Method and device for exposure of photosensitive layer
10852528 ยท 2020-12-01
Assignee
Inventors
Cpc classification
G03F7/70291
PHYSICS
G03F7/2057
PHYSICS
G03F7/2051
PHYSICS
G03F7/7005
PHYSICS
G03F7/70633
PHYSICS
G03F7/213
PHYSICS
G03F7/70575
PHYSICS
International classification
Abstract
A method for exposing a light-sensitive layer to light using an optical system, wherein at least one light beam is generated by respectively at least one light source and pixels of an exposure pattern grid are illuminated by at least one micro-mirror device with a plurality of micro-mirrors. An affine distortion takes place, in particular a shearing, of the exposure pattern grid.
Claims
1. A method for exposing a light-sensitive layer to light using an optical system, said method comprising: directing at least one light beam generated by at least one light source, respectively, to at least one micro-mirror device having one or more micro-mirrors to respectively illuminate one or more pixels to generate an image of the micro-mirror device; and effecting, via two cylinder lenses, a shearing of the generated image to form horizontal and/or vertical exposure pattern grid lines of a pattern grid to which the light-sensitive layer is exposed, each of the cylinder lenses having a cylinder axis, wherein greater than 50% of an energy of each of the pixels is found in a field of the light-sensitive layer having an image that directly corresponds with the pixel, and wherein a remaining amount of the energy of each of the pixels is distributed across adjacent fields to the field having the image that directly corresponds with the pixel.
2. The method according to claim 1, wherein the method includes arranging the horizontal and/or vertical exposure pattern grid lines obliquely.
3. The method of claim 1, wherein the two cylinder lenses are combined to form a compound lens.
4. A device for exposing a light-sensitive layer to light, the device comprising: at least one light source for respectively generating at least one light beam, at least one micro-mirror device toward which the light beam is directed by the light source, the micro-mirror device having one or more micro-mirrors configured to respectively illuminate one or more pixels to generate an image of the micro-mirror device, two cylinder lenses, each cylinder lens having a cylinder axis, the cylinder lenses being configured to effect a shearing of the generated image to form horizontal and/or vertical exposure pattern grid lines of a pattern grid to which the light-sensitive layer is exposed, wherein greater than 50% of an energy of each of the pixels is found in a field of the light-sensitive layer having an image that directly corresponds with the pixel, and wherein a remaining amount of the energy of each of the pixels is distributed across adjacent fields to the field having the image that directly corresponds with the pixel.
5. The device of claim 4, wherein the two cylinder lenses are combined to form a compound lens.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
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(8)
(9) In the figures identical components or components having the same function are marked with identical reference symbols.
DETAILED DESCRIPTION OF THE INVENTION
(10)
(11) Using fixing means 13 a substrate 10 is fixed to the substrate holder 11, the substrate 10 having a light-sensitive layer 9 from an exposable material on it, which is exposed to light by means of the device.
(12) The origin of a fixed-sample coordinate system K2 (i.e. fixed to the substrate 10/the light-sensitive layer 9) is preferably placed in the centre of the surface 9o of layer 9.
(13) A light beam 6 (primary beam), which is emitted by the light source 7 and, on the way to the DMD 1, may pass a number of optical elements (not shown), is changed by the DMD 1 into a structured light beam 6 (secondary beam). The beam may pass a number of optical elements, such as two cylinder lenses 12, 12, on the way to the layer 9.
(14) Using a semi-transparent mirror 14 a detector 19, in particular a camera, more preferably a CCD or CMOS camera, may directly detect and/or measure the surface 9o of the layer 9 to be exposed. The measuring results are preferably used to directly control the process and/or calibrate the device. In the description below and in the further figures a depiction of these measuring means has for clarity's sake been omitted. The measuring means according to the invention may however be used in any of the said inventive embodiments.
(15)
(16) The united light beam 6 is guided to the DMD 1 and converted by the same into a structured light beam 6, which again, on the way to layer 9, may pass a number of optical elements such as two cylinder lenses 12, 12.
(17) One, in particular autonomous, inventive aspect is that, above all, the two light sources 7 may be different with regard to radiation intensity, wavelength, coherence length and possibly further properties or parameters, so that a laser beam 6 with a plurality of different optical parameters can be generated.
(18) According to the invention in particular more than two light sources, in particular more than 5, more preferably more than 10, most preferably more than 20 light sources 7, 7 may be used. Each light source may preferably be a LED field or a laser diode (LD) field.
(19)
(20) A light beam 6 is emitted by the light source 7 and split by a beam splitter 14. A first split beam 6.1 is modified by a first DMD 1 to result in a first modified beam 6.1. The layer 9 is exposed to this first modified beam 6.1. The second split beam 6.2 is deflected by means of a mirror 14 in direction of a second DMD 1 and is then directed as a second modified beam 6.2 to the layer 9. Preferably the second modified beam 6.2 is directed at a position in the layer 9, which is different from the position at which the first modified beam 6.1 is directed. All said beams may pass through a number of optical elements, such as two cylinder lenses 12, 12.
(21) One, in particular autonomous, inventive aspect is that at least two DMDs 1 are used by means of which two positions of layer 9 can be exposed simultaneously, wherein preferably a single, in particular united, beam is used for acting on the DMDs. This leads, in particular, to a widening of the exposed section, in particular the exposed strip, and thus to an increase in throughput.
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(26) It is also feasible for exposure to take place at exposure pattern grid line intersections 25 and/or exposure pattern partial surfaces 26, 26, 26 and not within individual grid surfaces.
(27) The different exposure patterns 24, 24, 24 can in particular be created/modified by means of optical elements mounted upstream and/or downstream of the DMD 1 such as the two cylinder lenses 12, 12 illustrated downstream of the DMD 1 in
(28)
(29) The optical elements, such as the two cylinder lenses 12, 12 illustrated downstream of the DMD 1 in
LIST OF REFERENCE SYMBOLS
(30) 1 DMD 2 mirror surface 2kx, 2ky mirror surfaces edges 3 mirror 6 light beam (beam) 6 modified/structured beam 6.1 first split beam 6.1 first modified beam 6.2 second split beam 6.2 second modified beam 7,7 light source 8 optical system 9 layer 9o surface of the layer 10 substrate 11 substrate holder 12, 12 cylinder lenses 13 fixing means 14 mirror 14 beam splitter 14 semi-transparent mirror 19 detector 23 pixel 24, 24, 24 exposure pattern grid 25 exposure pattern grid line intersection 26, 26, 26 exposure pattern partial surface K1, K2, K3 coordinate systems K2x, K2y mutually orthogonal directions