Component Carrier With Different Stack Heights and Vertical Opening and Manufacturing Methods

Abstract

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The stack has at least one central stack section, at least one cavity stack section, and at least one vertical opening formed in the cavity stack section. The cavity stack section at least partially surrounds the central stack section, and the thickness of the central stack section is greater than the thickness of the cavity stack section.

Claims

1. A component carrier comprising a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, the stack of the component carrier, comprising: at least one central stack section; at least one cavity stack section; and at least one vertical opening formed in the cavity stack section; wherein the cavity stack section at least partially surrounds the central stack section; and wherein the thickness of the central stack section is larger than the thickness of the cavity stack section.

2. The component carrier according to claim 1, wherein the central stack section is arranged between at least two cavity stack sections.

3. The component carrier according to claim 1, wherein the at least one vertical opening is at least partially void.

4. The component carrier according to claim 1, wherein the component carrier further comprises: a functional coating layer covering at least one vertical side wall delimiting the vertical opening.

5. The component carrier according to claim 4, wherein the functional coating layer comprises at least one of the following features: wherein the functional coating layer comprises a black coating; wherein the functional coating layer has a thickness of 25 μm or less; wherein the functional coating layer is configured to prevent light scattering or wherein the functional coating layer is configured to enhance light scattering; wherein the functional coating layer is optically opaque or transparent; wherein the functional coating layer is electrically insulating or electrically conductive; wherein the functional coating layer is magnetic or non-magnetic; wherein the protective coating layer is anticorrosive.

6. The component carrier according to claim 1, further comprising at least one of the following features: wherein the at least one electrically conductive layer structure comprises a plurality of vertical through connections extending through the central stack section; wherein the at least one electrically conductive layer structure comprises a plurality of vertical through connections extending through the cavity stack section, wherein a component is embedded in or on the component carrier.

7. The component carrier according to claim 1, wherein the cavity stack section is free of vertical through connections.

8. The component carrier according to claim 1, wherein an angle between one vertical side wall delimiting the vertical opening and a first main surface of the cavity stack section is in the range between 80° and 100°.

9. The component carrier according to claim 1, wherein the component carrier is configured as one of the group which consists of a printed circuit board (PCB) and a substrate.

10. An arrangement, comprising: a component carrier including a stack; wherein the stack of the component carrier has at least one central stack section, at least one cavity stack section, and at least one vertical opening formed in the cavity stack section; wherein the cavity stack section at least partially surrounds the central stack section; and wherein the thickness of the central stack section is larger than the thickness of the cavity stack section; and an electronic element, wherein at least a part of the electronic element extends through at least part of the at least one vertical opening.

11. The arrangement according to claim 10, wherein the electronic element is not integrally formed with the component carrier.

12. The arrangement according to claim 10, wherein the electronic element is physically separate from the component carrier.

13. The arrangement according to claim 10, wherein the electronic element is an optical element.

14. A method of manufacturing a component carrier, the method comprising: providing a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein providing the stack comprises: forming at least one central stack section in the stack; forming at least one cavity stack section in the stack, wherein the cavity stack section at least partially surrounds the central stack section, wherein the thickness of the central stack section is larger than the thickness of the cavity stack section; and forming at least one vertical opening in the cavity stack section.

15. The method according to claim 14, wherein the forming the at least one vertical opening is accomplished by at least one of the group consisting of laser drilling and mechanical drilling.

16. The method according to claim 14, wherein providing the stack further comprises: embedding a release layer in the stack, defining, by cutting or drilling, a cut-out portion in the stack, wherein drilling is performed down to the embedded release layer to provide the cut-out portion directly on the release layer, and removing the cut-out portion from the stack to provide the cavity stack section at least partially surrounding the central stack section.

17. The method according to claim 14, wherein forming the at least one cavity stack section of the stack is accomplished by routing.

18. The method according to claim 14, wherein forming the at least one vertical opening is carried out before forming the cavity stack section of the stack.

19. The method according to claim 14, further comprising: providing a functional coating layer on at least a part of a vertical side wall delimiting the at least one vertical opening, wherein providing a functional coating layer comprises at least one of the group consisting of spray coating and inkjet printing.

20. A method, comprising: using a component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, the stack of the component carrier, comprising: at least one central stack section; at least one cavity stack section; and at least one vertical opening formed in the cavity stack section; wherein the cavity stack section at least partially surrounds the central stack section; and wherein the thickness of the central stack section is larger than the thickness of the cavity stack section; and accommodating in the at least one vertical opening at least a part of an electronic element which is not integrally formed with the component carrier.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0063] FIG. 1 shows a cross-sectional view of a stack of a component carrier comprising a central stack section, two cavity stack sections, and a vertical opening, according to an exemplary embodiment of the invention.

[0064] FIG. 2 shows an isometric view of a component carrier with a central stack section and two cavity stack sections, and a vertical opening, according to an exemplary embodiment of the invention.

[0065] FIG. 3 shows a cross-sectional view of an arrangement of a component carrier and an electronic element, according to an exemplary embodiment of the invention.

[0066] FIG. 4, FIG. 5 and FIG. 6 illustrate cross-sectional views of stacks obtained during carrying out a method of manufacturing a component carrier, according to exemplary embodiments of the invention.

[0067] FIG. 7 shows a cross-sectional view of a detail of the vertical opening of a component carrier, according to an exemplary embodiment of the invention.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

[0068] The illustrations in the drawings are schematically presented. It is noted that in different figures, similar or identical elements or features are provided with the same reference signs. In order to avoid unnecessary repetitions, elements, or features, which have already been elucidated with respect to a previously described embodiment, are not elucidated again at a later position of the description.

[0069] Furthermore, spatially relative terms, such as “front” and “back”, “above” and “below”, “left” and “right”, et cetera are used to describe an element's relationship to another element(s) as illustrated in the figures. Thus, the spatially relative terms may apply to orientations in use which may differ from the orientation depicted in the figures. Obviously, all such spatially relative terms refer to the orientation shown in the figures only for ease of description and are not necessarily limiting as a device according to an embodiment of the invention may assume orientations different than those illustrated in the figures when in use.

[0070] FIG. 1 shows a cross-sectional view of a stack 101 of a component carrier 100 comprising a central stack section 104, two cavity stack sections 105, and a vertical opening 106 (an opening area or opening cavity), according to an exemplary embodiment of the invention. The stack 101 comprises an electrically conductive layer structure 102 and electrically insulating layer structures 103, for example a core layer structure. The central stack section 104 is partially surrounded by the two cavity stack sections 105, or, in other words, the central stack section 104 is arranged between two cavity stack sections 105.

[0071] As can be taken from FIG. 1, the central stack section 104 is a protruding section with respect to the cavity stack sections 105 of the component carrier 100. Thus, the thickness B of the central stack section 104 is larger than the thickness C of the cavity stack section 105. Furthermore, a vertical opening 106 is formed in one of the cavity stack sections 105. The vertical opening 106 is depicted as being fully void. However, in other embodiments, the vertical opening 106 may also be partially void.

[0072] Reference sign 107 denotes a functional coating layer 107 covering at least one vertical side wall 108 delimiting the vertical opening 106. The functional coating layer 107 may for example be provided by means of spray coating or inkjet printing. As has been elucidated in detail above, the functional coating 107 may comprise at least one of a plurality of features, such as specific optical features and particularly a thickness of not more than 25 μm. The functional coating layer 107 may in particular be a black solder mask ink.

[0073] As can further be taken from FIG. 1, the electrically conductive layer structure 102 comprises a plurality of vertical through connections 109 extending through the central stack section 104, and the electrically conductive layer structure 102 also comprises a plurality of vertical through connections 109 extending through the cavity stack section 105. However, a part of the cavity stack section 105 comprising the vertical opening 106 is free of vertical through connections 109 in this example.

[0074] FIG. 2 shows an isometric view of a component carrier 100 with a central stack section 104 and two cavity stack sections 105, and a vertical opening 106, according to an exemplary embodiment of the invention. In this example, the vertical opening 106 comprises a rectangular shape and extends nearly over the whole width along the (y-axis) of the component carrier 100. It has to be noted, that the vertical opening is not limited to one specific shape or cross-sectional shape. In some embodiments, for example, the vertical opening may in particular be adapted to the shape of a camera, an optical sensor unit, a light detector etc., and as such, may have a (substantially) round shape, a (substantially) elliptical shape, a circular shape, a polygonal shape, etc.

[0075] FIG. 3 shows a cross-sectional view of an arrangement 300 of a component carrier 100 and an electronic element 110, according to an exemplary embodiment of the invention. The electronic element 110 is embedded on a further component carrier 310. Descriptively speaking, the electronic element 110 is not integrally formed with the component carrier 100, or, in other words, the electronic element 110 is physically separate (e.g., not embedded) from the component carrier 100. The vertical opening 106 of the component carrier 100 partially accommodates the electronic element 110, which may for example be an optical element such as a camera.

[0076] The electronic element 110 is protected by the vertical side walls 108 of the vertical opening 106 from damage, in particular from mechanical damage. In some embodiments, the electronic element 110 may extend all the way through the vertical opening 106 such that it protrudes from a first main surface S of the cavity stack section 105.

[0077] However, in the embodiment shown in FIG. 3, the electronic element 110 is fully protected by the vertical opening 106 because it only extends through part of the vertical opening 106. The vertical through connections 109 may for example serve to electrically connect the further component carrier 310 to the component carrier 100, and, in some embodiments, to yet another component carrier or component (both not shown), which may be connected on a side of the component carrier 100 opposing the side of the component carrier 100 at which the further component carrier 310 is arranged.

[0078] FIG. 3 also illustrates the use of a component carrier 100 to accommodate in the vertical opening 106 at least a part of an electronic element 110, which is not integrally formed with the component carrier 100 as described in detail above.

[0079] FIG. 4 to FIG. 6 illustrate cross-sectional views of stacks 101 obtained during carrying out a method of manufacturing a component carrier 100, according to exemplary embodiments of the invention.

[0080] In FIG. 4, a stack 101 comprising electrically insulating layer structures 103 and an electrically conductive layer structure 102 with vertical through connections 109 is shown. On a main surface of the stack 101, there is embedded a release layer 111.

[0081] Next, in FIG. 5, the stack 101 further comprises another electrically insulating layer structure 103 (and not-depicted electrically conductive layers), which is formed on the embedded release layer 111 (step of layer build-up). In the insulating layer structure 103 (and not-depicted electrically conductive layers), vertical through connections 109 of the electrically insulating layer structure 102 (and of the not-depicted electrically conductive layers) are formed, substantially electrically connecting both main surfaces of the stack 101.

[0082] In FIG. 6, cut-out portions 120 in the stack 101 are shown. The cut-out portions 120 are defined by cutting or drilling, in particular laser drilling. The drilling (symbolized by dotted lines) is performed down to the embedded release layer 111. Hence, the cut-out portions 120 are provided directly on the release layer 111. Removing the cut-out portion 120 from the stack 101 provides the cavity stack section, which at least partially surrounds the central stack section. Furthermore, in the so-formed cavity stack section 105, there is formed a vertical opening 106, for example by laser drilling or mechanical drilling. In other embodiments, the cavity stack section 105 may be formed by routing or cutting.

[0083] According to the embodiment shown in FIG. 6, forming the vertical opening 106 (symbolized by dotted lines) is carried out before forming the cavity stack section 105 of the stack 101. In other words, the vertical opening 106 is formed before the cut-out portions 120 are removed. Thus, a component carrier 100 as depicted for example in FIG. 1, and described in detail above, may be formed.

[0084] FIG. 7 shows a cross-sectional view of a detail of the stack 101 comprising the vertical opening 106, according to an exemplary embodiment of the invention. In the illustrated detail, the cavity stack section 105 comprises an electrically insulating layer structures 103 and the electrically insulating layer structure 102, which does, however, not have any vertical through connections 109.

[0085] An angle A between one vertical side wall 108 delimiting the vertical opening 106 and a first main surface S of the cavity stack section 105 is 90°. This can for example be achieved by forming the vertical opening 106 before forming the cavity stack section 105 of the stack 101 and furthermore by using one of cutting, laser drilling or mechanical drilling.

[0086] The angle A between the vertical side wall 108 and the main surface S being 90° (or at least in a range between 80° and 100°) can also be described as a clean, undamaged, sharp, and even edge or corner. This may be particularly advantageous for preventing light scattering and/or refraction, which could otherwise occur due to rough and damaged edges, surfaces, and corners (for example if the angle A were greater than 100°).

[0087] Furthermore, damage of a component or electronic element embedded on the component carrier 100 and/or accommodated in the vertical opening 106 may be prevented by providing the angle A in a range from 80° to 100°, in particular 90° as depicted in FIG. 7.

[0088] It should be noted that the term “comprising” does not exclude other elements or steps and the use of articles “a” or “an” does not exclude a plurality. Also, elements described in association with different embodiments may be combined.

[0089] Implementation of the invention is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which variants use the solutions shown and the principle according to the invention even in the case of fundamentally different embodiments.

LIST OF REFERENCE SIGNS

[0090] A Angle [0091] B Thickness of a central stack section [0092] C Thickness of a cavity stack section [0093] S First main surface [0094] 100 Component carrier [0095] 101 Stack [0096] 102 Electrically conductive layer structure [0097] 103 Electrically insulating layer structure [0098] 104 Central stack section [0099] 105 Cavity stack section [0100] 106 Vertical opening [0101] 107 Functional coating layer [0102] 108 Vertical side wall [0103] 109 Vertical through connection [0104] 110 Electronic element [0105] 111 Release layer [0106] 120 Cut out portion [0107] 300 Arrangement [0108] 310 Further component carrier