METHOD AND DEVICE FOR SURFACE PROCESSING

Abstract

A method for processing a surface (2) of a workpiece (1) is disclosed. Besides, a device for performing the method is disclosed.

Claims

1. Method for removing parts of a layer (2) on a surface of a workpiece (1), the method comprising the steps: establishing a mechanical contact between a contact element and the layer (2) on the surface for removing parts (13) of the layer (2); physical separating of removed parts (13) of the layer (2) from the parts of the layer (2) remaining on the surface of the workpiece (1).

2. Method for removing parts of a layer (2) on a surface of a workpiece (1), the method comprising the steps: generating a fluid flow, preferred at an angle between 1 and 90 with respect to the layer (2), for removing parts (13) of the layer (2); physical separating of removed parts (13) of the layer (2) from the parts of the layer (2) remaining on the surface of the workpiece (1).

3. Method according to claim 1, wherein the layer (2) on the surface of the workpiece (1) has differences in hardness of at least a factor 1.5, preferably at least a factor 2, between harder areas (2a) and less hard areas (2b).

4. Method according to claim 1, wherein the physical separating of the loosened parts (13) of the layer (2) from the parts of the layer (2) remaining on the surface of the workpiece (1) is performed by sucking away, wiping away, blowing away, or by a combination of these steps.

5. Method according to claim 1, wherein the layer (2) located on the surface of the workpiece (1) and the contact element move relative to one another during removing of parts of the layer (2).

6. Method according to claim 1, wherein the contact element comprises a stationary and/or moved brush (8, 15) and/or a grinding element and/or a plane element, wherein, the brush (8) preferably comprises, at least as moved brush (8), a disc brush and/or a roller brush and/or a brush band, and/or, as stationary brush (8), a beam (11) with brush trimming, and/or wherein the contact element, particularly the brush (8, 15), comprises textile and/or plastic fibers, particularly nylon fibers, Anderton, and/or metal, particularly steel, brass or copper as bristles.

7. Method according to claim 1, wherein simultaneously to the establishing of the mechanical contact between the contact element and the layer (2) on the surface, and/or, simultaneously to the generating of the fluid flow onto the layer (2), an irradiation of the layer (2) and/or of the contact element and/or of the surroundings of the contact element in which separated parts of the layer (2) are located is performed preferably by electromagnetic radiation.

8. Method according to claim 1, wherein the contact element (8, 15) is continuously cleaned during the physical separating, wherein the cleaning is preferably performed by use of a combination of an electromagnetic beam source (5, 12) and/or a suction device (7, 7a) and/or a mechanical chipping edge (14).

9. Method according to claim 2, wherein a nozzle (6) configured to generate a fluid flow is continuously cleaned during the physical separating, wherein the cleaning is performed preferably by a combination of an electromagnetic beam source (5, 12) and/or a suction device (7, 7a) and/or one or several further drying devices or beam sources (5, 12).

10. Method according to claim 1, wherein before the establishing of the mechanical contact between the contact element and the layer (2), cleaning of the surface of the layer (2) is performed, and/or wherein, after the physical separating of parts of the layer (2), cleaning of the residual layer (2) remaining on the surface of the workpiece (1) is performed.

11. Method according to claim 2, wherein before the generating of the fluid flow onto the layer (2), cleaning of the surface is performed, and/or, after the physical separating of parts of the layer (2), cleaning of the residual layer (2) remaining on the surface of the workpiece (1) is performed.

12. Method according to claim 8, wherein the continuous cleaning of the contact element, particularly of the brush (8), is performed by irradiation with UV radiation, preferably with a wavelength between 180 and 400 nm, in combination with stripping off cured residual components (13) from the separated parts of the layer (2) on a chipping edge (14) and a sucking away these residual components (13) by means of a suction device (7, 7a).

13. Method according to claim 9, wherein the continuous cleaning of the nozzle (6) is performed by irradiation with UV radiation, preferably with a wavelength between 180 and 400 nm, in combination with sucking away residual components (13) of the separated parts of the layer (2) by means of a suction device (7, 7a).

14. Method according to claim 10, wherein for cleaning the surface of the layer (2), a cleaning agent (16) which is removed once again subsequently, particularly preferred by means of a stripper (18) and/or a suction device (19), is applied onto the layer.

15. Device for performing the method according to claim 1, the device comprising: a transport device configured to transport a workpiece (1) to further elements of the device, and/or at least one further element of the device to the workpiece (1); as further element, a removal device configured to remove parts (13) of the layer (2) mechanically, preferred by a contact element, and/or in a fluidic manner, preferred by a fluid flow out of a nozzle (6), wherein the device further comprises a control means configured to control the transport device and the further elements of the device in order to perform the method according to claim 1.

16. Method according to claim 2, wherein the layer (2) on the surface of the workpiece (1) has differences in hardness of at least a factor 1.5, preferably at least a factor 2, between harder areas (2a) and less hard areas (2b).

17. Method according to claim 2, wherein the physical separating of the loosened parts (13) of the layer (2) from the parts of the layer (2) remaining on the surface of the workpiece (1) is performed by sucking away, wiping away, blowing away, or by a combination of these steps.

18. Method according to claim 2, wherein simultaneously to the establishing of the mechanical contact between the contact element and the layer (2) on the surface, and/or, simultaneously to the generating of the fluid flow onto the layer (2), an irradiation of the layer (2) and/or of the contact element and/or of the surroundings of the contact element in which separated parts of the layer (2) are located is performed preferably by electromagnetic radiation.

19. Device for performing the method according to claim 2, the device comprising: a transport device configured to transport a workpiece (1) to further elements of the device, and/or at least one further element of the device to the workpiece (1); as further element, a removal device configured to remove parts (13) of the layer (2) mechanically, preferred by a contact element, and/or in a fluidic manner, preferred by a fluid flow out of a nozzle (6), wherein the device further comprises a control means configured to control the transport device and the further elements of the device in order to perform the method according to claim 2.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0133] Below, the invention is described in detail by means of preferred embodiments and by means of the attached drawings.

[0134] In particular,

[0135] FIG. 1 shows an embodiment of the invention in which the removing of parts of the layer is performed in a fluidic manner;

[0136] FIG. 2 shows an embodiment of the invention in which the removing of the parts of the layer is performed in a mechanical manner;

[0137] FIG. 3 shows an embodiment of brushes for mechanical removing of parts of the layer;

[0138] FIG. 4 shows a further embodiment of brushes for mechanical removing of parts of the layer;

[0139] FIG. 5 shows a further embodiment of brushes for mechanical removing of parts of the layer;

[0140] FIG. 6 shows a workpiece in the form of a pre-milled plank having an applied layer;

[0141] FIG. 7 shows a possibility for cleaning the contact element;

[0142] FIG. 8 shows a device in the form of a production line;

[0143] FIG. 9 shows a possibility for cleaning the surface of the layer;

[0144] FIG. 10 shows a cross-section of a workpiece having a layer comprising different hardness grades; and

[0145] FIG. 11 shows an exemplary flowchart of a method.

DESCRIPTION OF SPECIFIC EMBODIMENTS OF THE INVENTION

[0146] FIG. 1 shows an embodiment of the invention in which the removing of parts of the layer, here, in particular, the manipulation medium, is performed in a fluidic manner.

[0147] A flat workpiece 1 moving from the right to the left in the drawing is shown. The workpiece 1 is covered by a liquid layer 2 forming the surface of the workpiece 1 after the complete curing. Into the liquid layer 2, a manipulation medium 3 has been brought in at some places in order to displace the liquid layer 2. The workpiece 1 is moved into a chamber 4, for example, by a transport device of a device according to the invention. The chamber 4 comprises, in the direction of motion, first, a curing device 5 comprising an UV radiation source emitting UV radiation onto the liquid layer 2 in order to cure it so that the viscosity of the layer 2 is changed. The UV radiation has thereby a wavelength of 200 to 400 nm. Subsequently, the workpiece 1 is fed to a nozzle 6 emitting a fluid flow against the direction of motion at an angle with respect to the surface of the layer 2. Thereby, the angle is maximum 45 or less. Preferably, an adaption of the angle between 0 and 45 is performed. This adaption can be done, for example, depending on the removed manipulation medium.

[0148] By the nozzle 6, the fluid flow is formed such that it exerts a flow pressure onto the manipulation medium 3, wherein the flow pressure is as high as the manipulation medium 3 breaks loose as part 13 of the layer 2 from the layer 2.

[0149] By the pressure of the fluid flow, subsequently, the loosened parts 13 of the manipulation medium 3 (framed in a dotted manner) are urged to the right where they are collected by a suction device 7 by vacuum and removed from the chamber 4.

[0150] In one embodiment, the fluid flow is configured such that it extends across the entire width of the workpiece 1, i.e., in a direction of extension of the workpiece 1 perpendicular to the drawing plane. In this way, it is ensured that all of the parts of the manipulation medium 3 are covered by the fluid flow which, in particular, upon a chaotically or irregularly inserted manipulation medium 3, obviates the need of a targeted streaming to individual regions of the surface of the layer 2.

[0151] As fluid, a liquid or a gaseous substance is deployed. Specifically, also, water and/or air can be deployed as the fluid.

[0152] FIG. 2 shows an embodiment of the invention, in which the removing of parts of the layer is performed in a mechanical manner.

[0153] A flat workpiece 1 moving from the left to the right in the drawing is shown. The workpiece 1 is covered by a liquid layer 2 forming the surface of the workpiece 1 after the complete curing. Into the liquid layer 2, a manipulation medium 3 has been brought in at some places in order to displace the liquid layer 2. The workpiece 1 is, for example, moved by a transport device of a device according to the invention.

[0154] In the direction of motion, first, a suction device 7 configured to suck away loosened parts 13 of the layer 2, in particular, the loosed manipulation medium 3, by means of vacuum is arranged. Thereto, the suction nozzle of the suction device 7 is aligned close to the surface of the layer 2. After the suction device 7, a brush 8 designed as roller brush is arranged. This brush 8 extends perpendicular to the drawing plane across the direction of motion of the workpiece 1. In this embodiment, the roller brush is rotated opposite to the direction of motion of the workpiece 1. The suction device 7 further comprises a radiation source 12. This radiation source 12 is configured to emit electromagnetic radiation, such as UV radiation, for curing the sucked-up parts 13 of the layer 2, whereby, curing of the parts 13 takes place within the suction device 7 so that there is no risk for adhering in and clogging the suction device 7.

[0155] By the contact of the bristles of the brush 8, parts 13 of the layer 2, in particular, the manipulation medium 3, are brushed away from the layer 2 and conveyed in direction of the suction device 7. This suction device 7 collects the loosened parts 13 (framed in a dotted manner).

[0156] Finally, a further radiation source 12a configured to emit electromagnetic radiation, particularly UV radiation, to the brush 8 in order to cure and/or embrittle the material of parts of the layer 2 adhering there in order to clean the brush 8 is shown.

[0157] FIG. 3 shows an embodiment of brushes for mechanical removing of parts of the layer.

[0158] A workpiece 1 as well as several brushes 8 are shown in plan view. The workpiece 1 is moved through under the brushes 8 from the left to the right. The brushes 8 are here designed as disc brushes rotating in the shown directions of rotation 9 around a respective axis. When the workpiece 1 on which a layer with or without a manipulation medium (both is not shown) is located is moved through under the brushes 8, thus, parts of the layer, in particular, the manipulation medium, are mechanically removed by a contact with the brushes 8 relatively moving with respect to the workpiece 1.

[0159] By the rotating motion of the brushes 8, additionally to the relative motion between the workpiece 1 and the brushes 8, a further relative motion component is added so that the force by which the bristles of the brushes 8 act onto the layer or the manipulation medium is enlarged.

[0160] FIG. 4 shows a further embodiment of brushes for mechanical removing parts of the layer, in particular of the manipulation medium.

[0161] A workpiece 1 having a layer with or without a manipulation medium (both is not shown) as well as a brush band are shown in the side view. The workpiece 1 is moved from the left to the right. The brush band is trimmed with several brushes 8.

[0162] The brush band cyclicality circulates in the shown circulation direction so that the brushes 8 which are located at the underside of the brush band at the moment move from the right to the left opposite to the motion of the workpiece 1. In this way, additionally to the relative motion between the workpiece 1 and the brushes 8, a further relative motion component is added due to the motion of the workpiece 1 from the left to the right so that the force by which the bristles of the brushes 8 act onto the layer or the manipulation medium is enlarged.

[0163] FIG. 5 shows a further embodiment of brushes for mechanical removing of parts of the layer, in particular, of the manipulation medium.

[0164] A workpiece 1 which is moved through from the left to the right under a beam 11 comprising, on its side facing the workpiece 1, brushes which can contact the workpiece 1 or the layer and/or the manipulation medium thereon (both is not shown) is shown in the plan view. Thereby, the beam 11 extends across the entire extension of the workpiece 1, therefore, from above to below in the drawing.

[0165] FIG. 7 shows a possibility for cleaning the contact element.

[0166] A flat workpiece 1 which is moved from the left to the right in the drawing is shown. The workpiece 1 is covered with a liquid layer 2 which forms the surface of the workpiece 1 after the complete curing. Into the liquid layer 2, a manipulation medium 3 has been inserted at some places in order to displace the liquid layer 2. The workpiece 1 is moved, for example, by a transport device of a device according to the invention.

[0167] In the direction of motion, first, a suction device 7 configured to suck away parts 13 of the layer 2, particularly the loosed manipulation medium 3, by means of vacuum is arranged. Thereto, the suction nozzle of the suction device 7 is aligned close to the surface of the layer 2. After the suction device 7, a brush 8 designed as a roller brush is arranged. This brush 8 extends perpendicular to the drawing plane across the direction of motion of the workpiece 1. In this embodiment, the roller brush is rotated opposite to the direction of motion of the workpiece 1. Further, the suction device 7 comprises a radiation source 12. This radiation source 12 is configured to emit electromagnetic radiation, such as UV radiation, for curing the sucked-up parts 13 of the layer 2, whereby curing of the parts 13 takes place within the suction device 7 so that there is no risk that they adhere within the suction device 7 and clog it.

[0168] Apart from that, the functionality of the brush 8 as well as of the suction device 7 for removing the parts 13 of the layer 2, particularly the manipulation medium 3, is identical to the functionality of the embodiment in FIG. 2.

[0169] For cleaning the contact element or the brush 8, a radiation source 12a emitting the UV radiation to the brush 8 and, thus, to the parts 13 of the layer 2 adhering on the bristles of the brush 8 is provided here, wherein the parts 13 can comprise the material of the layer 2 and material of the manipulation medium 3. In their rotary motion, the bristles of the brush 8 hit onto a stripper edge 14 after they have been irradiated by the radiation source 12a. The stripper edge 14 extends downright in the drawing and comprises a surface being formed such that parts 13 of the layer 2 which has been loosed from the bristles, are guided into direction of a suction device 7a located at this surface. The suction device 7a is configured to receive the loosened parts 13 of the layer 2 and to the suck them away by means of vacuum.

[0170] The functionality of the cleaning of the brush 8 presents as follows:

[0171] Within a cycle, i.e., within one rotation of the brush 8, the bristles of the brush 8 first hit onto the surface of the layer 2, whereby, here, parts 13 of the layer 2 are removed. Parts 13 which are loosed and which do not adhere in the bristles of the brush 8 are conveyed by the brush in direction of the suction device 7 which sucks them away by means of vacuum. In the further course of the rotation of the brush 8, parts 13 adhered in the bristles of the brush 8 are irradiated by the radiation source 12a, whereby they cure. The irradiation of the radiation source 12a can be as strong as the parts 13 adhered in the bristles of the brush 8 embrittle. Subsequently, the bristles hit onto the stripper edge 14, whereby a mechanical effect to these parts 13 is achieved. Due to that, the cured and/or embrittled parts 13 loose from the bristles of the brush 8, whereby they are conveyed by their removal speed and the formed surface of the stripper edge 14 to the suction device 7a. The suction device 7a finally sucks away these parts 13. The bristles of the brush 8 cleaned in such manner are now available again for removing parts 13 of the layer 2 in a new cycle.

[0172] FIG. 8 shows a device in the form of a production line.

[0173] Two workpieces 1 which are moved one after another in the direction of motion from the left to the right are shown. Thereto, a transport device (not shown) is provided. The workpiece 1 comprises a liquid layer 2 on its surface. In and/or on the layer 2, a manipulation medium 3 is included. In the direction of motion, following elements are arranged one after another from the left to the right. First, a stationary contact element in the form of a brush 15 which is configured to contact the surface of the layer 2 in order to mechanically remove parts of the layer 2 is arranged. Thereby, it is here achieved that the manipulation medium 3 enclosed in the layer 2 is uncovered. After the brush 15, a radiation source 12 configured to emit UV radiation in the direction of the workpiece 1 or the layer 2 is arranged in order to at least partially cure the layer 2.

[0174] Subsequently in the direction of motion, an element comprising a chamber 4 through which the workpiece 1 is moved is provided. In the direction of motion, the chamber 4 first comprises a nozzle 6 emitting a fluid flow against the direction of motion of the workpiece 1 at an angle with respect to the surface of the layer 2. Thereby, the angle is maximum 90 or less. Preferably, an adaption of the angle between 0 and 30 is performed. This adaption can be performed, for example, depending on the removed material of the manipulation medium 3 and/or depending on the removed material of the layer 2. The fluid flow comprises solid bodies as described above in order to remove parts 13 of the layer 2. Further, the chamber 4 comprises a suction device 7 configured to suck away loosened parts 13 of the layer 2. Within the chamber 4, in the motion direction behind the nozzle 6, a radiation source 12 configured to irradiate the layer 2 with radiation in order to partially cure it so that the viscosity of the layer 2 changes is located. The radiation can, for example, be UV radiation having a wavelength of 200 to 400 nm.

[0175] In one embodiment, the fluid flow is configured such that it extends across the entire width of the workpiece 1, i.e., in a direction of extension of the workpiece 1 perpendicular to the drawing plane. In this way, it is ensured that all areas of the layer 2 are covered by the fluid flow.

[0176] A liquid or a gaseous substance is deployed as fluid. Specifically, also water and/or air can be deployed as fluid.

[0177] After the chamber 4, a contact element having a brush 8 in the form of a roller brush is arranged. The brush 8 is configured to mechanically remove parts of the layer 2. A radiation source 12a, for example, emitting UV radiation to the brush 8, is arranged above the brush 8 in order to cure the material of the parts of the layer 2 adhering to the bristles in order to remove it out of the bristles, for example, at a stripper edge (not shown) for cleaning the brush 8.

[0178] The cleaning of the brush 8 can basically be performed according to the description to FIG. 7.

[0179] After the brush 8 in the direction of motion, a further radiation source 12b is arranged. This radiation source 12b emits, for example, UV radiation to the layer 2 and to an as possibly requested included manipulation medium 3 in order to perform a final curing.

[0180] FIG. 9 shows the removing of parts of the layer 2 with preceded and subsequent cleaning of the layer 2 by a device in the form of a production line.

[0181] Two workpieces 1 moved from the left to the right by a transport device having a conveyor transport 20 are shown. On the workpieces 1, a layer 2 is applied.

[0182] Thereby, before the removing of parts of layer 2, first, a cleaning agent 16 is applied onto the layer 2 by means of an application device 17, here comprising an application roller. Subsequently, this cleaning agent 16 is at least partially removed once again by a stripper 18. Subsequently, the removing of parts of the layer 2 by a stationary contact element 15 and a brush 8 is performed, wherein a UV beam source 12 is provided in order to irradiate the brush 8 and the contact element 15 in order to cure or brittle the thereat adhering material of removed parts of the layer 2. By means of a suction device 7, these parts 13 are continuously sucked away as described above. Moreover, as described in FIG. 7, a stripper edge (not shown) can be provided.

[0183] Subsequently, a further cleaning of the residual surface 2 remaining on the workpiece 1 is performed by means of a cleaning agent 16a, an application device 17a, and a device for removing the cleaning agent 16a once again. Thereto, the device for removing once again the cleaning agent 16a comprises a stripper 18a being in contact with the surface of the layer 2 and a suction device 19a. The suction device 19a is configured to suck away and discharge the cleaning agent 16a held back on the stripper 18a.

[0184] Such a suction device for removing the cleaning agent 16 can also be provided at the first stripper 18.

[0185] FIG. 10 shows a workpiece 1 having a layer 2 on the surface of the workpiece 1, wherein the layer 2 has at least partially been cured and now comprises areas 2a having a higher hardness grade and areas 2b having a lower hardness grade, wherein these areas differ in the hardness grade about a factor of at least 1.5, preferably of at least 2. The here illustrated workpiece 1 having the layer 2 is, for example, further processed in one above-described method for surface processing.

[0186] FIG. 11 shows an exemplary flowchart of a method.

[0187] In a step S10, a layer is generated on a work piece as, e.g., shown in FIG. 10, wherein the layer has different hardness grades.

[0188] In step S12, the workpiece having the layer is moved to a removal device. Here, according to step S14, a contact between the surface of the layer and a contact element of the removal device is established.

[0189] Alternatively or additionally, according to step S15, a fluid flow having an optional solid body ratio is generated, wherein the fluid flow acts onto the surface of the layer, whereby parts of the layer are removed or loosed.

[0190] According to S16, after the establishing of the contact between the surface of the layer and a contact element according to step S14, a relative motion between the contact element and the surface is performed, wherein parts of the layer are removed or loosened.

[0191] According to step S18, separating of the loosened parts of the surface of the layer from the residual layer is performed. This can be performed, e.g., by sucking away, wiping away, or blowing away, or by another suitable measure.

[0192] In step S20, cleaning of the surface of the layer by means of contact or, also, in a contactless manner and/or by deploying a cleaning agent is performed.

[0193] The method can be further developed by exchanging, omitting and/or repeating several steps as well as by supplementing several steps.

[0194] The invention is not restricted to the here shown embodiments. Moreover, further devices and/or methods also corresponding to the invention can be achieved by combining, exchanging, or omitting individual features.

[0195] For example, the configuration of FIG. 7 can be supplementary integrated into the production line of FIG. 8 or provided instead of the chamber 4 and/or the here-shown brush 8.

[0196] Also, when in the FIGS. 2, 7, and 8, brushes 8 in the form of roller brushes are provided, supplementary or alternatively, the implementations of the brushes 8 of the FIGS. 3, 4, and 5 can be provided.

[0197] All of the nozzles 6 shown in the FIGS. 1 and 8 can be configured to emit a fluid flow with or without solid bodies, as described above. The fluid flow can include a gas and/or a liquid, wherein it especially includes air and/or water.

[0198] The radiation sources shown in all of the figures can be configured to, alternatively or additionally to the electromagnetic radiation, particularly UV radiation, also emit another radiation, as, e.g., electron radiation. The kind of radiation and/or the respective wavelength is thereby selected depending on the composition of the material of the layer 2 and/or of the manipulation medium 3 and/or depending on the desired effect of the radiation to the layer 2 and/or to the manipulation medium 3. Thus, for a complete curing, another wavelength and/or radiation can be deployed than if merely the viscosity of the layer 2 shall be changed in a previous step in order to, for example, prevent blurring of the recesses inserted by the manipulation medium 3.

[0199] All of the here-shown embodiments of the invention which at least comprise a brush 8 can further be configured such that the at least one brush 8 is provided movably. Thereby, it is to be understood that the at least one brush 8 can be moved actively in a predefined motion pattern. Therefore, for example, a disc brush can be provided at a pivotable suspension.

LIST OF REFERENCE SIGNS

[0200] 1 workpiece

[0201] 1a connection element

[0202] 2 layer

[0203] 3 manipulation medium

[0204] 4 chamber

[0205] 5 curing device

[0206] 6 nozzle

[0207] 7 suction device

[0208] 7a suction device

[0209] 8 brush

[0210] 9 direction of rotation

[0211] 10 circulation direction

[0212] 11 beam

[0213] 12 radiation source

[0214] 12a radiation source

[0215] 12b radiation source

[0216] 13 loosened parts of the layer

[0217] 14 stripper edge

[0218] 15 brush

[0219] 16 cleaning agent

[0220] 16a cleaning agent

[0221] 17 application device

[0222] 17a application device

[0223] 18 stripper

[0224] 18a stripper

[0225] 19a suction device

[0226] 20 conveyor transport

[0227] S10 method step

[0228] S12 method step

[0229] S14 method step

[0230] S15 method step

[0231] S16 method step

[0232] S18 method step

[0233] S20 method step