High-frequency transformer design for DC/DC resonant converters

Abstract

A transformer assembly includes a transformer with primary windings located on multiple layers and with secondary windings interleaved with the multiple layers and includes a substrate connected to the transformer and with a first transistor with first, second, and third terminals, in which the first terminal is connected to the secondary windings, the second terminal is connected to an output terminal of the transformer assembly, and the third terminal is a control terminal; first conductive layers; second conductive layers interleaved with the first conductive layers; a first via that is solid filled and that connects the first conductive layers and the first terminal; and a second via that is solid filled and that connects the second conductive layers and the second terminal.

Claims

1. A transformer assembly comprising: a transformer including: primary windings located on multiple layers; and secondary windings interleaved with the multiple layers; and a substrate connected to the transformer and including: a first transistor with first, second, and third terminals, in which the first terminal is connected to the secondary windings, the second terminal is connected to an output terminal of the transformer assembly, and the third terminal is a control terminal; first conductive layers; second conductive layers interleaved with the first conductive layers; a first via that is solid filled and that connects the first conductive layers and the first terminal; and a second via that is solid filled and that connects the second conductive layers and the second terminal.

2. The transformer assembly of claim 1, wherein the first and second vias extend downward directly under the first transistor.

3. The transformer assembly of claim 1, further comprising a bus bar that is located on a second surface of the substrate opposite to a first surface of the substrate on which the first transistor is located and that is connected to the second via.

4. The transformer assembly of claim 1, wherein the secondary windings include output terminals that are soldered to the substrate.

5. The transformer assembly of claim 4, wherein the output terminals are soldered to pads on the substrate.

6. The transformer assembly of claim 1, wherein the secondary winding is center tapped.

7. The transformer assembly of claim 1, wherein the multiple layers include printed circuit boards.

8. The transformer assembly of claim 1, wherein more than one primary winding is located on each of the multiple layers.

9. The transformer assembly of claim 1, wherein the first transistor is a MOSFET.

10. The transformer assembly of claim 9, wherein the first terminal is a drain of the MOSFET, the second terminal is a source of the MOSFET, and the third terminal is a gate of the MOSFET.

11. The transformer assembly of claim 1, wherein the transformer further includes a magnetic core.

12. The transformer assembly of claim 1, wherein: heat generated by the first transistor is dissipated by the first and second vias; and the first transistor is not connected to a heatsink other than the first and second vias.

13. The transformer assembly of claim 1, wherein: the substrate further includes a second transistor; and the first and second transistors are synchronous rectifiers.

14. A converter assembly comprising: a host substrate including a primary-side circuit; and the transformer assembly of claim 1 connected to the host substrate; wherein the primary-side circuit is connected to the primary windings of the transformer.

15. The converter assembly of claim 14, wherein the first and second vias extend downward directly under the first transistor.

16. The converter assembly of claim 14, further comprising a bus bar that is located on a second surface of the substrate opposite to a first surface of the substrate on which the first transistor is located and that is connected to the second via.

17. The converter assembly of claim 14, wherein the secondary windings include output terminals that are soldered to the substrate.

18. The converter assembly of claim 17, wherein the output terminals are soldered to pads on the substrate.

19. The converter assembly of claim 14, wherein the primary-side circuit includes first and second primary-side transistors connected to an input voltage.

20. The converter assembly of claim 14, wherein: the substrate further includes a second transistor; and the first and second transistors are synchronous rectifiers.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a circuit diagram of a half-bridge LLC resonant converter.

(2) FIGS. 2-4 show known transformers.

(3) FIG. 5 is a circuit diagram of an output-rectifier circuit of the transformer.

(4) FIG. 6 is a cross-sectional view of the PCB of the output-rectifier circuit.

(5) FIGS. 7, 8, and 9 show an output-rectifier PCB.

(6) FIG. 10 is an exploded view of the structure of the transformer.

(7) FIG. 11 shows a transformer.

(8) FIG. 12 shows a transformer assembly with the transformer shown in FIG. 11 connected to the output-rectifier PCB shown in FIGS. 7, 8, and 9.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

(9) Preferred embodiments of the present invention relate to high-frequency transformer design for DC/DC resonant converters such as parallel LC, LLC, LCLC, etc. FIG. 5 is a circuit diagram of the secondary-side of a DC/DC resonant converter. FIG. 12 shows the transformer assembly 200 that implements that circuit shown in FIG. 5. The transformer assembly 200 includes transformer 204 and output-rectifier PCB 210. The output rectifier PCB 210 can be any suitable substrate. FIGS. 6-9 shows the output-rectifier PCB 210. FIGS. 10 and 11 show the transformer 204 with primary windings 201, secondary windings 202, and magnetic core 203. As shown in FIG. 10, the primary windings 201 can be located on multiple PCBs 205 and the secondary windings 202 can be made of stamped copper 206. The primary windings 201 do not have to be located on PCBs 205. The primary windings 201 can, for example, be made of Litz wire. The secondary windings do not have to be made of stamped copper. The secondary windings 202 can be made of any suitable material with high electrical conductivity, including, for example, silver or a silver alloy.

(10) To reduce the losses on the primary winding 201, the number of turns on each PCB 204 should be significantly reduced or minimized. For example, as shown in FIG. 10, in a 16-turn primary winding 201 and a 1-turn secondary winding 202, each of four PCBs P1, P2, P3, P4 can have four turns for a total of 16 turns. It is possible to use a different number of turns on the PCBs 205 and to use a different number of turns in the primary winding 201 and in the secondary winding 202. The PCBs 205 with the primary windings 201 are preferably connected in series.

(11) The secondary winding 202 is preferably center tapped as shown in FIG. 5. Center tapping is sometimes used for low-voltage, high-current output applications. For high-current applications, center-tapped secondary winding Ns.sub.1, Ns.sub.2 are preferably multiple windings connected in parallel. As shown in FIG. 10, the transformer 204 can include four windings S.sub.top that correspond to secondary windings Ns.sub.1, and four windings S.sub.bottom that correspond to secondary windings Ns.sub.2. When connected on the output-rectifier PCB 210, the windings S.sub.top are connected in parallel, and the windings S.sub.bottom are connected in parallel.

(12) FIG. 6 shows the layers of the output-rectifier PCB 210 with MOSFETs Q3 or Q4. In FIG. 5, the terminal D is the drain terminal of the MOSFET Q3 or Q4, and terminal S is the source terminal of the MOSFET Q3 or Q4. MOSFETs Q3 or Q4 could be a single MOSFET or multiple MOSFETS in parallel. For example, FIG. 7 shows six MOSFETs Q3 and six MOSFETs Q4. In FIG. 7, for clarity, only one MOSFET Q3 and only one MOSFET Q4 are labeled. Any suitable transistor can be used instead of MOSFETs. As shown in FIG. 6, the output-rectifier PCB 210 includes multiple drain and source layers 213, 214 to provide the required load current. The drain layers 213 are dedicated to the drain, and the source layers 214 are dedicated to the source. As shown in FIG. 6, the source and drain layers 213, 214 can be stacked alternatively. Because the drain and source layers 213, 214 are symmetrically interleaved, the current is equally shared among the parallel drain and source layers 213, 214.

(13) For high-frequency applications, the thickness of the copper in each drain and source layers 213, 214 must be selected properly to reduce the DC and AC losses caused by the skin effect and proximity effect. The distance between the drain and source layers 213, 214 should maintain a small drain-to-source capacitance. For example, the minimum distance between the drain and source layers 213, 214 should be about 5 mils. For a 1600 W, 12 V output converter, the thickness of each copper layer preferably is about 2 oz, where 2 oz corresponds to the thickness of 2 oz of copper rolled out to an area of 1 ft.sup.2, and the total thickness of the output-rectifier PCB 210 preferably is about 1.5 mm, for example. If higher power is required, then approximately 3 oz copper can be used, or the number of drain and source layers 213, 214 can be increased, for example.

(14) Vias 211 filled with a conductive material are used to interconnect the drain and source layers 213, 214. As shown in FIG. 6, the vias 211 extend downward, directly underneath the MOSFETs Q3, Q4. The solid conductive material of the vias 211 significantly reduces the impedance and the heat generated when large currents are conducted through the vias 211. The solid conductive material of the vias 211 can transport heat from the MOSFET Q3, Q4 to the other side of the output-rectifier PCB 210 like a radiator.

(15) As shown in FIGS. 7, 8, and 9, bus bars 212 connect the source layers 214 of the MOSFETs Q3 or Q4 and the terminal Vout_RTN (terminal Vout_RTN is shown in FIG. 5). The bus bars 212 collect the source current and provides the source current to the terminal Vout_RTN with lower conduction losses. The terminal Vout is connected to the output bus bar 225 (the output bus bar 225 is shown in FIG. 11). The bus bars 212 dissipate heat produced by the components, including the MOSFETs Q3, Q4, on the output-rectifier PCB 210. The bus bars 212 are preferably located on the opposite side of the MOSFETs Q3, Q4 where the vias 212 connect the source of MOSFETs Q3 or Q4 to the bus bars 212 so that the bus bars 212 effectively remove the heat from MOSFETs Q3 or Q4. Thus, a heat sink is not required, which saves space and cost.

(16) The heat generated from AC loss is reduced by interleaving the windings and by using a small skin depth. To avoid having an external heat sink, vias 211 and a bus bar 212 are used to dissipate the heat generated by the MOSFETs Q3, Q4 and other semiconductors devices. FIGS. 7, 8, and 9 shows one non-limiting example of a possible layout of the output-rectifier PCB 210.

(17) As shown in FIGS. 7 and 9, the output-rectifier PCB 210 includes pads 215, 216 that are used to connect the output-rectifier PCB 210 to the transformer 204. Preferably, the terminals 220, 221, 222 are soldered to corresponding pads 215, and the output bus bar 225 is soldered to pad 216.

(18) FIG. 10 shows the transformer 204 that includes primary windings 201 on PCBs 205 connected in series and secondary windings 202 made of stamped copper 206 connected in parallel. FIG. 11 shows the transformer 204 before being connected to the output-rectifier PCB 210. The transformer 204 includes central terminals 220, left terminals 221, and right terminals 222 that can be soldered to corresponding pads 215 in the output-rectifier PCB 210. Preferably, the terminals 220, 221, 222 are not connected to pads 215 by a friction or interference fit, and the electrical connection between the terminals 220, 221, 222 is created by solder. The central terminals 220 provide the center tap of the secondary windings 202 as shown in FIG. 5, while left and right terminals 221, 222 are connected to the ends of the secondary windings 202 as also shown in FIG. 5. Although not shown in the circuits of FIGS. 1 and 5, the transformer 204 can include an integrated output inductor 226.

(19) FIG. 12 shows the transformer assembly 200 with the transformer 204 connected to the output-rectifier PCB 210. The electrical path between the secondary windings 202 and the terminals Vout, Vout_RTN can be short and wide to lower contact resistance, which reduces conduction losses. The terminal Vout is connected to the secondary windings 202 through central terminals 220. The terminal Vout_RTN is connected to the secondary windings 202 through left and right terminals 221 or 222, MOSFETs Q3 or Q4, vias 211, and bus bars 212.

(20) Although not shown in FIG. 12, the transformer assembly 200 can be mounted to a host PCB. The host PCB can include the primary-side circuit that can be connected to the primary windings 201 through terminals 223. The primary-side circuit can include, for example, passive components capacitor C.sub.1, inductor L.sub.rt, and inductor L.sub.mt and active components MOSFETs Q1, Q2 as shown in FIG. 1.

(21) It should be understood that the foregoing description is only illustrative of the present invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the present invention. Accordingly, the present invention is intended to embrace all such alternatives, modifications, and variances that fall within the scope of the appended claims.