Coolant supply device
10809015 ยท 2020-10-20
Assignee
Inventors
- Kosuke YAMAMOTO (NARA, JP)
- Mitsuru Taga (Nara, JP)
- Futoshi YAMAZAKI (Nara, JP)
- Yoshiaki Azuma (Nara, JP)
Cpc classification
F28D21/0017
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D2021/004
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F2250/102
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B24B55/03
PERFORMING OPERATIONS; TRANSPORTING
F28F13/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23Q11/1069
PERFORMING OPERATIONS; TRANSPORTING
International classification
F28D21/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B24B55/03
PERFORMING OPERATIONS; TRANSPORTING
B23Q11/10
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A coolant supply device includes a coolant tank having first and second coolant reservoirs arranged in parallel with a predetermined space therebetween and a communicating part arranged between the first and second coolant reservoirs to allow them to communicate with each other, and formed to have a U-shaped overall shape. The coolant supply device further includes pumps pumping up coolant from the second coolant reservoir and supplying the coolant to predetermined destinations. The coolant supplied by the pumps is returned to the first coolant reservoir and flows into the second coolant reservoir through the communicating part. The first coolant reservoir has a first agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing toward the communicating part, and the second coolant reservoir has a second agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing therein from the communicating part.
Claims
1. A coolant supply device, comprising: a coolant tank including a first coolant reservoir, a second coolant reservoir, and a communicating part and formed to have a substantially U-shaped overall shape in plan view, the first and second coolant reservoirs each having a substantially rectangular shape in plan view and being arranged in parallel with a predetermined space therebetween, the communicating part being arranged at an end between the first and second coolant reservoirs and having one end connected to a sidewall of the first coolant reservoir and another end connected to a sidewall of the second coolant reservoir to allow the first coolant reservoir and the second coolant reservoir to communicate with each other; and a supply pump pumping up coolant from the second coolant reservoir and supplying the coolant to a predetermined destination, the coolant supply device being configured such that the coolant supplied to the predetermined destination by the supply pump is returned to the first coolant reservoir and coolant in the first coolant reservoir flows into the second coolant reservoir through the communicating part, the coolant supply device including: at least one agitation pump configured to pump coolant from the coolant tank; a first agitating nozzle body connected to the at least one agitation pump, disposed at a position diagonal to a connecting portion between the communicating part and the first coolant reservoir in the first coolant reservoir, and configured to discharge the coolant pressurized by the at least one agitation pump in a direction toward the communication part to assist a flow of coolant flowing from the first coolant reservoir toward the communicating part; and a second agitating nozzle body connected to the at least one agitation pump, disposed near a connecting portion between the communicating part and the second coolant reservoir in the second coolant reservoir, and configured to discharge the coolant pressurized by the at least one agitation pump in a direction of a flow of coolant flowing into the second coolant reservoir from the communicating part to assist the flow of coolant flowing into the second coolant reservoir from the communicating part.
2. The coolant supply device of claim 1, wherein: at least one of the first and second agitating nozzle bodies has a plurality of discharge ports; and a discharge direction of at least one of the plurality of discharge ports is directed more centrally of a corresponding coolant reservoir than a discharge direction of a remaining discharge port.
3. The coolant supply device of claim 1, wherein: the second coolant reservoir has a baffle plate disposed therein at a position ahead in a coolant discharge direction of the second agitating nozzle body; and the baffle plate extends inward from an inner wall of the second coolant reservoir to obstruct the flow of coolant, with a clearance between the baffle plate and a bottom of the second coolant reservoir such that the coolant can flow through the clearance.
4. The coolant supply device of claim 2, wherein: the second coolant reservoir has a baffle plate disposed therein at a position ahead in a coolant discharge direction of the second agitating nozzle body; and the baffle plate extends inward from an inner wall of the second coolant reservoir to obstruct the flow of coolant, with a clearance between the baffle plate and a bottom of the second coolant reservoir such that the coolant can flow through the clearance.
5. The coolant supply device of claim 1, wherein the second coolant reservoir has a flow adjusting plate disposed therein for adjusting the flow of coolant flowing into the second coolant reservoir from the communicating part, the flow adjusting plate extending from the communicating part along an inner wall surface of the second coolant reservoir and facing the inner wall surface.
6. The coolant supply device of claim 2, wherein the second coolant reservoir has a flow adjusting plate disposed therein for adjusting the flow of coolant flowing into the second coolant reservoir from the communicating part, the flow adjusting plate extending from the communicating part along an inner wall surface of the second coolant reservoir and facing the inner wall surface.
7. The coolant supply device of claim 3, wherein the second coolant reservoir has a flow adjusting plate disposed therein for adjusting the flow of coolant flowing into the second coolant reservoir from the communicating part, the flow adjusting plate extending from the communicating part along an inner wall surface of the second coolant reservoir and facing the inner wall surface.
8. The coolant supply device of claim 4, wherein the second coolant reservoir has a flow adjusting plate disposed therein for adjusting the flow of coolant flowing into the second coolant reservoir from the communicating part, the flow adjusting plate extending from the communicating part along an inner wall surface of the second coolant reservoir and facing the inner wall surface.
9. The coolant supply device of claim 1, comprising a third agitating nozzle body connected to the at least one agitation pump, disposed in the communicating part, and configured to discharge the coolant pressurized by the at least one agitation pump toward the second coolant reservoir to assist a flow of coolant flowing toward the second coolant reservoir from the first coolant reservoir.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
DETAILED DESCRIPTION
(4) Hereinafter, a specific embodiment of the present invention will be described with reference to the drawings. A coolant supply device 1 according to this embodiment is attached to a machine tool, which is not shown in the drawings, to supply coolant C to a machining area and the like of the machine tool. As shown in
(5) Specifically, the coolant tank 2 includes a first coolant reservoir 3 and a second coolant reservoir 7 each having a rectangular shape in plan view and arranged in parallel with a predetermined space therebetween, as well as a communicating part 8 arranged between ends (ends illustrated on the lower side in
(6) As shown in
(7) The highly clean reservoir 4 has a first pump 27 disposed therein, and the return reservoir 5 has a second pump 28 and a third pump 29 disposed therein near a sidewall thereof located on the second coolant reservoir 7 side. Further, the return reservoir 5 has a first agitating nozzle body 20 disposed therein at a position diagonal to the connecting portion between the communicating part 8 and the return reservoir 5. Furthermore, the second coolant reservoir 7 has a second agitating nozzle body 23 disposed therein at a position facing the connecting portion between the communicating part 8 and the second coolant reservoir 7, and has a fourth pump 30, a fifth pump 31, and a sixth pump 32 disposed therein near a sidewall thereof located on the first coolant reservoir 3 side. Further, the communicating part 8 has a third agitating nozzle body 26 disposed therein. Note that the first agitating nozzle body 20, the second agitating nozzle body 23, and the third agitating nozzle body 26 are being immersed in coolant C.
(8) The first pump 27 pumps up coolant C from the highly clean reservoir 4 and supplies the pumped-up coolant C to a circulating path formed in a spindle of the machine tool. The second pump 28 pumps up coolant C from the return reservoir 5 and supplies the pumped-up coolant C to the first agitating nozzle body 20, the second agitating nozzle body 23, and the third agitating nozzle body 26. The third pump 29 pumps up coolant C from the return reservoir 5 and supplies the pumped-up coolant C to a destination above the machining area of the machine tool to discharge the coolant C into the machining area.
(9) The fourth pump 30, the fifth pump 31, and the sixth pump 32 each pump up coolant C from the second coolant reservoir 7, the fourth pump 30 supplies the pumped-up coolant C to a filter device, which is not shown in the drawings, the fifth pump 31 supplies the pumped-up coolant C to a destination near the spindle of the machine tool to discharge the coolant C into the machining area, and the sixth pump 32 supplies the pumped-up coolant C to a base of the machine tool. Note that the first pump 27 is mounted on a mounting plate (not shown) that constitutes a top plate of the highly clean reservoir 4, and the second pump 28, the third pump 29, the fourth pump 30, the fifth pump 31, and the sixth pump 32 are mounted on a top plate (not shown) closing the coolant tank 2.
(10) Further, a chip conveyor (not shown) as disclosed in Japanese Unexamined Patent Application Publication No. 2009-226491 mentioned above is disposed in the space between the first coolant reservoir 3 and the second coolant reservoir 7 of the coolant tank 2. This chip conveyor collects the coolant C supplied to the machining area of the machine tool, with chips and sludge contained in the coolant C.
(11) The chip conveyor has incorporated therein a drum-shaped filter (drum filter) (not shown) as disposed in Japanese Unexamined Patent Application Publication No. 2009-226491 mentioned above. When coolant C flows into the drum filter, the coolant C is filtered and thereby chips and sludge of a certain size are separated and removed from the coolant C. The internal space of the drum filter liquid-tightly communicates with the coolant tank 2 through an opening (not shown) formed in the sidewall of the return reservoir 5 located on the second coolant reservoir 7 side. Accordingly, the coolant C supplied to the machining area of the machine tool is collected in the chip conveyor, and filtered by the drum filter, after which the coolant C is returned to the return reservoir 5.
(12) Note that the coolant C supplied to the circulating path of the spindle by the first pump 27 and the coolant C supplied to the base of the machine tool by the sixth pump 32 are returned to the return reservoir 5 through separate flow paths. Further, the coolant C pumped up by the sixth pump 32 is used also for so-called backwash for unclogging the drum filter. Further, the coolant C pumped up by the fourth pump 30 is, as described above, supplied to the not-shown filter device, and highly purged by the filter device, after which the coolant C is supplied to the highly clean reservoir 4. If an excessive amount of coolant C is supplied to the highly clean reservoir 4, the coolant C overflows into the return reservoir 5 through an opening 6a formed in the divider 6.
(13) The first agitating nozzle body 20 includes two nozzles 21, 22 arranged in parallel and discharging the coolant C supplied by the second pump 28 toward the communicating part 8. The coolant C discharged from the nozzle 22 produces a liquid flow which flows substantially along sidewalls of the return reservoir 5, while the coolant C discharged from the nozzle 21 produces a liquid flow which is directed approximately to the center of the return reservoir 5.
(14) The third agitating nozzle body 26 is disposed so as to discharge the coolant C supplied by the second pump 28 toward the second coolant reservoir 7.
(15) The second agitating nozzle body 23 includes two nozzles 24, 25 arranged in parallel and discharging the coolant C supplied by the second pump 28 in a direction substantially perpendicular to a flow of coolant C flowing into the second coolant reservoir 7 from the communicating part 8, that is, in the upward direction in
(16) Further, the second coolant reservoir 7 has a baffle plate 13 disposed therein at a position ahead in the direction of the discharge of coolant C from the second agitating nozzle body 23. The baffle plate 13, as shown in
(17) Further, the second coolant reservoir 7 has a flow adjusting plate 14 disposed therein at the connecting portion between the communicating part 8 and the second coolant reservoir 7, the flow adjusting plate 14 extending from the communicating part 8 along an inner wall surface (inner wall surface illustrated on the lower side in
(18) In the coolant supply device 1 according to this embodiment having the above-described configuration, as described above, coolant C in the second coolant reservoir 7 is pumped up by the fourth pump 30, the fifth pump 31, and the sixth pump 32, the pumped-up coolant C is supplied to the above-mentioned destinations, and the supplied coolant C is returned to the return reservoir 5. Thus, this circulation of coolant C forms a basic flow of coolant C that flows from the reservoir 5 into the second coolant reservoir 7 through the communicating part 8.
(19) Specifically, coolant C from the machining area of the machine tool is returned to the return reservoir 5 via the chip conveyor. Further, coolant C supplied to the circulating path of the spindle by the first pump 27 is returned to the return reservoir 5 through an appropriate flow path, and coolant C supplied to the base of the machine tool by the sixth pump 32 is also returned to the return reservoir 5 through an appropriate flow path. Furthermore, coolant C supplied to the highly clean reservoir 4 by the fifth pump 31 overflows into the return reservoir 5. In the return reservoir 5, such coolant C produces a liquid flow which flows toward the communicating part 8, and therefore the coolant C flows from the return reservoir 5 into the second coolant reservoir 7 through the communicating part 8.
(20) Further, in the second coolant reservoir 7, coolant C is pumped up by the fourth pump 30, the fifth pump 31, and the sixth pump 32, and their pumping-up actions and the flow of coolant C flowing into the second coolant reservoir 7 from the communicating part 8 produce a swirl flow.
(21) In this coolant supply device 1, in the return reservoir 5, the nozzles 21, 22 of the first agitating nozzle body 20 discharge coolant C supplied thereto by the second pump 28, the coolant C discharged from the nozzle 22 produces a liquid flow which flows substantially along the sidewalls of the return reservoir 5, and the coolant C discharged from the nozzle 21 produces a liquid flow which is directed approximately to the center of the return reservoir 5. Thereby, the flow of coolant C flowing toward the communicating part 8 is assisted by the coolant C discharged from the nozzles 21, 22 and the coolant C in the return reservoir 5 is agitated. Further, the arc-shaped flow adjusting plate 9 disposed at the corner of the return reservoir 5 enables a stagnation-free, smooth flow of coolant C at the corner.
(22) As described above, in the return reservoir 5, the flow of coolant C therein is assisted, the coolant C therein is agitated, and a stagnation-free, smooth flow of coolant C is formed. Therefore, even if foreign substances such as chips and sludge are mixed in with the coolant C, deposition and accumulation of such foreign substances can be suppressed.
(23) Further, in the communicating part 8, coolant C is discharged from the third agitating nozzle body 26 toward the second coolant reservoir 7. Therefore, the coolant C flowing into the second coolant reservoir 7 from the return reservoir 5 is assisted and accelerated by the coolant C discharged from the third agitating nozzle body 26 and this coolant C flows into the second coolant reservoir 7. Thereby, deposition and accumulation of foreign substances in the communicating part 8 can be suppressed.
(24) On the other hand, in the second coolant reservoir 7, the nozzles 24, 25 of the second agitating nozzle body 23 discharge coolant C supplied thereto by the second pump 28, the coolant C discharged from the nozzle 25 produces a liquid flow which flows substantially along the sidewalls of the second coolant reservoir 7, and the coolant discharged from the nozzle 24 produces a liquid flow which is directed approximately to the center of the second coolant reservoir 7. Thereby, the flow (swirl flow) of coolant C in the second coolant reservoir 7 is assisted and agitated by the coolant C discharged from the nozzles 24, 25. Further, the arc-shaped flow adjusting plates 10, 11, 12 disposed at the corners of the second coolant reservoir 7 enable a stagnation-free, smooth flow of coolant C at the corners.
(25) Note that the velocity of the swirl flow formed in the second coolant reservoir 7 is smallest at a position remote from the second agitating nozzle body 23, that is, at a position ahead in the discharge direction of the second agitating nozzle body 23. In the flow path following the position, the flow velocity is increased by the pump-up actions of the fourth pump 30, fifth pump 31, and sixth pump 32.
(26) In the coolant supply device 1 according to this embodiment, the baffle plate 13 is provided at a position at which the velocity of the flow of coolant C is small; the action of the baffle plate 13 can increase the velocity of the flow of coolant C. That is, the flow of coolant C flowing ahead from the second agitating nozzle body 23 is obstructed by the baffle plate 13, and this causes the flow of coolant C to flow through the clearance formed between the baffle plate 13 and the bottom 7a of the second coolant reservoir 7 shown in
(27) Thus, in the second coolant reservoir 7, the flow of coolant therein is assisted by the coolant discharged from the second agitating nozzle body 23 and thereby the coolant therein is agitated, and a stagnation-free, smooth flow of coolant is formed by the flow adjusting plates 10, 11, 12. These actions consequently suppress deposition and accumulation of foreign substances in the second coolant reservoir 7.
(28) Further, the baffle plate 13 is provided at a position at which the velocity of the flow of coolant C is small; therefore, the velocity of the flow of coolant C can be increased when the coolant C flows through the clearance between the baffle plate 13 and the bottom 7a of the second coolant reservoir 7. Thereby, deposition and accumulation of foreign substances at the position are prevented.
(29) Furthermore, in the second coolant reservoir 7 in this embodiment, the flow adjusting plate 14 is provided at the connecting portion between the communicating part 8 and the second coolant reservoir 7, the flow adjusting plate 14 extending from the communicating part 8 along the inner wall surface (inner wall surface illustrated on the lower side in
(30) As described above, in the second coolant reservoir 7, the coolant flow is assisted by the coolant C discharged from the second agitating nozzle body 23 and a swirl flow swirling along the wall of the second coolant reservoir 7 is formed. Therefore, at the connecting portion between the communicating part 8 and the second coolant reservoir 7, the flow of coolant C flowing into the second coolant reservoir 7 from the communicating part 8 collides with the swirl flow of coolant C in the second coolant reservoir 7 and thereby is blocked, which makes the communicating part 8 susceptible to deposition and accumulation of foreign substances.
(31) Accordingly, the provision of the flow adjusting plate 14 allows the flow of coolant flowing into the second coolant reservoir 7 from the communicating part 8 and the swirl flow of coolant in the second coolant reservoir 7 to join together smoothly at the connecting portion between the communicating part 8 and the second coolant reservoir 7, so that the coolant C flowing from the communicating part 8 successfully flows into the second coolant reservoir 7. Thereby, deposition and accumulation of foreign substances at the connecting portion between the communicating part 8 and the second coolant reservoir 7 is prevented.
(32) The foregoing has described a coolant supply device according to an embodiment of the present invention. However, the present invention is not limited thereto and can be implemented in other modes.
(33) For example, although the above embodiment has the configuration in which the first agitating nozzle body 20 is composed of the nozzles 21, 22 and the second agitating nozzle body 23 is composed of the nozzles 24, 25, the present invention is not limited to such a configuration. The first agitating nozzle body 20 and the second agitating nozzle body 23 each may be composed of one nozzle or may be composed of three or more nozzles. The number of nozzles can be determined to an appropriate one which can eliminate deposition and accumulation of foreign substances in the return reservoir 5 and the second coolant reservoir 7, in accordance with the state of the deposition and accumulation. Further, the discharge direction of each nozzle also can be determined to an appropriate one which can eliminate deposition and accumulation of foreign substances in each reservoir.
(34) Further, the provision of the third agitating nozzle body 26 is optional. If deposition and accumulation of foreign substances do not occur in the communicating part 8, there is no particular need to provide the third agitating nozzle body 26.
(35) Further, the present invention does not necessarily require all the first pump 27 through the sixth pump 32; the pumps can be provided as appropriate in accordance with the purpose of supplying coolant.