RESISTANCE SOLDERING METHOD AND SOLDERING DEVICE

Abstract

The present disclosure describes a resistance soldering method for producing a plate assembly including at least two basic elements that are materially bonded together via a soldering device, e.g., for producing a winding of an electrical machine. The method includes applying an output voltage to a first electrode and a second electrode, between which the at least two basic elements are arranged, to solder a solder element interposed therebetween; detecting a correct or incorrect position of the solder element in the plate assembly via a control unit; determining via the control unit a voltage between the solder element and one or more points on the electric circuit. The control unit detects the correct or incorrect position of the solder element through an evaluation and/or a comparison with reference to the voltage or voltages.

Claims

1. A resistance soldering method for producing a plate assembly comprised of at least two basic elements that are materially bonded via a soldering device, comprising: providing a first basic element and a second basic element spaced apart and, with respect to a mounting direction, arranged one above the other between a first electrode and a second electrode of the soldering device; arranging a solder element between and in contact with the first basic element and the second basic element; applying an output voltage to the first electrode and the second electrode to provide an electric circuit and solder the first basic element and the second basic element together via the solder element; detecting a correct or incorrect position of the solder element in the plate assembly via a control unit; determining via the control unit, upon the detection of the correct or incorrect position of the solder element in the plate assembly, a voltage between the solder element and one point on the electric circuit, or voltages between the solder element and mutually divergent points on the electric circuit, and wherein the control unit detects the correct or incorrect position of the solder element with reference to the voltage or voltages determined through at least one of an evaluation and a comparison.

2. The resistance soldering method as claimed in claim 1, wherein the control unit compares the determined voltage with a saved comparative value or the determined voltages with saved comparative values, and detects the correct or incorrect position of the solder element in the plate assembly.

3. The resistance soldering method as claimed in claim 2, wherein in the detection of the correct or incorrect position of the solder element in the plate assembly, the control unit determines at least one of (i) a first voltage that is constituted between the first electrode or the first basic element and the solder element, and (ii) a second voltage that is constituted between the second electrode or the second basic element and the solder element.

4. The resistance soldering method as claimed in claim 3, wherein at least one of: in the event of the correct positioning of the solder element in the plate assembly, the first voltage is dependent upon a first electrical resistance, that is composed of at least one of the electrical resistance of the first electrode, the electrical resistance of the first basic element, the contact resistance between the first electrode and the first basic element, and of the electrical resistance of the solder element, and in the event of the correct positioning of the solder element in the plate assembly, the second voltage is dependent upon a second electrical resistance, that is composed of at least one of the electrical resistance of the second electrode, the electrical resistance of the second basic element, the contact resistance between the second electrode and the second basic element, and the electrical resistance of the solder element.

5. The resistance soldering method as claimed in claim 1, wherein: upon the detection of the correct or incorrect position of the solder element in the plate assembly, the control unit determines the output voltage, a first voltage constituted between the first electrode or the first basic element and the solder element, and a second voltage constituted between the second electrode or the second basic element and the solder element; and the control unit, in accordance with the output voltage, the first voltage and the second voltage, detects the correct or incorrect position of the solder element in the plate assembly.

6. The resistance soldering method as claimed in claim 5, wherein: the control unit calculates a first ratio between the first voltage and the output voltage, and a second ratio between the second voltage and the output voltage; and the control unit, by at least one of an evaluation and a comparison of the first ratio and the second ratio, detects the correct or incorrect position of the solder element in the plate assembly.

7. The resistance soldering method as claimed in claim 5, wherein: in the event of the correct positioning of the solder element in the plate assembly, the first voltage is dependent upon a first electrical resistance that is composed of at least one of the electrical resistance of the first electrode, the electrical resistance of the first basic element, the contact resistance between the first electrode and the first basic element, and the electrical resistance of the solder element, and in the event of the correct positioning of the solder element in the plate assembly, the second voltage is dependent upon a second electrical resistance that is composed of at least one of the electrical resistance of the second electrode, the electrical resistance of the second basic element, the contact resistance between the second electrode and the second basic element, the electrical resistance of the solder element.

8. The resistance soldering method as claimed in claim 1, wherein: the control unit, via an output voltage measuring device, continuously measures an output voltage signal during the resistance soldering process; and the control unit, from the output voltage signal, executes a read-off of the output voltage that correlates to a specified time point.

9. The resistance soldering method as claimed in claim 8, wherein the control unit integrates the output voltage signal prior to the read-off of the output voltage via an integrator.

10. The resistance soldering method as claimed in claim 3, wherein: the control unit, via a first voltage measuring device, records a first voltage signal throughout the resistance soldering process with no interruption; and the control unit, from the first voltage signal, executes a read-off of the first voltage that correlates to a specified time point.

11. The resistance soldering method as claimed in claim 10, wherein the control unit, via an integrator, integrates the first voltage signal prior to the read-off of the first voltage.

12. The resistance soldering method as claimed in claim 3, wherein: the control unit, via a second voltage measuring device, records a second voltage signal throughout the resistance soldering process with no interruption; and the control unit, from the second voltage signal, executes a read-off of the second voltage that correlates to a specified time point.

13. The resistance soldering method as claimed in claim 12, wherein the control unit, via an integrator, integrates the second voltage signal prior to the read-off of the second voltage.

14. The resistance soldering method as claimed in claim 3, wherein the control unit determines the output voltage, the first voltage and the second voltage at the same specified time point.

15. The resistance soldering method as claimed in claim 1, wherein at least one of: at least one of the first basic element is a first electrical conductor and the second basic element is a second electrical conductor, and at least one of the first basic element and the second basic element are a plurality of electrical conductors that are soldered together by the resistance soldering method.

16. A soldering device for the resistance soldering of two basic elements to constitute a plate assembly, comprising: a first electrode and a second electrode, between which the two basic elements are compressed in a mounting direction, with a solder element interposed therebetween that is resistance soldered by the application of an output voltage, a control unit for detecting the correct or incorrect position of the solder element in the plate assembly, wherein the soldering device is configured for the execution of the resistance soldering method as claimed in claim 1.

17. The soldering device as claimed in claim 16, wherein the soldering device further comprises a controlling system, which is configured to operate the soldering device by the resistance soldering method as claimed in claim 1.

18. The soldering device as claimed in claim 16, wherein the control unit comprises at least one of an output voltage measuring device for detecting an output voltage signal, a first voltage measuring device for detecting a first voltage signal between the first electrode or the first basic element and the solder element, and a second voltage measuring device for detecting a second voltage signal between the second electrode or the second basic element and the solder element.

19. The soldering device as claimed in claim 18, wherein the control unit further comprises at least one integrator for integrating at least one of the output voltage signal, the first voltage signal, and the second voltage signal.

20. The soldering device as claimed in claim 18, wherein at least one of the output voltage correlates to the output voltage signal at a specified time point, the first voltage correlates to the first voltage signal at a specified time point, and the second voltage correlates to the second voltage signal at a specified time point.

21. The soldering device as claimed in claim 20, wherein the specified time point for the read-off of at least one of the output voltage, the first voltage, and the second voltage is one and the same.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In the figures, schematically in each case:

[0027] FIGS. 1 and 2 show views of a soldering device according to the invention for executing a resistance soldering method according to the invention;

[0028] FIG. 3 shows a schematic plan of the resistance soldering method according to the invention;

[0029] FIG. 4 shows a view of the soldering device according to the invention, with a plate assembly in which the solder element is in the correct position;

[0030] FIGS. 5 to 7 show views of the soldering device according to the invention, with the plate assembly in which the solder element is in the incorrect position.

DETAILED DESCRIPTION

[0031] FIG. 1 and FIG. 2 show views of a soldering device 1 according to the invention for executing a resistance soldering method 2 according to the invention. The soldering device 1 comprises a first electrode 3a and a second electrode 3b, between which a plate assembly 4 is arranged for resistance soldering. The plate assembly 4 comprises a first basic element 5a and a second basic element 5b, between which a solder element 6 is arranged. In this case, the first basic element 5a and the second basic element 5b are respectively constituted by an electrical conductor 7a and an electrical conductor 7b. The soldering device 1 comprises a control unit 9, which can detect the correct or incorrect position of the solder element 6 in the plate assembly 4. The control unit 9 is only schematically represented here. The correct position of the solder element 6 in the plate assembly 4 is thus the position of the solder element 6 between the two basic elements 5a and 5b, as represented here. With the solder element 6 in the correct position, a soldering point 8c.f. FIG. 2can be constituted between the two basic elements 5a and 5b. At the soldering point 8, the two basic elements 5a and 5b are materially bonded to one another. Any position of the solder element 6 in the plate assembly 4 which deviates herefrom is thus the incorrect position.

[0032] In the resistance soldering method 2, according to FIG. 1, the first basic element 5a and the second basic element 5b are spaced and, with respect to a mounting direction 10, are arranged one above the other between the first electrode 3a and the second electrode 3b of the soldering device 1. The solder element 6 is arranged between the first basic element 5a and the second basic element 5b. By means of the electrodes 3a and 3b, the solder element 6 is then compressed together with the basic elements 5a and 5b by a force F, as represented in FIG. 2. Thereafter, an output voltage U.sub.0c.f. FIG. 3is applied to the electrodes 3a and 3b and, as a result, the two basic elements 5a and 5b are soldered to one another at the soldering point 8 by means of the solder element 6. It is understood that the soldering point 8 defined herein is not a point-type bond and, depending upon the quantity of heat generated by the resistance soldering method 2, can also extend over the entire contact region of the two basic elements 5a and 5b.

[0033] In the resistance soldering method 2, the correct or incorrect position of the solder element 6 in the plate assembly 4 is detected by the control unit 9. FIG. 3 illustrates a schematic plan for this purpose. The electrodes 3a and 3b of the soldering device 1, the basic elements 5a and 5b and the solder element 6 of the plate assembly 4 each have a determinable electrical resistance such that, in the resistance soldering method 2, upon the application of the output voltage U.sub.0, a series circuit, and thus a voltage divider, are constituted by the electrodes 3a and 3b and the plate assembly 4. In the event of the correct positioning of the solder element 6 in the plate assembly 4as represented herea first voltage U.sub.1 between the first electrode 3a and the solder element 6 is dependent upon a totalized first resistance R.sub.1. The totalized first resistance R.sub.1 is composed of the electrical resistance R.sub.3a of the first electrode 3a, of the electrical resistance R.sub.5a of the first basic element 5a, and of the contact resistance R.sub.K1 between the first electrode 3a and the first basic element 5a. A second voltage U.sub.2 between the second electrode 3b and the solder element 6 is dependent upon a totalized second resistance R.sub.2. The second totalized resistance R.sub.2 is composed of the electrical resistance R.sub.3b of the second electrode 3b, of the electrical resistance R.sub.5b of the second basic element 5b, and of the contact resistance RK2 between the second electrode 3b and the second basic element 5b.

[0034] The control unit 9, upon the detection of the correct or incorrect position of the solder element 6 in the plate assembly 4, determines the output voltage U.sub.0, the first voltage U.sub.1 and the second voltage U.sub.2. The control unit 9 then calculates a first ratio between the first voltage U.sub.1 and the output voltage U.sub.0, and a second ratio between the second voltage U.sub.2 and the output voltage U.sub.0. By an evaluation and/or comparison of the first ratio and the second ratio, the control unit 9 can detect the correct or incorrect position of the solder element 6 in the plate assembly 4 in a simplified and secure manner.

[0035] The detection of the correct or incorrect position of the solder element 6 is described in greater detail hereinafter with reference to FIG. 4 to FIG. 7. In the interests of simplification, it is assumed that the two electrodes 3a and 3b and the two basic elements 5a and 5b are identical, and the electrical resistances R.sub.3a and R.sub.3b, the electrical resistances R.sub.5a and R.sub.5b, and the contact resistances R.sub.K1 and R.sub.K2 are respectively equal.

[0036] FIG. 4 shows a view of the soldering device 1 and the plate assembly 4, in which the solder element 6 is arranged between the two basic elements 5a and 5b, and is thus in the correct position. An impeccable soldering point 8 is constituted in this case. Here, the electrical resistance R.sub.1 is equal to the electrical resistance R2, such that the voltages U.sub.1 and U.sub.2 are equal, and the first ratio U.sub.1 to U.sub.0 and the second ratio U.sub.2 to U.sub.0 are respectively .

[0037] FIG. 5 shows a view of the soldering device 1 and the plate assembly 4, in which the solder element 6 is not at all arranged between the basic elements 5a and 5b, and is thus in the incorrect position. A soldering point 8 is not constituted between the basic elements 5a and 5b. In this case, the electrical resistance R.sub.1 is equal to the electrical resistance R.sub.2, and the voltages U.sub.1 and U.sub.2 are close to equal to the output voltage U.sub.0. The first ratio U.sub.1 to U.sub.0 and the second ratio U.sub.2 to U.sub.0 are respectively close to 1.

[0038] FIG. 6 shows a view of the soldering device 1 and the plate assembly 4, in which the solder element 6 is arranged between the first electrode 3a and the first basic element 5a, and is thus in the incorrect position. In this case, no soldering point 8 is constituted between the basic elements 5a and 5b. The first resistance R.sub.1 is composed of the resistance R.sub.3a of the first electrode 3a. Conversely, the second resistance R2 is composed of the resistances R.sub.5a, R.sub.5b, R.sub.3b, R.sub.K2, and of a contact resistance between the two basic elements 5a and 5b. The first voltage U.sub.1 is correspondingly smaller than the second voltage U.sub.2. The first ratio U.sub.1 to U.sub.0 and the second ratio U.sub.2 to U.sub.0 differ from each other, and assume unequal values of or 1.

[0039] FIG. 7 shows a view of the soldering device 1 and the plate assembly 4, in which the solder element 6 is arranged between the second electrode 3b and the second basic element 5b, and is thus in the incorrect position. Here again, no soldering point 8 is constituted between the basic elements 5a and 5b. The same comments apply here as to FIG. 6 wherein, however, the resistance R.sub.2 is smaller than the resistance R.sub.1.

[0040] In summary, in the resistance soldering method 2 according to the invention, the correct or incorrect position of the solder element 6 can be detected by the control unit 9 in a simplified and secure manner. As a result, defective soldering points in the plate assembly 4 can be prevented, and the number of rejected components reduced accordingly.