METHOD AND APPARATUS FOR PROCESSING GLASS ELEMENTS
20200369551 · 2020-11-26
Assignee
Inventors
- Andreas ORTNER (Gau-Algesheim, DE)
- Ulla Trinks (Mitterteich, DE)
- Fabian Wagner (Mainz, DE)
- Carsten Etz (Ingelheim, DE)
- Daniela Seiler (Dittelsheim-Heßloch, DE)
- Michael Kluge (Offenbach, DE)
- Peter Czepelka (Mainz-Kostheim, DE)
- Frank-Thomas Lentes (Bingen, DE)
- André Witzmann (Waldershof, DE)
- Reiner Artmann (Mitterteich, DE)
Cpc classification
Y02P40/57
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B23K26/146
PERFORMING OPERATIONS; TRANSPORTING
B23K26/53
PERFORMING OPERATIONS; TRANSPORTING
C03B33/0955
CHEMISTRY; METALLURGY
B23K26/14
PERFORMING OPERATIONS; TRANSPORTING
C03B17/04
CHEMISTRY; METALLURGY
C03B33/06
CHEMISTRY; METALLURGY
B23K26/147
PERFORMING OPERATIONS; TRANSPORTING
C03B33/0215
CHEMISTRY; METALLURGY
C03B33/091
CHEMISTRY; METALLURGY
B23K26/0624
PERFORMING OPERATIONS; TRANSPORTING
C03B33/0222
CHEMISTRY; METALLURGY
International classification
C03B17/04
CHEMISTRY; METALLURGY
Abstract
A method for processing glass elements is provided. The method includes introducing a perforation line for parting a glass element introduced into the glass element during or after a hot processing process at an elevated temperature of at least 100 C. Spaced-apart filamentary flaws are introduced into the glass element along the predetermined course of the perforation line by a pulsed laser beam of an ultrashort pulse laser, and, during or after the introduction of the filamentary flaws, the glass element is cooled down so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, whereby the breaking force required for parting the glass element along the perforation line is reduced.
Claims
1. A method for processing glass elements, comprising: introducing a perforation line for parting a glass element during or after a hot processing process at an elevated temperature of at least 100 C., the perforation line comprising spaced-apart filamentary flaws along a predetermined course of the perforation line, wherein the spaced-apart filamentary flaws are introduced via a pulsed laser beam of an ultrashort pulse laser; and cooling the glass element, during or after the introduction of the filamentary flaws, so as to produce a temperature gradient that introduces a mechanical stress in the glass element at the filamentary flaws that reduces a breaking force required for parting the glass element along the perforation line.
2. The method of claim 1, wherein the hot processing process is selected from a group consisting of forming the glass element from a glass melt, ceramicizing of the glass element, shaping of the glass element into a hollow container or tube glass, thermal tempering, baking in of a ceramic colours, and coating of the glass element.
3. The method of claim 1, wherein the hot forming process comprises producing a glass ribbon with a thickness in the range from 0.01 mm to 20 mm.
4. The method of claim 1, wherein the elevated temperature is selected from a group consisting of below a temperature at which glass of the glass element has a viscosity of 10.sup.4 dPa.Math.s, below a glass transition temperature of glass of the glass element, and below a softening point of glass of the glass element.
5. The method of claim 1, wherein the cooling step comprises contacting the glass element with a medium selected from a group consisting of air, an aerosol, and a liquid.
6. The method of claim 1, wherein the cooling step comprises cooling at a cooling rate of at least 50 C. per second.
7. The method of claim 1, wherein the cooling step comprises cooling so that the temperature gradient is at least 50 C. per millimetre at the filamentary flaws.
8. The method of claim 1, wherein the step of introducing the perforation line comprises introducing the spaced-apart filamentary flaws at a position on the glass element where a temperature of the glass element is between 100 C. and 400 C. and/or where the temperature of the glass element is equal or less than to a lower cooling point of the glass.
9. A method for processing glass elements, comprising: pulsing, during or after a hot processing process, an ultrashort pulse laser so that a pulsed laser beam introduces spaced-apart filamentary flaws in a glass element along a perforation line while the glass element is still at an elevated temperature of at least 100 C.; and cooling the glass element, during or after the introduction of the filamentary flaws, so as to produce a mechanical stress in the glass element at the filamentary flaws that reduces a breaking force required for parting the glass element along the perforation line.
10. The method of claim 9, wherein the hot forming process comprises producing a glass ribbon from a glass melt.
11. The method of claim 9, wherein the cooling step comprises contacting the glass element with a medium selected from a group consisting of air, an aerosol, and a liquid.
12. The method of claim 9, wherein the hot processing process is selected from a group consisting of forming the glass element from a glass melt, ceramicizing of the glass element, shaping of the glass element into a hollow container or tube glass, thermal tempering, baking in of a ceramic colours, and coating of the glass element.
13. The method of claim 9, wherein the cooling step comprises cooling so that the temperature gradient is at least 50 C. per millimetre at the filamentary flaws.
14. An apparatus for processing a glass element, comprising: a hot processing device for hot forming the glass element; an ultrashort pulse laser arranged and aligned to radiate a laser beam onto a glass element in a region of the hot processing device where the glass element still has a temperature of at least 100 C., the laser beam being sufficient to introduce filamentary flaws into the glass element; a moving device configured and positioned to move a point of impingement of the laser beam with respect to the glass element along a perforation line; and a cooling device configured to cool down the glass element during or after the introduction of the filamentary flaws so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws, such that a breaking force required for parting the glass element along the perforation line is reduced.
15. The apparatus of claim 14, wherein the hot processing device is configured to form the glass element from a glass melt from a process selected from a group consisting of a down-draw process, an up-draw process, an overflow-fusion process, a redraw process, a float process, a Danner process, and a Vello process.
16. The apparatus of claim 14, wherein the hot processing device is configured to form the glass element as a glass ribbon along a longitudinal direction, the moving device being configured and positioned to form the perforation line along the longitudinal direction at strip-shaped edge regions of the glass ribbon.
17. The apparatus of claim 14, wherein the cooling device comprises a device for quenching the glass element in a liquid.
18. The apparatus of claim 14, wherein the cooling device comprises a nozzle for emitting a cooling fluid jet onto the glass element.
19. The apparatus of claim 18, further comprising a processing head housing the ultrashort pulse laser and the cooling device so that the point of impingement of the laser beam on the glass element lies in the cooling fluid jet.
20. The apparatus of claim 18, wherein the cooling device is arranged such that the cooling fluid jet is directed onto the glass element in an opposite direction from a direction of the point of impingement of the laser beam on the glass element.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The invention is explained more precisely below on the basis of and with reference to the accompanying drawings.
[0022]
[0023]
[0024]
[0025]
[0026]
[0027]
[0028]
[0029]
DETAILED DESCRIPTION
[0030]
[0031] The apparatus 2 generally comprises a device 13 for introducing a perforation line 3 into the glass element 1. The perforation line 3 represents a deliberate predetermined breaking point or weakening of the material, such that the glass element 1 can be easily parted later along the perforation line 3. The device 13 comprises an ultrashort pulse laser 7, which is arranged and aligned such that it radiates onto the glass element 1, here that is the glass ribbon 100, in a region of the apparatus 2 for processing glass elements 1 in which the glass element 1 still has a temperature of at least 100 C.
[0032] As can be seen from the figure, the point of impingement of the laser beam 5 is however preferably at a position that is further away from the nozzle than the position 21 at which the glass reaches the glass transition temperature. The temperature of the glass consequently generally lies in a range between 100 C. and the glass transition temperature.
[0033] Generally, as shown, a beam-shaping optical unit 4 may be provided, in order to adapt the laser beam. In particular, the beam-shaping optical unit 4 can focus the laser beam 5, in order to increase the power density in the glass. The individual filamentary flaws 9 run in their longitudinal direction transversely, preferably perpendicularly, to the surface of the glass element 1, following the direction of propagation of the laser beam 5.
[0034] In the case of the example shown, the processing of the glass element 1 comprises the separation into individual glass sheets 101. The perforation lines 3 provide a controlled, clean break here. In order to introduce the perforation lines 3, comprising filamentary flaws 9 lying next to one another, in this example running perpendicularly to the plane of representation and perpendicularly to the longitudinal direction of the glass ribbon 100, the laser beam 5 is accordingly moved over the ribbon 100 perpendicularly to the longitudinal direction. For this purpose, a moving device 15 is provided, in order to move the point of impingement of the laser beam 7 along an intended course of the perforation line 3. This may involve both the laser beam being guided over the glass, and the glass being guided past the laser beam. Similarly, a combination of the two variants is possible. In order to move the laser beam 5 perpendicularly to the direction of movement of the glass ribbon 100, for example a galvanometer scanner may be used. Since the glass ribbon 100 at the same time advances of its own accord, the moving device 15 may guide the laser beam 5 over the glass elements 1 slightly obliquely, in order to compensate for the movement of the glass ribbon. The galvanometer scanner is therefore shown here arranged slightly obliquely. In order in this embodiment to ensure a course of cut that runs perpendicularly to the edge of the glass ribbon, the oblique positioning of the scanning mirror is dependent on the speed of the glass ribbon, and may be adapted if necessary.
[0035] Due to the special ambient conditions in the vicinity of the hot forming process, in particular in the case of forming from a glass melt as in the example shown, it is of advantage if, as shown, the beam-shaping optical unit 4 and further components of the device 13, if necessary, are arranged in a cooled enclosure 8. In particular, the laser 7 and/or the moving device 15 may also be arranged in the cooled enclosure 8. A cooled enclosure may advantageously be provided generally for an apparatus 2, without being restricted to the example of
[0036] Once the perforation lines 3 comprising filamentary flaws 9 lying next to one another have been introduced, finally the individual glass sheets 101 may be cut off. One advantage of the method is that the distance that the glass covers can be shortened, since the preparation for separating is carried out while the glass is still hot. At the high temperatures of the glassas explained abovethe filamentary flaws introduced are generally not as pronounced as they are when processing at room temperature. In order nevertheless to achieve reliable and easy separability, during or after the introduction of the filamentary flaws 9 the glass element 1 is cooled down in a spatially confined manner, i.e. in the vicinity of the filamentary flaws, so as to produce a temperature gradient, which induces a mechanical stress at the filamentary flaws 9, whereby the breaking force required for parting the glass element 1 along the perforation line 3 is reduced. For this purpose, the apparatus 2 for processing glass elements 1 has a cooling device 17, which is arranged such that it cools down the glass element 1 during or as soon as possible directly after the introduction of the filamentary flaws 9 the glass element 1 such that the temperature gradient mentioned is produced. Particularly in the case of thin glasses, a high cooling rate is favourable in this case, in order to build up sufficient stresses. The cooling rate is preferably at least 50 C. per second.
[0037] According to a particularly preferred embodiment, the cooling device 17 comprises a nozzle 20 for emitting a cooling fluid jet 18. The cooling may for example take place by blasting with air, other gaseous media or aerosols (gas-liquid mixtures), preferably with air as a carrier. The cooling fluid may also be a liquid jet. According to one embodiment of the invention, it is therefore provided, without being restricted to the specific example shown, that the cooling down takes place by blasting with air or an aerosol or by spraying on of a liquid.
[0038] In a further embodiment, the cooling down is carried out by quenching in a cooler liquid preferred temperature lower than room temperature, particularly preferably lower than 0 C. This embodiment may take place as an alternative or in addition to the blasting. For example, after a first, more cautious cooling down by blasting, a rapid cooling down by quenching may take place.
[0039]
[0040] As a result of the process, this is accompanied by the forming of a so-called border (i.e. a bead-like thickening) at the two edges of the glass ribbon, which can be cut off inter alia by a laser process, for example with a CO.sub.2 laser or with an ultrashort pulse laser. Because of the high breaking forces expended during the separating operation, this may be accompanied by cracks running into the glass ribbon, which may lead to destruction of the glass ribbon. Therefore, as shown in the example, the glass ribbon coming from the hot forming zone is filamented in the border region by means of two ultrashort pulse lasers 7, and directly thereafter cooled locally on one or both sides along the perforation line 3 by means of cooling devices 17 in the form of cooling nozzles. The cooling rate may be adapted here by controlling the flow rate of the cooling fluid to the process parameters (glass ribbon temperature and advancing rate) of the respective hot forming process, in order to prevent influencing of the glass ribbon 100 in the quality surface (producing stresses in the glass ribbon). The glass ribbon 100 prepared in this way may be cut off in the cold state (for example during or after the deflection into a horizontal part of the production line) by introducing a mechanical stress. One possibility for this is that of taking the perforation line 3 over a crowned roller.
[0041] The borders 102 run along the edges of the glass ribbon 100 in the longitudinal direction. Accordingly, the perforation lines 3 are also introduced in the longitudinal direction of the glass ribbon near the edges. In the case of this embodiment of the invention, the laser beam 5 may remain essentially fixed in place. The moving device 15 comprises here in particular drawing rollers 25, which draw off the glass ribbon 100 and consequently move it past the device 13 for introducing the perforation line 3, in particular past the one or more ultrashort pulse lasers.
[0042] Generally, without being restricted to the specific example shown, in summary according to one embodiment, a hot processing apparatus 11 is provided in the form of a hot forming apparatus 110 for drawing a glass element 1 in the form of an elongated glass ribbon 100, wherein the device 13 for introducing a perforation line 3 is set up for introducing perforation lines in the longitudinal direction of the glass ribbon 100 at which strip-shaped edge regions which each have a thickened border 102 can be cut off. As shown, the moving device 15 may comprise a drawing device, in particular drawing rollers 25. The embodiment can be applied analogously to other drawing processes, such as the up-draw process, the overflow-fusion process and the redraw process, and also to tube drawing processes, in particular to the Danner process or the Vello process.
[0043]
[0044] Also in the case of the embodiment shown in
[0045] Preferably, the temperature at the outlet of the annealing lehr is between 100 C. and 400 C. This is also a preferred temperature range generally, independently of the hot processing process. Likewise preferred is introduction of the perforation line 3 at a temperature at or below the lower cooling point, that is to say at a temperature at which the viscosity of the glass is at least 10.sup.13 dPa.Math.s. This condition is typically met at the outlet of the annealing lehr. The temperature below the lower cooling point makes it possible to avoid the buildup of undesired permanent stresses during the cooling down by the cooling device 17. Therefore, according to a development of the invention, the perforation line line 3 is introduced at a position on the glass element 1 at which at least one of the aforementioned conditions is satisfied, that is to say a temperature in the stated range between 100 C. and 400 C. or below the lower cooling point. It goes without saying that this development of the invention is not restricted to the float process, but instead the stated temperature ranges can be used when introducing the perforation line in the case of all hot processing processes.
[0046] The float process is suitable particularly for the production of thicker glasses, with thicknesses in the range from 0.3 mm to 8 mm, preferably up to 4 mm. Such thicker glasses can however also be produced by the other stated drawing processes. Generally, without being restricted to the specific embodiments shown in
[0047] There follows a description of examples for separating glass tubes. In this case, glass tubes (material: Fiolax clear; diameter: 6.85 mm; inner diameter: 4.85 mm) were heated in a tubular kiln to about 304 C. The temperature was measured with a pyrometer. The glass tubes were removed from the furnace and filamented along a circumferential circle directly while being rotated on a motor-driven spindle.
[0048] In a first series of measurements, the glass tubes 103 provided with a perforation line 3 were allowed to cool down without active cooling. In a second series of measurements, the glass tubes 103 were quenched with water. As a comparative test, in a third series of measurements, the glass tubes were processed with the ultrashort pulse laser at room temperature. Finally, in a fourth series of measurements, after filamenting at 304 C., the glass tubes 103 were cooled by forced cooling with a cooling nozzle by applying an air/water cooling mixture, or an air-water aerosol, along the perforation line. The volumetric flow was 0.2 ml/min. For each series of measurements, at least 24 samples were tested. The strength of the perforation lines 3 was determined in a modified flexural strength test in accordance with DIN EN 843-1 by determining the average breaking stress, or the Weibull parameter.
[0049]
TABLE-US-00001 Breaking force Number of average value Variance Series of measurements: samples N N M1: perforation line 24 154.86 49.12 introduced at 304 C., slow cooling down M2: perforation line 24 118.08 34.44 introduced at 304 C., cooling by quenching. M3: 25 94.06 2.66 M4: 30 42.49 4.41
[0050] It was found that, with defined local force cooling after filamentation in the hot state, the breaking forces are only half as great (with comparable variance) than in the case of filamentation at room temperature. With uncontrolled cooling over the surface area of the substrate after filamentation in the hot state, on the other hand, although the breaking forces are on average increased by more than 50% in comparison with the conditions at room temperature, the values still lie well below the breaking forces that occur in the case of slow cooling down.
[0051] Incidentally, only series of measurements 2 shows a distribution of the breaking force values that approximates a Weibull distribution. For the average value of 118 N and a variance of 34 N, here a characteristic value of 130 N and a Weibull modulus of 4.0 can also be calculated. The examples show that, with the invention, generally significant reductions of the breaking forces can be achieved.
[0052] In the case of the example of
[0053]
[0054] Without restricting generality, the procedure described here, with filamentation on the hot glass and subsequent active cooling, may be performed in such a way that eitheras described abovethe two processes, that is to say introducing the perforation line with the ultrashort pulse laser and cooling, are carried out separately one after the other or else also take place at the same time. In the latter variant, it is possible to resort to the method of laser welding, in which the process gases are supplied to the working volume of the laser beam through a suitably designed welding head and, instead of the process gases, here the corresponding coolant is already supplied during the filamentation. According to one embodiment of an apparatus according to the invention for processing glass elements, it is provided in this respect that the device 13 for introducing a perforation line 3 comprises a head by which the laser light is radiated and the cooling fluid, in particular the cooling jet, is directed onto the glass element 1.
[0055] All of the examples shown have in common that the cooling takes place in a locally confined manner during or after the filamentation. Without being restricted to the specific examples shown, this is generally of advantage, in order to avoid stresses in the glass.
[0056] The invention is not restricted to the hot forming processes shown in the previous figures. Further hot processing processes are the baking in of ceramic colours, or decorations, and also coating processes, in which the glass is kept at an elevated temperature. Without being restricted to specific exemplary embodiments, according to one embodiment of the invention it is in this case provided that the hot processing process comprises at least one of the processes: ceramicizing of the glass element 1 for producing glass ceramic, shaping of a glass element in the form of a hollow, container or tube glass, thermal tempering, baking in of ceramic colours, and also the coating of the glass element.
LIST OF REFERENCE NUMERALS
[0057]
TABLE-US-00002 Glass element 1 Apparatus for processing glass elements 2 Perforation line 3 Beam-shaping optical unit 4 Laser beam 5 Ultrashort pulse laser 7 Cooled enclosure 8 Filamentary flaw 9 Apparatus for hot processing glass elements 11 Device for introducing a perforation line 13 Moving device 15 Cooling device 17 Cooling fluid jet 18 Nozzle 20 Position at temperature T.sub.g 21 Drawing roller 25 Spindle 26 Float apparatus 28 Melt tank 29 Float tank 31 Tin bath 33 Annealing lehr 35 Separating device 37 Transporting roller 39 Lens 40 Mandrel 42 Channel 44 Glass ribbon 100 Glass sheet 101 Border 102 Glass tube 103 Areas of 1 105, 106 Hot forming apparatus 110 Glass melt 111 Processing head 130 Channel 131 Spindle 151 Motor 152