Seton for treating fistulae, and a method of forming a closed loop of a seton
10842475 ยท 2020-11-24
Assignee
Inventors
- Tim Horeman (Leiden, NL)
- Willem Nerkens (The Hague, NL)
- Freek Van Delft (Oestgeest, NL)
- Wilhelmus Adrianus Bemelman (Vinkeveen, NL)
Cpc classification
A61B17/0487
HUMAN NECESSITIES
A61B17/0057
HUMAN NECESSITIES
A61M27/002
HUMAN NECESSITIES
A61B2017/06019
HUMAN NECESSITIES
International classification
Abstract
A size-adjustable seton (1) for treating fistulae (32) is provided with first and second wire ends (4, 6), which are provided with connecting means (8, 10) for, in a connected state, forming a smooth connection (12); in such a way, the seton (1) is a smooth, closed loop (3). The invention also relates to a method of forming the closed loop using the aforesaid seton (1), and a melt clamp (40) for use when placing the seton (1) in a person (30).
Claims
1. A seton for treating a fistula, comprising: a wire having an elongate and flexible tubular structure on the order of ten times longer than it is wide, a first wire end, a second wire end and an inner surface extending in a longitudinal direction from a first wire end inner surface to a second wire end inner surface; and a connection body including a first insertion portion having a first outer surface in the longitudinal direction of the wire at least partially conformed to the first wire end inner surface enabling a smooth connection in the longitudinal direction of the wire such that the seton becomes a smooth, closed loop.
2. The seton as set forth in claim 1, wherein the connection body, the wire or both include a thermoplastic material for providing the smooth connection.
3. The seton as set forth in claim 1, wherein the connection body, the wire or both include a light-curable material for providing the smooth connection.
4. The seton as set forth in claim 1, wherein the connection body, the wire or both include a chemically-curable material for providing the smooth connection.
5. The seton as set forth in claim 1, wherein the wire is formable in shape.
6. The seton as set forth in claim 1, wherein the wire has a circular cross-section, with a wire diameter optionally in a range of 0.5 mm to 5 mm, and more optionally in a range of 1.5 mm to 2.5 mm.
7. The seton as set forth in claim 1, wherein cutting of the wire to adjust wire length does not affect the smooth connection or the seton becoming the smooth, closed loop.
8. The seton as set forth in claim 1, wherein the connection body is further provided with a second insertion part having a second outer surface in the longitudinal direction of the wire which is at least partially conformed to the second wire end inner surface recess to support the smooth connection in the longitudinal direction of the wire.
9. The seton as set forth in claim 8, wherein the connection body between the first insertion part and the second insertion part comprises a transverse thickening.
10. The seton as set forth in claim 8, wherein the connection body has a different color relative to one or more colors of the wire and the wire ends.
11. The seton as set forth in claim 1, wherein the connection body provides an intermediate pin structure or plug structure, such that the first and second wire ends can connect with each other.
12. The seton as set forth in claim 1, wherein the connection body is substantially shorter than the wire.
13. The seton as set forth in claim 12, wherein the connection body has a length no more than half that of the wire.
14. The seton as set forth in claim 1, wherein the wire and the connection portion provide a smooth connection in the longitudinal direction of the wire such that the seton becomes the smooth, closed loop with a substantially constant cross-section at the connection.
Description
BRIEF DESCRIPTION OF THE FIGURES
(1) Next, exemplary embodiments of the invention, only in way of example, will be described with reference to the accompanying diagrammatic drawings, in which corresponding parts designated by corresponding reference symbols are shown; in respect of the accompanying diagrammatic drawings:
(2)
(3)
(4)
(5)
(6) The drawings are only intended for illustrative purposes, and should not limit the scope of protection which is defined by the claims.
DESCRIPTION OF EMBODIMENTS
(7) Referring to
(8) In
(9) In
(10) According to another embodiment shown in
(11) In a further embodiment (not shown), the wire 2 is formed as a solid cylindrical structure with a cylindrical second wire end that forms the first plug-in part, and with the first wire end having a thickened thermoplastic compound structure that contains a cylindrically shaped first recess along the longitudinal direction of the wire, wherein the cylinder-shaped first insertion part can be received. By melting the thickened connection structure around the second wire end, the smooth connection is thereby formed. The length of the cylindrical wire that is desired to be advanced to the second wire end can be shortened, for example by a cutting operation.
(12) The seton 1 described in the foregoing, together with alternative embodiments of the seton 1 according to the first aspect, can be manufactured into a smooth, closed loop 3 in the longitudinal direction S of the wire 2, by forming of the wire ends 4, 6 and connecting means 13-28 to form a smooth connection 8. Such a seton 1 with the smooth connection 8 can be, for example, achieved by means of a melt clamp 40 according to a third aspect, one of which embodiment is described below in detail.
(13) In
(14) The portable melt clamp 40 comprises a melt source 48 in the receiving area 46, adapted for applying thermal energy to the connecting means. By employing such a fusing terminal provided by way of the portable melt clamp 40, it is possible, in a very simple manner, to form the thermoplastic material in the connecting means of the seton 1 to provide a smooth joint 8 in a controlled manner.
(15) The portable melt clamp 40 has a locking mechanism 54 for holding the clamping members 42, 44 in a closed state when supplying thermal energy to the connecting means, when present in the receiving area 46. The portable melt clamp 40 is optionally provided with a spring element 56 to force the arms 43, 45 mutually away from each other, thereby causing the clamping parts 42, 44 to open, for example, when the locking mechanism 54 is turned off. Moreover, the portable melt clamp 40 optionally comprises a cooling element 49 in the receiving area 46, for extracting thermal energy from the connecting parts when in a smooth mutually connected state.
(16) The portable melt clamp 40 has a control unit 50 for controlling the melt source 48, the cooling element 49, and the locking mechanism 54. By using the cooling element 49, the thermal energy associated with a previous step fed to the thermoplastic connecting means can be removed, after formation of the smooth wire connection. Such an approach enables the thermoplastic material to solidify faster, so that the smooth connection can be achieved very quickly.
(17) In
(18) It will be appreciated that the above described embodiments, are described only by way of example and not limiting in any sense, and that various changes and modifications are possible without departing from the scope of the invention and that the scope is determined only by the appended claims.
(19) TABLE-US-00001 LIST OF REFERENCE SIGNS 1: seton 20: first outer surface 43: first arm 2: wire 21: transverse thickening 44: the second clamping part 3: smooth closed loop 22: the second recess 45: second arm 4: first wire end 24: the second inner 46: receiving area surface 6: second wire end 26: the second insertion 48: melt source portion 8: smooth connection 28: second outer surface 49: cooling element 10: tube 29: sleeve 50: control unit 12: inner surface 30: patient 52: optical indicator 13: thermo-plastic 32: fistula 54: locking mechanism connection body 14: the first recess 34: fistula tract 56: spring 16: first inner surface 40: melt clamp 18: first insertion 42: first clamping means portion A: cross section S: longitudinally 1: first diameter
REFERENCES
(20) 10 [1] DROP, J G. Integrated Circuit Personalization at the Module Level, IBM tech. dis. bull. October 1974, Vol. 17, No. 5, p. 1344-1345, ISSN 2345-6789.