perceives the tabloids 9 through the transparent plastic foil molding 2. As a background to the tablets 9, the viewer recognizes the carrier substrate furnished with the semi-transparent function layer 3 in the form of a homogeneous, gold-colored metallization, wherein the additional regions 11 represented by hatching are visible in light blue.
(13) FIG. 6 shows the back side of the tablet blister 1, namely the opaque cover foil 4 based on aluminum, upon viewing in incident light. The opaque cover foil 4 has the shape of a homogeneous, silver metallization, wherein in the regions of the recesses 12 the carrier substrate furnished with the semi-transparent function layer 3 is visible in the shape of a gold-colored metallization.
(14) FIG. 7 shows the back side of the tablet blister 1, namely the opaque cover foil 4 based aluminum, upon viewing in transmitted light. The opaque cover foil 4 has the figure of a homogeneous, silver metallization, wherein in the regions of the recesses 12 the carrier substrate furnished with the semi-transparent function layer 3 is visible in light blue.
(15) FIGS. 8 to 14 illustrate the mode of function of an inventive blister package according to the second embodiment example. The blister package is described in the present example with the help of a tablet blister.
(16) FIG. 8 shows the cross-sectional view of a tablet blister 13 which comprises a transparent plastic foil molding 14 and an opaque cover foil 15. The block arrow 18 symbolizes the viewing of the tablet blister 13 from the front side, the block arrow 19 symbolizes the viewing of the tablet blister 13 from the back side. The opaque cover foil 15 is based on an aluminum foil furnished with a heat-seal coating with a thickness of 20 micrometers. The opaque cover foil 15 has transparent regions 17, namely recesses generated by means of punching or by means of laser cutting. Above the opaque cover foil 15, on the side of the cover foil 15 distant to the plastic foil molding 14, a carrier substrate furnished with a semi-transparent function layer 16, namely a polyethylene terephthalate (PET) foil, is arranged. The carrier substrate 16 furnished with a semi-transparent function layer is fastened by means of an adhesive layer with the opaque cover foil 15. The plastic foil molding 14 has cavities in which tablets are located (not shown in the figure).
(17) The semi-transparent function is based on the layer sequence 20 nm Ag/240 nm SiO.sub.2/20 nm Ag and shows a gold/blue color change in incident light/transmitted light viewing. The semi-transparent function layer is obtainable by means of vapor deposition.
(18) FIG. 9 shows the shape of the carrier substrate furnished with the semi-transparent function layer 16 in plan view. The carrier substrate 16 is left blank in the regions 20 which correspond to the contour lines of the cavities of the plastic foil molding 14.
(19) FIG. 10 shows the shape of the opaque cover foil 15 in plan view. The opaque cover foil 15 is left blank in the regions 17.
(20) FIG. 11 shows the front side of the tablet blister 13, namely the plastic foil molding 14, upon viewing in incident light. Optionally present perforations are represented with the reference number 22. The viewer perceives the tabloids 21 through the transparent plastic foil molding 14. As a background to the tablets 21, the viewer recognizes the opaque cover foil 15 in the shape of a silver metallization, wherein in the regions of the recesses 23 the carrier substrate 16, which is arranged below the opaque cover foil 15 and furnished with the semi-transparent function layer, is visible in the shape of a gold-colored metallization.
(21) FIG. 12 shows the front side of the tablet blister 13, namely the plastic foil molding 14, upon viewing in transmitted light. The viewer perceives the tabloids 21 through the transparent plastic foil molding 14. As a background to the tablets 21, the viewer recognizes the opaque cover foil 15 in the shape of a silver metallization, wherein in the regions of the recesses 23 the carrier substrate 16, which is arranged below the opaque cover foil 15 and furnished with the semi-transparent function layer, is visible is light blue.
(22) FIG. 13 shows the back side of the tablet blister 13, namely the carrier substrate furnished with the semi-transparent function layer 16, upon viewing in incident light. The carrier substrate 16 furnished with the semi-transparent function layer has the shape of a gold-colored metallization, wherein in the regions of the recesses 24, the opaque cover foil 15 is visible in the shape of a silver metallization.
(23) FIG. 14 shows the back side of the tablet blister 13, namely the carrier substrate furnished with the semi-transparent function layer 16, upon viewing in transmitted light. The carrier substrate furnished with the semi-transparent function layer 16 has the figure of a gold-colored metallization and the regions 25 appear in light blue. In the regions of the recesses 24, the opaque cover foil 15 is visible in the shape of a silver metallization.
(24) A third embodiment example is based on the first embodiment example described in the FIGS. 1 to 7. The shape of the carrier substrate 3, shown in FIG. 2, furnished with the semi-transparent function layer is, however, modified to the effect that the carrier substrate furnished with the semi-transparent function layer is present not as an individual object, but in the form of a multiplicity, namely in form of the strips 26 shown in the FIG. 15.
(25) A fourth embodiment example is based on the second embodiment example described in the FIGS. 8 to 14. The shape of the carrier substrate 16, shown in FIG. 9, furnished with the semi-transparent function layer is, however, modified to the effect that the carrier substrate furnished with the semi-transparent function layer is present not as an individual object, but in the form of a multiplicity, namely in form of the strips 26 shown in the FIG. 15.
(26) A fifth embodiment example is based on the first embodiment example described in the FIGS. 1 to 7. The shape of the carrier substrate 3, shown in FIG. 2, furnished with the semi-transparent function layer is, however, modified to the effect that the carrier substrate furnished with the semi-transparent function layer is present not as an individual object, but in the form of a multiplicity, namely in form of the patches 27 shown in the FIG. 16.
(27) A sixth embodiment example is based on the second embodiment example described in the FIGS. 8 to 14. The shape of the carrier substrate 16, shown in FIG. 9, furnished with the semi-transparent function layer is, however, modified to the effect that the carrier substrate furnished with the semi-transparent function layer is present not as an individual object, but in the form of a multiplicity, namely in form of the patches 27 shown in the FIG. 16.
