Sintering tool for the lower die of a sintering device

Abstract

Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).

Claims

1. A lower die of a sintering device, the lower die comprising a tool, the tool having a rest for an electronic subassembly comprising a circuit carrier, to be sintered, where the rest is formed from a material with a coefficient of linear expansion measured at 20 C. of less than or equal to 15.Math.10.sup.6K.sup.1, wherein the tool has a depression and the rest is located within the depression, wherein the rest is configured to receive the electronic subassembly to be sintered thereupon, wherein the rest is not a component of the electronic subassembly to be sintered, and wherein a top surface of the rest is located below a top surface of the tool.

2. The lower die according to claim 1, wherein the rest is formed from a material with a coefficient of linear expansion measured at 20 C. of less than or equal to 11.Math.10.sup.6K.sup.1.

3. The lower die according to claim 1, wherein the rest is formed by coating at least a partial region of the tool.

4. The lower die according to claim 1, wherein the rest is formed as a plate.

5. The lower die according to claim 4, wherein a surface of the plate serving as a rest is coated with the material.

6. The lower die according to claim 4, wherein the plate is formed solidly from the material.

7. The lower die according to claim 1, wherein the depression has a channel in the wall or on the bottom of the depression leading to outside the tool.

8. The lower die according to claim 1, wherein the material is molybdenum or an alloy comprising molybdenum.

9. The lower die according to claim 1, wherein the tool comprises a plurality of rests.

10. A sintering device comprising the lower die according to claim 1.

11. The lower die according to claim 2, wherein the material is molybdenum or an alloy comprising molybdenum.

12. The lower die according to claim 3, wherein the material is molybdenum or an alloy comprising molybdenum.

13. The lower die according to claim 4, wherein the material is molybdenum or an alloy comprising molybdenum.

14. The lower die according to claim 5, wherein the material is molybdenum or an alloy comprising molybdenum.

15. The lower die according to claim 6, wherein the material is molybdenum or an alloy comprising molybdenum.

16. The lower die according to claim 7, wherein the material is molybdenum or an alloy comprising molybdenum.

17. The lower die according to claim 1, wherein the rest of the tool has a surface configured to removably receive the electronic subassembly.

18. The lower die according to claim 1, wherein the tool comprises a plurality of depressions and a plurality of rests, each of the plurality of rests located within one of the plurality of depressions.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The invention is explained in more detail on the basis of an exemplary embodiment that is represented in the appended figures. In these figures:

(2) FIG. 1 shows a sectional view through a first exemplary embodiment according to the invention of a particularly preferable design.

(3) FIG. 2 shows a sectional view through a second exemplary embodiment according to the invention of a particularly preferable design.

(4) FIG. 3 shows a perspective view of a third exemplary embodiment according to the invention of a particularly preferable design.

DETAILED DESCRIPTION

(5) FIG. 1 shows a tool 10, which has a depression, in which a rest 20 formed as a plate and an electronic subassembly 30 to be sintered arranged thereupon are represented. The depression in the tool 10 is designed such that the rest 20 and the subassembly 30 are received completely by the depression and the surface of the subassembly 30 finishes flush with the surface of the tool 10. It may be provided in this case that the rest 20 is stocked in various thicknesses, in order to compensate for differing heights of the subassembly 30.

(6) FIG. 2 shows a tool 10, which has a depression, in which a partial coating 20a formed as a layer at the bottom of the depression and an electronic subassembly 30 to be sintered arranged thereupon are represented. The depression in the tool 10 is designed such that the partial coating 20a and the subassembly 30 are received completely by the depression and the surface of the subassembly 30 finishes flush with the surface of the tool 10. It may be provided in this case that the partial coating 20a is varied in thickness, in order to compensate for differing heights of the subassembly 30.

(7) FIG. 3 shows a tool 10, which has a number of depressions, in which a plurality of rests 20 formed either as a plate or a layer at the bottom of the depression. The depressions in the tool 10 are designed such that there are channels leading to the periphery of the tool 10.

(8) In all of the embodiments illustrated, if the tool 10 is at the same time the die of a sintering device, it preferably comprises a heating element (not shown).

(9) While the present disclosure has been illustrated and described with respect to a particular embodiment thereof, it should be appreciated by those of ordinary skill in the art that various modifications to this disclosure may be made without departing from the spirit and scope of the present disclosure.