METHOD AND DEVICE FOR PRODUCING A DECORATIVE SURFACE

Abstract

A method for producing a decorative surface is disclosed, wherein a manipulation medium applied to the surface is remove in a mechanical and/or contactless manner therefrom. Further, a device for performing the method is disclosed.

Claims

1. Method for producing a decorative surface on a workpiece (1), the method comprising the steps: applying (S12) a manipulation medium (3) at least onto and/or into a part of a liquid layer (2) located on the workpiece (1) and/or at least onto a part of the workpiece (1); removal (S18) of parts (13) of the layer (2), wherein the removal (S18) takes place in a mechanical and/or contactless manner, in particular in a fluidic manner.

2. Method according to claim 1, wherein the parts (13) of the layer (2) also include parts of the manipulation medium (3) located on or in the layer (2) or exclusively consist of the manipulation medium (3).

3. Method according to claim 1, wherein the removal (S18) takes place mechanically by means of a removal device comprising a contact element being in contact with the surface of the layer (2), wherein the surface of the layer (2) and the contact element move relative to each other during the removal (S18).

4. Method according to claim 3, wherein the contact element comprises a stationary and/or movable brush (8) and/or a grinding element and/or a plane element, wherein, preferably, the brush (8) comprises, at least as the movable brush (8), a disc brush and/or a roller brush and/or a brush band and/or, as the stationary brush (8), a beam (11) with a brush trimming, and/or wherein the contact element, particularly the brush (8), comprises textile and/or plastic fibers, in particular, nylon fibers, Anderton, and/or metal, particularly steel, brass or copper as bristles.

5. Method according to claim 1, wherein the removal (S18) includes a suction of the parts (13) by vacuum, preferably by means of a suction device, and/or a heating of the layer (2) and/or the manipulation medium (3), preferably by supplying heat, especially preferred for at least partial liquefaction of the parts (13), in particular, of the manipulation medium (3).

6. Method according to claim 3, wherein a step of cleaning the contact element is executed.

7. Method according to claim 1, wherein the removal (S18) includes a streaming to the surface of the layer (2) and/or to the manipulation medium (3) by a fluid flow, in particular an air flow.

8. Method according to claim 7, wherein the accordingly formed fluid flow impinges onto the surface of the layer (2) and/or the manipulation medium (3) so that the fluid flow extends across the entire width of the layer (2), and/or wherein the fluid flow impinges onto the layer (2) and/or onto the manipulation medium (3) at an angle which is less than 45, preferably less than 30, especially preferred less than 15.

9. Method according to claim 7, wherein the fluid flow comprises solid bodies having a diameter of 0.0001 to 1 mm, preferably 0.001 to 0.5 mm, especially preferred 0.005 to 0.3 mm and/or which are configured to liquefy or to evaporate after the impinging onto the layer (2) and/or which are supplied by a liquid when emitted.

10. Method according to claim 1, comprising at least one of the following steps: applying (S10) a liquid layer (2) onto at least a part of a surface of the workpiece (1) and/or onto a manipulation medium (3) applied onto the surface of the workpiece (1); curing (S14) the layer (2) and/or the manipulation medium (3) at least until the partial curing, wherein, preferably, the layer (2) is at least partially cured before the applying (S12) of the manipulation medium (3) and wherein, preferably, the manipulation medium (3) is at least partially cured before the applying (S10) of the liquid layer (2), wherein, thereto, a preferably electromagnetic radiation, in particular, UV radiation, is respectively used.

11. Method according to claim 10, wherein the curing (S14) includes an irradiation of the layer (2) and/or of the manipulation medium (3) by electromagnetic radiation, preferably by UV radiation, and/or an irradiation by electron radiation, and/or wherein the curing (S14) includes active and/or passive drying and/or reaction curing, preferably by a two-component system, and/or wherein the curing (S14) is performed until to the final curing of the layer (2) after the removal (S18).

12. Method according to claim 10, wherein the manipulation medium (3) and the layer (2) are configured such that they do not coalesce during the curing (S14).

13. Device for performing the method according to claim 1, comprising: a transport device configured to transport a workpiece (1) to further elements of the device and/or to move at least one further element of the device to the workpiece (1); as further element, an application device (15), in particular, comprising a digital printing device configured to apply a manipulation medium (3) onto an at least partial liquid layer (2) located on the workpiece (1) and/or onto a surface of the workpiece (1); preferably, as further element, a curing device configured to cure the liquid layer (2) and/or the manipulation medium (3); as further element, a removal device configured to remove parts (13) of the layer (2) in a mechanical and/or fluidic manner, wherein the device further comprises a control means configured to control the transport device and the further elements of the device in order to execute the method according to claim 1.

14. Device according to claim 13, wherein the transport device comprises a belt transport, and/or wherein the curing device comprises a radiation source (12), preferably for an electromagnetic radiation, wherein the wavelength of the emitted radiation is preferably variable, and/or wherein the curing device comprises a blower configured to blow a fluid flow, particularly an airflow, onto the layer (2) and/or the manipulation medium (3); and/or wherein the removal device for the mechanical removal comprises a contact element configured to come into contact with the surface of the layer (2) in order to remove parts (13) of the layer (2); and/or wherein the removal device comprises a nozzle (6) configured to let flow a fluid flow, preferably an airflow, onto the surface of the layer (2) in order to remove the manipulation medium (3), wherein the fluid flow preferably comprises solid bodies having a diameter of 0.0001 to 1 millimeter, preferably 0.001 to 0.5 mm, especially preferred 0.005 to 0.3 mm; and/or wherein the removal device comprises a suction device (7) configured to suck the manipulation medium (3) from the layer (2) by means of vacuum and/or to suck up the already loosed manipulation medium (3); and/or wherein the removal device comprises a heating device configured to heat the surface of the layer (2) and/or the manipulation medium (3).

15. Device according to claim 14, wherein the contact element comprises a stationary and/or a moved brush (8) and/or a grinding element and/or a plane element, and/or wherein the contact element, particularly the brush (8), comprises textile and/or plastic fibers, in particular, nylon fibers, and/or Andalon, and/or metal, in particular, steel, brass or copper as bristles.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0104] Below, the invention is described in detail by means of preferred embodiments and by means of the attached drawings. In particular,

[0105] FIG. 1 shows an embodiment of the invention in which the removal of parts of the layer takes place in a fluidic manner;

[0106] FIG. 2 shows an embodiment of the invention in which the removal of the parts of the layer takes place in a mechanical manner;

[0107] FIG. 3 shows an embodiment of brushes for mechanical removal of part of the layer;

[0108] FIG. 4 shows a further embodiment of brushes for mechanical removal of parts of the layer;

[0109] FIG. 5 shows a further embodiment of brushes for mechanical removal of parts of the layer;

[0110] FIG. 6 shows a workpiece in the form of a pre-milled plank with an applied layer;

[0111] FIG. 7 shows a possibility to clean the contact element;

[0112] FIG. 8 shows a device in the form of a production line; and

[0113] FIG. 9 shows an exemplary flowchart of the method.

DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION

[0114] FIG. 1 shows an embodiment of the invention in which the removal of parts of the layer, here, in particular, of the manipulation medium, takes place in a fluidic manner.

[0115] A flat workpiece 1, in the drawing, moving from the right to the left, is shown. The workpiece 1 is covered by a liquid layer 2 which forms the surface of the workpiece 1 after the complete curing. Into the liquid layer 2, a manipulation medium 3 has been brought in at some places in order to displace the liquid layer 2. The workpiece 1 is moved into a chamber 4 by a transport device of a device according to the invention. The chamber 4 comprises, in the direction of motion, first, a curing device 5 comprising an UV radiation source emitting UV radiation onto the liquid layer 2 in order to cure it so that the viscosity of the layer 2 is changed. The UV radiation comprises thereby a wavelength of 200 to 400 nm. Subsequently, the workpiece 1 is fed to a nozzle 6 emitting a fluid flow at an angle with respect to the surface of the layer 2 against the direction of motion. Thereby, the angle is maximum 45 or less. Preferably, an adaption of the angle between 0 and 45 takes place. This adaption can be done, for example, depending on the removed manipulation medium.

[0116] By the nozzle 6, the fluid flow is configured such that it exerts a flow pressure onto the manipulation medium 3 which is as high as the manipulation medium 3 loosens as parts 13 of the layer 2 from the layer 2.

[0117] By the pressure of the fluid flow, subsequently, the loosed parts 13 of the manipulation medium 3 (framed in a dotted manner) are urged to the right where they are collected by a suction device 7 by vacuum and are removed from the chamber 4.

[0118] In one embodiment, the fluid flow is configured such that it extends across the entire width of the workpiece 1, i.e., in a direction of extension of the workpiece 1 perpendicular to the drawing plane. In this way, it is ensured that all parts of the manipulation medium 3 are covered by the fluid flow which, in particular, upon chaotically or irregularly inserted manipulation medium 3, obviates the need of a targeted flow to individual regions of the surface of the layer 2.

[0119] As fluid, a liquid or a gaseous substance is deployed. Specifically, also, water and/or air can be deployed as the fluid.

[0120] FIG. 2 shows an embodiment of the invention, in which the removal of parts of the layer takes place in a mechanical manner.

[0121] A flat workpiece 1, in the drawing, moving from the right to the left, is shown. The workpiece 1 is covered by a liquid layer 2 which forms the surface of the workpiece 1 after the complete curing. Into the liquid layer 2, at some places, a manipulation medium 3 has been brought in in order to displace the liquid layer 2. The workpiece 1 is, for example, moved by a transport device of a device according to the invention.

[0122] In the direction of motion, first, a suction device 7 configured to suck up loosed parts 13 of the layer 2, in particular, the loosed manipulation medium 3, by means of vacuum is arranged. Thereto, the suction nozzle of the suction device 7 is aligned close to the surface of the layer 2. After the suction device 7, a brush 8 designed as roller brush is arranged. This brush 8 extends perpendicular to the drawing plane across the direction of motion of the workpiece 1. In this embodiment, the roller brush is rotated opposite to the direction of motion of the workpiece 1. The suction device 7 further comprises a radiation source 12. This radiation source 12 is configured to emit electromagnetic radiation, as UV radiation, for curing the sucked-up parts 13 of the layer 2, whereby, curing of the parts 13 takes place within the suction device 7 so that there is no risk for adhering in and clogging the suction device 7.

[0123] By the contact of the bristles of the brush 8, parts 13 of the layer 2, in particular, the manipulation medium 3, are brushed out of the layer 2 and conveyed in direction of the suction device 7. This suction device 7 collects the loosed parts 13 (framed in a dotted manner).

[0124] Finally, a further radiation source 12a configured to emit electromagnetic radiation, particularly UV radiation, to the brush 8 in order to cure and/or embrittle the material of parts of the layer 2 adhering there is shown.

[0125] FIG. 3 shows an embodiment of brushes for mechanical removal of parts of the layer.

[0126] A workpiece 1 as well as several brushes 8 are shown in a plan view. The workpiece 1 is moved through under the brushes 8 from the left to the right. The brushes 8 are here designed as disc brushes rotating in the shown directions of rotation around a respective axis. When the workpiece 1 on which a layer with or without a manipulation medium (both is not shown) is located is moved through under the brushes 8, thus, parts of the layer, in particular, the manipulation medium, are mechanically removed by a contact with the brushes 8 relatively moving with respect to the workpiece 1.

[0127] By the rotating motion of the brushes 8 additionally to the relative motion between the workpiece 1 and the brushes 8, a further relative motion component is added so that the force with which the bristles of the brushes 8 act onto the layer or the manipulation medium is enlarged.

[0128] FIG. 4 shows a further embodiment of brushes for mechanically removing parts of the layer, in particular the manipulation medium.

[0129] A workpiece 1 having a layer with or without a manipulation medium (both is not shown) as well as a brush band are shown in the side view. The workpiece 1 is moved from the left to the right. The brush band is trimmed with several brushes 8.

[0130] The brush band cyclicality circulates in the shown circulation direction so that the brushes 8 which are located at the underside of the brush band at the moment move from the right to the left opposite to the motion of the workpiece 1. In this way, additionally to the relative motion between the workpiece 1 and the brushes 8, a further relative motion component is added due to the motion of the workpiece 1 from the left to the right so that the force by which the bristles of the brushes 8 act onto the layer or the manipulation medium is enlarged.

[0131] FIG. 5 shows a further embodiment of brushes for mechanical removal of parts of the layer, in particular, of the manipulation medium.

[0132] A workpiece 1 which is moved through under a beam 11 from the left to the right, wherein the beam 11 comprises, on its side facing the workpiece 1, brushes which can come in contact with the workpiece 1 or with the layer and/or the manipulation medium thereon (both is not shown). Thereby, the beam 11 extends across the entire extension of the workpiece 1, therefore, from above to below in the drawing.

[0133] FIG. 7 shows a possibility for cleaning the contact element.

[0134] A flat workpiece 1 which, in the drawing, is moved from the left to the right is shown. The workpiece 1 is covered with a liquid layer 2 which forms the surface of the workpiece 1 after the complete curing. Into the liquid layer 2, a manipulation medium 3 has been inserted at some places in order to displace the liquid layer 2. The workpiece 1 is moved, for example, by a transport device of a device according to the invention.

[0135] In the direction of motion, first, a suction device 7 configured to suck up parts 13 of the layer 2, particularly the loosed manipulation medium 3, by vacuum is arranged. Thereto, the suction nozzle of the suction device 7 is aligned close to the surface of the layer 2. After the suction device 7, a brush 8 designed as a roller brush is arranged. This brush 8 extends perpendicular to the drawing plane across the direction of motion of the workpiece 1. In this embodiment, the roller brush is rotated opposite to the direction of motion of the workpiece 1. Further, the suction device 7 comprises a radiation source 12. This radiation source 12 is configured to emit electromagnetic radiation, as UV radiation, for curing the sucked-up parts 13 of the layer 2, whereby a curing of the parts 13 takes place within the suction device 7 so that there is no risk that they adhere within the suction device 7 and clog it.

[0136] Apart from that, the functionality of the brush 8 as well as of the suction device 7 for removing the parts 13 of the layer 2, particularly of the manipulation medium 3, is identical to the functionality of the embodiment in FIG. 2.

[0137] For cleaning the contact element or the brush 8, a radiation source 12a emitting the UV radiation to the brush 8 and, thus, to the parts 13 of the layer 2 adhering on the bristles of the brush 8, wherein the parts 13 can comprise the material of the layer 2 and material of the manipulation medium 3, is here provided. In the rotary motion, the bristles of the brush 8 hit a stripper edge 14 after they have been irradiated by the radiation source 12a. The stripper edge 14 extends in the drawing downright and comprises a surface being formed such that parts 13 of the layer 2 which has been loosed from the bristles, are guided in direction of a suction device 7a located at this surface. The suction device 7a is configured to receive the loosed parts 13 of the layer 2 and to the suck them up by means of vacuum.

[0138] The functionality of the cleaning of the brush 8 presents as follows:

[0139] Within a cycle, i.e., within one rotation of the brush 8, the bristles of the brush 8 first hit onto the surface of the layer 2, whereby, here, parts 13 of the layer 2 are removed. Parts 13 which are loosed and which do not adhere in the bristles of the brush 8 are conveyed by the brush in direction of the suction device 7 which sucks them up by means of vacuum. Parts 13 adhered in the bristles of the brush 8 are irradiated by the radiation source 12a in the further course of the rotation of the brush 8, whereby they cure. The irradiation of the radiation source 12a can be as strong as the parts 13 adhered in the bristles of the brush 8 embrittle. Subsequently, the bristles hit onto the stripper edge 14, whereby a mechanical effect to these parts 13 is achieved. Due to that, the cured and/or embrittled parts 13 loose from the bristles of the brush 8, whereby they are conveyed by their removal speed and the formed surface of the stripper edge 14 to the suction device 7a. The suction device 7a finally sucks up these parts 13. The bristles of the brush 8 cleaned in such way are now available again for removing parts 13 of the layer 2 in a new cycle.

[0140] FIG. 8 shows a device in the form of a production line.

[0141] Two workpieces 1 which are moved one after another in the direction of motion from the left to the ride are shown. Thereto, a transport device (not shown) is provided. The workpiece 1 comprises a liquid layer 2 on its surface. In and/or on the layer 2, a manipulation medium 3 is included. In the direction of motion, following elements are arranged one after another from the left to the right. First, a stationary contact element in the form of a brush 15 which is configured to come into contact with the surface of the layer 2 in order to mechanically remove parts of the layer 2 is arranged. Thereby, it is here achieved that the manipulation medium 3 enclosed in the layer 2 is uncovered. After the brush 15, a radiation source 12 configured to emit UV radiation in the direction of the workpiece 1 or the layer 2 is arranged in order to at least partially cure the layer 2.

[0142] Subsequently in the direction of motion, an element comprising a chamber 4 through which the workpiece 1 is moved is provided. In the direction of motion, the chamber 4 first comprises a nozzle 6 emitting a fluid flow at an angle with respect to the surface of the layer 2 against the direction of motion of the workpiece 1. Thereby, the angle is maximum 90 or less. Preferably, an adaption of the angle between 0 and 30 is performed. This adaption can take place, for example, depending on the removed material of the manipulation medium and/or depending on the removed material of the layer 2. The fluid flow comprises solid bodies as described above in order to remove parts 13 of the layer 2. Further, the chamber comprises a suction device 7 configured to suck loosed parts 13 of the layer 2. Within the chamber, in the motion direction behind the nozzle 6, a radiation source 12 configured to irradiate the layer 2 with radiation in order to partially cure it is located so that the viscosity of the layer 2 changes. The radiation can, for example, be UV radiation with a wavelength of 200 to 400 nm.

[0143] In one embodiment, the fluid flow is configured such that it extends across the entire width of the workpiece 1, i.e., in a direction of extension of the workpiece 1 perpendicular to the drawing plane. In this way, it is ensured that all areas of the layer 2 are covered by the fluid flow.

[0144] A liquid or a gaseous substance is deployed as fluid. Specifically, also water and/or air can be deployed as fluid.

[0145] After the chamber 4, a contact element having a brush 8 in the form of a roller brush is arranged. The brush 8 is configured to mechanically remove parts of the layer 2. A radiation source 12a, for example, emitting UV radiation to the brush 8, is arranged above the brush 8 in order to cure the material of the parts of the layer 2 adhering to the bristles for cleaning the brush 8 in order to remove it out of the bristles, for example, at a stripper edge (not shown).

[0146] The cleaning of the brush 8 can basically take place according to the description to FIG. 7.

[0147] After the brush 8 in the direction of motion, a further radiation source 12b is arranged. This radiation source 12b emits, for example, UV radiation to the layer 2 and to a possibly requested included manipulation medium 3 in order to perform a final curing.

[0148] FIG. 9 shows an exemplary flowchart of the method.

[0149] In step S10, a liquid layer is applied onto a workpiece, the liquid layer forming the surface of the workpiece in the cured state then. This can be performed, for example, by a digital or analog procedure.

[0150] In step S12, an application of a manipulation medium onto and/or into a part of the liquid layer located on a workpiece takes place. If step S12 is executed before step S10, a manipulation medium can also be applied to the workpiece, whereby, subsequently, step S10 is performed so that the manipulation medium is enclosed by the liquid layer.

[0151] In step S14, the fixing of the layer with the manipulation medium on the workpiece takes place. Alternatively, also, only the layer can be fixed.

[0152] In step S18, parts of the layer, also material of the manipulation medium can belong thereto, are removed. This ensues as described above.

[0153] The method can be further developed by interchanging, omitting and/or repeating of individual steps.

[0154] The invention is not limited to the embodiments shown here. Rather, further devices and/or methods also corresponding to the invention can be included by combining, interchanging or omitting individual features.

[0155] For example, the configuration of FIG. 7 can be supplementary integrated into the production line of FIG. 8 or can be provided instead of the chamber 4 and/or the brush 8 shown here.

[0156] Also, when in the FIGS. 2, 7, and 8, brushes 8 in the form of roller brushes are provided, supplementary or alternatively, the implementations of the brushes 8 of the FIGS. 3, 4, and 5 can be provided.

[0157] All of the nozzles 6 shown in the FIGS. 1 and 8 can be configured to emit a fluid flow with or without solid bodies as described above. The fluid flow can include a gas and/or a liquid, wherein it especially includes air and/or water.

[0158] The radiation sources shown in all of the figures can be configured to, alternatively or additionally to the electromagnetic radiation, particularly UV radiation, also emit another radiation, as, e.g., electron radiation. The kind of radiation and/or the respective wavelength is thereby selected depending on the composition of the material of the layer 2 and/or of the manipulation medium 3 and/or depending on the desired effect of the radiation to layer 2 and/or the manipulation medium 3. Thus, for a complete curing, another wavelength and/or radiation can be deployed than if merely the viscosity of layer 2 shall be changed in a previous step in order to, for example, prevent a blurring of the recesses inserted by the manipulation medium 3.

[0159] All of the here-shown embodiments of the invention which at least comprise a brush 8 can further be configured such that the at least one brush 8 is provided movably.

[0160] Thereby, it is to be understood that the at least one brush 8 can be actively moved in a predefined motion pattern. Therefore, for example, a disc brush can be provided at a rotatable suspension.

LIST OF REFERENCE SIGNS

[0161] 1 workpiece

[0162] 1a connection element

[0163] 2 layer

[0164] 3 manipulation medium

[0165] 4 chamber

[0166] 5 curing device

[0167] 6 nozzle

[0168] 7 suction device

[0169] 7a suction device

[0170] 8 brush

[0171] 9 direction of rotation

[0172] 10 circulation direction

[0173] 11 beam

[0174] 12 radiation source

[0175] 12a radiation source

[0176] 12b radiation source

[0177] 13 loosed parts of layer 2

[0178] 14 stripper edge

[0179] 15 contact element

[0180] S10 application of a liquid layer

[0181] S12 application of a manipulation medium

[0182] S14 fixation of the layer

[0183] S18 removal of parts of the layer