Rotogravure cylinders, intermediates and methods
10844505 ยท 2020-11-24
Assignee
Inventors
Cpc classification
B32B15/017
PERFORMING OPERATIONS; TRANSPORTING
B32B1/00
PERFORMING OPERATIONS; TRANSPORTING
B65B61/26
PERFORMING OPERATIONS; TRANSPORTING
B41C1/18
PERFORMING OPERATIONS; TRANSPORTING
C25D5/10
CHEMISTRY; METALLURGY
Y10T428/1275
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B41N1/20
PERFORMING OPERATIONS; TRANSPORTING
International classification
C25D5/10
CHEMISTRY; METALLURGY
B65B61/26
PERFORMING OPERATIONS; TRANSPORTING
B32B1/00
PERFORMING OPERATIONS; TRANSPORTING
B41C1/18
PERFORMING OPERATIONS; TRANSPORTING
B41N1/20
PERFORMING OPERATIONS; TRANSPORTING
B32B15/01
PERFORMING OPERATIONS; TRANSPORTING
Abstract
An intermediate rotogravure product has a cylindrical case onto which a circumferential copper layer extends, the circumferential copper layer having a characteristic surface roughness Rz and porosity. A copper engraving layer is on the circumferential copper layer. A method for engraving into adds a copper engraving layer, followed by engraving a predetermined pattern. A rotogravure cylinder product and method add a copper engraving layer on the circumferential copper layer that can be engraved in accordance with a predefined pattern and protected with a protection layer.
Claims
1. An intermediate product comprising a cylindrical base of aluminum onto which a circumferential copper layer extends, the base and the circumferential copper layer having a mutual interface, wherein the circumferential copper layer as applied to the base and prior to application of a layer thereover has a plurality of properties including a thickness of at most 100 m, a surface roughness Rz of less than 0.5 m and a porosity of less than 1.0%, wherein the circumferential copper layer is formed from melted or partially melted and cooled copper particles, whereby the circumferential copper layer imparts compressive stress onto the underlying base, and wherein the intermediate product further comprises a copper engraving layer that is present on the circumferential copper layer.
2. The intermediate product as claimed in claim 1, wherein the porosity is less than 0.5%.
3. The intermediate product as claimed in claim 1, wherein the surface roughness Rz is between 0.2 and 0.4 m.
4. The intermediate product as claimed in claim 1, wherein the circumferential copper layer has a thickness of at most 50 m.
5. The intermediate product as claimed in claim 1, wherein the interface between the base and the circumferential copper layer has a bond strength of more than 15N.
6. The intermediate product as claimed in claim 5, wherein the bond strength is about 70N.
7. The intermediate product as claimed in claim 1, wherein the circumferential copper layer is obtained by spraying of copper particles with a jet velocity of at least 1,000 m/s.
8. The intermediate product as claimed in claim 1, wherein the copper engraving layer is selected from the group consisting of pure copper, copper with small addition of other materials and copper alloys.
9. The intermediate product as claimed in claim 1, wherein the circumferential copper layer is selected from the group consisting of pure copper, copper with small addition of other materials and copper alloys.
10. A method for engraving into an intermediate product that is a cylindrical base of aluminum onto which a circumferential copper layer extends, the base and the circumferential copper layer having a mutual interface, wherein the circumferential copper layer as applied to the base and prior to application of a layer thereover has a plurality of properties including a thickness of at most 100 m, a surface roughness Rz of less than 0.5 m and a porosity of less than 1.0%, wherein the circumferential copper layer is formed from melted or partially melted and cooled copper particles, whereby the circumferential copper layer imparts compressive stress onto the underlying base, and wherein the intermediate product further comprises a copper engraving layer that is present on the circumferential copper layer, comprising engraving a predetermined pattern into the copper engraving layer.
11. A rotogravure cylinder comprising a cylindrical base of aluminum onto which a circumferential copper layer extends, the base and the circumferential copper layer having a mutual interface, wherein the circumferential copper layer as applied to the base and prior to application of a layer thereover has a plurality of properties including a thickness of at most 100 m, a surface roughness Rz of less than 0.5 m and a porosity of less than 1.0%, wherein the circumferential copper layer is formed from melted or partially melted and cooled copper particles, whereby the circumferential copper layer imparts compressive stress onto the underlying base, and wherein the cylinder further comprises a copper engraving layer that is present on the circumferential copper layer and that is engraved in accordance with a predefined pattern and protected with a protection layer.
12. The rotogravure cylinder as claimed in claim 11, wherein the surface roughness Rz is between 0.2 and 0.4 m.
13. The rotogravure cylinder as claimed in claim 11, wherein the copper engraving layer is selected from the group consisting of pure copper, copper with small addition of other materials and copper alloys.
14. The rotogravure cylinder as claimed in claim 11, wherein the circumferential copper layer is selected from the group consisting of pure copper, copper with small addition of other materials and copper alloys.
15. A method of manufacturing rotogravure cylinders, wherein a circumferential copper support layer is provided onto a cylindrical base of aluminum, and a copper engraving layer is engraved according to a desired pattern and protected with a protection layer, wherein the provision of the circumferential copper support layer is arranged to obtain a layer as applied to the base and prior to application of a layer thereover has a plurality of properties including a thickness of at most 100 m, with a surface roughness Rz of less than 0.5 m and a porosity of less than 1.0%, wherein the circumferential copper layer is formed from melted or partially melted and cooled copper particles, whereby the circumferential copper layer imparts compressive stress onto the underlying base.
16. The method as claimed in claim 15, wherein the circumferential copper layer is obtained by spraying of copper particles with a jet velocity of at least 1,000 m/s.
17. A method of printing packaging material with rotogravure cylinders, wherein a circumferential copper support layer is provided onto a cylindrical base of aluminum, and a copper engraving layer is engraved according to a desired pattern and protected with a protection layer, wherein the provision of the circumferential copper support layer is arranged to obtain a layer as applied to the base and prior to application of a layer thereover to have a plurality of properties including a thickness of at most 100 m, a with a surface roughness Rz of less than 0.5 m and a porosity of less than 1.0%, wherein the circumferential copper layer is formed from melted or partially melted and cooled copper particles, whereby the circumferential copper layer imparts compressive stress onto the underlying base, applying ink to the rotogravure cylinder and transferring at least some of the ink from the rotogravure cylinder to the packaging material.
Description
BRIEF INTRODUCTION OF THE FIGURES
(1) These and other aspects of the invention will be further elucidated with respect to the following figures, wherein:
(2)
(3)
(4)
ILLUSTRATED DISCUSSION OF DETAILED EMBODIMENTS
(5) The
(6) The term rotogravure cylinders relates herein to rotogravure cylinders and/or any gravure cylinders used in the printing industry, particularly for the printing of packaging materials. The length of such cylinders is typically at least 1.0 meter, more preferably in the order of 1.5-2.5 meter.
(7) The term cylindrical base as used in the context of the present invention does not require the base to be a block-like material. Rather the base may be hollow. Alternatively, the base may comprise several layers, such as a steel core and an aluminium top layer.
(8) The term aluminum in the present invention refers to pure aluminum, aluminum with small addition of other materials or aluminum alloys. Likewise, the term copper refers to pure copper, copper with small addition of other materials or copper alloys. Most suitably, however, in the process in accordance with a preferred embodiment of the invention, particles are sprayed that contain at least 99% copper, more preferably at least 99.5% copper or more.
(9) The term high velocity spraying relates to a spraying process wherein particles are sprayed with a velocity of at least 300 m/s, more preferably at least 500 m/s, at least 800 m/s or even at least 1,000 m/s. Preferably, use is made of a jet with a velocity above the said particle velocity. Generation of a supersonic jet is considered most advantageous. Herein, the jet velocity may be higher than 1,400 m/s.
(10) High velocity spraying may for instance be implemented with High-Velocity Air Fuel (HVAF) technology and guns as commercially available from UniqueCoat Technologies, LLC from Oilville, Va. 23129, USA.
(11) The term at least partial melting refers to a process wherein at least the surface of individual particles is melted so as to create a homogeneous layer. It is not excluded that inner cores of the said particles remain in solid form. It is moreover not excluded that the circumferential layer created by melting of copper particles is actually an alloy with some aluminium of the underlying cylindrical base. Such an alloy may well be created, particularly close to the interface with the cylindrical base. The composition of the circumferential layer further away from the cylindrical base may thus be different from the composition near to said interface.
(12) In the preferred embodiment wherein the copper particles are sprayed onto the base in a high velocity process, it is foreseen that the impact of the copper particles onto the base may result in deformation and fracture of the top layer of the base. Such deformation is deemed beneficial so as to obtain a larger interface area and/or some mechanical anchoring of the copper into the aluminium. The subsequent melting and furthermore the thinning step are highly suitable in combination therewith, so as to ensure appropriate dimensions and particularly appropriate roundness when seen in cross-sectional view perpendicular to an axial direction of the cylindrical base.
(13) In one preferred embodiment, a gravure cylinder with an aluminium base was produced from an aluminum tube to the desired dimensions. Thereafter, a high velocity spraying process was used for spraying of copper particles. Use was made of a gun as available from UniqueCoat Technologies, LLC, as sold as M3. The copper particles, with an average diameter of less than 50 m, preferably in the range of 40-45 m, were sprayed with a jet velocity of 1,200-1,400 m/s, resulting in a particle velocity of 900-1000 m/s. During the spraying process, the cylinder was rotated. Impact of the substantially pure copper particles onto the cylinder resulted in deformations in the aluminum cylinder, and in heating up of the particles, to the extent of at least partial melting. This melting resulted in formation of a single layer extending circumferential around the base. Compressive stress developed in the course of cooling down. This cooling down was achieved by waiting in one embodiment; in an alternative embodiment, jetted air was sprayed onto the cylinder with the circumferential layer. For the jet spraying, the same gun as mentioned above was used, but this is not considered essential.
(14) In one embodiment, the resulting layer had a thickness of approximately 125 m. This layer was thereafter thinned and polished, by means of a sawing process. Use was made of a diamond saw, as known for the sawing of copper or copper-containing elements. A lubricant was sprayed while sawing so as to prevent too much heating of the copper layer. Moreover, herewith a polishing was achieved as well. The sawing resulted in removal of about 50 m thickness of copper. The copper support, here consisting of the copper circumferential layer, was therewith ready. It is however net excluded that additional layers are deposited.
(15) In an alternative embodiment, the deposited layer had a thickness of 40-80 microns, for instance about 50 microns. This layer was thereafter thinned, for instance with 40-60%. Use was made herein of grinding with a conventional grinding machine with grinding and polishing stones.
(16) The resulting surface roughness Rz, as for instance achieved with the latter embodiment with a final layer thickness between 20 and 40 microns, was suitably less than 0.5 m. As known to the skilled person, various parameters of surface roughness exist, which have been defined in norms DIN EN ISO 4287:1998 and DIN EN ISO 4289: 1998. The surface roughness Rz, also known as the (average) surface roughness depth or the ten-pint mean roughness. It is defined as the arithmetic mean value of the single roughness depths of consecutive sampling lengths. More suitably the surface roughness Rz was less than 0.4 m, for instance between 0.2 and 0.4 m, and in one preferred embodiment close to 0.3 m (i.e. 0.25-0.35 m).
(17) In a subsequent step, a copper engraving layer with a high hardness, suitably in the range of 200-240 HV, was deposited. The layer was deposited in a thickness of 60-100 m, for instance 75 m. In one embodiment, a layer thickness was chosen that was substantially corresponding to the layer thickness of the copper support. However, thicker layers are not excluded. The deposition process for such an engraving layer is known per se and involves electroplating. Use was made in one embodiment of a solution of copper sulfate (200-230 gr CuSO.sub.45H.sub.2O) and sulfuric acid (60-65 gr H.sub.2SO.sub.4 per liter of solution) and a catalyst for hardness. The catalyst does not have any particular properties and can be found easily in the market. During the plating, the cylinder is revolved with a speed of about 100 rpm. The current density during electroplating in this phase ranges from 20 to 25 amps/dm.sup.2 for about 80-100 min and with a solution temperature maintained at about 30 C. Further details in relation to this process are known from various patents, such as U.S. Pat. No. 4,334,966, Nos. 4,781,801, 5,417,841 and 7,153,408, which are herein included by reference.
(18) In an alternative embodiment, which was tested particularly in combination with a ground and thin circumferential layer as discussed above, the copper engraving layer was formed by deposition and subsequent thinning and polishing. Here again, a thinning to approximately half of the deposited thickness turned out suitable in practice. However, it is not excluded that the thinning removes merely 20-40% of the deposited thickness.
(19) Thereafter, the cylinder was polished to achieve desired surface roughness (usually R.sub.z is between 0.03 m and 0.07 m). The intermediate product was therewith ready. In a subsequent step, this intermediate product was engraved in accordance with a desired and predefined pattern. Use could be made of any engraving technique known per se, including so called electronic engraving. Use of a laser appears beneficial. The engraving could be carried out in a different location if so desired. After the engraving, a protection layer was applied. This protection layer is suitably a chromium coating layer of about 6 to 10 m, and was produced by plating in a chromium oxide solution (250 - 280 gm of Cr.sub.2O.sub.3 per solution liter) and sulfuric acid (2.5 - 2.8 gm of H.sub.2SO.sub.4 per solution liter) for about 30 min.
(20) In order to further reduce the weight of the gravure cylinder, the end plates of the gravure cylinders (typical cross sections of an end plate is shown in
(21) The dimensions of the end plate are determined by the customer specifications. This is why the dimensions (and the keyway) are not shown in
(22) The manufacturing of the end plates are made using the following simple steps:
(23) a) The outer diameter of the aluminum end plate part (4,
(24) b) The outer diameter of the steel end plate part (5,
(25) c) The assembly of the aluminum and the steel part of the end plates are is accomplished simply by heating (normal or induction heating) and press fitting the two parts.
(26) Although the above description is the recommended methodology for the manufacturing of a light weight gravure cylinder with a base made of aluminum and end plates made from aluminum and steel, it is apparent to the experts of the field that small deviations or alterations or modifications can be implemented without significant deviations from the present invention.
TEST RESULTS
(27) Semimanufactured cylinders made in according with the prior art of WO2011/073695A2 and in accordance with the invention were subjected to a bond strength test. The semimanufactured cylinders had an aluminum base, a copper support and a copper engraving layer. No engraving was applied in the copper engraving layer. A protection layer was not applied. The cylinder base in both semi-manufactured cylinders was identical; merely the manufacture of the copper support differed.
(28) Bond strength tests were carried out using a universal testing machine (as supplied from TLCLO, Dartec Ltd, Stourbridge, England). Therein, shear force was applied as close as possible to the aluminum-copper interface at a crosshead speed of 1 mm/min. The ultimate load to failure was recorded in Newton (N), and repeated several times to ensure sufficient statistics. Table 1 provides the results. It is clear therefrom that the bond strength has been significantly improved. Whereas the prior art cylinders had a bond strength that was close to the limit or even below the limit of 15 N, the bond strength in the invention is such that any variation does not matter any longer.
(29) TABLE-US-00001 TABLE 1 sample bond preparation strength (N) WO2011/073659A2 12 N invention 70 N