Capsule type heat conduction column and method for manufacturing the same

Abstract

The present invention relates to a capsule type heat conduction column and a method for manufacturing the same. The method comprises the steps of mixing a thermally conductive base material thoroughly, stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, and sealing the capsule by a plurality of thermal interface materials. Each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe is assembled to the first opening of the second pipe.

Claims

1. A method for manufacturing a capsule type heat conduction column, comprising the steps of: (A) mixing a thermally conductive base material thoroughly; (B) stuffing and compacting the thermally conductive base material into a capsule formed by a first pipe and a second pipe, wherein each of the first pipe and the second pipe has a first opening and a second opening at two terminals thereof, and wherein the second opening of the first pipe is assembled to the first opening of the second pipe; and (C) sealing the first opening of the first pipe and the second opening of the second pipe of the capsule by a plurality of thermal interface materials.

2. The method as claimed in claim 1, wherein the thermally conductive base material is prepared by mixing a first material and a second material thoroughly, wherein the first material is selected from the group consisting of a grapheme, a carbon nanotube, a reduced expanded graphite, a carbon fiber and a carbon, and wherein the second material is selected from the group consisting of a phase change material, a high molecular conductive polymer, a metal material having a high thermal conductivity and a plurality of non-metal granules.

3. The method as claimed in claim 1, wherein the thermally conductive base material is stuffed into the capsule by a stuffing machine.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a flow chart showing a method for manufacturing a capsule type heat conduction column of the present invention;

(2) FIG. 2 is an exploded diagram showing a capsule type heat conduction column of the present invention;

(3) FIG. 3 is a stereogram showing a capsule type heat conduction column of the present invention;

(4) FIG. 4 is a sectional view showing a capsule type heat conduction column of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

(5) To provide a thorough understanding, the purpose and advantages of the present invention will be described in detail with reference to the accompany drawings.

(6) Referring to FIG. 1 and FIG. 2 showing a flow chart of a method for manufacturing a capsule type heat conduction column and an exploded diagram thereof, the method of present invention comprises the steps of:

(7) (A) Fixing a first material and a second material thoroughly to obtain a thermally conductive base material (1), wherein the first material is selected from the group consisting of a grapheme, a carbon nanotube, a reduced expanded graphite, a carbon fiber and a carbon, and wherein the second material is selected from the group consisting of a phase change material, a high molecular conductive polymer, a metal material having a high thermal conductivity and a plurality of non-metal granules.

(8) (B) The thermally conductive base material (1) is stuffed into a capsule (2) by a stuffing machine, and is compacted in the capsule (2). The capsule (2) is formed by a first pipe (21) and a second pipe (22), and each of the first pipe (21) and the second pipe (22) has a first opening and a second opening at two terminals thereof, and the second opening of the first pipe (21) is assembled to the first opening of the second pipe (22) to form the capsule (2).

(9) (C) Please referring to FIG. 3 and FIG. 4, the first opening of the first pipe (21) and the second opening of the second pipe (22) are sealed by a plurality of thermal interface materials (3) to provide efficacy of thermal conductivity and prevent leakage of the thermally conductive base material (1) from the capsule (2).

(10) Accordingly, to use the capsule type heat conduction column of the present invention, the plurality of thermal interface materials (3) is contacted to an object to be cooled and dissipate the heat of the object by the thermally conductive base material (1) in the capsule (2) to achieve an improved heat dissipation effect.

(11) According to the description of the embodiment above, the present invention has advantages of:

(12) 1. The present invention increases efficiency of 3-dimensional heat dissipation, and increases efficiency of electromagnetic wave absorption or decreases reflection interference of electromagnetic wave.

(13) 2. The present invention is not oxidized and damaged and maintains a long serve life with high performance.

(14) 3. It is easy to manufacture the capsule type heat conduction column of the present invention and the method for manufacturing the present invention has a low attrition rate and a high yield rate to reduce a manufacturing cost.

(15) 4. The method for manufacturing the present invention does not cause environmental damage, and the present invention is environmental friendly due to its recyclability.