A tubular ceramic component suitable for being used in a nuclear reactor
20200373022 · 2020-11-26
Assignee
Inventors
- Simon Middleburgh (Chester, GB)
- Lars HALLSTADIUS (Västerås, SE)
- Edward J. LAHODA (Pittsburgh, PA, US)
- Kenneth Görannson (Västerås, SE)
- Peng Xu (Columbia, SC, US)
Cpc classification
C04B35/00
CHEMISTRY; METALLURGY
G21C21/02
PHYSICS
C04B37/00
CHEMISTRY; METALLURGY
Y02E30/30
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
Abstract
A tubular ceramic component is provided for being used in a nuclear reactor. The component comprises an inner layer of silicon carbide, an intermediate layer of silicon carbide fibres in a fill material of silicon carbide, and an outer layer of silicon carbide. The intermediate layer adjoins the inner layer. The outer layer adjoins the intermediate layer. The silicon carbide of the inner layer, the fill material and the outer layer is doped and comprises at least one dopant in solid solution within crystals of the silicon carbide.
Claims
1-10. (canceled)
11. A tubular ceramic component suitable for being used in a nuclear reactor, comprising: an inner layer of silicon carbide, an intermediate layer of silicon carbide fibres in a fill material of silicon carbide, the intermediate layer adjoining the inner layer, and an outer layer of silicon carbide, the outer layer adjoining the intermediate layer; wherein the silicon carbide of the inner layer, the fill material and the outer layer is doped and comprises at least one dopant in solid solution within crystals of the silicon carbide.
12. The tubular ceramic component according to claim 11, wherein the dopant comprises at least one of the substances B, N, Al, P, O, Be, Li, S, Ti, Ge, P.sub.2O.sub.3, P.sub.2O.sub.5, Al.sub.2O.sub.3, AlN, Al.sub.4C.sub.3 and TiC.sub.1-x.
13. The tubular ceramic component according to claim 11, wherein the concentration of the dopant in the silicon carbide is 1-1000 ppm.
14. The tubular ceramic component according to claim 11, wherein the concentration of the dopant in the silicon carbide is 10-1000 ppm.
15. The tubular ceramic component according to claim 11, wherein the concentration of the dopant in the silicon carbide is 50-1000 ppm.
16. The tubular ceramic component according to claim 11, wherein the dopant comprises at least N, wherein the nitrogen is enriched to contain a higher percentage of the isotope .sup.15N than natural N.
17. The tubular ceramic component according to claim 11, wherein, the dopant comprises at least Boron (B), wherein the boron is enriched to contain a higher percentage of the isotope .sup.11B than natural B.
18. The tubular ceramic component according to claim 11, wherein the silicon carbide of the inner layer, the fill material and the outer layer has a concentration of secondary phases that is less than 1%.
19. The tubular ceramic component according to claim 11, wherein the tubular ceramic component forms a cladding tube of a fuel rod and encloses a pile of nuclear fuel pellets.
20. The tubular ceramic component according to claim 11, wherein the tubular ceramic component forms flow channel of a fuel assembly and encloses a plurality of fuel rods.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The invention is now to be explained more closely through a description of various embodiments and with reference to the drawings attached hereto.
[0028]
[0029]
[0030]
[0031]
DETAILED DESCRIPTION
[0032]
[0033] Furthermore, the fuel assembly 1 comprises, when intended to be used in a BWR, a flow channel 6 that surrounds and encloses the fuel rods 4.
[0034]
[0035]
[0036]
[0037] The inner layer 21 consists of homogeneous, preferably monolithic, silicon carbide. The intermediate layer 22 consists of silicon carbide fibres 25, 26 in a fill material 27 of homogeneous silicon carbide. The outer layer 23 consists of homogeneous, preferably monolithic, silicon carbide.
[0038] As can be seen in
[0039] It should be noted that the intermediate layer 22 also may comprise only one sublayer with silicon carbide fibres 25, 26, or more than two sublayers with silicon carbide fibres 25, 26.
[0040] The silicon carbide of the inner layer 21, of the fill material 27 and of the outer layer 23 is crystalline and doped with one or more dopants.
[0041] The dopants are present in solid solution within crystals of the crystalline silicon carbide of the inner layer 21, of the fill material 27 and of the outer layer 23.
[0042] The dopant, or dopants, may be added to the silicon carbide in various ways. For instance the dopants can be added during the process of depositing the silicon carbide onto the silicon carbide fibres 25, 26 and onto the intermediate layer 22.
[0043] In a first step, silicon carbide fibres 25, 26 may be wound in one or more sublayers to a tubular shape, for instance on a suitable form.
[0044] In a second step, silicon carbide may be deposited on the silicon fibres 25, 26 of the intermediate layer 22 to form the fill material 27. During the deposition process, the silicon carbide will penetrate the interspaces between the silicon carbide fibres 25, 26. The silicon carbide may be deposited by any suitable method such as sputtering, physical vapour deposition, PVD, chemical vapour deposition, CVD, etc. The dopant may then be added in advance to the silicon carbide to be deposited, or be mixed with the silicon carbide during the depositing process.
[0045] In a third step, the silicon carbide may be deposited to the intermediate layer 22 to form the inner layer 21 onto the intermediate layer 22 by any of the depositing methods mentioned above. The dopant may then be added in the same way as to the silicon carbide of intermediate layer 22.
[0046] In a fourth step, the silicon carbide may be deposited to the intermediate layer 22 to form the outer layer 23 onto the intermediate layer 22 by any of the depositing methods mentioned above. The dopant may then be added in the same way as to the silicon carbide of intermediate layer 22. The outer layer 23 may be deposited after or before the deposition of the inner layer 21.
[0047] According to another method, the dopant or dopants may be supplied during the manufacturing of the silicon carbide, for instance by adding the dopant or dopants to SiO.sub.2 and C in a so called Acheson furnace.
[0048] The concentration of the dopants in the silicon carbide of the inner layer 21, of the fill material 27 and of the outer layer 23 may be 1-1000 ppm, preferably 10-1000 ppm, more preferably 50-1000 ppm, and most preferably 50-500 ppm.
[0049] The silicon carbide of the inner layer 21, of the fill material 27 and of the outer layer 23 may contain a balance of possible residual substances in addition to the dopant or dopants.
[0050] The silicon carbide of the inner layer 21, of the fill material 27 and of the outer layer 23 has a concentration of secondary phases that is less than 1%.
[0051] The silicon carbide fibres 25, 26 are made of pure, or substantially pure, silicon carbide being free of dopants. A balance of possible residual substances may be present in the silicon carbide fibres 25, 26.
[0052] The dopants to be added to and comprised by the silicon carbide comprise at least one of the substances B, N, Al, P, O, Be, Li, S, Ti, Ge, P.sub.2O.sub.3, P.sub.2O.sub.5, Al.sub.2O.sub.3, AlN, Al.sub.4C.sub.3 and TiC.sub.1-x.
[0053] The silicon carbide may be doped by the addition of one of these substances, or with a combination of two or more of these substances.
B, Boron
[0054] B is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. Preferably, the boron is enriched to contain a higher percentage of the isotope .sup.11B than natural B in order to reduce the neutron absorption cross-section. B may be added as an element, for instance by sputtering, PVD or CVD.
N, Nitrogen
[0055] N is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. Preferably, the nitrogen is enriched to contain a higher percentage of the isotope .sup.15N than natural N in order to reduce the neutron absorption cross-section. N may be added as an element, for instance by sputtering, PVD or CVD. The element N is larger than C, and thus N may be effective to replace C-atoms in the silicon carbide.
Al, Aluminium
[0056] Al is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. Al may be added as an element, for instance by sputtering, PVD or CVD. Al may also be added as one of the compounds Al.sub.2O.sub.3, MN and Al.sub.4C.sub.3. Also in these cases, Al will be contained as an element in solid solution in the crystals of the silicon carbide. The element Al is larger than C, and thus Al may be effective to replace C-atoms in the silicon carbide.
P, Phosphorous
[0057] P is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. P may be added as an element, for instance by sputtering, PVD or CVD. P may also be added as one of the compounds P.sub.2O.sub.3 and P.sub.2O.sub.5. Also in these cases, P will be contained as an element in solid solution in the crystals of the silicon carbide. The element P is larger than C, and thus P may be effective to replace C-atoms in the silicon carbide.
O, Oxygen
[0058] O is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. O may be added as an element, for instance by sputtering, PVD or CVD. O may also be added as one of the compounds P.sub.2O.sub.3, P.sub.2O.sub.5 and Al.sub.2O.sub.3. Also in these cases, O will be contained as an element in solid solution in the crystals of the silicon carbide. The element O is larger than C, and thus O may be effective to replace C-atoms in the silicon carbide.
Be, Beryllium
[0059] Be is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. Be may be added as an element, for instance by sputtering, PVD or CVD.
Li, Lithium
[0060] Li is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. Li may be added as an element, for instance by sputtering, PVD or CVD.
S, Sulphur
[0061] S is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. S may be added as an element, for instance by sputtering, PVD or CVD. The element S is larger than both C and Si, and thus S may be effective to replace C-atoms and Si-atoms in the silicon carbide.
Ti, Titanium
[0062] Ti is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. Ti may be added as an element, for instance by sputtering, PVD or CVD. Ti may also be added as the compound TiC.sub.1-x. Also in this case, Ti will be contained as an element in solid solution in the crystals of the silicon carbide. The element Ti is larger than both C and Si, and thus Ti may be effective to replace C-atoms and Si-atoms in the silicon carbide.
Ge, Germanium
[0063] Ge is a possible dopant which may be contained in solid solution in crystals of the silicon carbide. Ge may be added as an element, for instance by sputtering, PVD or CVD. The element Ge is larger than both C and Si, and thus Ge may be effective to replace C-atoms and Si-atoms in the silicon carbide.
[0064] The present invention is not limited to the embodiments disclosed and discussed above, but may be varied and modified within the scope of the following claims.