Sputtering Target

Abstract

A multiple sputtering target for magnetron arrangements has a tubular magnetron, for coating substrates in a vacuum chamber. The tubular magnetron is mounted in an end block or some other drive unit. A magnet bar is located in the tubular magnetron. Substrates transported along a circular path through a vacuum chamber can be coated with a selectable multiplicity of materials by magnetron sputtering. At least one polygonal carrier tube having an angular cross section has a plurality of longitudinally extending outer surfaces for receiving targets. A free extends longitudinally through the polygonal carrier tube. A magnet bar for forming plasma clouds outside the polygonal carrier tube is located in a working position in front of a target which can be selected by rotating the polygonal carrier tube. The moving or stationary substrate is located at a predetermined distance in front of the plasma clouds.

Claims

1. A sputtering target for sputter-coating a substrate in a vacuum chamber, comprising: a polygonal carrier tube (1) having an angular cross section with a plurality of longitudinally extending outer surfaces (3) for receiving targets (2); a free space (5) located in the polygonal carrier tube (1) and extending longitudinally through the polygonal carrier tube (1); and a magnet bar (4) arranged in the free space (5) for forming plasma clouds (6) outside the polygonal carrier tube (1) in front of a selected one of the targets (2), wherein the selected one of the targets (2) can be selected by rotating the polygonal carrier tube, and wherein the substrate (7) is located at a predetermined distance in front of the plasma clouds (6).

2. The sputtering target as claimed in claim 1, wherein one of the targets (2) is located on each of the outer surfaces (3) of the polygonal carrier tube (1), and wherein the targets (2) are made of the same material.

3. The sputtering target as claimed in claim 1, wherein one of the targets (2) is located on each of the outer surfaces (3) of the polygonal carrier tube (1), and wherein the targets (2) are made of different materials.

4. The sputtering target as claimed in claim 1, wherein the polygonal carrier tube (1) has a triangular, quadrangular, pentagonal, hexagonal, heptagonal or octagonal cross section.

5. The sputtering target as claimed in claim 1, wherein the polygonal carrier tube (1) can be rotated in angular steps in such a way that the targets (2) can be positioned individually between the magnet bar (4) and the plasma clouds (6).

6. The sputtering target as claimed in claim 1, wherein the magnet bar (4) is positioned in a fixed position at a top of the free space (5), above an axis of symmetry of the latter.

7. The sputtering target as claimed in claim 1, wherein the magnet bar (4) is positioned in a fixed position at a bottom of the free space (4), below an axis of symmetry of the latter.

8. The sputtering target as claimed in claim 1, wherein the magnet bar (4) is positioned in a fixed position at a side of the free space (5), to a side of an axis of symmetry of the latter.

9. The sputtering target as claimed in claim 1, wherein a further magnet bar (4,1) is arranged opposite the magnet bar (4) in a fixed position in the free space (5), in such a way that there are respective plasma clouds (6, 6.1) at a top and a bottom in front of the respective target (2).

10. The sputtering target as claimed in claim 1, wherein the polygonal carrier tube (1) can be moved in an oscillating motion around the magnet bar (4).

11. The sputtering target as claimed in claim 1, wherein the magnet bar (4) can be pivoted in the free space (5) about a virtual axis in relation to the polygonal carrier tube (1) in any desired angular steps.

12. The sputtering target as claimed in claim 1, wherein the polygonal carrier tube (1) is connected via a connection element (9) to a magnetron end block (8) for driving the polygonal carrier tube (1) in rotation and for supplying energy and for supplying cooling water to the magnet bar (4).

13. A system, comprising: a first and a second sputtering target as claimed in claim 1, the first and the second sputtering target being in a bipolar arrangement parallel to one another in a common vacuum chamber and operatively connected to a common MF power supply (10).

14. A system, comprising: the sputtering target as claimed in claim 1; and a tubular or planar magnetron (11), the sputtering target and the tubular or planar magnetron being in a bipolar arrangement parallel to one another in a common vacuum chamber and operatively connected a common MF power supply (10).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0045] FIG. 1: shows a multiple sputtering target consisting of a polygonal carrier tube in cross section with a three-fold target system rotatable in angular steps on the outer surfaces and with a magnet bar within the carrier tube with three targets and indicated plasma clouds in front of the target, in each case located at the top, as well as a substrate guided past above the plasma clouds;

[0046] FIG. 2a: shows a multiple sputtering target with a polygonal carrier tube as in FIG. 1, but as a four-fold target system with four targets;

[0047] FIG. 2b: shows a multiple sputtering target with a polygonal carrier tube as in FIG. 1 with four-fold target system, but with beveled edges;

[0048] FIG. 3: shows a multiple sputtering target with a polygonal carrier tube as in FIG. 1 with a five-fold target system;

[0049] FIG. 4: shows a multiple sputtering target with a polygonal carrier tube as in FIG. 1 with a six-fold target system;

[0050] FIG. 5: shows a multiple sputtering target with a polygonal carrier tube as in FIG. 1 with an eight-fold target system;

[0051] FIG. 6: shows a schematic side view of a polygonal carrier tube of a multiple sputtering target mounted on an end block;

[0052] FIG. 7: shows a multiple sputtering target with a polygonal carrier tube in which a magnet bar is positioned in the lower region of the free space;

[0053] FIG. 8: shows a multiple sputtering target with a polygonal carrier tube in which a magnet bar is positioned at the side of the free space;

[0054] FIG. 9: shows a multiple sputtering target with a polygonal carrier tube in which two magnet bars are positioned in the free space at the top and bottom respectively according to the drawing, with the result that two plasma clouds are formed in each case at the top and bottom in front of the corresponding targets, past each of which a substrate can be guided;

[0055] FIG. 10: shows a parallel arrangement of two multiple sputtering targets with a common MF power supply for depositing identical materials on a substrate;

[0056] FIG. 11: shows a parallel arrangement of two multiple sputtering targets with a common MF power supply for depositing different materials on a substrate;

[0057] FIG. 12: shows a parallel arrangement of a multiple sputtering target and a tubular magnetron having a common MF power supply for depositing various materials on a substrate; and

[0058] FIG. 13: shows a parallel arrangement of two four-fold sputtering targets in a symmetrical and asymmetrical embodiment with a different distance between the magnet bar and the target.

DETAILED DESCRIPTION

[0059] The multiple sputtering target in the form of a polygonal carrier tube 1 is equipped with a plurality of outer surfaces 3 for receiving targets 2, wherein a magnet bar 4 is located in a free space 5 within the polygonal carrier tube 1. The free space 5 extends longitudinally through the center of the carrier tube 1 and preferably has an annular cross section.

[0060] It is self-evident that the coatings described below with the various variants of the multiple sputtering target with the polygonal carrier tube 1 must be produced under a vacuum in a vacuum chamber (not illustrated).

[0061] FIG. 1 shows a polygonal carrier tube 1 of a multiple sputtering target with a three-fold target system which can be rotated in angular steps and has three targets 2, which are fastened individually in each case to an outer surface 3 of the carrier tube 1 with a triangular cross section, wherein the targets 2 can consist of the same or preferably of different materials.

[0062] The spatially fixed magnet bar 4, which is positioned at the top in the free space 5, that is to say above the axis of symmetry of the latter, is located within the carrier tube 1. With the magnet bar 4, two plasma clouds 6 are generated in front of the respective target 2 located at the top on the carrier tube 1, with the aid of which a substrate 7 located above or guided past the plasma clouds 6 is coated with the material sputtered off from the target 2 in the sputter-up method.

[0063] As is known, the sputter-up method has the advantage that sputtered particles which are accelerated primarily upward are deposited on the substrate 7.

[0064] FIG. 2a shows a polygonal carrier tube 1 with a square cross section having four longitudinally extending outer surfaces 3, on each of which a target 2 is fastened. In the free space 5, the magnet bar 4 is located above the axis of symmetry of the latter.

[0065] FIG. 2b shows a multiple sputtering target with a polygonal carrier tube 1 with a similar structure to that in FIGS. 1 and 2a but with four longitudinally extending outer surfaces 3 with beveled edges 3.1 of the polygonal carrier tube 1.

[0066] In principle, such beveled edges can also be implemented in a three-fold target system according to FIG. 1.

[0067] FIG. 3 shows a multiple sputtering target with a polygonal carrier tube 1 with a structure as in FIG. 1 but as a five-fold target system with five longitudinally extending outer surfaces 3 of the carrier tube 1 for receiving a maximum of five targets 2.

[0068] Furthermore, FIG. 4 shows a multiple sputtering target with a polygonal carrier tube 1 with a structure as in FIG. 1 but with a six-fold target system with six longitudinally extending outer surfaces 3 for receiving a total of six targets 2.

[0069] FIG. 5 shows a multiple sputtering target with a polygonal carrier tube 1 with a structure as in FIG. 1 but with an eight-fold target system with eight longitudinally extending outer surfaces 3 for receiving one target 2 each.

[0070] In most of the variants described above, the magnet bar 4 is located in the free space 5, above the axis of symmetry of the latter, the free space 5 extending centrally through the carrier tube 1.

[0071] An exception to this positioning can be useful, if the polygonal carrier tube 1 has a particularly large diameter, to prevent the distance between the magnet bar 4 in the polygonal carrier tube 1 and the target 2 on the outer surface 3 of the carrier tube 1 from becoming too large and the intensity of the plasma clouds 7 from being weakened as a result. In this case, said distance should be reduced.

[0072] The different hatching of the targets 2 fastened on the outer surfaces 3 of the carrier tube 1 is intended to symbolize different materials in each case. In order to select the material to be sputtered off, the carrier tube 1 has only to be rotated in equal angular steps until the desired target 2 is positioned at the top above the magnet bar 4. The required plasma clouds 6 are then generated during operation of the magnet bar 4 in front of the target 2 located at the top.

[0073] The polygonal carrier tubes 1 with different cross sections can be operated with a commercially available magnetron end block 8 via a connection element 9, it being possible for a spatially fixed magnet bar 4 of a conventional tubular target to be used in the interior of the carrier tube 1. FIG. 6 shows a side view of a hexagonal carrier tube 1 with the targets 2 located on the outer surfaces 3.

[0074] Particularly long carrier tubes 1 can be mounted with their free end in a counterbearing (not illustrated) in order to limit deflections to a minimum.

[0075] The sputter plasma required for sputtering is generated by the magnet bar 4 in the vicinity of the target surface due to the magnetic field. By rotating the carrier tube 1 with the targets 2 located thereon, different or identical materials can thus be sputtered off in succession with respect to the magnet bar 3—depending on how the targets 2 are distributed on outer surfaces 3 of the carrier tube 1—and a substrate 7 guided past can be coated accordingly. In addition, an oscillating motion of the polygonal carrier tube 1 or of the magnet bar 4 can achieve an expanded target erosion field, whereby better use of the targets 2 is achieved.

[0076] FIG. 1 to FIG. 5 of the drawing show the sputtering device for operation in the sputter-up method. This means that the particles sputtered off from the target 2 move upward in the direction of the substrate 7 to be coated, which is moved past above the plasma clouds 6.

[0077] Other sputtering methods, such as the sputter-down method, can be implemented in a simple manner with the multiple sputtering target in conjunction with the polygonal carrier tube 1 described above, in that the magnet bar 4 is pivoted downward by 180 axis about an imaginary pivoting axis, with the result that the magnet bar 4 is below the axis of symmetry of the free space 5. Alternatively, the magnet bar 4 is to be positioned pointing downward in the free space 5, with the result that the plasma clouds 6 are formed in front of a target 2 located at the bottom on the carrier tube 1.

[0078] In this case, the particles sputtered off from the target 2 are deposited on a substrate 7 to be coated, which is guided past below the plasma clouds 6. (FIG. 7)

[0079] If a sputter-side method, i.e. lateral deposition on a substrate 7, is to be implemented, then the magnet bar 4 would have to be moved through 90° into a lateral position, with the result that the plasma clouds 6 are formed in front of the target 2 to be positioned laterally. In this case, the substrate 7 to be coated would have to be positioned or passed laterally perpendicularly in front of the plasma clouds 6. (FIG. 8)

[0080] A special embodiment is illustrated in FIG. 9. The polygonal carrier tube 1 described is equipped here with a central free space 5 in which two magnet bars 4, 4.1 are arranged respectively above and below the axis of symmetry. In this way, two plasma clouds 6, 6.1 can be formed at the top and bottom in front of the corresponding targets 2, past which clouds a respective substrate 7, 7.1 can be guided or at which it can be positioned. The prerequisite for this embodiment is that the polygonal carrier tube 1 has an even number of outer surfaces 3.

[0081] FIGS. 10 to 11 show special embodiments with multiple sputtering targets or in combination with a conventional tubular magnetron in order to be able to carry out a bipolar process in a common vacuum chamber. The flexibility of a sputtering installation is thereby considerably increased.

[0082] A parallel arrangement of two multiple sputtering targets with a common MF power supply 10 for depositing identical materials on a substrate 7 is illustrated in FIG. 10.

[0083] FIG. 11 shows basically the same parallel arrangement of two multiple sputtering targets with a common MF power supply for depositing different materials on a substrate, wherein here the polygonal carrier tube 1 on the right according to the drawing is rotated upward with another target 2 into the coating position. This allows the deposition of various material combinations on a substrate 7.

[0084] FIG. 12 shows a special variant with a simultaneously operated parallel arrangement of a multiple sputtering target and a conventional tubular magnetron 11 having a common MF power supply 10 for depositing various materials on a substrate 7. The tubular magnetron 11 contains a central free space 5, in which a magnet bar 4 is located and which is surrounded by a tubular target 12.

[0085] Finally, FIG. 13 shows a parallel arrangement of two multiple sputtering targets with a common MF power supply for depositing identical materials on a substrate 7, each having a polygonal carrier tube 1 and a magnet bar 4 located in the free space 5, wherein the multiple sputtering target on the left according to the drawing is of symmetrical design and the multiple sputtering target on the right according to the drawing is of asymmetrical design. It is thereby possible to achieve different distances between the magnet bar 4 and the target 2. It is thereby possible to carry out sputtering out with magnetic fields of different strengths.

[0086] A combination of a multiple sputtering target with a conventional planar magnetron (not illustrated) and with a common MF power supply in a common vacuum chamber is also possible without problems. With this combination too, it is possible to deposit material combinations on the substrate which is to be guided past.

[0087] Instead of the polygonal carrier tubes illustrated in FIGS. 7-9 with four outer surfaces 3 and beveled edges 3.1, the polygonal carrier tubes 1 can also have the cross-sectional shapes illustrated in the other figures of the drawing.

[0088] The advantage of this embodiment of the multiple sputtering target allows sputter-up and sputter-down methods to be carried out simultaneously.

[0089] Standard magnet bars or any other suitable magnet bars can be used as magnet bars 4 in the free space 5.

[0090] The round connection elements 9 required for operation on a magnetron end block 8 and in the support bearing can be joined to the carrier tube 1 by welding, or a corresponding connection element 9 is used as an adapter. (FIG. 6)

[0091] Instead of the commercially available magnetron end block 7, it is also possible to use other suitable receiving devices with adjusting motors, provided that an angularly accurate rotary movement is produced in order to bring the various targets 2 on the polygonal carrier tube 1 into the correct position, i.e. parallel to the substrate 7, 7.1 to be coated.

[0092] An oscillating motion of the polygonal carrier tube 1 of the multiple target about the fixed magnet bar is also conceivable.

[0093] While the present invention has been described with reference to exemplary embodiments, it will be readily apparent to those skilled in the art that the invention is not limited to the disclosed or illustrated embodiments but, on the contrary, is intended to cover numerous other modifications, substitutions, variations and broad equivalent arrangements that are included within the spirit and scope of the following claims.

LIST OF REFERENCE SIGNS

[0094] 1 carrier tube [0095] 2 target [0096] 3 outer surface [0097] 3.1 beveled edge [0098] 4 magnet bar [0099] 4.1 magnet bar [0100] 5 free space [0101] 6 plasma cloud [0102] 6.1 plasma cloud [0103] 7 substrate [0104] 7.1 substrate [0105] 8 magnetron end block [0106] 9 connection element [0107] 10 MF power supply [0108] 11 tubular magnetron [0109] 12 tubular target