Abstract
An LED light fixture, includes a bulb, a light module with at least one light emitting diode chip which is mounted on a circuit board by means of chip-on-board assembly, and a driver of the light module, wherein the light module and the driver electronics are received in the bulb. The LED light fixture may be arranged within an enclosure to form an LED lamp.
Claims
1. A light emitting diode (LED) light fixture comprising: a glass bulb; a light module with at least one light emitting diode chip which is mounted on a circuit board with a chip-on-board assembly; and a driver of the light module; wherein the light module and the driver are received in the glass bulb; and wherein at least one of: the circuit board is translucent; the glass bulb has two dimples opposite one another, and wherein the circuit board is clamped between the two dimples; and the circuit board has a width which corresponds substantially to a greatest internal diameter of the glass bulb.
2. The LED light fixture according to claim 1, wherein at least a part of the driver is mounted on the circuit board with the chip-on-board assembly.
3. A light emitting diode (LED) light fixture comprising: a glass bulb; a light module with at least one light emitting diode chip which is mounted on a circuit board with a chip-on-board assembly; and a driver of the light module; wherein the light module and the driver are received in the glass bulb; wherein the driver comprises a smoothing capacitor which is connected to the at least one light emitting diode chip; and wherein at least one of: the glass bulb has a dimple which protrudes into an interior space of the glass bulb and is in thermal contact with at least one of the circuit board and the smoothing capacitor; at least one of the circuit board and the smoothing capacitor are embedded at least partially in a mechanically flexible cast body; and the smoothing capacitor is parallel-connected to the at least one light emitting diode chip.
4. The LED light fixture according to claim 1, wherein a thickness of the circuit board is at most 400 m.
5. The LED light fixture according to claim 1, wherein an interior space of the glass bulb is filled with a heat-conducting gas.
6. The LED light fixture according to claim 3, wherein at least one of the circuit board and the smoothing capacitor is thermally coupled to the glass bulb.
7. The LED light fixture according to claim 1, wherein the glass bulb has a notch which protrudes into an interior space of the glass bulb, extends along an axis of symmetry of the glass bulb, and is configured for centering of the light module inside the glass bulb.
8. The LED light fixture according to claim 3, wherein the glass bulb has a convexity with respect to an interior space of the glass bulb, and wherein the circuit board and the smoothing capacitor are received at least partially in the convexity.
9. The LED light fixture according to claim 1, wherein the glass bulb is at least one of: formed with frosted glass; and is matte.
10. An LED lamp comprising: an enclosure; and the LED light fixture according to claim 1 arranged inside the enclosure.
11. A light emitting diode (LED) light fixture comprising: a bulb; a light module with at least one light emitting diode chip which is mounted on a circuit board with a chip-on-board assembly; and a driver of the light module; wherein the bulb has a notch which protrudes into an interior space of the bulb, extends along an axis of symmetry of the bulb, and is configured for centering of the light module inside the bulb; and wherein the light module and the driver are received in the bulb.
12. A light emitting diode (LED) light fixture comprising: a bulb; a light module with at least one light emitting diode chip which is mounted on a circuit board with a chip-on-board assembly; a driver of the light module; and a smoothing capacitor connected to the at least one light emitting diode chip; wherein the bulb has a convexity with respect to an interior space of the bulb, and wherein the circuit board and the smoothing capacitor are received at least partially in the convexity; and wherein the light module and the driver are received in the bulb.
13. An LED lamp comprising: an enclosure; and the LED light fixture according to claim 3 arranged inside the enclosure.
14. An LED lamp comprising: an enclosure; and the LED light fixture according to claim 11 arranged inside the enclosure.
15. An LED lamp comprising: an enclosure; and the LED light fixture according to claim 12 arranged inside the enclosure.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Preferred further embodiments of the invention are explained in greater detail by the following description of the drawings.
(2) FIGS. 1A, 1B, 10, 2A, 2B, 2C, 3A and 3B show exemplary embodiments of a LED light fixture described here as well as light modules for a LED light fixture described here.
(3) FIGS. 4A, 4B and 4C show exemplary embodiments of a LED lamp described here.
(4) FIGS. 5A, 5B, 5C, 5D and 5E show exemplary embodiments of a LED light module described here.
(5) FIGS. 6A, 6B and 6C show exemplary embodiments of metal clamps for a LED light fixture described here.
(6) FIGS. 7A, 7B, 7C, 7D, 7E, 8A, 8B, 9A, 9B, 10A and 10B show exemplary embodiments of a LED light fixture described here.
(7) FIGS. 11A, 11B, 12A and 12B show measured illumination intensities and emission characteristics for exemplary embodiments of a LED light fixture described here.
DETAILED DESCRIPTION OF PREFERRED EXEMPLARY EMBODIMENTS
(8) The light fixture described here as well as the LED lamp described here are explained in greater detail below with reference to exemplary embodiments and the associated drawings. In this case elements which are the same, of the same kind, similar or equivalent are provided with the same reference numerals. Repeated description of some of these elements is omitted in order to avoid redundancies.
(9) The drawings and the size ratios of the elements illustrated in the drawings elements should not be regarded as drawn to scale relative to one another. On the contrary, individual elements may be shown as excessively large for better illustration and/or to aid understanding.
(10) A first exemplary embodiment of a LED light fixture 1 described here is explained in greater detail with reference to the schematic illustrations in FIGS. 1A, 1B and 1C. The illustrated LED light fixture 1 can be used as a LED lamp, for example in a so-called pin-base lamp, in particular a G9 pin-base lamp which can be operated at 230 V. In this case FIG. 1A shows a circuit diagram of a light module 100 for the LED light fixture 1, FIG. 1B shows a schematic sketch of the light module 100 for the LED light fixture 1, and FIG. 1C shows a schematic sketch of the LED light fixture 1.
(11) The light module 100 comprises a plurality of light emitting diode chips 11. In fact, four light emitting diode chips 11 are shown in the example. However, unlike the illustration in FIG. 1A, the light module 100 can also have more or fewer light emitting diode chips 11. The light emitting diode chips 11 are series-connected to a transistor 31. The transistor 31 can serve for example for setting a current through the series-connected light emitting diode chips 11. A smoothing capacitor 30 is parallel-connected to the light emitting diode chips 11. The smoothing capacitor 30 serves for filtering modulations, in particular at 100 Hz, in the operating voltage of the light emitting diode chips 11. The operating voltage is provided by a voltage source 33. Between the voltage source 33 and the light emitting diode chip 11 is located a rectifier circuit 32, which in the present case is formed with four diodes 321. The rectifier circuit 32 and the transistor 31 can be part of an driver electronics, which can be mounted inside the glass bulb 20 of the LED light fixture 1.
(12) In FIG. 1B the electronic components of FIG. 1A are illustrated schematically together on a circuit board 12. Alternatively it is possible that at least some of the components of the light module 100 is mounted on a separate board. Preferably at least light emitting diode chips 11 of the light module 100 are mounted on the circuit board 12 by means of chip-on-board assembly. The electric contacting of the light module 100 takes place by means of contact points 44 which are located on the circuit board 12.
(13) In the case of a G9 pin-base lamp the circuit board 12 preferably has a width of at least 5 mm and at most 11 mm. The length preferably amounts to at least 10 mm and at most 30 mm. The contact points 44 are spaced 6 mm apart from one another.
(14) FIG. 10 shows a LED light fixture 1 which can contain a light module 100 described in connection with FIGS. 1A and 1B. The light module 100 of the LED light fixture 1 is illustrated purely by way of example as an incandescent filament of a conventional halogen lamp. In this case the LED light fixture 1 comprises two light modules 100. However, in a preferred embodiment of the LED light fixture 1contrary to the illustration in FIG. 1Conly one light module 100 is provided. The light modules 100 are located in a glass bulb 20. The glass bulb 20 further comprises electrical connectors 43 which are electrically conductively connected to the contact points 44 of the light module 100. The position of the electrical connectors 43 defines a bottom side of the glass bulb 20.
(15) On a top side opposite the bottom side the glass bulb 20 has a convexity 21. The convexity 21 is arranged on an axis of symmetry of the glass bulb 20. A part 101 of the light module 100 protrudes into the convexity 21 and as a result can be centred by means of the convexity 21.
(16) The electrical connectors 43 are electrically conductively connected to contact pins 41 by means of a connection region 42. A molybdenum film is located in the connection region 42, and when this film is used it is possible to compensate for a different thermal coefficient of expansion of the material of the electrical connectors 43 or the contact pins 41 and the material of the glass bulb 20. In particular, in the illustrated example the glass bulb 20 can be formed with quartz glass. Alternatively, in the case of tempered glass it is possible that the connection region 42 merely comprises a wire, for example a molybdenum wire, a tungsten wire or an iron-nickel-cobalt wire, since with tempered glass in conjunction with the said electrically conductive materials no adaptation of the coefficients of thermal expansion is necessary.
(17) A further exemplary embodiment of a LED light fixture 1 described here is explained in greater detail with reference to the schematic illustrations in FIGS. 2A, 2B and 2C. The illustrated LED light fixture 1 can also be used as a LED lamp, for example in a so-called pin-base lamp, in particular a G4 pin-base lamp which can be operated at 12 V. In this case FIG. 2A shows a circuit diagram of a light module 100 for the LED light fixture 1, FIG. 2B shows a schematic sketch of the light module 100 for the LED light fixture 1, and FIG. 1C shows a schematic sketch of the LED light fixture 1.
(18) In contrast to the light module 100 of FIG. 1A the light module 100 of FIG. 2A merely comprises three light emitting diode chips 11. The rest of the configuration does not differ from the light module 100 of FIG. 1A. Due to the reduction in the number of light emitting diode chips 11 it is also possible to operate the light module 100 at low voltages, in particular at 12 V.
(19) FIG. 2B shows a schematic illustration of the electronic components of FIG. 2A mounted on a circuit board 12. For the remaining components the layout corresponds to that of FIG. 1B. In the case of a G4 pin-base lamp the circuit board 12 preferably has a width of at least 5 mm and at most 10 mm and a length of at least 5 mm and at most 20 mm. The contact points 44 are spaced 5 mm apart from one another.
(20) FIG. 2C shows a LED light fixture 1 which can contain the light module 100 described in connection with FIGS. 2A and 2B. The light module 100 of the LED light fixture 1 is illustrated purely by way of example as an incandescent coiled filament. However, the light module 100 comprises the light emitting diode chips 11 of FIGS. 2A and 2B mounted on a circuit board 12 by means of chip-on-board assembly. The LED light fixture 1 differs from the LED light fixture 1 of FIG. 10 in particular by a partially spherical structure of the glass bulb 20 due to a more pronounced convexity 21. As a result, the LED light fixture 1 is even more similar to a conventional halogen or incandescent lamp.
(21) Of course, the LED light fixture 1 of FIG. 10 can also be equipped with the light module 100 of FIGS. 2A and 2B and vice versa.
(22) A further exemplary embodiment of a LED light fixture 1 described here is explained in greater detail with reference to the schematic illustrations in FIGS. 3A and 3B. The illustrated LED light fixture 1 can be designed for example as a halogen tubular lamp. The LED light fixture 1 has an elongated, rod-like shape. Both the light module 100 described in connection with FIG. 1A and the one described in connection with FIG. 2A can be used as the light module 100. Because of the elongated shape the circuit board 12 should likewise be elongated. The circuit board 12 preferably has a width of 5 mm and a length of at least 50 mm and at most 100 mm.
(23) In contrast to the LED light fixtures 1 of FIGS. 1A to 2C, in which the contact pins 41 were arranged on the same side of the glass bulb 20, the contact pins 41 are now arranged on opposite sides of the glass bulb 20. The contact points 44 are preferably also mounted on opposing sides of the circuit board 12 (see FIG. 3B).
(24) Exemplary embodiments of a LED lamp described here is explained in greater detail with reference to the schematic illustrations in FIGS. 4A, 4B and 4C. The LED lamps are in each case designed as LED retrofit lamps. Each of the LED lamps comprises a LED light fixture 1 as well as an enclosure 60. Furthermore, bases 62 for introduction of the LED lamp into a lamp socket and for electrical contacting of the LED lamp are provided.
(25) In the LED lamp of FIG. 4A the enclosure 60 is a glass shell which preferably corresponds to the glass shell of a conventional light bulb. In FIG. 4A the enclosure 60 is pear-shaped. Alternatively the enclosure 60 can be cylindrical. A heat-conducting gas is preferably introduced between the enclosure 60 and the glass bulb 20 of the LED light fixture 1. The LED light fixture 1 is connected by means of two mounting wires 61 to the base 62. The mounting wires 61 serve on the one hand to hold the LED light fixture 1 and on the other hand produce an electrically conductive connection between the base 62 and the contact pins 41 of the LED light fixture 1.
(26) The LED lamp of FIG. 4B comprises an enclosure 60 which is designed as a reflector of a (halogen) reflector lamp. The LED light fixture 1 (not visible in FIG. 4B) is located in a cavity of the enclosure 60. The enclosure 60 of the LED lamp of FIG. 4C is formed with a glass shell which in part has a reflecting coating to form a reflector. The enclosures 60 of the LED lamps of FIGS. 4B and 4C can likewise contain a heat-conducting gas in an intermediate space between the enclosure 60 and the LED light fixture 1.
(27) Exemplary embodiments of a light module 100 for a LED light fixture 1 described here are explained in greater detail with reference to the schematic illustrations in FIGS. 5A to 5E. A circuit board 12 with contact points 44 and electrical connectors 43 electrically conductively connected thereto is illustrated sketchily in each case in FIGS. 5A to 5E. The light emitting diode chips 11 as well as the electronic components, in particular the smoothing capacitor 30, of the light module 100 (not shown in FIGS. 5A to 5E) are located on the circuit board 12. The light modules 100 of FIGS. 5A to 5E differ through by the electrical contacting of the contact points 44.
(28) In the exemplary embodiment of FIG. 5A the electrical connectors 43 are formed as wires which are soldered to the contact points 44. A high-temperature solder (melting temperature above 400 C.) in conjunction with a wire and contact points, which in each case have a high melting temperature, is preferably used for the soldering. In particular, the melting temperature of the solder, the wire and the material of the contact points 44 is at least 1800 C. Coated or uncoated molybdenum, niobium, tantalum and/or stainless steel, for example, are suitable as such high-temperature materials. By the choice of such a material it can be ensured that the mechanical connection between the electrical connectors 43 and the contact points 44 during fusion of the glass bulb 20 around the electrical connectors 43 is not broken by the heat evolution associated therewith.
(29) In the exemplary embodiment of FIG. 5B the electrical connectors 43 formed as wires are connected to the contact points 44 by means of rivets 441. For the riveting 441 holes are introduced into the contact points 44 and the electrical connectors 43 are riveted to the contact points 44 by means of a riveting tool. The contact points 44 and the electrical connectors 43 are preferably formed from one of the previously described high-temperature materials.
(30) In contrast to the preceding light modules 100, the light module 100 of FIG. 5C has no electrical connectors 43. Instead, a connection region 42 formed as a molybdenum film is connected directly to the contact points 44. The molybdenum film is in particular soldered directly to the contact points 44, so that material savings can be made. For mechanical stabilisation of the thin foil and/or for improvement of the soldering or welding properties this film can be coated, for example with ruthenium. The use of a molybdenum film instead of a wire is advantageous in particular in the case of quartz glass.
(31) In the exemplary embodiment shown in FIG. 5D the electrical connectors 43 have first connection regions 431 and second connection regions 432. In this case the electrical connectors 43 can be constructed as wires which are soldered onto the contact points 44. The second connection regions 432 are doubly curved. As a result it is possible for the contact points 44 mounted on the front side of the circuit board 12 shown in FIG. 5D to be electrically conductively connected to further contact points (not illustrated in FIG. 5D) which are mounted on the rear side of the circuit board 12 remote from the front side. This is advantageous, in particular, if both sides of the circuit board 12 are equipped with light emitting diode chips 11, since the light emitting diode chips 11 on the front side and the light emitting diode chips 11 on the rear side can be contacted in each case by a wire as electrical connector 43.
(32) FIG. 5E shows an exemplary embodiment of a light module 100, in which a contact point 44 is mounted on the front side of the circuit board 12 and the second contact point 44 is mounted on the rear side of the circuit board 12 remote from the front side (not visible in FIG. 5E). This arrangement is advantageous, for example, for equipping the circuit board 12 on both sides with light emitting diode chips 11. For example, the electrical connectors 43 can be soldered onto the contact points 44.
(33) The exemplary embodiments of FIGS. 5A to 5E can be combined with one another. For example, the connection region 42 illustrated in FIG. 5C can be used in connection with one of the electrical connectors 43 of FIG. 5A, 5B, 5D or 5E and/or the two connection regions 431, 432 of FIG. 5D are connected to the contact points 44 by means of the riveting 441 of FIG. 5B.
(34) FIGS. 6A, 6B and 6C in each case show metal clamps 444 for transmission of an electrical contact from the front side of the circuit board 12 to the rear side of the circuit board 12. Such metal clamps 444 can be used in conjunction with the light modules 100 shown in FIGS. 5A to 5E, in particular if contact points 44 are mounted both on the front side and also on the rear side of the circuit board 12. The metal clamps 444 are in each case made from an electrically conductive material, such as for example stainless steel.
(35) The metal clamps 444 in each case have contact regions 446 and an opening 445 which is formed for introduction of the circuit board 12. A diameter of the opening 445 corresponds substantially to the thickness of the circuit board 12. The circuit board 12 is clamped into the opening 445 and the contact regions 446 in direct contact with the contact points 44, so that an electrical contact is produced between contact points 44 on the front side and contact points 44 on the rear side of the circuit board 12.
(36) The metal clamp 444 of FIG. 6A is constructed like a spring and has a curved region which facilitates clamping. The metal clamp 445 of FIG. 6B is planar on its outer sides remote from the opening 445, so that the metal clamp 445 can be extremely narrow.
(37) In the case of the metal clamp 444 of FIG. 6C, two wire tracks, which can be formed in particular as protective conductors, have been arranged at an angle relative to one another and welded to one another at a connection point 447. As a result, a metal clamp 444 can be provided in a simple manner.
(38) Further exemplary embodiments of a LED light fixture 1 described here are explained in greater detail with reference to the illustrations in FIGS. 7A to 7E.
(39) FIGS. 7A and 7B in each case show photographs of a LED light fixture 1, wherein the top side of the LED light fixture 1 is illustrated in each case on the left side and the bottom side with the electrical connectors 43 and the contact pin 41 is shown separately on the right side. FIG. 7A shows the LED light fixture 1 in a side view and FIG. 7B shows the LED light fixture 1 in a plan view.
(40) The LED light fixture 1 contains two dimples 22 in the glass bulb 20. The light modules 20 arranged in the glass bulb 20 are retained and centred by means of the dimples 22. The electrical contacting takes place by means of a connection region 42 (see also FIG. 10).
(41) FIGS. 7C and 7D show enlargements of dimples 22 in the glass bulb 20. The dimples 22 are formed as cavities in the glass bulb. Between the dimples 22 a free space is formed into which the circuit board 12 can be clamped.
(42) FIG. 7E shows a schematic sketch of a LED light fixture 1. Only the glass bulb 20 as well as the contact pins 41 and the connection region 42 of the LED light fixture 1 are illustrated. The glass bulb 23 has a notch 23 which serves for centring a circuit board 12 in the glass bulb 20. For example, the circuit board 12 can be clamped firmly by means of the notch 23 in the interior space of the glass bulb 20.
(43) Exemplary embodiments of a LED light fixture 1 described here is explained in greater detail with reference to the schematic sketches of FIGS. 8A and 8B. FIGS. 8A and 8B in each case show enlargements of the region around a dimple 22 in the glass bulb 20 (see also FIGS. 7A to 7D).
(44) Between the dimples 22 shown in FIGS. 8A and 8B there is located in each case an intermediate space in which the circuit board 12 is located. Furthermore, the smoothing capacitor 30 mounted on the circuit board 12 is located between the dimples 22, so that the smoothing capacitor 30 is more or less concealed. In FIG. 8A the smoothing capacitor 30 is only mounted on one side of the circuit board 12, for example the front side, whilst the circuit board 12 of FIG. 8B has a smoothing capacitor 30 on both sides, that is to say on the front side and on the rear side of the circuit board 12.
(45) The circuit board 12 is embedded together with the smoothing capacitor 30 in a mechanically flexible cast body 122. The cast element 122 can be formed from silicone. Furthermore, the cast body 122 can have wavelength-converting particles, so that the view of the smoothing capacitor 30 is additionally concealed.
(46) Deviations of the thickness d of the circuit board 12 and/or the dimensions of the intermediate space between the dimples 22 due to manufacturing tolerances can be compensated for by the cast body 122. Thus the cast body 122 is compressed more or less strongly depending upon the deviation, so that clamping is also facilitated in the event of deviations from an optimal dimension.
(47) Further exemplary embodiments of a LED light fixture 1 described here is explained in greater detail with reference to the schematic illustrations in FIGS. 9A and 9B. In particular, possible shapes for the glass bulb 20 are shown. In FIG. 9A the glass bulb 20 has the shape of a conventional halogen glass bulb, namely cylindrical with a convexity 21 along an axis of symmetry of the glass bulb 20. A part of the circuit board 12 of the LED light fixture 1 can be arranged in the convexity 21 and in the region of the convexity 21 thermally coupled to the glass bulb 20, so that the heat removal can be improved without having a negative influence on the appearance of the LED light fixture 1.
(48) As shown in FIG. 9B, the glass bulb 20 can alternatively have a cuboid configuration and can follow a rectangular shape of the circuit board 12. In general, because the shape of the glass bulb 20 is chosen to be similar to the shape of the circuit board 12 the heat dissipation away from the circuit board 12 can be improved.
(49) Further exemplary embodiments of a LED light fixture 1 described here is explained in greater detail with reference to the schematic illustrations in FIGS. 10A and 10B. In the illustrated exemplary embodiments, the width b of the circuit board 12 corresponds approximately to the greatest internal diameter r of the glass bulb 20. As a result, the circuit board 12 can be retained by the walls of the glass bulb 20. It is possible that the circuit board 12 is embedded in a mechanically flexible cast body 122, so that production tolerances can be compensated for in the width b of the circuit board 12 and/or of the greatest internal diameter r of the glass bulb 20.
(50) The glass bulb 20 of FIG. 10A has a cylindrical cross-section and the glass bulb 20 of FIG. 10B has a circular cross-section, wherein the cross-section is formed in each case perpendicularly to an axis of symmetry and the glass bulb 20 has a cylindrical shape in each case. For maximisation of the radiating surface, with an elliptical cross-section the width of the circuit board b preferably corresponds to the large half-axis of the ellipse, so that when the circuit board 12 is clamped by means of the walls of the glass bulb 20 the maximum width of the glass bulb 20 can be utilised.
(51) Exemplary embodiments of a LED light fixture 1 described here are explained in greater detail with reference to the measured illumination intensities 71, 72 (in Lux) and emission characteristics 711, 722 (also called: illumination intensity curves) of FIGS. 11A and 11B or 12A and 12C. The measurements have been carried out in each case with a LED light fixture 1 similar to that of FIGS. 1A to 10. FIGS. 11A and 12A show measurements in the case of a LED light fixture 1 with a regular glass bulb 20, whilst the glass bulb 20 of the LED light fixture 1 for the measurements of FIGS. 11B and 12B has been frosted by sand blasting.
(52) FIGS. 11A and 11B show in each case a first illumination intensity 71, which has been measured in the plane spanned by the lateral directions of the circuit board 12 (that is to say in a plan view of the light emitting diode chip 11), and a second illumination intensity 72, which has been measured in a plane spanned by the vertical direction and the lateral direction of the circuit board 12 extending along the length of the circuit board 12 (that is to say in a side view). The measurement takes place as a function of the respective angle to the vertical relative to the plane. FIGS. 12A and 12B show a first emission characteristic 711 which has been measured in the measuring plane of the first illumination intensity 71 and a second emission characteristic 722 which has been measured in the measuring plane of the second illumination intensity 72.
(53) Due to the frosting the entire illumination intensity 71, 72 (total of 211 Lumen for FIGS. 11A and 12A and 191 Lumen for FIGS. 11B and 12B, in each case measured at a power von 1.9 Watt). However, the emission characteristic is significantly homogenised and improved. Thus the left-hand maximum of the first illumination intensity 71 in FIG. 11A is approximately 250 Lux and the right-hand maximum of the first illumination intensity 71 is approximately 53 Lux, that is to say only approximately 20% of the value of the left-hand maximum. In FIG. 11A the second illumination intensity 72 is on average significantly less than the first illumination intensity 71 (maximum approximately 51 Lux). In FIG. 11B the left-hand maximum of the first illumination intensity 71 is approximately 215 Lux and the right-hand maximum is approximately 73 Lux, that is to say approximately 30% of the value of the left-hand maximum. The second illumination intensity 72 is significantly increased by comparison with FIG. 11A (maximum approximately 83 Lux).
(54) This homogenisation of the light intensity distribution can also be seen clearly in FIGS. 12A and 12B. In particular in the 0 plane more light is emitted and the Lambertian emission characteristic of the light emitting diode chip 11 is extended. In FIG. 12A it can be seen clearly that the light emitting diode chips 11 are only mounted on the front side of the circuit board 12 (higher radiation in the left-hand region), whilst in FIG. 12B the radiation is less one-sided.
(55) The invention is not limited to these embodiments by the description with reference to the exemplary embodiments. On the contrary, the invention encompasses each new feature as well as any combination of features, in particular including any combination of features in the claims, even if this feature or this combination itself is not explicitly given in the claims or the exemplary embodiments.
LIST OF REFERENCES
(56) 1 LED light fixture 11 light emitting diode chip 12 circuit board 122 cast body 100 light module 20 glass bulb 21 convexity 22 dimple 23 notch 30 smoothing capacitor 31 transistor 32 rectifier circuit 321 diode 33 voltage source 41 contact pin 42 connection region 43 electrical connector 431 first connection region 432 second connection region 44 contact point 441 riveting 444 metal clamp 445 opening 446 contact region 447 connection point 23 notch 60 enclosure 61 mounting wires 62 base 71 first illumination intensity 72 second illumination intensity 711 first emission characteristic 722 first emission characteristic d thickness of the circuit board r greatest internal diameter of the glass bulb
