MICRO- AND NANO- HOT EMBOSSING METHOD FOR OPTICAL GLASS LENS ARRAYS

Abstract

A micro- and nano-hot embossing method for an optical glass lens array, including: preparing a mold with a micro-hole array by micro EDM, where the micro-hole array matches an optical glass lens array and the mold is made of a hard metal material which is conductive and meets strength and temperature requirements; preparing a nano nitride-based graded composite coating on a surface of the mold by magnetron sputtering; and pre-fabricating a glass preform and then placing the glass preform on the surface of the mold; heating the glass preform and hot embossing by a glass molding machine in vacuum; cooling in nitrogen atmosphere; and demolding to produce the optical glass lens array. The micro- and nano-hot embossing method of the present invention improves the surface quality of the optical glass lens array and reduces the cost and difficulty for manufacturing.

Claims

1. A micro- and nano-hot embossing method for an optical glass lens array, comprising: 1) preparing a mold with a micro-hole array by micro EDM, wherein the micro-hole array matches an optical glass lens array, and the mold is made of a hard metal material which is conductive and meets strength and temperature requirements; 2) preparing a nano nitride-based graded composite coating on a surface of the mold by magnetron sputtering; and 3) pre-fabricating a glass preform and placing the glass preform in the mold; heating the glass preform and hot embossing by a glass molding machine in vacuum; cooling in a nitrogen atmosphere and demolding to produce the optical glass lens array.

2. The micro- and nano-hot embossing method of claim 1, wherein the nano nitride-based graded composite coating is a Cr.sub.xW.sub.yN coating or a Cr.sub.x1W.sub.y1C.sub.zN coating; in the Cr.sub.xW.sub.yN coating, 20<x<40, and 20<y<40; and in the Cr.sub.x1W.sub.y1C.sub.zN coating, 10<x1<20, 10<yl<20, and 10<z<20.

3. The micro- and nano-hot embossing method of claim 1, wherein the nano nitride-based graded composite coating is a Cr.sub.x1W.sub.y1C.sub.zN coating, wherein 10<x1<20, 10<y1<20, and 10<z<20.

4. The micro- and nano-hot embossing method of claim 3, wherein step 2) further comprises: starting a magnetron sputtering system which is set to have a vacuum for sputter cleaning of 510.sup.3 Pa, a bias voltage of 120 V and a time for sputter cleaning of 1-2 h; washing a target for 15 minutes with a power of 300 W and a bias voltage of 50 V; starting the magnetron sputtering system for a high-purity Cr target to prepare a Cr coating having a thickness of 10-20 nm on the mold in an argon atmosphere, and then to prepare an intermediate CrN coating having a thickness of 20-40 nm on the prepared Cr coating in a nitrogen and argon atmosphere, wherein flow rates of both argon and nitrogen are controlled at 100 sccm, and a vacuum is 0.45 Pa; starting the magnetron sputtering system for high-purity Cr and W targets to prepare a Cr.sub.xW.sub.yN coating having a thickness of 100-200 nm on the prepared intermediate CrN coating; and starting the magnetron sputtering system for high-purity Cr, W and C targets to prepare a Cr.sub.xW.sub.yC.sub.zN coating having a thickness of 500-1000 nm on the prepared Cr.sub.xW.sub.yN coating.

5. The micro- and nano-hot embossing method of claim 4, wherein in the hot embossing process, an embossing temperature is between Tg and Ts; Tg refers to a glass transition temperature, and Ts refers to a glass softening temperature.

6. The micro- and nano-hot embossing method of claim 5, wherein in the hot embossing process, the embossing temperature is between Tg+50 C. and Ts30 C.

7. The micro- and nano-hot embossing method of claim 6, wherein in the hot embossing process, an embossing force is between 100 to 500 N; or a radial deformation displacement of the glass preform in the micro-hole array of the mold is controlled to be 10-500 m by exerting the embossing force.

8. The micro- and nano-hot embossing method of claim 7, wherein after the hot embossing process, the nitrogen is filled into the mold to cool the glass and the mold, and at the same time, the embossing force is reduced to a holding force which is 1/10 to 3/10 of the embossing force until the glass and the mold are cooled to a room temperature; in the cooling process, when the glass is cooled below Tg30 C., the holding force is removed, and the glass is demolded after the glass and the mold are cooled to the room temperature.

9. The micro- and nano-hot embossing method of claim 1, wherein the mold with the micro-hole array is made of carboloy, chrome-molybdenum steel or high-speed steel.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG. 1 is a diagram showing a hot embossing process of a micro- and nano-hot embossing method for an optical glass lens array according to an embodiment of the present invention; and

[0018] FIG. 2 is a diagram showing a nano nitrogen-based graded composite coating according to an embodiment of the present invention.

[0019] In the drawings: 1, head of glass molding machine; 2, optical glass lens array; 3, micro-hole array; 4, mold body; 5, glass preform.

DETAILED DESCRIPTION OF EMBODIMENTS

[0020] The present invention will be further described with reference to the embodiments, but these embodiments are not intended to limit the scope of the present invention. Simple substitutions and adjustments made by those skilled in the art according to the present invention shall fall within the scope of the present invention.

[0021] Taking L-BAL35 glass lens arrays as an example, a micro- and nano-hot embossing method for an optical glass lens array comprises the following steps.

[0022] 1) A mold with a micro-hole array is prepared by micro EDM, where the size and contour of the micro-hole array match that of an optical glass lens array and the mold is made of a hard metal material which is conductive and meets strength and temperature requirements, and specifically, the mold is made of carbology, chrome-molybdenum steel or high-speed steel, and in this embodiment, the mold is made of carbology. During the processing of the micro-hole array using EDM, the pulse voltage is 120 V, the pulse frequency is 0.2 MHz, the pulse width is 500 ns, and the pulse interval is 400 ns. Each micro hole of the mold for L-BAL35 glass has a diameter of 0.5 mm and a depth of 0.8 mm. When the pulse voltage is at the range of 100-150 V, micro holes with a diameter of 0.1-0.8 mm and a depth of 0.1-1 mm are processed as needed.

[0023] 2) a nano nitride-based graded composite coating is prepared on a surface of the mold by magnetron sputtering, specifically comprising the following steps. A magnetron sputtering system is started which is set to have a vacuum for sputter cleaning of 510.sup.3 Pa, a bias voltage of 120 V, and the time for sputter cleaning of 2 h (the time for sputter cleaning can be set to be 1 h to improve the efficiency). A target is washed for 15 minutes with power of 300 W and a bias voltage of 50 V, where the motor speed is 2 rpm. During washing, the target is covered with a cover to prevent sputtering onto a substrate. The magnetron sputtering system for a high-purity Cr target is started to prepare a Cr coating having a thickness of 10-20 nm on the mold in an argon atmosphere, and then to prepare an intermediate CrN coating having a thickness of 20-40 nm in a nitrogen and argon atmosphere, where flow rates of both argon and nitrogen are controlled at 100 sccm, and the vacuum is 0.45 Pa. Then, the magnetron sputtering system for high-purity Cr and W targets are started to prepare a Cr.sub.25W.sub.25N.sub.50 coating having a thickness of 100-200 nm on the prepared intermediate CrN coating. Then, the magnetron sputtering system for high-purity Cr, W and C targets are started to prepare a Cr.sub.15W.sub.15C.sub.15N.sub.55 coating having a thickness of 500-1000 nm on the prepared Cr.sub.25W.sub.25N.sub.50 coating. During the preparing, the thickness of the coating is controlled by adjusting the deposition time, where the time for depositing the Cr coating is set to be 10-15 min; the time for depositing the CrN coating is set to be 10-15 min; the time for depositing the Cr.sub.25W.sub.25N.sub.50 is set to be 20-30 min; and the time for depositing the Cr.sub.15W.sub.15C.sub.15N.sub.55 coating is set to be 60-120 min. The diagram showing a microstructure of the prepared nano nitride-based graded composite coating is shown in FIG. 2.

[0024] 3) Appropriate amount of the glass preform is calculated and weighed according to the size of the glass lens array and the glass preform is heated after placed in the mold of micro-hole arrays, and specifically, the glass preform is placed on the surface of the mold deposited with the nano nitride-based graded composite coating. When the glass preform is heated between 517 and 619 C., the glass preform is hot embossed by the glass precision molding machine. As shown in FIG. 2, the embossing force (F.sub.embossing) is controlled at 100-500 N, or a radial deformation displacement of the glass preform in the micro holes of the mold is controlled to be 10-500 m by exerting appropriate embossing force (F.sub.embossing). The radial deformation displacement can be controlled by the existing TOSHIBA's glass molding press (GMP) and Shenzhen University's precision glass molding machine (SZU's PGMM30). After the hot embossing, the nitrogen is filled into the mold to cool the glass and the mold, and at the same time, the embossing force is reduced to a holding force (F.sub.holding) which is 1/10 to 3/10 of the embossing force (F.sub.embossing) until the glass and the mold are cooled to a room temperature. In the cooling process, when the glass is cooled to below Tg30 C., the holding force (F.sub.holding) is removed, and the glass is demolded after the glass and the mold are cooled to the room temperature.